A low-power 2.4-GHz transmitter/receiver CMOS IC

A 2.4-GHz CMOS receiver/transmitter incorporates circuit stacking and noninvasive baseband filtering to achieve a high sensitivity with low power dissipation. Using a single 1.6-GHz local oscillator, the transceiver employs two upconversion and downconversion stages while providing on-chip image rejection filtering. Realized in a 0.25-/spl mu/m digital CMOS technology, the receiver exhibits a noise figure of 6 dB and consumes 17.5 mW from a 2.5-V supply, and the transmitter delivers an output power of 0 dBm with a power consumption of 16 mW.     

8-Gb/s source-synchronous I/O link with adaptive receiver equalization, offset cancellation, and clock de-skew

A source-synchronous I/O link with adaptive receiver-side equalization has been implemented in 0.13-/spl mu/m bulk CMOS technology. The transceiver is optimized for small area (360 /spl mu/m /spl times/ 360 /spl mu/m) and low power (280 mW). The analog equalizer is implemented as an 8-way interleaved, 4-tap discrete-time linear filter. The equalization improved the data rate of a 102 cm backplane interconnect by 110%. On-die adaptive logic determines optimal receiver settings through comparator offset cancellation, data alignment of the transmitter and receiver, clock de-skew and setting filter coefficients for equalization. The noise-margin degradation due to statistical variation in converged coefficient values was less than 3%.     

Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect

A wireless bus for stacked chips was developed by utilizing inductive coupling among them. This paper discusses inductor layout optimization and transceiver circuit design. The inductive coupling is analyzed by a simple equivalent circuit model, parameters of which are extracted by a magnetic field model based on the Biot-Savart law. Given communication distance, transmit power, data rate, and SNR budget, inductor layout size is minimized. Two receiver circuits, signal sensitive and yet noise immune, are designed for inductive nonreturn-to-zero (NRZ) signaling where no signal is transmitted when data remains the same. A test chip was fabricated in 0.35-/spl mu/m CMOS technology. Accuracy of the models is verified. Bit-error rate is investigated for various inductor layouts and communication distance. The maximum data rate is 1.25 Gb/s/channel. Power dissipation is 43 mW in the transmitter and 2.6 mW in the receiver at 3.3 V. If chip thickness is reduced to 30 /spl mu/m in 90-nm device generation, power dissipation will be 1 mW/channel or bandwidth will be 1 Tb/s/mm/sup 2/.     

A fully integrated SOC for 802.11b in 0.18-/spl mu/m CMOS

A fully integrated system-on-a-chip (SOC) intended for use in 802.11b applications is built in 0.18-/spl mu/m CMOS. All of the radio building blocks including the power amplifier (PA), the phase-locked loop (PLL) filter, and the antenna switch, as well as the complete baseband physical layer and the medium access control (MAC) sections, have been integrated into a single chip. The radio tuned to 2.4 GHz dissipates 165 mW in the receive mode and 360 mW in the transmit mode from a 1.8-V supply. The receiver achieves a typical noise figure of 6 dB and -88-dBm sensitivity at 11 Mb/s rate. The transmitter delivers a nominal output power of 13 dBm at the antenna. The transmitter 1-dB compression point is 18 dBm and has over 20 dB of gain range.     

A Bluetooth radio in 0.18-/spl mu/m CMOS

This paper describes the results of an implementation of a Bluetooth radio in a 0.18-/spl mu/m CMOS process. A low-IF image-reject conversion architecture is used for the receiver. The transmitter uses direct IQ-upconversion. The VCO runs at 4.8-5.0 GHz, thus facilitating the generation of 0/spl deg/ and 90/spl deg/ signals for both the receiver and transmitter. By using an inductor-less LNA and the extensive use of mismatch simulations, the smallest silicon area for a Bluetooth radio implementation so far can be reached: 5.5 mm/sup 2/. The transceiver consumes 30 mA in receive mode and 35 mA in transmit mode from a 2.5 to 3.0-V power supply. As the radio operates on the same die as baseband and SW, the crosstalk-on-silicon is an important issue. This crosstalk problem was taken into consideration from the start of the project. Sensitivity was measured at -82 dBm.     

A UWB CMOS transceiver

A direct-conversion ultra-wideband (UWB) transceiver for Mode 1 OFDM applications employs three resonant networks and three phase-locked loops. Using a common-gate input stage, the receiver allows direct sharing of the antenna with the transmitter. Designed in 0.13-/spl mu/m CMOS technology, the transceiver provides a total gain of 69-73 dB and a noise figure of 6.5-8.4 dB across three bands, and a TX 1-dB compression point of -10 dBm. The circuit consumes 105 mW from a 1.5-V supply.     

A complete single-chip GPS receiver with 1.6-V 24-mW radio in 0.18-/spl mu/m CMOS

We have developed a complete single-chip GPS receiver using 0.18-/spl mu/m CMOS to meet several important requirements, such as small size, low power, low cost, and high sensitivity for mobile GPS applications. This is the first case in which a radio has been successfully combined with a baseband processor, such as SoC, in a GPS receiver. The GPS chip, with a total size of 6.3 mm /spl times/ 6.3 mm, contains a 2.3 mm /spl times/ 2.0 mm radio part, including RF front end, phase-locked loops, IF functions, and 500 K gates of baseband logic, including mask ROM, SRAM, and dual port SRAM . It is fabricated using 0.18-/spl mu/m CMOS technology with a MIM capacitor and operates from a 1.6-2.0-V power supply. Experimental results show a very low power consumption of, typically, 57 mW for a fully functional chip including baseband, and a high sensitivity of -152dBm. Through countermeasures against substrate coupling noise from the digital part, the high sensitivity was successfully achieved without any external low-noise amplifier.     

49 mW 5 Gbit/s CMOS receiver for 60 GHz impulse radio

A 5 Gbit/s CMOS receiver for 60 GHz impulse radio is realised. It contains a fully differential envelope detector for differential inputs, a current mode offset canceller for robustness against PVT variations, and a high-speed comparator with hysteresis for noise immunity. The receiver is fabricated using a 90 nm CMOS process with a size of 950 x 750 spl mu/m. The total power consumption of the receiver is 49 mW at 5 Gbit/s.     

A 10-Gb/s receiver with series equalizer and on-chip ISI monitor in 0.11-/spl mu/m CMOS

A 10-Gb/s receiver is presented that consists of an equalizer, an intersymbol interference (ISI) monitor, and a clock and data recovery (CDR) unit. The equalizer uses the Cherry-Hooper topology to achieve high-bandwidth with small area and low power consumption, without using on-chip inductors. The ISI monitor measures the channel response including the wire and the equalizer on the fly by calculating the correlation between the error in the input signal and the past decision data. A switched capacitor correlator enables a compact and low power implementation of the ISI monitor. The receiver test chip was fabricated by using a standard 0.11-/spl mu/m CMOS technology. The receiver active area is 0.8 mm/sup 2/ and it consumes 133 mW with a 1.2-V power supply. The equalizer compensates for high-frequency losses ranging from 0 dB to 20 dB with a bit error rate of less than 10/sup -12/. The areas and power consumptions are 47 /spl mu/m /spl times/ 85 /spl mu/m and 13.2 mW for the equalizer, and 145 /spl mu/m /spl times/ 80 /spl mu/m and 10 mW for the ISI monitor.     

A 5-GHz direct-conversion CMOS transceiver utilizing automatic frequency control for the IEEE 802.11a wireless LAN standard

A fully integrated CMOS direct-conversion 5-GHz transceiver with automatic frequency control is implemented in a 0.18-/spl mu/m digital CMOS process and housed in an LPCC-48 package. This chip, along with a companion baseband chip, provides a complete 802.11a solution The transceiver consumes 150 mW in receive mode and 380 mW in transmit mode while transmitting +15-dBm output power. The receiver achieves a sensitivity of better than -93.7dBm and -73.9dBm for 6 Mb/s and 54 Mb/s, respectively (even using hard-decision decoding). The transceiver achieves a 4-dB receive noise figure and a +23-dBm transmitter saturated output power. The transmitter also achieves a transmit error vector magnitude of -33 dB. The IC occupies a total die area of 11.7 mm/sup 2/ and is packaged in a 48-pin LPCC package. The chip passes better than /spl plusmn/2.5-kV ESD performance. Various integrated self-contained or system-level calibration capabilities allow for high performance and high yield.     

A low-power high-performance SiGe BiCMOS 802.11a/b/g transceiver IC for cellular and bluetooth Co-existence applications

This paper describes a high-performance WLAN 802.11a/b/g radio transceiver, optimized for low-power in mobile applications, and for co-existence with cellular and Bluetooth systems in the same terminal. The direct-conversion transceiver architecture is optimized in each mode for low-power operation without compromising the challenging RF performance targets. A key transceiver requirement is a sensitivity of -77 dBm (at the LNA input) in 54 Mb/s OFDM mode while in the presence of a GSM1900 transmitter interferer. The receiver chain achieves an overall noise figure of 2.8/3.2 dB, consuming 168/185 mW at 2.8 V for the 2.4/5GHz bands, respectively. Signal loopback and transmit power detection techniques are used in conjunction with the baseband modem processor to calibrate the transmitter LO leakage and the transceiver I/Q imbalances. Fabricated in a 70 GHz f/sub T/ 0.25-/spl mu/m SiGe BiCMOS technology for system-in-package (SiP) use, the dual-band, tri-mode transceiver occupies only 4.6 mm/sup 2/.     

An ultrawideband system architecture for tag based wireless sensor networks

With the latest improvements in device size, power consumption, and communications, sensor networks are becoming increasingly more popular. There has also been a great increase in the popularity of commercial applications based on ultrawideband (UWB). Impulse radio (IR) based UWB technology utilizes noise-like signal, has potentially low complexity and low cost, is resistant to severe multipath, and has very good time domain resolution allowing for location and tracking applications. In this paper, the architecture and performance of a noncoherent low complexity UWB impulse radio based transceiver designed for low data rate, low cost sensor network applications is presented. The UWB-IR transmitter is based on a delay locked loop (DLL) and UWB monocycle pulse generator. The UWB-IR receiver utilises a noncoherent, energy detection based approach, which makes it largely independent of the shape of the transmit waveform and robust to multipath channels. The test circuits are designed for 0.35 /spl mu/m SiGe BiCMOS technology. This paper presents system simulations results as well as the performance of key functional blocks of the designed UWB application specific integrated circuit (ASIC) transceiver architecture. The simulated power consumption of UWB-IR transceiver circuits is 136 mW with 100% duty cycle with a 3.3 V power supply.     

An 8-Gb/s simultaneous bidirectional link with on-die waveform capture

A full-duplex transceiver capable of 8-Gb/s data rates is implemented in 0.18-/spl mu/m CMOS. This equalized transceiver has been optimized for small area (329 /spl mu/m /spl times/ 395 /spl mu/m) and low power (158 mW) for point-to-point parallel links. Source-synchronous clocking and per-pin skew compensation eliminate coding bandwidth overhead and reduce latency, jitter, and complexity. This link is self-configuring through the use of automatic comparator offset trim and adaptive deskew. Comprehensive diagnostic capabilities have been integrated into the transceiver to provide link, interconnect, and circuit characterization without the use of external test equipment. With a resolution of 4 mV and 9 ps, these capabilities enable on-die eye diagram generation, equivalent time waveform capture, noise characterization, and jitter distribution measurements.     

A 5.6-mW 1-Gb/s/pair pulsed signaling transceiver for a fully AC coupled bus

This paper describes a low-power synchronous pulsed signaling scheme on a fully AC coupled multidrop bus for board-level chip-to-chip communications. The proposed differential pulsed signaling transceiver achieves a data rate of 1 Gb/s/pair over a 10-cm FR4 printed circuit board, which dissipates only 2.9 mW (2.9 pJ/bit) for the driver and channel termination and 2.7 mW for the receiver pre-amplifier at 500 MHz. The fully AC coupled multipoint bus topology with high signal integrity is proposed that minimizes the effect of inter-symbol interference (ISI) and achieves a 3 dB corner frequency of 3.2 GHz for an 8-drop PCB trace. The prototype transceiver chip is implemented in a 0.10-/spl mu/m 1.8-V CMOS DRAM technology and packaged in a WBGA. It occupies an active area of 330/spl times/85 /spl mu/m/sup 2/.     

A WiMedia/MBOA-Compliant CMOS RF Transceiver for UWB

A WiMedia/MBOA compliant RF transceiver for ultra-wideband data communication in the 3-5-GHz band is presented. The transceiver includes receiver, transmitter and synthesizer is completely integrated in 0.13-mum standard CMOS technology. The receiver uses a feedback-based low-noise amplifier (LNA) to obtain an RF gain of 4 to 37 dB and an overall measured noise figure of 3.6 to 4.1 dB over the 3-5-GHz band of interest. The transmitter supports an error vector magnitude (EVM) of -28 dB up to -4 dBm output power and meets the FCC and WiMedia mask specifications. The power consumption from a single supply voltage of 1.5 V is 237 mW for the receiver and 284 mW for the transmitter, both including the synthesizer     

A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package

A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0.25-/spl mu/m CMOS technology. By thinning chip thickness to 10/spl mu/m, the interface communicates at distance of 15 /spl mu/m at minimum and 43 /spl mu/m at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk.     

低电压低功耗CMOS 5Gb/s串行收发器

设计并实现了一种使用0.13μm CMOS 工艺制造的低电压低功耗串行收发器.它的核心电路工作电压为1V,工作频率范围为2.5~5GHz.发送器包括一个20:1的串行器和一个发送驱动器,其中发送驱动器采用了预加重技术来抵消传输信道对信号的衰减,降低信号的码间串扰.接收器包括一个输入信号预放大器,两个1:20的解串器以及时钟恢复电路.在输入信号预放大器中设计了一个简单新颖的电路,利用前馈均衡来进一步消除信号的码间串扰,提高接收器的灵敏度.测试表明,收发器功耗为127mW/通道.发送器输出信号均方根抖动为4ps.接收器在输入信号眼图闭合0.5UI,信号差分峰-峰值150mV条件下误码率小于10-12.     

Level selection based pre-emphasis for PAM transmitter

A novel pre-emphasis for a multi-level PAM transmitter is presented. Overshooting and power consumption are reduced through a level selection approach. The test chip fabricated using a TSMC 0.18 /spl mu/m CMOS process shows 142 mW power dissipation with 500 Mbit/s symbol rate and 1 Gbit/s equivalent data rate.     

A 10-20 Gb/s PAM2-4 transceiver in 65 nm CMOS

This paper presents the design of a 10 Gb/s PAM2, 20 Gb/s PAM4 high speed low power wire-line transceiver equalizer in a 65 nm CMOS process with 1 V supply voltage. The transmitter occupies 430×240 μm2 and consumes 50.56 mW power. With the programmable 5-order pre-emphasis equalizer, the transmitter can compensate for a wide range of channel loss and send a signal with adjustable voltage swing. The receiver equalizer occupies 146×186 μm2 and consumes 5.3 mW power.     

A low-power CMOS Bluetooth RF transceiver with a digital offset canceling DLL-based GFSK demodulator

This paper presents a fully integrated 0.18-/spl mu/m CMOS Bluetooth transceiver. The chip consumes 33 mA in receive mode and 25 mA in transmit mode from a 3-V system supply. The receiver uses a low-IF (3-MHz) architecture, and the transmitter uses a direct modulation with ROM-based Gaussian low-pass filter and I/Q direct digital frequency synthesizer for high level of integration and low power consumption. A new frequency shift keying demodulator based on a delay-locked loop with a digital frequency offset canceller is proposed. The demodulator operates without harmonic distortion, handles up to /spl plusmn/160-kHz frequency offset, and consumes only 2 mA from a 1.8-V supply. The receiver dynamic range is from -78 dBm to -16 dBm at 0.1% bit-error rate, and the transmitter delivers a maximum of 0 dBm with 20-dB digital power control capability.