Modeling the thermal conductivity of diamond reinforced aluminium matrix composites with inhomogeneous interfacial conductance

A reasonable model for describing the thermal conductivity of diamond reinforced aluminium matrix composites behaving a distinctive character of inhomogeneous distribution of interfacial thermal conductance on diamond surfaces is proposed in terms of an equivalent diameter approach combined with a double effective-medium approximation scheme. Theoretical analyses for the thermal conductivity of diamond reinforced Al (Si) composites prepared by different infiltration techniques (squeeze casting (SQ), gas pressure infiltration (GPI)) are given for rediscovering the existing experimental results considering inhomogeneous conductance behavior. Numerical results using present model agree reasonably well with the experimental observations and explore new findings, i.e. the diffusion bonding also occurs at Al–diamond {1 1 1} interfaces of GPIed composites; the interconnected particles is possibly existed in GPIed Al/diamond composites.     

Effect of thermal cycling on the damping behavior in alumina borate whisker with and without Bi2O3 coating reinforced pure aluminum composites

Alumina borate whiskers with and without Bi₂O₃ coatings reinforced pure aluminum composites were fabricated by squeeze casting. The damping behavior of the composites was described. Samples had undergone thermal cycling during the damping measurement. For the Al₁₈B₄O₃₃w/Al composite, two damping peaks are present either in the heating or in the cooling process. For the Al₁₈B₄O₃₃w/Al composite with whisker coatings, there are also two damping peaks in the heating process, but there are three damping peaks in the cooling process. The research results indicate that a distinct difference presents in the damping-temperature curves for the Al₁₈B₄O₃₃w/Al composite with and without whisker coatings. The damping behavior and damping mechanism in the composites during thermal cycling are explained through dislocation motion, interfacial and grain boundary slip.     

Simulations of precipitation in ferritic steels

Abstract

A new technique based on Monte Carlo random sampling has been proposed to simulate the precipitation kinetics in alloys. The new approach employs time dependent nucleation and diffusion laws, considers both intergranular and intra-granular precipitation, and also combines precipitation kinetics with intergranular segregation. The simulation can be used not only to predict the average size of precipitate phase particles, but also to predict particle size distributions, volume fraction, and interparticle spacing. The new approach overcomes the shortcomings of earlier model calculations where only the average size of the precipitate phase is considered. In addition, the proposed simulation overcomes the difficulty of connecting Monte Carlo steps to real time using the Metropolis algorithm. The approach has been used to simulate M₂₃C₆ precipitation kinetics in a creep resistant steel, P92: the results are in good agreement with published experimental measurements, and the model is believed to be applicable to other types of precipitates in different alloys.     

Formation of interfacial voids in composites with a weakly bonded viscoplastic matrix

The formation and evolution of interfacial voids are investigated in the case of metal matrix composites (MMCs) reinforced by ceramic fibres and subjected to high compressive loads. The resulting compression flows of a viscoplastic aluminum matrix around rigid fibres are described by a nonlinear free-boundary problem. A new finite element model with boundary-fitted mesh motion is introduced to simulate the formation of interfacial voids. The fibre–matrix interface is weak and allows yielding and sliding with separation at a dynamic contact line connecting three phases. The fibre–matrix interaction is simulated via a modified O'Donovan–Tanner constitutive model and a phenomenologically defined interface potential. The shape of the interfacial surface undergoing large deformation is not known a priori and found as a part of the solution. The influence of hydrostatic stress and constitutive characteristics of the matrix on the evolution of interfacial voids and their growth rates are examined. As the transverse strain increases, the evolution of interfacial voids occurs through a sequence of convex profiles. Numerical simulations are carried out for a special case involving small values of the yield stress and the viscosity of yielded matrix in order to compare them with similar results for linear viscous solids. The numerical results are also compared with the experiments involving similar compression flows of viscoplastic model materials.     

Effect of tungsten addition on thermal conductivity of graphite/copper composites

Graphite/copper composites with high thermal conductivity were fabricated by tungsten addition, which formed a thin tungsten carbide layer at the interface. The microstructure and thermal conductivity of the composite material were studied. The results indicated that the insertion of tungsten carbide layer obviously suppressed spheroidization of copper coating on the graphite particles during the sintering process, and decreased the interfacial thermal resistance of the composites. Compared with the graphite/copper composites without tungsten, the thermal conductivity of the obtained composites was increased by 43.6%.     

Irreversible deformation of metal matrix composites: A study via the mechanism-based cohesive zone model

An elastic–plastic interface model at finite deformations is utilized to predict the irreversible deformation of metal matrix composites (MMCs) under the transverse loading and unloading conditions. The associated benefit of the cohesive model is to provide a physical insight on the main irreversible deformation mechanisms, i.e., the geometrically nonlinear, localized plastic deformation and damage induced debonding, at the interface of MMCs. The extensive parametric study is conducted using this cohesive model to investigate the effects of the cohesive parameters on the stress–strain response of MMCs under transverse loading. Further, the ductile mechanism of the matrix is considered to characterize the competition between the plastic flow of the matrix and the inelastic interface induced irreversible deformation. Moreover, the predictions using the cohesive model are compared with those available experimental data in the literature to demonstrate the inelastic behaviors, including the interfacial plasticity and damage induced debonding, as well as the plastic flow of the matrix. The numerical results of the stress–strain responses for both loading and unloading conditions show good agreements with those obtained by the experiment. The deformation and failure modes of MMCs predicted by the model are also consistent with the observations of the experiment.     

Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Cu/diamond composites were fabricated by spark plasma sintering (SPS) after the surface pretreatment of the diamond powders, in which the diamond particles were mixed with copper powder and tungsten powder (carbide forming element W). The effects of the pretreatment temperature and the diamond particle size on the thermal conductivity of diamond/copper composites were investigated. It was found that when 300 μm diamond particles and Cu–5 wt.% W were mixed and preheated at 1313 K, the composites has a relatively higher density and its thermal conductivity approaches 672 W (m K)⁻¹.     

Enhanced thermal conductivity of Cu matrix composites reinforced with Ag-coated β-Si3N4 whiskers

Cu matrix composites reinforced with 10 vol.% Ag-coated β-Si₃N₄ whiskers (ASCMMCs) were prepared by powder metallurgy method. With the aim of improving the thermal conductivity of the composites, a quite thin Ag layer was deposited on the surface of β-Si₃N₄ whiskers. The results indicated that thermal conductivity of ASCMMCs with 0.30 vol.% Ag (0.30ASCMMCs) reached up to 273 W m⁻¹ K⁻¹ at 25 °C, which was 98 W m⁻¹ K⁻¹ higher than that of Cu matrix composites reinforced with uncoated β-Si₃N₄ whiskers (USCMMCs). The Ag coating could promote the densification of composites, reduce the aggregation of β-Si₃N₄ whiskers and enhance the Cu/Si₃N₄ interfacial bonding, therefore it could efficiently enhance the thermal conductivity of Cu matrix composites reinforced with β-Si₃N₄ whiskers (SCMMCs).     

Interface damage of SiC/Ti metal matrix composites subjected to combined thermal and axial shear loading

A three-dimensional micromechanical finite element model is developed to study initiation and propagation of interface damage of unidirectional SiC/Ti metal matrix composites (MMCs) subjected to combined thermal and axial shear loading. Effects of various important parameters such as manufacturing process thermal residual stress, fiber coating and interface bonding are investigated. The model includes a representative volume element consists of a quarter of SiC (SCS-6) fibers covered by interface and coating, which are all surrounded by Ti-15-3 matrix. Appropriate boundary conditions are introduced to include effects of combined thermal and axial shear loading on the RVE. A suitable failure criterion for interface damage is introduced to predict initiation and propagation of interface de-bonding during shear loading. It is shown that while predictions based on perfectly bonded and fully de-bonded interface are far from reality, the predicted stress–strain curve for damaged interface demonstrates very good agreement with experimental data.     

Metal matrix composites. A bird’s eye view

Composite materials, in general, have so far been used mainly for structural applications. However, with regard to metal matrix composites, interest is growing on account of their physical properties. Indeed, customer requirements in this field cannot always be met by traditional materials. This paper first presents a brief overview of the interaction between fabrication, microstructure and properties of metal matrix composites. Further, some changes in the strategy for modelling and designing these materials are discussed. Finally, future prospects are outlined.     

Enhancement of ablative and interfacial bonding properties of EPDM composites by incorporating epoxy phenolic resin

Effects of epoxy phenolic resin (EPR) on ablative and interfacial bonding properties of EPDM composites were evaluated. Ablative properties of EPDM composites were enhanced by two folds with incorporating 10 phr EPR. This significant enhancement was attributed to positive effect of EPR on thermal stability and thermal insulating properties of EPDM composites as well as formation of compact char layer onto composites. Furthermore, interfacial shear strength of EPDM composites with carbon fiber/epoxy (CF/EP) composites was increased by 55.6% with incorporating 10 phr EPR, due to interfacial chemical reaction of epoxide groups of EPR molecule from EPDM composites with amine group of hardener from CF/EP composites.     

A model for the transverse strain response of unidirectional ceramic matrix composites during tensile testing

A comprehensive micromechanical model relating the longitudinal stress and transverse strain of unidirectional fibre toughened ceramic matrix composites (CMCs) is presented. The model uses different cylindrical unit-cells to describe the composite throughout a tensile test and considers all relevant damage mechanisms. The proposed model takes into account the Poisson contraction of fibre and matrix, the relief of thermal residual stresses upon damage development, and the build-up of compressive radial stresses at the interface due to mismatch between fibre and matrix after debonding and sliding. Thus the modelled transverse strain response depends on a wide range of microstructural and micromechanical parameters. The approach is checked by comparing the experimentally observed and simulated response of a unidirectional SiC/CAS composite of which all constituent properties were determined experimentally. The agreement between experiment and theory is excellent.     

Processing and interfacial bonding strength of 2014 Al matrix composites reinforced with oxidized SiC particles

The SiC powder with a SiO₂ protective layer is used as the reinforcements for 2014 Al/SiC_p composites to suppress the reaction between the Al matrix and the SiC particle. 2014 Al/SiC_p composites were fabricated by vacuum hot pressing (VHP) and subsequent extrusion using 2014 Al powders and the SiC particles covered with a SiO₂ layer. The interfacial product was found to be Mg spinel (MgAl₂O₄) formed mainly by the chemical reactions of the SiO₂ layer covered on SiC particles with the Mg, Al in the 2014 Al alloy matrix. Also the interfacial bonding strength of the composites was investigated using push-out tests of SiC rods with the SiO₂ oxidation layer, which were processed within 2014 Al alloy.     

Microstructure and mechanical properties of aluminum alloy matrix composites reinforced with Fe-based metallic glass particles

Fe-based metallic glass (FMG) particles reinforced Al-2024 matrix composites were fabricated by using the powder metallurgy method successfully. Mechanical alloying result in nanostructured Al-2024 matrix with a grain size of about 30 nm together with a good distribution of the FMG particles in the Al matrix. The consolidation of the composites was performed at a temperature in the super-cooled liquid region of the FMG particles, where the FMG particles act as a soft liquid-like binder, resulting in composites with low or zero porosity. The microstructure and mechanical properties of the composites were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and compression test. The yield and fracture strength of the composites are 403 MPa and 660 MPa, respectively, while retaining a considerable fracture deformation of about 12%. The strengthening mechanism is associated with the grain refinement of the matrix and uniform distribution of the FMG particles.     

Thermal expansion behaviour of aluminum matrix composites with densely packed SiC particles

The coefficient of thermal expansion (CTE) of Al-based metal matrix composites containing 70 vol.% SiC particles (AlSiC) has been measured based on the length change from room temperature (RT) to 500 °C. In the present work, the instantaneous CTE(T) of AlSiC is studied by thermo-elastic models and micromechanical simulation using finite element analysis in order to explain abnormalities observed experimentally. The CTE(T) is predicted according to analytical thermo-elastic models of Kerner, Schapery and Turner. The CTE(T) is modelled for heating and cooling cycles from 20 °C to 500 °C considering the effects of microscopic voids and phase connectivity. The finite element analysis is based on a two-dimensional unit cell model comparing between generalized plane strain and plane stress formulations. The thermal expansion behaviour is strongly influenced by the presence of voids and confirms qualitatively that they cause the experimentally observed decrease of the CTE(T) above 250 °C.     

Effect of metalloid silicon addition on densification,microstructure and thermal–physical properties of Al/diamond composites consolidated by spark plasma sintering

Aluminum matrix composites reinforced with diamond particles were consolidated by spark plasma sintering. Metalloid silicon was added (Al–Si/diamond composites) to investigate the effect. Silicon addition promotes the formation of molten metal during the sintering to facilitate the densification and enhance the interfacial bonding. Meanwhile, the alloying metal matrix precipitates the eutectic-Si on the diamond surfaces acting as the transitional part to protect the improved interface during the cooling stage. The improved interface and precipitating eutectic-Si phase are mutually responsible for the optimized properties of the composites. In this study, for the Al–Si/diamond composite with 55 vol.% diamonds of 75 μm diameter, the thermal conductivity increased from 200 to 412 Wm⁻¹ K⁻¹, and the coefficient of thermal expansion (CTE) decreased from 8.9 to 7.3 × 10⁻⁶ K⁻¹, compared to the Al/diamond composites. Accordingly, the residual plastic strain was 0.10 × 10⁻³ during the first cycle and rapidly became negligible during the second. Additionally, the measured CTE of the Al–Si/diamond composites was more conform to the Schapery’s model.     

Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Polymethyl methacrylate (PMMA) composites filled with Aluminum Nitride (AlN) were prepared by powder processing technique. The microstructures of the composites were investigated by scanning electron microscopy techniques. The effect of AlN filler content (0.1–0.7 volume fraction (vf)) on the thermal conductivity, relative permittivity, and dielectric loss were investigated. As the vf of AlN filler increased, the thermal conductivity of the specimens increased. The thermal conductivity and relative permittivity of AlN/PMMA composites with 0.7 vf AlN filler were improved to 1.87 W/(m K) and 4.4 (at 1 MHz), respectively. The experimental thermal conductivity and relative permittivity were compared with that from simulation model.     

Intermetallic-reinforced aluminum matrix composites produced in situ by friction stir processing

Friction stir processing (FSP) is applied to produce intermetallic-reinforced aluminum matrix composites from elemental powder mixtures of Al-Cu and Al-Ti. The intermetallic phases are identified as Al₂Cu and Al₃Ti, which are formed in situ during FSP. The volume fraction of the intermetallic phases in the in situ composites may reach as high as ∼ 0.5. The composites produced by FSP are fully dense with high strength, and the composite strength increases with the reinforcement content.     

A model of thermal conductivity of nanofluids with interfacial shells

We derive an expression for the effective thermal conductivity of nanofluids with interfacial shells. Comparing with conventional models, the expression is not only depended on the thermal conductivity of the solid and liquid and their relative volume fraction, but also depended on the particle size and interfacial properties. The theoretical results on the effective thermal conductivity of CuO/water and CuO/ethylene glycol nanofluids are in good agreement with the experimental data.     

Interface diffusion-induced creep and stress relaxation in unidirectional metal matrix composites under biaxial loading

Analytical solutions are developed for interface diffusion-induced creep and stress relaxation in unidirectional metal matrix composites under biaxial transverse loading. The driving force for the interface diffusion is the normal stress acting on the interface, which is obtained from rigorous Eshelby inclusion theory. The solutions are a function of the applied stress, volume fraction and radius of the reinforced-fiber, the modulus ratio between the fiber and the matrix, specially, exhibit a strong dependence of creep rate and stress relaxation behavior on the biaxial stress ratio. Moreover, the solution for the interface stress presented in this study also gives some insight into the relationship between the interface diffusion and interface slip. For the application of the solutions in the realistic composites, the scale effect is taken into account by detailed finite element analysis based on a unit cell model.