共查询到20条相似文献,搜索用时 140 毫秒
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把智能材料(如光纤)植入工程结构形成智能结构,使工程结构具有感知和处理信息,并执行处理结果,对环境的刺激作出自适应响应,智能结构的提出使工程学科产生革命性的变化,具有重大的科学意义与广阔的应用前景。本介绍了光纤智能结构的发展历史、研究现状、和光纤传感技术。 相似文献
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目前,有线电视“村村通”工程正在全国深入开展,采用HFC网络进行传输是有线电视“村村通”的主要实现形式,星-树型光点传输结构在工程中广泛应用。本篇主要讲述了该种结构的设计方法、计算步骤。 相似文献
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需求演化过程建模 总被引:1,自引:1,他引:0
张国生 《微电子学与计算机》2012,29(5):54-57
对需求任务、需求活动、需求工程过程以及需求工程过程系统进行形式化定义.用信息熵对需求任务演化进行度量,用联合熵对需求活动、需求工程过程以及需求工程过程系统演化进行度量.从需求工程过程的角度,用条件-事件网对需求工程过程的迭代、反馈进行微观演化建模.从系统工程的角度,用耗散结构理论对整个软件需求工程过程系统进行宏观演化建模. 相似文献
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Mechatronics engineering graduates are expected to design mechatronics products with higher performance and lower costs. The success of a mechatronics engineering program is directly related to the structural design methodology, modeling and simulation, and the practical implementation of fully integrated physical systems. In this paper a mechatronics design education-oriented V-model was proposed to fulfill these requirements. The main idea behind our proposed approach aims to integrate various stages such as design, simulation and physical implementations in development of mechatronics product or system. Students are asked to first follow the structural design methodology to do the conceptual and further detail design for an open-ended problem, then to do appropriate simulation to verify the feasibility of the design, and at last to integrate all components and subsystems into a complete physical product or system. The V-model-related courses and structures were explained in detail, and project implementation experiences were described and discussed with the help of example student projects. 相似文献
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基于点云数据处理的三维重建技术突破了基于二维投影信息对目标物体建模在几何精度方面的瓶颈,重新构建出准确性更高、真实感更强的三维场景,可应用于工程项目的模拟仿真、规划、结构分析,或GIS展示、虚拟设计、场景还原等领域。因此,如何实现快速且自动化程度较高的真实再现三维模型的重建技术越来越多的受到人们的关注。 相似文献
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The large difference in thermal expansion between dissimilar materials present in any electronic package is the source of a major problem to be solved in order to achieve improved reliability. In this paper, simplified thermal and mechanical finite element models are presented for the analysis of thermal stress derived problems. The problems investigated here include, thermal stresses in adhesive backbonds in surface mounted structures and effects of thermal fatigue in soft solder interfaces in conventional power modules such as insulated gate bipolar transistors modules. Full multi-dimensional mechanical and thermal analysis is made by using the commercial engineering computer package
. Validation of the thermal simulation is achieved by comparison between simulation and experimental test results, whereas a simple analytical model based upon the lap joint theory is used to verify the structural simulation. 相似文献
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移相器是控制相控阵天线空间波束捷变的方向盘,其性能的优良决定着相控阵天线性能的高低。微机电系统(MEMS)移相器优势明显,但由于相控阵天线工作环境复杂,环境载荷会导致MEMS移相器结构变形,进而直接降低整个相控阵天线的性能。为此,该文研究MEMS移相器关键结构参数和电性能之间的耦合关系,将复杂环境要素对物理结构的影响传递到结构参数和电参数上,推导出分布式MEMS移相器的机电集成模型,并利用集成模型对变形MEMS移相器进行电性能快速评估和结构公差计算。仿真结果说明了集成模型的有效性和工程应用价值。 相似文献
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以聚偏氟乙烯(PVDF)压电薄膜作为信息采集端并根据实际需要进行结构优化,制成搏击比赛用测力传感器模块。通过对比电荷放大器、射极跟随器、电压跟随器的性质及实际工作特点,最终设计了基于AD744KR运放的电压跟随器作为调理电路。再根据各自工作原理进行等效分析、模拟仿真,并最终实现制成工程样机达到研究目的。 相似文献
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This paper uses TCAD (technology computer-aided design) to calculate practical NMOS and PMOS device behaviors under ESD/EOS events. The simulations include electrothermal effect with lattice temperature parameters. These simulations reproduce TLPG (transmission line pulse generator) current–voltage curves successfully. They also predict the same experimental tendencies of various device structural dimensions in practical engineering applications. The electrothermal device simulation has shown its ability to predict a real device ESD/EOS event. It will become a valuable tool to analyze device internal breakdown properties and find out optimized ESD/EOS conditions. 相似文献