Fibre reinforced composites of multifunctional epoxy resins

Glass and carbon fibre reinforced epoxy composites were fabricated for N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenyl methane (TGDDM) and its formulated systems with tri- and di-functional reactive epoxy diluents using 30% diaminodiphenyl sulphone (DDS) as a curing agent. The epoxy laminates were evaluated for their physical, chemical and mechanical properties [at room (26°C) and high (100°C) temperatures]. A marginal increase (<20%) in the mechanical properties of CFRP was found compared with GFRP laminates. Incorporation of epoxy diluents altered the mechanical properties of the composites significantly. The incorporation of triglycidyl-4-aminophenol diluent to TGDDM systems resulted in an improvement in mechanical properties of about 2–6%.     

Enhanced mechanical properties of epoxy composites using cellulose micro- and nano-crystals

Epoxy polymers are commonly utilized in structural applications due to their high bearing capacity and excellent chemical resistance. However, their inherent brittleness poses a significant challenge for their use in high shock and fracture strength products. To address this shortcoming, fillers can be incorporated into the polymer during preparation. In this study, we aimed to investigate the effect of incorporating cellulose-based fillers, namely cellulose nanocrystals (CNCs) and microcrystalline cellulose (MCC), on the mechanical properties of epoxy polymer composites. The study evaluated the impact of various factors, including filler concentration, particle size, and moisture content, on the mechanical properties of the composites. The results demonstrated that the incorporation of CNC or MCC powders at concentrations below 5% could enhance the mechanical properties of the resulting epoxy composites without adversely affecting their surface and thermal properties. The maximum tensile strength and fracture toughness of the filler-based epoxy composites were achieved at 2 and 4 wt% for CNCs and MCC, respectively. CNCs with a smaller particle size distribution were found to be much more effective than MCC in improving the mechanical properties of the epoxy composites. Furthermore, utilizing dried fillers resulted in a higher improvement in tensile strength, which was achieved at lower filler concentrations.     

环氧树脂/碳化硅复合材料的热性能及韧性

采用碳化硅作为增强剂制备了环氧树脂/碳化硅复合材料,考察了复合材料的热学及力学性能。实验结果表明,碳化硅的添加使环氧树脂的玻璃化温度提高。当碳化硅添加质量分数为3%时,复合材料的韧性与纯环氧树脂相比提高了35%。     

Rubber-modified epoxy resins: 3. Influence of filler on the dielectric relaxation properties

Dielectric measurements are reported on the effect of addition of glass (wool and beads) to a rubber modified epoxy resin. A parallel study of the influence of the addition of polydimethylsiloxane is also reported. It is found that there are significant shifts in the position of the dielectric relaxation associated with the acrylonitrile/butadiene phase. Analysis of the data indicates that the activation energy of the relaxation is little affected by the additives and the observed effects can be explained by the change in internal field brought about by the addition of filler through its effect on the permittivity of the material.     

改性空心玻璃微珠/环氧树脂复合材料力学性能研究

采用偶联剂对玻璃微珠表面进行改性处理,借助超声波振动,使改性空心玻璃微珠在环氧树脂中均匀、稳定分散,增强了玻璃微珠与环氧树脂之间的相容并探讨了改性空心玻璃微珠对环氧树脂力学性能的影响。结果表明,复合材料中改性空心玻璃微珠添加质量分数为3%时,其拉伸强度达到最大值68.54 MPa,与空白样相比提高了20.3%;冲击强度达到最大值24.42 kJ/m2,比纯环氧树脂提高了166%;KIC(断裂韧性)达到最大值2.338 MPa/m2,是空白试样的2.27倍,增韧效果较为明显。     

Effect of post-cure on the glass transition temperature and mechanical properties of epoxy adhesives

The effects of post-curing and cure temperature on the glass transition temperature, T _g, and the mechanical properties of epoxy adhesives were studied. T _g was measured by a dynamic mechanical analysis apparatus developed in-house and the mechanical properties of the adhesives (yield strength, Young’s modulus and failure strain) were measured by a tensile machine. The relationships between T _g and mechanical performance under various post-cure conditions were investigated. The curing process was the same for all tests, consisting of an initial stage performed at different temperatures followed by cooling at room temperature. Three sets of specimens were considered, sharing the same initial cure process, but with a different post-curing procedure. In the first set, the specimens were only subjected to a curing process; in the second set, the specimens were subjected to a curing process followed by a post-cure performed at a temperature below the T _g of the fully cured network, T _g∞; and in the third set, the specimens were subjected to a curing process followed by a post-cure performed at a temperature above the T _g∞. When post-cured at a temperature above T _g∞, the mechanical and physical properties tend to have a constant value for any cure temperature.     

聚酰亚胺PI／SiC纳米复合材料的制备及特性

通过熔胶-凝胶方法合成了用于电子封装的聚酰亚胺PI/SiC复合薄膜介电材料,并通过扫描电镜、透射电镜、红外光谱对复合薄膜进行结构表征。结果表明,聚酰亚胺PI／SiC复合材料是一种共聚物,是纳米SiC粒子均匀分散在PI基体中的复合材料体系。在4284A型阻抗分析仪上测量了材料的电容,并换算出相应介电常数,最低达ε=2．0。     

Glass fibre reinforced composites of triglycidyl-p-aminophenol

Glass fibre reinforced epoxy composites were fabricated from the matrix resins diglycidyl ether of bisphenol A (DGEBA) and triglycidyl-p-aminophenol (TGAP) using diethylene triamine as curing agent. The epoxy laminates were evaluated for their mechanical properties, dielectrical properties and chemical resistance. Significant improvement in fiexural strength but a slight deterioration in dielectrical properties were observed on incorporation of an epoxy fortifier into the resin system before fabricating the composites.     

Effects of a liquid metal co-filler on the properties of epoxy/binary filler composites

Liquid metals (LMs) with high fluidity and high thermal conductivity (TC) are receiving considerable attention in the research on thermal management polymer composites as alternatives to conventional rigid solid fillers or as co-fillers to overcome the trade-off between TC and composite processability at high filler loads. While most previous studies have investigated the effects of LM fillers in soft elastomeric matrices, their effects on the composite properties with rigid matrices, such as epoxy-based polymers, have not been discussed extensively. Herein, we investigated the effects of LM eutectic Ga-In (EGaIn) as a co-filler on the properties of rigid epoxy-based composites with a binary filler (Al₂O₃/EGaIn) system. The increase in the volume fraction of LM fillers significantly improves the processability of uncured precursor composites but markedly decreases the mechanical strength of the cured composites at their high loads—the latter effects have rarely been examined in previous studies. However, with adequate LM loads, the composites exhibited superior mechanical properties compared with the all-solid-filler system, withstanding a surprisingly high compressive load (~100 kN) under which the all-solid-filler system fractured. Furthermore, the epoxy/binary filler composites exhibited reasonably high TC values (~1 W/mK) comparable to that of commercial epoxy molding compounds, suggesting their potential applicability for electronic packaging.     

Development of high Tg epoxy resin and mechanical properties of its fiber‐reinforced composites

A new epoxy resin with high glass transition temperature (T_g) (～ 180°C) and a viscosity low enough for infiltration into dry reinforcements at 40°C was developed for the vacuum‐assisted resin transfer molding process. To study the curing behavior and viscosity, several blends were formulated using multifunctional resin, aromatic hardener, and reactive diluents. Effects of these components on the viscosity and T_g were investigated by thermomechanical analysis, dynamic scanning calorimetry, and rheometer. Experimental results showed that a liquid aromatic hardener and multifunctional epoxy resin should be used to decrease the viscosity to <1 Pa·s at 40°C. Moreover, the addition of a proper reactive diluent decreased the viscosity and simultaneously minimized the deterioration of T_g. Mechanical properties of the composite produced with the optimized blend were evaluated at both room‐temperature and high‐temperature conditions. According to the results, the composite showed comparable mechanical properties with that of the current commercial resin. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Effects of organo‐montmorillonite on the mechanical and morphological properties of epoxy/glass fiber composites

Epoxy composites filled with glass fiber and organo‐montmorillonite (OMMT) were prepared by the hand lay‐up method. The flexural properties of the epoxy/glass fiber/OMMT composites were characterized by a three‐point bending test. The flexural modulus and strength of epoxy/glass fiber were increased significantly in the presence of OMMT. The optimum loading of OMMT in the epoxy/glass fiber composites was attained at 3 wt%, where the improvement in flexural modulus and strength was approximately 66 and 95%, respectively. The fractured surface morphology of the epoxy/glass fiber/OMMT composites was investigated using field emission scanning electron microscopy. It was found that OMMT adheres on the epoxy/glass fiber interface, and this is also supported by evidence from energy dispersive X‐ray analysis. Copyright © 2007 Society of Chemical Industry     

Relationship between electrical and mechanical loss tangents of hollow glass powder reinforced epoxy composites: A pilot study

This study was focused on the synthesis of monodisperse poly(n‐butyl methacrylate‐co‐methyl methacrylate) submicrospheres via soap‐free emulsion polymerization and on their characterization. The glass‐transition temperatures of poly(n‐butyl methacrylate) and poly(methyl methacrylate) were approximately 25 and 110°C, respectively. Therefore, submicrospheres with different glass‐transition temperatures could be obtained through the variation of the copolymer composition. In addition, relationships between the monomer feed concentration (M₀) and the Mark–Houwink constant (α) for the copolymer submicrospheres were proposed. The molecular weights of the copolymer submicrospheres decreased sharply with an increase in the weight fraction of n‐butyl methacrylate. On the contrary, the particle diameter increased linearly from 277 to 335 nm with an increase in the weight fraction of n‐butyl methacrylate. The α values decreased with an increase in M₀, and this indicated that the branched structures of the copolymer submicrospheres were easily obtained when M₀ was higher than 0.11 g/mL of water. Consequently, the results of this study are expected to provide useful information for the synthesis of monodisperse copolymer submicrospheres by soap‐free emulsion polymerization. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

碳纤维增强碳化硅基复合材料的研究

碳纤维增强碳化硅基复合材料(Cf/SiC)具有良好的力学性能,作为特殊结构的功能材料,是航空航天领域和新能源领域的研究热点之一。本文主要阐述了增强相碳纤维的发展,复合材料的基体复合技术,以及复合材料界面相的研究,并展望了碳纤维复合材料在高新技术领域中的应用与发展前景。     

Preparation and properties of glass cloth‐reinforced polyimide composites with improved impact toughness for microelectronics packaging substrates

A series of glass cloth‐reinforced thermosetting polyimide composites (EG/HTPI) were prepared from E‐glass cloth (EG) and polyimide matrix resins. The polyimide resins were derived from 1,4‐bis(4‐amino‐2‐ trifluoromethyl‐phenoxy)benzene, p‐phenylenediamine, diethyl ester of 3,3′,4,4′‐benzophenonetetracarboxylic acid, and monoethyl ester of cis‐5‐norbornene‐endo‐2,3‐dicarboxylic acid. Based on the rheological properties of the B‐staged polyimide resins, the optimized molding cycles were designed to fabricate the EG/HTPI laminates and the copper‐clad laminates (Cu/EG/HTPI). Experimental results indicated that the EG/HTPI composites exhibited high thermal stability and outstanding mechanical properties. They had flexural strength of >534 MPa, flexural modulus of >20.0 GPa, and impact toughness of >46.9 kJ/m². The EG/HTPI composites also showed good electrical and dielectric properties. Moreover, the EG/HTPI laminates exhibited peel strength of ～ 1.2 N/mm and great isothermal stability at 288°C for 60 min, showing good potential for application in high density packaging substrates. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Electromagnetic wave absorption and mechanical properties of silicon carbide fibers reinforced silicon nitride matrix composites

It is difficult for ceramic matrix composites to combine good electromagnetic wave (EMW) absorption properties (reflection coefficient, RC less than -7 dB in X band) and good mechanical properties (flexural strength more than 300 MPa and fracture toughness more than 10 M P·m^1/2). To solve this problem, two kinds of wave-absorbing SiC fibers reinforced Si₃N₄ matrix composites (SiC_f/Si₃N₄) were designed and fabricated via chemical vapor infiltration technique. Effects of conductivity on EM wave absorbing properties and fiber/matrix bonding strength on mechanical properties were studied. The SiC_f/Si₃N₄ composite, having a relatively low conductivity (its conduction loss is about 33% of the total dielectric loss) has good EMW absorption properties, i.e. a relative complex permittivity of about 9.2-j6.4 at 10 GHz and an RC lower than ?7.2 dB in the whole X band. Its low relative complex permittivity matches impedances between composites and air better, and its strong polarization relaxation loss ability help it to absorb more EM wave energy. Moreover, with a suitably strong fiber/matrix bonding strength, the composite can transfer load more effectively from matrix to fibers, resulting in a higher flexural strength (380 MPa) and fracture toughness (12.9 MPa?m^1/2).     

Effect of polyarylene ether nitriles on processing and mechanical behaviors of phthalonitrile‐epoxy copolymers and glass fiber laminated composites

A series of copolymers and glass fiber composites were successfully prepared from 2,2‐bis [4‐(3,4‐dicyanophenoxy) phenyl] propane (BAPh), epoxy resins E‐44 (EP), and polyarylene ether nitriles (PEN) with 4,4′‐diaminodiphenyl sulfone as curing additive. The gelation time was shortened from 25 min to 4 min when PEN content was 0 wt % and 15 wt %, respectively. PEN could accelerate the crosslinking reaction between the phthalonitrile and epoxy. The initial decomposition temperatures (T_i) of BAPh/EP copolymers and glass fiber composites were all more than 350°C in nitrogen. The T_g of 15 wt % PEN glass fiber composites increased by 21.2°C compared with that of in comparison with BAPh/EP glass fiber composite. The flexural strength of the copolymers and glass fiber composites reached 119.8 MPa and 698.5 MPa which increased by 16.6 MPa and 127.3 MPa in comparison with BAPh/EP composite, respectively. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

The effect of filler content and size on the mechanical properties of polypropylene/oil palm wood flour composites

The effect of filler content and size on the mechanical properties of a new type of wood-based filler, oil palm wood flour (OPWF), in polypropylene (PP) was investigated. Four sizes of OPWF filler at different filler loadings were compounded using a twin screw compounder. All sizes of filler showed a similar trend of declining mechanical properties with increasing filler content. In terms of size, the composites filled with larger-sized filler showed higher modulus, tensile and impact strengths, particularly at high filler loadings. The OPWF used in this study was not treated with any coupling agent.     

无机填料对低粘度高性能环氧树脂性能的影响

研究了空心玻璃微珠QH550、石英砂、氧化锌、白炭黑等无机填料对低粘度高活性环氧树脂体系的填充效果,通过比较树脂体系的拉伸性能、弯曲性能和冲击性等力学性能表明,用氧化锌作为填料时,树脂体系各项力学性能达到最优;研究了氧化锌的填充量对树脂体系力学性能的影响,找到了最佳填充量为树脂总质量的60%。     

Effect of alkaline treatment on physical,mechanical, and thermal characteristics of jute filler reinforced epoxy composites

With burgeoning environmental concerns worldwide, using natural fibers/fillers to produce composites rather than conventional fibers is on the rise. The current work focuses on the physical and thermomechanical characteristics of alkaline-treated jute filler-based epoxy composites. The composites have been prepared with different weight fraction of jute fillers (0%, 2.5%, 5%, 7.5%, 10%, and 12.5%) using hand layup process. The X-ray diffraction and Fourier transform infrared spectroscopy analysis observed that the alkali treatment of jute fillers improved the crystallinity and molecular structure, enhancing the interfacial and molecular bond between fillers and matrix. The mechanical characterizations of developed composites analyzed that the inclusion of treated jute fillers strengthened the tensile and flexural properties. The 5% filler-based composites have demonstrated maximum tensile strength (54.06 MPa) and modulus (3.12 GPa) with maximum flexural strength (67.55 MPa) and modulus (3.90 GPa). The viscoelastic characteristics of composites revealed that the 7.5% filler-based composite has the highest storage modulus (3.75 GPa), loss modulus (0.496 GPa), and glass transition temperature (91°C) due to greater interfacial interactions of molecules. The weight loss and degradation of composites analyzed with thermogravimetric analysis, and observed better thermal stability with treated jute fillers. The morphological analysis at fracture surfaces analyzed the brittle catastrophic failure of composites. Therefore, the finding produced better specific strength and stiffness with greater thermal stability for electronics equipment, packaging, and transportation.