Electron beam curing of polymer composites

Electron‐beam (E‐Beam) curing of an epoxy polymer matrix and its composite (reinforced with IM7 Carbon fibers) was studied using a cationic photoinitiator. Photoinitiator concentration, dose, and process temperature were varied to understand their influence on E‐beam curing. Optimal photoinitiator concentration was found to be 5 phr. The curing was due to a primary α reaction with a strong dependence on dose, and a secondary β reaction with a weak dependence on dose and a strong dependence on initiator concentration. The extent of cure increased rapidly with dose until 100 kGy and it approached a plateau value beyond 100 kGy. This plateau value corresponded to incomplete curing by 27% for resin and 22% for composite at a process‐temperature of 22°C. The causes for incomplete curing appear to be the secondary β reaction and diffusional limitation. Increase in process temperature resulted in higher extent of cure at a dose level. The material used in this study was also found to be thermally curable and the reaction onset temperature (measured in a DSC ramp experiment) reduced from about 150°C at 0 kGy to about 50°C at 30 kGy. This indicates that simultaneous thermal curing during E‐beam curing of resin and composite is possible. After thermal post‐curing, the T_g of the E‐beam cured resin increased from 130°C at 200 kGy to a value greater than 370°C and the modulus decreased by 10%. The service temperature and the modulus of the 100% thermally cured resin and the thermally post‐cured (after E‐Beam irradiation) resin were comparable.     

Electron Beam Curing of the System Cycloaliphatic Diepoxide‐Epoxidized Natural Rubber‐Glycidyl Methacrylate in Presence of Cationic Initiators

Electron beam curing of the system cycloaliphatic diepoxide‐epoxidized natural rubber‐glycidyl methacrylate containing a cationic initiator was carried out. Storage modulus, glass transition temperature and pendulum hardness were measured as function of EB dose, photoinitiator concentration, content of epoxidized natural rubber, post cure temperature and post cure time. At electron beam doses larger than 100 kGy a highly cross‐linked polymer network is generated which shows a two phase morphology. Microscale elastomeric domains are incorporated into a continuous epoxy resin phase. Dynamical mechanical analysis and pendulum hardness measurement show that an increase of the ENR ratio leads to a more elastic polymer network. Post curing results in increased glass transition temperatures. This EB cured polymer system is believed to provide both toughness and favorable viscoelastic properties to be used as component of EB curable composites.     

不同化学结构环氧树脂电子束固化效果的分析

研究了化学结构对环氧树脂电子束辐射反应速率和辐射固化效果的影响。对于分子量相近的环氧树脂，反应速率大的环氧树脂体系最终达到的反应程度较高。酚醛型环氧树脂辐射反应活性高，固化后的高温模量及玻璃化转变温度高于双酚A型环氧树脂，但固化度沿辐射深度方向下降较快，脂环族环氧树脂的辐射反应活性小，在相同辐射条件下的固化效果差。缩水甘油胺结构的环氧树脂对于碘Wong盐引发的电子束辐射固化反应没有活性。     

Exothermic effect in the process of electron‐beam curing of epoxy resins

Temperature measurements have been performed in the process of electron‐beam curing of EB‐I and EB‐II epoxy resin systems. The influence of initiator content, resin type, and dose rate on the temperature of the systems was studied. Transverse and longitudinal temperatures of samples in the glass vessel were also analyzed. The nature of temperature curves varied with the different epoxy resin systems in the steel mold, but did not change with different contents of the initiator. At the same time, the heat had no effect on the gel fraction of epoxy resin systems. The temperature curve was greatly affected by the dose rate, and its peak value, peak width, and plateau value also increased with it. The transverse temperature of EB‐II glass vessel samples increased as the radiation dose increased and, in the same sample, the temperature reduced as the distance between the radiation center and the test point increased. The longitudinal temperature of EB‐I and EB‐II resin systems in a glass vessel decreased as the radiation depth increased. As the radiation dose increased, the temperature of the EB‐I resin system increased simultaneously, while that of the EB‐II resin system initially increased and then kept constant when the dose reached a certain value. The temperatures of these two resin systems decreased rapidly when the radiation process stopped. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 2217–2222, 2004     

Three-dimensional simulations of the curing step in the resin transfer molding process

The curing step in resin transfer molding process involves heat transfer coupled with the curing reaction of thermoset resin. In order to examine the curing behavior under a specified cure cycle in the resin transfer molding process, numerical simulations are carried out by three-dimensional finite elements method. An experimental study for isothermal cure kinetics of epoxy resin is conducted by using differential scanning calorimetry. Kinetic parameters based on the modified Kamal model are determined from the calorimetric data for the epoxy system, and by using these parameters, numerical simulations are performed for a hat-shaped mold. It is found from the simulation results that the temperature profile and the degree of cure are well predicted for the region inside the mold. This numerical study can provide a systematic tool in the curing process to find an optimum cure cycle and a uniform distribution of the degree of cure.     

邻苯二甲酸二烯丙基酯树脂固化特性的研究

运用示差扫描量热(DSC)法研究了邻苯二甲酸二烯丙基酯(DAP)树脂的固化反应历程。讨论了引发剂对DAP固化特性的影响,并由DSC曲线得到了DAP树脂的固化工艺和动力学参数。通过固化度、FT-IR的测试对DAP树脂在中温条件下的固化情况进行了研究。结果表明:在过氧化二异丙苯(DCP)固化体系中引入BPO可以使DAP树脂在更低温度下引发固化;在BPO、DCP用量均为2%的条件下,确定了体系的凝胶温度、固化温度、后处理温度分别为:100.5℃,124.3℃,137.8℃,表观活化能为129.3 kJ/mol,反应级数为0.950。固化度、FTIR的测试结果表明:DAP树脂在中温条件下可以固化得较完全。     

Resin transfer molding (RTM) process of a high performance epoxy resin. I: Kinetic studies of cure reaction

The cure kinetics of a high performance PR500 epoxy resin in the temperature range of 160–197°C for the resin transfer molding (RTM) process have been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and the rate of cure reaction and the degree of cure being determined under isothermal conditions. A modified Kamal's kinetic model was adapted to describe the autocatalytic and diffusion‐controlled curing behavior of the resin. A reasonable agreement between the experimental data and the kinetic model has been obtained over the whole processing temperature range, including the mold filling and the final curing stages of the RTM process.     

基于变活化能模型的T800/环氧树脂预浸料固化反应动力学研究

为了深入了解某新型高温固化T800/环氧树脂预浸料的固化行为,借助差示扫描量热仪(DSC),采用非等温DSC法研究了T800/环氧树脂预浸料的固化反应过程。基于唯象模型,系统研究了该预浸料的固化反应特征温度及固化动力学参数,确定该预浸料中环氧树脂的固化反应动力学模型为自催化模型。采用等转化率法,分析了预浸料中环氧树脂的反应活化能随固化度的变化情况,结果表明在整个固化反应过程中,树脂固化反应活化能变化较大,传统模型法基于全固化过程活化能不变的假设无法准确描述该固化反应。采用变活化能自催化模型,利用粒子群全局优化算法,得到了T800/环氧树脂预浸料的固化动力学方程,结果表明该模型能较好地描述实验现象,可为进一步研究该预浸料的热力学性能及其成型过程中的质量控制提供理论基础。     

Material systems for rapid manufacture of composite structures

A manufacturing process is described that builds complex composite parts using a layered building process in which each layer of pre‐preg composite is laid and cured as the build progresses. In order to employ on‐line curing without molds, resin technologies that provide fast curing at room temperature—ultraviolet curable and epoxy/polyamide—were investigated. UV‐curable resins were tested for their ability to “shadow” cure by exposing carbon fiber composites to ultraviolet light to determine if the cure propagated from areas directly exposed to areas under fibers. Though ultraviolet curing showed advantages in cure time and low volatile production, very minimal “shadow” curing was achieved. A low temperature curing epoxy/polyamide mixture was tested for the effects of cure temperature, cure time, and mix ratio on the final degree of cure (%DOC) and glass transition temperature (T_g). Layers were made using different resin mixtures, partially cured, and used to build layered parts to determine curing characteristics during the lay‐up process. In the epoxy/polyamide mixtures, mix ratio had little effect on the reaction rate but did affect the T_g. A kinetic model was established for the resin epoxy/polyamide system for optimizing processing conditions during fabrication. However, the model failed to correctly predict the fabrication. The reaction of the material was different during the fabrication process than during the isothermal cure due to the presence of oxygen. During the build process, the degree of cure in each layer increased significantly over the prestaged degree of cure in less time than theoretically predicted. However, the final resin properties, such as T_g, were still below the specifications for high performance parts.     

Ultraviolet‐curing behavior of an epoxy acrylate resin system

Ultraviolet (UV)‐curing behavior of an epoxy acrylate resin system comprising an epoxy acrylate oligomer, a reactive diluent, and a photoinitiator was investigated by Fourier transform infrared (FTIR) spectroscopy. The conversion changes of the resin system containing 20 phr of 1,6‐hexanediol diacrylate as a reactive diluent and 2‐hydroxy‐2‐methyl‐1‐phenyl‐propan‐1‐one as a photoinitiator were measured under different UV‐curing conditions. The fractional conversion was calculated from the area of the absorption peak for the vinyl group vibration occurring at 810 cm^?1. The effects of photoinitiator concentration, total UV dosage, one‐step or stepwise UV irradiation, UV intensity, atmosphere, and temperature on the curing behavior of the resin system were investigated. The conversion of the resin system increased rapidly at the initial stage of the UV‐curing process but increased very slowly after that. The final conversion of the resin system was mainly affected by total UV dosage. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1180–1185, 2005     

Thermogravimetric and Fourier‐transform infrared analyses on the cure behavior of polycardanol containing epoxy groups cured by electron beam

In this study, the curing behavior of polycardanol containing epoxy groups (diepoxidized polycardanol) was exploited in terms of thermal stability and the cure reaction conversion by means of thermogravimetric analysis and Fourier‐transform infrared spectroscopy, respectively. The effect of photo‐initiator type and concentration and electron beam absorption dose in the presence of cationic photo‐initiators (triarylsulfonium hexafluorophosphate (P‐type) and triarylsulfonium hexafluoroantimanate (Sb‐type) on the cure behavior of diepoxidized cardanol (DEC) resin was investigated. The thermal stability of DEC with Sb‐type photo‐initiator was higher than that with P‐type one, being increased with increasing the concentration and electron beam absorption dose. The conversion of cure reaction was gradually increased with increasing the dose, showing the maximum at 800 kGy. The results revealed that Sb‐type photo‐initiator, the concentration of 2 or 3 wt %, and electron beam absorption dose of about 800 kGy may be preferable for initiating epoxy ring opening in the DEC molecules as well as for efficiently curing the DEC resin by electron beam irradiation. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41599.     

Influence of moisture content on curing behavior of two-step phenolic molding compounds

Using prepared and commercial two-step phenolic molding compounds, the influence of moisture on their curing behavior was examined by the disk cure test and the solvent extraction method for the early and middle stages of the curing process, respectively. It was determined that moisture in the compounds could enhance the curing rate and the degree of cure as well as flowability. A possible mechanism explaining the acceleration of curing was proposed, suggesting that moisture might facilitate catalytically the decomposition of hexamine or hexamine-novolac adduct into reactive low molecular weight materials, which could then easily react with a resin even in a state of fairly advanced cure due to their facile diffusion.     

Irradiation dose control for polymer‐matrix composites fabricated by in situ curing with low‐energy electron beam

The electron beam (EB) with emitting energies lower than 150 keV is applicable in in situ curing of polymer‐matrix composites; however, being poor in penetration ability, it leads to significant attenuation of irradiation dose along the prepreg thickness. In this study, polymer‐matrix composites were fabricated by low‐energy EB irradiation curing, and the effect of dose control of double‐sided irradiation was systematically investigated. Experimental results showed that laminates fabricated by single‐sided irradiated prepregs were low in interlaminar shear strength (ILSS) owing to incomplete curing after being post cured at 180 °C for 30 min. A double‐sided irradiation method which included irradiation of equal dose and different doses on both sides of the prepreg was proposed to overcome this difficulty. Analysis showed that under a total dose of 70 and 100 kGy, the ILSS results were high owing to the low curing degree of two adhesive surfaces; under a total dose of 130 and 160 kGy, laminates fabricated with different EB irradiation doses on both sides exhibited enhanced ILSS compared to those with equal dose on both sides, owing to physical adhesion and chemical crosslinking between layers. The ILSS results exhibited the largest increase of 18.9 and 60.5%, respectively, by tuning the dose differences between both sides of the prepregs. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44944.     

Low‐energy electron beam‐induced cationic polymerization with onium salts

Demand for higher polymer performance with very short cure times has resulted in the development of low energy electron beam processes. This article presents the results of such a process for curing two epoxy systems, namely 3,4‐epoxycyclohexylmethyl‐3′,4′‐epoxycyclohexane carboxylate and di‐glycidyl ether of bisphenol A (DGEBA), using the cationic photoinitiator salts, triarylsulfonium hexafluoroantimonate, and diaryliodonium hexafluoroantimonate, respectively. Glass transition temperature measurements were done using a modulated DSC method while the degree of conversion was measured using FTIR spectroscopy. Results indicate that for both epoxy systems a relatively low dosage of not more than 5 Mrad was sufficient to achieve up to 60% conversion, with up to 80% conversion achievable using 30 Mrad. The diaryliodonium salt appeared to be more effective than the sulphonium salt in the above study. The effect of varying photoinitiator concentration and the resulting glass transition temperature has been studied. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 3099–3108, 2001     

Curing kinetics and viscosity change of a two‐part epoxy resin during mold filling in resin‐transfer molding process

The curing kinetics and the resulting viscosity change of a two‐part epoxy/amine resin during the mold‐filling process of resin‐transfer molding (RTM) of composites was investigated. The curing kinetics of the epoxy/amine resin was analyzed in both the dynamic and the isothermal modes with differential scanning calorimetry (DSC). The dynamic viscosity of the resin at the same temperature as in the mold‐filling process was measured. The curing kinetics of the resin was described by a modified Kamal kinetic model, accounting for the autocatalytic and the diffusion‐control effect. An empirical model correlated the resin viscosity with temperature and the degree of cure was obtained. Predictions of the rate of reaction and the resulting viscosity change by the modified Kamal model and by the empirical model agreed well with the experimental data, respectively, over the temperature range 50–80°C and up to the degree of cure α = 0.4, which are suitable for the mold‐filling stage in the RTM process. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2139–2148, 2000     

Kinetic Study on UV-curing of Hyperbranched Polysiloxane

Ultraviolet (UV) curing kinetics of hyperbranched polysiloxane (HBP) initiated by 2-Hydroxy-2-methyl-1-[(4-isobutyl)phenyl]-1-propanone (Trade name: IHT-PI 185) was studied by using Differential Photo Calorimeter (DPC). The effects of photoinitiator concentration, UV irradiation intensity, environment temperature and atmosphere on curing behaviors were investigated. It was found that both curing rate (R) and ultimate vinyl conversion percentage (C) first increase and then tend to stabilize within 3 wt% of photoinitiator concentration. Higher UV irradiation intensity can lead to higher values of R and C. Particularly, R is proportional to the square root of irradiation intensity at initial stage. Although raising temperature could raise the values of R and C, the effect of temperature on R is not marked. Oxygen possesses a notable inhibition effect on curing, however, induction period can be reduced by enhancing irradiation intensity. Curing kinetics was studied using Ameliorated Autocatalytic Model attaching a diffusion term. It is found that the model is suitable to describe the autocatalysis effect at the initial stage and the termination stage controlled by diffusion process. The kinetic parameters including total apparent curing exponent and apparent activation energy calculated by model above are c.a. 6 and 13.15 KJ/mol, respectively.     

Cure characterization of Cycom 977‐2A carbon/epoxy composites for quickstep processing

In this effort, Quickstep, a relatively a new technique, have been employed for manufacturing of composite materials. The cure schedule provided by a prepreg manufacturer is usually designed for autoclave or other traditional processing techniques and thermosetting resin systems are formulated for ramp rate curing 2–3 K min^?1. While in case of Quickstep processing, ramp rates of 15 K min^?1 can be achieved, thus changing the chemorheology of resin. The cure process of 977‐2A carbon/epoxy composites was evaluated for Quickstep processing using differential scanning calorimetry (DSC), dynamic mechanical and thermal analysis, and Fourier transformed infrared and results were compared with cure cycle employed for autoclave curing. Optimum hold time for Quickstep processing at upper curing temperature (180°C) was determined using DSC. The hold time of 120 min at 180°C was found to be suitable for Quickstep cure cycle, producing a panel of similar degree of cure to that achieved through autoclave processing schedule. Final degree of cure was dependent on time spent at upper cure temperature and slightly on initial steps of the cure cycle which was used to control the resin flow, fiber wetting, and void removal. Quickstep processed samples exhibited higher T_g and crosslink density and similar molecular network structure to the autoclave cured samples. POLYM. ENG. SCI., 54:887–898, 2014. © 2013 Society of Plastics Engineers     

Investigation of curing characteristics of carbon fiber/epoxy composites cured with low‐energy electron beam

To solve the penetration depth of carbon fiber/epoxy prepreg and irradiation dose uniformity by low‐energy E‐Beam under 125 keV, the both‐side irradiation curing of prepreg was investigated. The results show that there is little thermal effect during the low‐energy electron beam irradiation curing process, even though the irradiation dosage reached 300 kGy, only 46.2°C can be tested on the prepreg surface. Due to the low curing temperature, the degree of cure of prepreg was only 61.8% at 300 kGy level of irradiation, and the glass‐transition temperature (T_g) was only 48.6°C. The degree of cure and T_g can be increased sharply by thermal postcure. After being postcured at 160°C for 30 min, the degree of cure and the T_g of prepreg reached 98.5% and 170.4°C, respectively. Interlaminar shear strength testing result indicate that the fabrication process of the composite layer by layer curing by the low‐ energy E‐Beam is a promising cure approach. POLYM. COMPOS., 36:1731–1737, 2015. © 2014 Society of Plastics Engineers     

A chemorheological model for the cure of unsaturated polyester resin

A chemorheological model is developed, using the free volume concept, for the prediction of viscosity during the cure of unsaturated polyester resin. We have incorporated into the development of the chemorheological model a mechanistic kinetic model of curing kinetics that predicts the degree of cure as a function of cure time. The mechanistic kinetic model uses an approach of free-radical polymerization that takes into account diffusion-controlled curing reactions, In order to test the usefulness of the chemorheological model developed, we have conducted cure experiments and measured viscosities of partially cured resin samples, using a general-purpose unsaturated polyester resin. Specifically, the following measurements were taken: (1) the quantity of ethylenic double bonds in the resin system before and after the cure reaction by infrared spectroscopy, (2) the glass transition temperature by differential scanning calorimetry (DSC) and (3) the viscosity as a function of shear rate, at several temperatures, using a cone-and-plate rheometer. It is concluded that the chemorheological model developed is very useful for predicting the variation of viscosity during the cure of unsaturated polyester resin.     

改性双马来酰亚胺树脂固化反应动力学的研究

用 PE DSC-7仪器测定了 N,N,N′,N′—四烯丙基二苯甲烷二胺改性双马来酰亚胺树脂的比热容,并借助DSC-7动力学软件得到该树脂的固化反应级数n=1.39±0.10、反应活化能E_a=138±7.77kJ/mol和表观频率因子InZ=28.6±1.921/sec;还预测了树脂的固化反应程度(d),固化反应温度(T)和固化反应时间 (t)三者间相互关系,并计算了凝胶化温度(Tgel)、固化温度(Tcure)和后处理温度(Ttreat)。