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1.
A novel trifluoromethyl‐containing aromatic diamine monomer, 2,5‐bis (4‐amino‐2‐trifluoromethylphenoxy)biphenyl (2), was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and phenylhydroquinone in the presence of potassium carbonate to yield the intermediate dinitro compound (1), followed by catalytic reduction with hydrazine and Pd/C. A series of fluorinated polyimides (code 5a–f) were synthesized from diamine (2) with six commercially available aromatic dianhydrides using a standard two‐stage process with thermal or chemical imidization of poly(amic acid). Most of fluorinated polyimides showed good solubility at a concentration of 5–10 wt % and even in pyridine and dioxane. For improving solubility of 5c, copolyimides (5c/a–f) were also prepared from 2 and a pair of dianhydrides (3c/a–f), which were mixed in the molar ratio 1:1. All the polyimide films had a tensile strength in the range from 73 to 112 MPa, an elongation at break within a range of 9–23%, and an initial modulus in the range of 1.6–2.2 GPa. These polyimides exhibited glass transition temperatures of 220–267°C and showed no significant decomposition below 500°C under either nitrogen or air atmosphere. In comparison with the analogous nonfluorinated polyimides based on 2,5‐bis (4‐aminophenoxy) biphenyl (2′), the fluorinated polyimides showed better solubility as well as reduced color intensity, lower dielectric constant, and moisture absorption. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4101–4110, 2006  相似文献   

2.
A polyfluorinated aromatic diamine, 3,3′, 5,5′‐tetrafluoro‐4,4′‐diaminodiphenylmethane (TFDAM), was synthesized and characterized. A series of polyimides, PI‐1–PI‐4, were prepared by reacting the diamine with four aromatic dianhydrides via a one‐step high‐temperature polycondensation procedure. The obtained polyimide resin had moderate inherent viscosity (0.56–0.68 dL/g) and excellent solubility in common organic solvents. The polyimide films exhibited good thermal stability, with an initial thermal decomposition temperature of 555°C–621°C, a 10% weight loss temperature of 560°C–636°C, and a glass‐transition temperature of 280°C–326°C. Flexible and tough polyimide films showed good tensile properties, with tensile strength of 121–138 MPa, elongation at break of 9%–12%, and tensile modulus of 2.2–2.9 GPa. The polyimide films were good dielectric materials, and surface and volume resistance were on the order of a magnitude of 1014 and 1015 Ω cm, respectively. The dielectric constant of the films was below 3.0 at 1 MHz. The polyfluorinated films showed good transparency in the visible‐light region, with a cutoff wavelength as low as 302 nm and transmittance higher than 70% at 450 nm. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1442–1449, 2007  相似文献   

3.
Three novel polyimides (PIs) having pendent 4‐(quinolin‐8‐yloxy) aniline group were prepared by polycondensation of a new diamine with commercially available tetracarboxylic dianhydrides, such as pyromellitic dianhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and bicyclo[2.2.2]‐oct‐7‐ene‐2,3,5,6‐tetracarboxylic dianhydride. These PIs were characterized by FTIR, 1H NMR, and elemental analysis; they had high yields with inherent viscosities in the range of 0.4–0.5 dl g−1, and exhibited excellent solubility in many organic solvents such as N,N‐dimethyl acetamide, N,N′‐dimethyl formamide, N‐methyl pyrrolidone (NMP), dimethyl sulfoxide, and pyridine. These PIs exhibited glass transition temperatures (Tg) between 250 and 325° C. Their initial decomposition temperatures (Ti) ranged between 270 and 450°C, and 10% weight loss temperature (T10) up to 500°C with 68% char yield at 600°C under nitrogen atmosphere. Transparent and hard polymer films were obtained via casting from their NMP solutions. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011  相似文献   

4.
Two series of melt‐processable polyimides were prepared from 4,4′‐bis(3‐amino‐5‐trifluoromethylphenoxy)biphenyl (m‐6FBAB) and 4,4′‐bis(4‐amino‐5‐trifluoromethylphenoxy) biphenyl (p‐6FBAB) with various aromatic dianhydrides. The effects of the chemical structures of the polyimides on their properties, especially the melt processability and organic solubility, were investigated. The experimental results demonstrate that some of the fluorinated aromatic polyimides showed good melt processability at elevated temperatures (250–360°C) with relatively low melt viscosities and could be melt‐molded to produce strong and tough polyimide sheets. Meanwhile, the polyimides showed excellent organic solubility in both polar aprotic solvents and common solvents to give stable polyimide solutions with high polymer concentrations and relatively low viscosities. Thus, we prepared high‐quality polyimide films by casting the polyimide solutions on glass plates followed by baking at relatively low temperatures. The polyimides derived from m‐6FBAB showed better melt processability and solubility than the p‐6FBAB based polymers. The melt‐processable polyimides showed a good combination of thermal stability and mechanical properties, with decomposition temperatures of 547–597°C, glass‐transition temperatures in the range 205–264°C, tensile strengths of 81.3–104.9 MPa, and elongations at break as high as 19.6%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   

5.
The objective of this research was the preparation of polyimides from 1,2‐bis(p‐dimethylaminophenylimino)alkane homologues and various dianhydrides in N‐methylpyrrolidone by one‐stage polycondensation. The monomers were prepared via condensation of p‐dimethylaminobenzaldehyde and the corresponding diamines, 1,4‐diaminobutane, 1,3‐diaminopropane and 1,2‐diaminoethane. The influence of the incorporation of this moiety into the polymer backbone on the properties of the polyimides has been evaluated. The thermogram of the polyimides indicated that PI‐10 to PI‐32 had Tg values ranging from 181 to 290 °C. The inherent viscosities of the polymers ranged from 0.99 to 2.05 dl g?1, and the highest solubility was obtained without significant loss of the thermal properties. Copyright © 2004 Society of Chemical Industry  相似文献   

6.
A novel fluorinated diamine monomer, 2,2‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]propane (2), was prepared through the nucleophilic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride with 2,2‐bis(4‐hydroxyphenyl)propane in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C. Polyimides were synthesized from diamine 2 and various aromatic dianhydrides 3a–f via thermal imidization. These polymers had inherent viscosities ranging from 0.73 to 1.29 dL/g. Polyimides 5a–f were soluble in amide polar solvents and even in less polar solvents. These films had tensile strengths of 87–100 MPa, elongations to break of 8–29%, and initial moduli of 1.7–2.2 GPa. The glass transition temperatures (Tg) of 5a–f were in the range of 222–271°C, and the 10% weight loss temperatures (T10) of them were all above 493°C. Compared with polyimides 6 series based on 2,2‐bis[4‐(4‐aminophenoxy)phenyl]propane (BAPP) and polyimides 7 based on 2,2‐Bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane (6FBAPP), the 5 series showed better solubility and lower color intensity, dielectric constant, and lower moisture absorption. Their films had cutoff wavelengths between 363 and 404 nm, b* values ranging from 8 to 62, dielectric constants of 2.68–3.16 (1 MHz), and moisture absorptions in the range of 0.04–0.35 wt %. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 95: 922–935, 2005  相似文献   

7.
To investigate the CF3 group affecting the coloration and solubility of polyimides (PI), a novel fluorinated diamine 1,1‐bis[4‐(4‐amino‐2‐ trifluoromethylphenoxy)phenyl]‐1‐phenylethane (2) was prepared from 1,1‐ bis(4‐hydrophenyl)‐1‐phenylethan and 2‐chloro‐5‐nitrobenzotrifluoride. A series of light‐colored and soluble PI 5 were synthesized from 2 and various aromatic dianhydrides 3a–f using a standard two‐stage process with thermal 5a– f(H) and chemical 5a–f(C) imidization of poly(amic acid). The 5 series had inherent viscosities ranging from 0.55 to 0.98 dL/g. Most of 5a–f(H) were soluble in amide‐type solvents, such as N‐methyl‐2‐pyrrolidone (NMP), N,N‐ dimethylacetamide (DMAc), and N,N‐dimethylformamide (DMF), and even soluble in less polar solvents, such as m‐Cresol, Py, Dioxane, THF, and CH2Cl2, and the 5(C) series was soluble in all solvents. The GPC data of the 5a–f(C) indicated that the Mn and Mw values were in the range of 5.5–8.7 × 104 and 8.5–10.6 × 104, respectively, and the polydispersity index (PDI) Mw /Mn values were 1.2–1.5. The PI 5 series had excellent mechanical properties. The glass transition temperatures of the 5 series were in the range of 232–276°C, and the 10% weight loss temperatures were at 505–548 °C in nitrogen and 508–532 °C in air, respectively. They left more than 56% char yield at 800°C in nitrogen. These films had cutoff wavelengths between 356.5–411.5 nm, the b* values ranged from 5.0–71.1, the dielectric constants, were 3.11–3.43 (1MHz) and the moisture absorptions were in the range of 011–0.40%. Comparing 5 containing the analogous PI 6 series based on 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐ phenylethane (BAPPE), the 5 series with the CF3 group showed lower color intensity, dielectric constants, and better solubility. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 2399–2412, 2005  相似文献   

8.
A series of molecular‐weight‐controlled imide resins end‐capped with phenylethynyl groups were prepared through the polycondensation of a mixture of 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene and 1,3‐bis(4‐aminophenoxy)benzene with 4,4′‐oxydiphthalic anhydride in the presence of 4‐phenylethynylphthalic anhydride as an end‐capping agent. The effects of the resin chemical structures and molecular weights on their melt processability and thermal properties were systematically investigated. The experimental results demonstrated that the molecular‐weight‐controlled imide resins exhibited not only meltability and melt stability but also low melt viscosity and high fluidability at temperatures lower than 280°C. The molecular‐weight‐controlled imide resins could be thermally cured at 371°C to yield thermoset polyimides by polymer chain extension and crosslinking. The neat thermoset polyimides showed excellent thermal stability, with an initial thermal decomposition temperature of more than 500°C and high glass‐transition temperatures greater than 290°C, and good mechanical properties, with flexural strengths in the range of 140.1–163.6 MPa, flexural moduli of 3.0–3.6 GPa, tensile strengths of 60.7–93.8 MPa, and elongations at break as high as 14.7%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2008  相似文献   

9.
A new kind of pyridine‐containing aromatic diamine monomer, 4‐phenyl‐2,6‐bis[4‐(4‐aminophenoxy)phenyl]‐pyridine (PAPP), was successfully synthesized by a modified chichibabin reaction of benzaldehyde and a substituted acetophenone, 4‐(4‐nitrophenoxy)‐acetophenone (NPAP), followed by a reduction of the resulting dinitro compound 4‐phenyl‐2,6‐bis[4‐(4‐nitrophenoxy)phenyl]‐pyridine (PNPP) with Pd/C and hydrazine monohydrate. The aromatic diamine was employed to synthesize a series of new pyridine‐containing polyimides by polycondensation with various aromatic dianhydrides in N‐methy‐2‐pyrrolidone (NMP) via the conventional two‐step method, i.e., ring‐opening polycondensation forming the poly (amic acid)s and further thermal or chemical imidization forming polyimides. The inherent viscosities of the resulting polyimides were in the range of 0.79–1.13 dL/g, and most of them were soluble in common organic solvents such as N,N‐dimethylacetamide (DMAc), NMP, and tetrahydrofuran (THF), etc. Meanwhile, strong and flexible polyimide films were obtained, which had good thermal stability, with the glass transition temperatures (Tg) of 268–338°C and the temperature at 5% weight loss of 521–548°C in air atmosphere, as well as outstanding mechanical properties with tensile strengths of 89.2–112.1 MPa and elongations at break of 9.5–15.4%. The polyimides also were found to possess low dielectric constants ranging from 2.53 to 3.11. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 212–219, 2007  相似文献   

10.
A new kind of aromatic unsymmetrical diamine monomer containing thiazole ring, 2‐amino‐5‐(4‐aminophenyl)‐thiazole (AAPT), was synthesized. A series of novel polyimides were prepared by polycondensation of AAPT with various aromatic dianhydrides by one‐step polyimidation process. The synthesized polyimides had inherent viscosity values of 0.36–0.69 dL/g and were easily dissolved in highly dipolar solvents. Meanwhile, strong and flexible polyimide films were obtained, which have good thermal and thermo‐oxidative stability with the glass transition temperatures (Tg) of 276.7–346.1°C, the temperature at 5% weight loss of 451–492°C in nitrogen and 422–440°C in air, as well as have outstanding mechanical properties with the tensile strengths of 94–122 MPa, elongations at breakage of 5–18%. These films also had dielectric constants of 3.12–3.38 at 10 MHz. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   

11.
Cheng-Lin Chung  Sheng-Huei Hsiao   《Polymer》2008,49(10):2476-2485
A novel trifluoromethyl-substituted bis(ether amine) monomer, 1,6-bis(4-amino-2-trifluoromethylphenoxy)naphthalene, was prepared through the nucleophilic substitution reaction of 2-chloro-5-nitrobenzotrifluoride and 1,6-dihydroxynaphthalene in the presence of potassium carbonate in dimethyl sulfoxide, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of new fluorinated polyimides were synthesized from the diamine with various commercially available aromatic tetracarboxylic dianhydrides via a conventional two-stage process with the thermal or chemical imidization of the poly(amic acid) precursors. Most of the polyimides obtained from both routes were soluble in many organic solvents such as N-methyl-2-pyrrolidone and N,N-dimethylacetamide. All the polyimides could afford transparent, flexible, and strong films with low moisture absorptions of 0.12–0.52% and low dielectric constants of 2.75–3.13 at 10 kHz. Thin films of these polyimides showed an UV–vis absorption cutoff wavelength at 376–428 nm, and those of polyimides from 4,4′-oxydiphthalic dianhydride (ODPA) and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) were essentially colorless. The polyimides exhibited excellent thermal stability, with decomposition temperatures (at 10% weight loss) above 530 °C in both air and nitrogen atmospheres and glass transition temperatures (Tgs) in the range of 241–298 °C. For a comparative study, some properties of the present fluorinated polyimides were compared with those of structurally related ones prepared from 1,6-bis(4-aminophenoxy)naphthalene and 2,6-bis(4-amino-2-trifluoromethylphenoxy)naphthalene.  相似文献   

12.
A novel fluorinated bis(ether amine) monomer, 2,3-bis(4-amino-2-trifluoromethylphenoxy)naphthalene, was prepared through the nucleophilic aromatic substitution reaction of 2-chloro-5-nitrobenzotrifluoride and 2,3-dihydroxynaphthalene in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C. A series of new fluorine-containing polyimides having inherent viscosities of 0.54 to 1.10 dl/g were synthesized from the diamine with various commercially available aromatic dianhydrides using a standard two-stage process with thermal imidization of poly(amic acid) films. These polyimides were highly soluble in a variety of organic solvents, and most of them afforded transparent, light-colored, and tough films with good tensile strengths. These polyimides exhibited glass transition temperatures (Tgs) of 247-300 °C and showed no significant decomposition below 500 °C under either nitrogen or air atmosphere. Except for the polyimide derived from pyromellitic dianhydride, the polyimide films were almost colorless, with an ultraviolet-visible absorption cutoff wavelength below 400 nm and low b∗ values (a yellowness index) of 10.7-41.9. These polyimides had dielectric constants of 3.09 to 3.65 (1 MHz) and moisture absorptions in the range of 0.2-0.3 wt%.  相似文献   

13.
A novel aromatic diamine monomer, 4‐(3,5‐dimethoxyphenyl)‐2,6‐bis(4‐aminophenyl)pyridine (DPAP) was successfully synthesized by 4′‐nitroacetophenone and 3,5‐dimethoxybenzaldehyde as raw material. The structure of DPAP was confirmed by Fourier transform infrared, nuclear magnetic resonance, and mass analysis. A series of polyimides (PIs) were obtained by polycondensation with various dianhydrides via the conventional two‐step method. These PIs showed good solubility in organic solvents. They also presented high thermal stability, the glass transition temperatures (Tg) of polymers were in the range of 325–388 °C, and the temperature at 10% weight loss was in the range of 531–572 °C. Furthermore, these polymers also exhibited outstanding hydrophobicity with the contact angles in the range of 89.1°–93.5°. Moreover, the results of wide‐angle X‐ray diffraction (WAXD) confirmed these polymers showed amorphous structure. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45827.  相似文献   

14.
A CF3‐containing diamine, 4,4′‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzophenone ( 2 ), was synthesized from 4,4′‐dihydroxybenzophenone and 2‐chloro‐5‐nitrobenzotrifluoride. Imide‐containing diacids ( 3 and 5Ba – 5Bg ) were prepared by the condensation reaction of aromatic diamines and trimellitic anhydride. Then, two series of novel soluble aromatic poly(amide imide)s (PAIs; 6Aa – 6Ak and 6Ba – 6Bg ) were synthesized from a diamine ( 4Aa – 4Ak or 2 ) with the imide‐containing diacids ( 3 and 5Ba – 5Bg ) via direct polycondensation with triphenyl phosphate and pyridine. The aromatic PAIs had inherent viscosities of 0.74–1.76 dL/g. All of the synthesized polymers showed excellent solubility in amide‐type solvents, such as N‐methyl‐2‐pyrrolidone and N,N‐dimethylacetamide (DMAc), and afforded transparent and tough films by DMAc solvent casting. These polymer films had tensile strengths of 90–113 MPa, elongations at break of 8–15%, and initial moduli of 2.0–2.9 GPa. The glass‐transition temperatures of the aromatic PAIs were in the range 242–279°C. They had 10% weight losses at temperatures above 500°C and showed excellent thermal stabilities. The 6B series exhibited less coloring and showed lower yellowness index values than the corresponding 6A series. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102:3641–3653, 2006  相似文献   

15.
A novel fluorinated bis(ether amine) monomer, 2,6‐bis(4‐amino‐2‐trifluoromethylphenoxy) naphthalene, was prepared through the nucleophilic aromatic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 2,6‐dihydroxynaphthalene in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of novel trifluoromethylated polyimides were synthesized from the diamine with various commercially available aromatic tetracarboxylic dianhydrides using a two‐stage process with thermal imidization of poly(amic acid) films. Most of the resulting polyimides were highly soluble in a variety of organic solvents and could afford transparent and tough films via solution casting. These polyimides exhibited moderately high glass transition temperatures (Tgs) of 249–311 °C, high thermal stability and good mechanical properties. Low moisture (0.19–0.85 %), low dielectric constants (2.49–3.59 at 10 kHz), and low color intensity were also observed. For a comparative study, a series of analogous polyimides based on 2,6‐bis(4‐aminophenoxy)naphthalene were also prepared and characterized. Copyright © 2005 Society of Chemical Industry  相似文献   

16.
A new trifluoromethylated bis(ether amine) monomer, 9,9‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]xanthene (BATFPX), was prepared through the nucleophilic aromatic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 9,9‐bis(4‐hydroxyphenyl)xanthene in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of novel fluorinated polyimides were synthesized from BATFPX with various commercially available aromatic tetracarboxylic dianhydrides by one‐step polycondensation in m‐cresol. The resulting polyimides were readily soluble in many organic solvents such as N,N‐dimethylacetamide and tetrahydrofuran, and afforded transparent, flexible and strong films with low moisture absorption (0.28–0.51%), low dielectric constant (2.85–3.26 at 1 MHz) and good optical transparency with UV‐visible absorption cut‐off wavelengths at 352–410 nm. All the polyimides were amorphous and exhibited high thermal stability, with glass transition temperatures of 282–330 °C, 5% weight loss temperatures above 520 °C in nitrogen or air and char yields higher than 55% at 800 °C in nitrogen. Also, these polyimides had good mechanical properties with tensile strengths of 93–118 MPa, elongations at break of 9–16% and initial moduli of 2.07–2.58 GPa. Copyright © 2011 Society of Chemical Industry  相似文献   

17.
A series of polyamides were synthesized by the direct polycondensation of 2,2‐bis[4‐(4‐amino‐2‐fluorophenoxy)phenyl]hexafluoropropane with various commercially available dicarboxylic acids such as terephthalic acid, isophthalic acid, 5‐t‐butyl isophthalic acid, and 2,6‐naphthalene dicarboxylic acid. The synthesized polyamides were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, dimethyl sulfoxide, tetrahydrofuran, and chloroform, and they exhibited inherent viscosities of 0.42–0.59 dL/g. The polyamides exhibited weight‐average molecular weights of up to 26,000, which depended on the exact repeating unit structure. These polyamides showed good thermal stability up to 440°C for a 10% weight loss in synthetic air. The polyamides synthesized from 5‐t‐butyl isophthalic acid and isophthalic acid exhibited glass‐transition temperatures of 217 and 185°C, respectively (by differential scanning calorimetry) in nitrogen. The polyamides synthesized from terephthalic acid and 2,6‐naphthalene dicarboxylic acid showed melting temperatures of 319 and 385°C, respectively. The polyamides films were pale yellow, with tensile strengths of up to 82 MPa, moduli of elasticity of up to 2.3 GPa, and elongations at break of up to 9%, which depended on the exact repeating unit structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 691–696, 2003  相似文献   

18.
A series of polyimide (PI) thin films were synthesized based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane and conventional aromatic dianhydrides. The structures and properties of the thin films were measured with Fourier transform infrared, NMR, thermogravimetric analysis, dynamic mechanical analysis, and impedance analysis. The PI films exhibited glass‐transition temperatures in the range of 211–300°C and possessed initial thermal decomposition temperature reaching up to 457–482°C in air and 461–473°C in nitrogen. Some PI films had high solubility in organic solvents such as 1‐methyl‐2‐pyrrolidinone, N,N‐dimethylformamide, N,N‐dimethylacetamide, dimethyl sulfoxide, m‐cresol, tetrahydrofuran, and CHCl3. The mechanical properties of these films were also examined. The dielectric constants of the films were in the range of 2.8–3.3 at 25°C. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1265–1270, 2007  相似文献   

19.
A series of novel aromatic diamines containing cycloaliphatic moieties was synthesized by the reaction of cycloalkanones like cyclohexanone and cycloheptanone with 2,6‐dimethylaniline. The tetrimide diacid was synthesized using the prepared diamine with 3,3′,4,4′‐benzophenonetetracarboxylic acid dianhydride/pyromellitic dianhydride and p‐aminobenzoic acid. The polymers were prepared by treating the tetrimide diacid with different aromatic diamines. The structures of the monomers and polymers were identified using elemental analysis and Fourier transform infrared, 1H NMR and 13C NMR spectroscopy. The polymers show excellent solubility. The polymers are amorphous and have high optical transparency. They also show good thermal stability and their Tg value is found to be in the range 268–305 °C. Copyright © 2007 Society of Chemical Industry  相似文献   

20.
Novel polyimides were synthesized from 1‐[3′,5′‐bis(trifluoromethyl)phenyl] pyromellitic dianhydride (6FPPMDA) by a conventional two‐step process: the preparation of poly(amic acid) followed by solution imidization via refluxing in p‐chlorophenol. The diamines used for polyimide synthesis included bis(3‐aminophenyl)‐3,5‐bis(trifluoromethyl)phenyl phosphine oxide, bis(3‐aminophenyl)‐4‐trifluoromethylphenyl phosphine oxide, and bis(3‐aminophenyl)phenyl phosphine oxide. The synthesized polyimides were designed to have a molecular weight of 20,000 g/mol by off‐stoichiometry and were characterized by Fourier transform infrared, NMR, differential scanning calorimetry, and thermogravimetric analysis. In addition, their intrinsic viscosity, solubility, water absorption, and coefficient of thermal expansion (CTE) were also measured. The adhesion properties of the polyimides were evaluated via a T‐peel test with bare and silane/Cr‐coated Cu foils, and the failure surfaces were investigated with scanning electron microscopy. The 6FPPMDA‐based polyimides exhibited high glass‐transition temperatures (280–299°C), good thermal stability (>530°C in air), low water absorption (1.46–2.16 wt %), and fairly low CTEs (32–40 ppm/°C), in addition to good adhesion properties (83–88 g/mm) with silane/Cr‐coated Cu foils. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 1801–1809, 2005  相似文献   

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