Synthesis of a bifunctional epoxy monomer containing biphenyl moiety and properties of its cured polymer with phenol novolac

A new type of epoxy resin containing a 4,4′‐biphenylene moiety in the backbone (Bis‐EBP) is synthesized and confirmed by elemental analysis, infrared spectroscopy, and ¹H‐nuclear magnetic resonance spectroscopy. In addition, to evaluate the influence of the 4,4′‐biphenylene group in the structure, an epoxy resin having a 1,4‐phenylene group in place of the 4,4′‐biphenylene moiety (Bis‐EP) is synthesized. The cured polymer obtained through the curing reaction between the new biphenyl‐containing epoxy resin and phenol novolac is used for making a comparison of its thermal and physical properties with those obtained from Bis‐EP and bisphenol‐A (4,4′‐isopropylidenediphenyl)‐type epoxy resin (Bis‐EA). The cured polymer obtained from Bis‐EBP shows markedly higher fracture toughness of 1.32 MPa m^1/2, higher glass transition temperature, lower moisture absorption, and higher thermal decomposition temperature. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 690–698, 1999     

Synthesis and properties of fluorinated biphenyl‐type epoxy resin

A novel fluorinated biphenyl‐type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl‐type phenolic resin, which was prepared by the condensation of 3‐trifluoromethylphenol and 4,4′‐bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3–2.5 Pa s) at 120–122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409–415°C, high glass‐transition temperature of 139–151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117–121 MPa as well as tensile strength of 71–72 MPa. The thermally cured fluorinated biphenyl‐type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5–0.8 × 10¹⁷ Ω cm and surface resistivity of 0.8–4.6 × 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8–4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6–3.8 × 10^?3. It was found that the fluorinated epoxy resins have improved dielectric properties, lower moisture adsorption, as well as better flame‐retardant properties compared with the corresponding commercial biphenyl‐type epoxy resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Preparation and properties of novel phosphorus‐containing binaphthyl epoxy polymer

Novel phosphorus‐containing binaphthyl epoxy DGEBN (diglycidyl ether of 2,2′‐hydroxy‐1,1′‐binaphthalene) with high thermal performance was obtained from the addition reaction of DGEBN and diethyl phosphite. The modified binaphthyl epoxy was characterized by Fourier transform infrared (FTIR) and nuclear magnetic resonance spectroscopy. The dynamic mechanical property of the cured epoxy polymer was investigated by dynamic mechanical thermal analysis. The result revealed that the cured polymer with lower phosphorus content displayed higher value of the storage modulus when the networks reached rubbery state (above the glass transition temperature T_g). The T_gs decreased slightly with increasing phosphorous content. The thermal degradation was studied with thermogravimetric analysis and the evolved gas was analyzed using thermogravimetric analysis/Fourier transform infrared technique. The influence of phosphorus content and the chemical structure on the degradation behavior was discussed. The P‐modified binaphthyl epoxy polymers exhibited higher thermal stability than the P‐modified diglycidyl ether of bisphenol A polymer. Flammability measurements were performed by the examination of limited oxygen index and UL‐94 test. Compared with unmodified DGEBN, P‐containing epoxy polymers displayed higher limited oxygen index values and exhibited better flame retardance. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers     

Synthesis,thermal properties,and flame retardance of phosphorus‐containing epoxy‐silica hybrid resins

A novel epoxy resin modifier, phosphorus‐containing epoxide siloxane (DPS) with cyclic phosphorus groups in the Si O network, was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with polyhedral‐oligomeric siloxanes, which was synthesized by the sol–gel reaction of 3‐glycidoxypropyltrimethoxysilane. DPS was confirmed by Fourier transform infrared and ²⁹Si NMR measurement, and then was employed to modify epoxy resin at various ratios, with 4,4‐diaminodiphenyl‐methane as a curing agent. In order to make a comparison, DOPO‐containing epoxy resins were also cured under the same conditions. The resulting organic–inorganic hybrid epoxy resins modified with DPS exhibited a high glass transition temperature (T_g), a good thermal stability, and a high limited oxygen index. In addition, the tensile strength of cured products was also rather desirable. POLYM. COMPOS., 2010. © 2009 Society of Plastics Engineers     

Dendritic carbosilane‐based macrophotoinitiator: synthesis,characterization, and photoinitiating behavior

A novel radical dendritic macrophotoinitiator, bearing alkyl pheone moieties linked to the surface of the dendrimer, was synthesized via alcoholysis of carbosilane dendrimer and the small‐molecule photoinitiator 2‐hydroxy‐2‐methyl‐1‐(4‐tert‐butyl)phenylpropane‐1‐one. The structure of the dendritic carbosilane‐based macrophotoinitiator (MPI) was characterized using Fourier transform infrared spectroscopy, ¹H NMR, ¹³C NMR, ²⁹Si NMR, elemental analysis, size exclusion chromatography/multi‐angle laser light scattering, UV‐visible spectroscopy, and differential photocalorimetry (DPC). UV‐visible analysis indicates that the absorption band of photosensitive moieties shifts towards high wavelength by introducing the carbosilane dendrimer core. The DPC results demonstrate that the initiating efficiency of MPI is effective when using epoxy acrylate (EA) as a model resin. Furthermore, thermogravimetric analysis of cured EA resin indicates that the thermal stability can be improved markedly by the incorporation of MPI in the curing formulation. Copyright © 2007 Society of Chemical Industry     

Anticorrosive properties of epoxy resin coatings cured by aniline/p‐phenylenediamine copolymer

Aniline/p‐phenylenediamine copolymer [poly(ANI‐co‐p‐PDA)] was prepared by chemical oxidative polymerization. FTIR and ¹H‐NMR analysis indicate that the poly(ANI‐co‐p‐PDA) is oligomer with end‐capped amino groups, which can cure epoxy resin. The anticorrosion performance of carbon steel (CS) samples coated by epoxy resin coating cured with poly(ANI‐co‐p‐PDA) and epoxy resin coating cured with triethylenetetramine exposed to 5 wt % NaCl and 0.1 mol/L HCl aqueous solution is studied by the potentiodynamic polarization and electrochemical impedance spectroscopy. The results show that the CS coated by epoxy resin coating cured with poly (ANI‐co‐p‐PDA) has more excellent corrosion protection than that of epoxy resin coating cured with triethylenetetramine. Raman spectroscopy analysis indicates that the surface of CS coated by epoxy resin coating cured with poly(ANI‐co‐p‐PDA) forms passive layer, which is composed of α‐Fe₂O₃. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis of a bifunctional epoxy monomer containing anthracene moiety and properties of its cured polymer with phenol novolac

A new type of epoxy resin containing anthracene moiety in the backbone was synthesized and was confirmed by elemental analysis, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. Thermal properties of its cured polymer with phenol novolac were examined by thermomechanical, dynamic mechanical, and thermogravimetric analyses. The cured polymer with phenol novolac showed higher glass transition temperature (T_g), lower thermal expansion, lower moisture absorption, and higher anaerobic char yield at 700°C than a cured polymer having a phenylene group in place of anthracene moiety. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 953–959, 1999     

Synthesis and properties of novel 4,4′‐biphenylene‐bridged flame‐retardant cyanate ester resin

The bisphenol‐containing 4,4′‐biphenylene moiety was prepared by the reaction of 4,4′‐bis(methoxymethyl) biphenyl with phenol in the presence of p‐toluenesulfonic acid. The bisphenol was end‐capped with the cyanate moiety by reacting with cyanogen chloride and triethylamine in dichloromethane. Their structures were confirmed by Fourier transform infrared spectroscopy, ¹H‐NMR, and elemental analysis. Thermal behaviors of cured resin were studied by differential scanning calorimetry, dynamic mechanical analysis, and TGA. The flame retardancy of cured resin was evaluated by limiting oxygen index (LOI) and vertical burning test (UL‐94 test). Because of the incorporation of rigid 4,4′‐biphenylene moiety, the cyanate ester (CE) resin shows good thermal stability (T_g is 256°C, the 5% degradation temperature is 442°C, and char yield at 800°C is 64.4%). The LOI value of the CE resin is 42.5, and the UL‐94 rating reaches V‐0. Moreover, the CE resin shows excellent dielectric property (dielectric constant, 2.94 at 1 GHz and loss dissipation factor, 0.0037 at 1 GHz) and water resistance (1.08% immersed at boiling water for 100 h). © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis of a novel epoxy resin containing pyrene moiety and thermal properties of its cured polymer with phenol novolac

A new epoxy resin containing the pyrene moiety in the backbone (3) was synthesized and confirmed by gel permeation chromatography and field‐desorption mass spectroscopy and infrared spectroscopy. In addition, to evaluate the influence of the pyrene moiety on the structure, epoxy resins having an anthrylene moiety (5) and having a phenylene moiety (7) were synthesized. The cured polymer obtained through the curing reaction between 3 and phenol novolac was used for making a comparison of its thermal properties with those obtained from 5, 7, and bisphenol‐A (4,4′‐isopropylidenediphenyl)‐type epoxy resin (Bis‐EA). The cured polymer obtained from 3 showed a higher glass transition temperature, lower coefficient of linear thermal expansion, lower moisture absorption, and markedly higher anaerobic char yield at 700°C of 37.6 wt %, which might be attributed to the higher aromaticity of 3 containing the pyrene moiety. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 528–535, 2000     

An investigation of epoxy/thermoplastic blends based on addition of a novel copoly(aryl ether nitrile) containing phthalazinone and biphenyl moieties

In this paper, a novel soluble copoly(aryl ether nitrile) containing phthalazinone and biphenyl moieties (PPBEN) was synthesized for the first time to improve the impact resistance of tetraglycidyl 4,4'‐diaminodiphenylmethane epoxy resin cured with 4,4‐diaminodiphenylsulfone. Then a series of blends were prepared via solution blending with different contents of PPBEN. The thermal and mechanical properties and the micromorphology of the cured blends were investigated by differential scanning calorimetry, dynamic mechanical analysis (DMA), parallel plate rheometry, mechanical property tests and SEM analysis, respectively. The results indicated that the incorporation of thermoplastic PPBEN delayed the epoxy curing reaction, and the crosslinking density of epoxies was also reduced. The no‐notch impact strength of the cured blend with 15% PPBEN was up to 16.7 kJ m^?2, higher by about 104% than that of pure epoxy resin without sacrificing the modulus due to a specific sea‐island structure. All the blends showed two‐phase morphology characterized by DMA and SEM. The size of the thermoplastic morphology was only 70?80 nm, much less than that of commonly used thermoplastics, due to the special segment structure of PPBEN. © 2015 Society of Chemical Industry     

Spectral,thermal, and photoreactivity studies on epoxy resin containing benzylidene units in the main chain

A photosensitive epoxy resin was synthesized from bis(4‐hydroxy ‐3‐methoxy benzylidene) acetone and epichlorohydrin using solution polycondensation method. The prepared epoxy resin was characterized by UV, IR, ¹H NMR, and ¹³C NMR spectroscopy. The thermal stability of the epoxy resin was assessed by thermogravimetric analysis. The glass transition temperature of the polymer was determined by differential scanning calorimetry. The photocrosslinking property and photopolymerizing ability of the epoxy resin were studied in film and solution state using UV spectroscopy. The effect of photo acid generator and sensitizer on photosensitivity of the resin was also investigated. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Phthalonitrile‐epoxy blends: Cure behavior and copolymer properties

Binary blends composed of 4,4′‐bis(3,4‐dicyanophenoxy)biphenyl (biphenyl PN) and diglycidyl ether of bisphenol A (epoxy resin) and oligomeric n = 4 phthalonitrile (n = 4 PN) and epoxy resin were prepared. The cure behavior of the blends was studied under dynamic and isothermal curing conditions using differential scanning calorimetry, simultaneous thermogravimetric/differential thermal analysis, infrared spectroscopy, and rheological analysis. The studies revealed that phthalonitrile‐epoxy blends exhibited good processability and that they copolymerized with or without the addition of curing additive. In the absence of curing additive, the blends required higher temperatures and longer cure times. The thermal and dynamic viscoelastic properties of amine‐cured phthalonitrile‐epoxy copolymers were examined and compared with those of the neat epoxy resin. The properties of the epoxy resin improved with increasing biphenyl PN content and with n = 4 PN addition. Specifically, the copolymers exhibited higher glass transition temperatures, increased thermal and thermo‐oxidative stabililty, and enhanced dynamic mechanical properties relative to the commercially available epoxy resin. The results showed that the phthalonitrile‐epoxy blends and copolymers have an attractive combination of processability and high temperature properties. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation,characterization, and polymerization of novel maleimidobenzoxazine containing carboxylic moiety and its cocuring behaviors with epoxy resin

A novel benzoxazine containing maleimide and carboxylic moieties, 1‐[3‐(4‐carboxylphenyl)‐3,4‐dihydro‐2H‐benzo[e][1,3]‐oxazin‐6‐yl]maleimide (Mal‐Bz‐Co), was synthesized and the structure was identified by ¹H‐NMR and FTIR. Mal‐Bz‐Co exhibited good solubility in common organic solvents. The cure behavior of Mal‐Bz‐Co and cocure behavior of Mal‐Bz‐Co with o‐cresol formaldehyde epoxy resin were investigated by differential scanning calorimetry. Results indicated that Mal‐Bz‐Co showed a single curing exothermic peak at about 238.3°C. However, the maximum curing temperature (T_p) decreased to 146.1°C when Mal‐Bz‐Co cocured with o‐cresol formaldehyde epoxy resin in the molar ratio of 1 : 1. The T_p was about 92°C lower than that of Mal‐Bz‐Co. Thermogravimetric analysis showed that high‐decomposition temperature and char yield were observed for the cured resins of Mal‐Bz‐Co and Mal‐Bz‐Co/o‐CFER. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Synthesis, characterization, and properties of novel novolac epoxy resin containing naphthalene moiety

A series of novel novolac epoxy resins containing naphthalene moiety with different molecular weights were synthesized via condensation of bisphenol A and 1-naphthaldehyde, followed by epoxidation with epichlorohydrin. The chemical structure of the naphthalene epoxy thus obtained was characterized using FTIR, ¹H NMR spectra and GPC analyses. The naphthalene epoxy was cured with 4,4′-diaminodiphenyl sulfone (DDS) and the cured products were characterized with thermogravimetric analysis, dynamic mechanical analysis, and X-ray diffraction. Compared with the diglycidyl ether of bisphenol A (DGEBA), the cured naphthalene epoxy resin showed remarkably higher glass transition temperatures (T_gs), enhanced thermal stability and better moisture resistance. When the molar ratio of 1-naphthaldehyde to bisphenol A was 0.67, the optimal thermal resistance was observed.     

Synthesis of rosin‐based flexible anhydride‐type curing agents and properties of the cured epoxy

BACKGROUND: Although rosin acid derivatives have received attention in polymer synthesis in recent years, to the best of our knowledge, they have rarely been employed as epoxy curing agents. The objective of the study reported here was to synthesize rosin‐based flexible anhydride‐type curing agents and demonstrate that the flexibility of a cured epoxy resin can be manipulated by selection of rosin‐based anhydride‐type curing agents with appropriate molecular rigidity/flexibility. RESULTS: Maleopimarate‐terminated low molecular weight polycaprolactones (PCLs) were synthesized and studied as anhydride‐type curing agents for epoxy curing. The chemical structures of the products were confirmed using ¹H NMR spectroscopy and Fourier transform infrared spectroscopy. Mechanical and thermal properties of the cured epoxy resins were studied. The results indicate that both the epoxy/anhydride equivalent ratio and the molecular weight of PCL diol play important roles in the properties of cured resins. CONCLUSION: Rosin‐based anhydride‐terminated polyesters could be used as bio‐based epoxy curing agents. A broad spectrum of mechanical and thermal properties of the cured epoxy resins can be obtained by varying the molecular length of the polyester segment and the epoxy/curing agent ratio. Copyright © 2009 Society of Chemical Industry     

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Novel flame retardant thermosets from nitrogen‐containing and phosphorus‐containing epoxy resins cured with dicyandiamide

A novel phosphorus‐containing epoxy resin (EPN‐D) was prepared by addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and epoxy phenol‐ formaldehyde novolac resin (EPN). The reaction was monitored by epoxide equivalent weight (EEW) titration, and its structure was confirmed by FTIR and NMR spectra. Halogen‐free epoxy resins containing EPN‐D resin and a nitrogen‐containing epoxy resin (XT resin) were cured with dicyandiamide (DICY) to give new halogen‐free epoxy thermosets. Thermal properties of these thermosets were studied by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA), thermal mechanical analyzer (TMA) and thermal‐gravimetric analysis (TGA). They exhibited very high glass transition temperatures (T_gs, 139–175°C from DSC, 138–155°C from TMA and 159–193°C from DMA), high thermal stability with T_{d,5 wt %} over 300°C when the weight ratio of XT/EPN‐D is ≥1. The flame‐retardancy of these thermosets was evaluated by limiting oxygen index (LOI) and UL‐94 vertical test. The thermosets containing isocyanurate and DOPO moieties showed high LOI (32.7–43.7) and could achieve UL‐94 V‐0/V‐1 grade. Isocyanurate and DOPO moieties had an obvious synergistic effect on the improvement of the flame retardancy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Development of a DOPO‐containing melamine epoxy hardeners and its thermal and flame‐retardant properties of cured products

In this study, a novel Schiff base of melamine used as flame‐retardant curing agent for epoxy resins, was synthesized via condensation reaction of 4‐hydroxybenzaldehyde with melamine, followed by the addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphen‐anthrene 10‐oxide (DOPO) to the resulting imine linkage. The structure of DOPO‐containing melamine Schiff base (P‐MSB) was characterized by Fourier transformed infrared spectroscopy, ¹H‐nuclear magnetic resonance (¹H‐NMR) and ³¹P‐NMR. The compound (P‐MSB) was used as a reactive flame retardant in o‐cresol formaldehyde novolac epoxy resin (CNE) to prepare flame‐retardant epoxy resins for electronic application. The thermal and flame‐retardant properties of the epoxy resins cured by various equivalent ratios phenol formaldehyde novolac (PN) and P‐MSB were investigated by the nonisothermal differential scanning calorimetry, the thermogravimetric analysis, and limiting oxygen index test. The obtained results showed that the cured epoxy resins possessed high T_g (165°C) and good thermal stability (T_5%, 321°C). Moreover, the P‐MSB/CNE systems exhibited higher limiting oxygen index (35) and more char was maintained in P‐MSB/CNE systems than that in PN/CNE system and the effective synergism of phosphorus–nitrogen indicated their excellent flame retardancy. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Nanostructures and thermomechanical properties of epoxy thermosets containing reactive diblock copolymer

Polystyrene‐block‐poly(glycidyl methacrylate) reactive diblock copolymer (PS‐b‐PGMA) was synthesized via atom transfer radical polymerization (ATRP). The diblock copolymer was characterized using nuclear magnetic resonance (NMR) spectroscopy and gel permeation chromatography (GPC). The cured epoxy thermosets with 10–20 nm PS particles were prepared by blending the diblock copolymer with epoxy resin. The nanostructures were examined by means of transmission electronic microscopy (TEM) and small angle X‐ray scattering (SAXS). The formation of the nanostructures was caused by the reaction‐induced microphase separation mechanism. It is significant that the glass transition temperatures (T_gs) of these epoxy thermosets were increased by the addition of PS‐b‐PGMA reactive block copolymer as revealed by both differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010