Thermal,electrical, and mechanical properties of addition-type liquid silicone rubber co-filled with Al2O3 particles and BN sheets

The addition-type liquid silicone rubber (ALSR) co-filled with spheroidal Al₂O₃ and flaky BN was prepared by the mechanical blending and hot press methods to enhance the thermal, electrical, and mechanical properties for industrial applications. Morphologies of ALSR composites were observed by scanning electron microscopy (SEM). It was found that the interaction and dispersion state of fillers in the ALSR matrix were improved by the introduction of BN sheets. Thermal, electrical, and mechanical performances of the ALSR composites were also investigated in this work. The result indicated that the thermal conductivity of ALSR can reach 0.64 W m⁻¹ K⁻¹ at the loading of 20 wt% Al₂O₃/20 wt% BN, which is 3.76 times higher than that of pure ALSR. The addition of Al₂O₃ particles and BN sheets also improve the thermal stability of ALSR composites. Moreover, pure ALSR and ALSR composites showed relatively lower dielectric permittivity (1.9–3.1) and dielectric loss factor (<0.001) at the frequency of 10³ Hz. The insulation properties including volume resistivity and breakdown strength were improved by the introduction of flaky BN in the ALSR matrix. The volume resistivity and characteristic breakdown strength E₀ are 6.68 × 10¹⁵ Ω m and 93 kV/mm, respectively, at the loading of 20 wt% Al₂O₃/20 wt% BN. In addition, the mechanical characteristics including elongation at break and tensile strength of ALSR composites were also enhanced by co-filled fillers. The combination of these improved performances makes the co-filled ALSR composites attractive in the field of electrical and electronic applications.     

Improved dielectric and mechanical properties of Ti3C2Tx MXene/silicone rubber composites achieved by adding a few boron nitride nanoplates

MXenes have attracted great attentions in the fabrication of dielectric polymer composites because of their excellent electrical conductivity. However, the high dielectric loss tangent would suppress the application of such polymer-based composites. Incorporating insulating fillers might be a solution. Herein, Ti₃C₂T_x MXene/silicone rubber (SR) composites incorporated with boron nitride (BN) nanoplates were prepared. The homogeneous distribution of fillers was obtained in the composites, which was also thermally stable up to 400 °C. Dielectric constant of 7.06 (2.54 times of pure SR) and dielectric loss tangent of 0.00131 were achieved when the filling contents of MXene and BN in SR composite were 1.2 wt% and 5 wt%, respectively. The improved dielectric constant can be ascribed to the enhanced interfacial polarization and the formation of conductive network, while the low dielectric loss tangent can be due to the insulating interlayers of BN which could inhibit the transfer of free electrons from conductive fillers to the insulating polymer matrices. BN/MXene/SR composites displayed improved mechanical properties (tensile stress of 671 kPa and elongation at break of 353%) and good flexibility (elastic modulus of 540 kPa) due to the low filling content of fillers. This work is promising for preparing dielectric polymer composites in applications of electronic devices.     

Thermal and dielectric properties of low-density polyethylene/NaA zeolite composites

The effect of the weight fraction of NaA zeolite on thermal properties (specific heat capacity, thermal diffusivity, thermal conductivity) and dielectric properties (electrical conductivity, real and imaginary electric permittivity) of composites based on low-density polyethylene (LDPE) and NaA zeolite is examined. Composite samples containing from 5 to 30 wt% zeolite are prepared using the compression molding technique. The degree of dispersion and the weight fraction of filler in the LDPE/NaA zeolite composites are determined using X-ray diffraction. A linear decrease in the values of the specific heat capacity with an increase in the weight fraction of zeolite is observed using differential scanning calorimetry. The laser flash method is used to determine the thermal diffusivity of the composites. An increase in effective thermal diffusivity and abrupt increase in the range from 15 to 20 wt% of zeolite are established. It is demonstrated that effective thermal conductivity increases with an increase in the weight fraction of zeolite, and an abrupt increase in the range from 15 to 20 wt% is observed. Dielectric spectroscopy measurements are performed to determine the real and imaginary parts of permittivity. An increase of real and imaginary parts of permittivity of LDPE/NaA zeolite composites, with increasing weight fraction of zeolite, is established. Two relaxation peaks of the imaginary parts of permittivity of LDPE/NaA zeolite composites are detected. An increase of electrical conductivity with increasing weight fraction of zeolite and abrupt increase in the range 15 to 20 wt% are noticed. © 2021 Society of Industrial Chemistry.     

Crystallization and thermal conductivity of poly (vinylidene fluoride)/boron nitride nanosheets composites

ABSTRACT

In this work, boron nitride (BN) and exfoliated boron nitride nanosheets (BNNs) were employed as thermal conductive fillers to improve the thermal conductivity of poly(vinylidene fluoride) (PVDF) composites. Results suggested that the thermal conductivity of PVDF increases significantly with an increase in loading content of functional fillers. When the mass ratio of fillers was more than 30 wt%, the heat conduction network was formed. BNNs were capable of forming denser heat conduction network as per the SEM observations. In this scenario, PVDF/BNNs composites demonstrated excellent thermal conductivity. For example, the thermal conductivity of PVDF/BNNs (60/40) was 0.82 W/mK, which was 2.4 times and 17% higher than that of neat PVDF and PVDF/BN (60/40) counterpart, respectively. The non-isothermal crystallization of corresponding composite was studied by Mo method. Combining with XRD results, both BN and BNNs acted as the nucleation agents but had no effect on crystal forms.     

Boron Nitride Quasi-Nanoscale Fibers: Controlled Synthesis and Improvement on Thermal Properties of PHA Polymer

High-purity h-BN quasi-nanoscale fibers were successfully synthesized by annealing oriented fiber-like precursor, an adduct of melamine with boric acid at a ratio of 1:2 (M · 2B), under ammonia flow. A series of experiments have been conducted to obtain an optimum condition for generating nanoscale precursor for the synthesis of h-BN quasi nanofibers with an average diameter of ～500 nm and length of several hundred micrometers, respectively. The fiber is a polycrystal composed of numerous disordered h-BN layers, with some stacking voids and defaults. In addition, the effects of BN fibers on the thermal conductivity and stability of biodegradable polyhydroxyalkanoate (PHA) have been studied. It is worth noting that with the addition of 2 wt% BN fibers, the thermal properties (thermostability and thermal conductivity) of the as-prepared composites have been influenced substantially.     

Microstructure,Thermal Conductivity,and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

The microstructure, thermal conductivity, and electrical properties of pressureless densified SiC–BN composites prepared from in situ reaction of Si₃N₄, B₄C, and C were systematically investigated, to achieve outstanding performance as substrate materials in electronic devices. The increasing BN content (0.25–8 wt%) in the composites resulted in finer microstructure, higher electrical resistivity, and lower dielectric constant and loss, at the expense of only slight degradation of thermal conductivity. The subsequently annealed composites showed more homogeneous microstructures with less crystal defects, further enhanced thermal conductivities and electrical resistivities, and reduced dielectric constants and losses, compared with the unannealed ones. The enhanced insulating performance, the weakened interface polarization, and the reduced current conduction loss were explained by the gradual equalization of dissolved B and N contents in SiC crystals and the consequent impurity compensation effect. The schottky contact between graphite and p‐type SiC grains presumably played a critical role in the formation of grain‐boundary barriers. The annealed composites doped with 8 wt% BN exhibited considerably high electrical resistivity (4.11 × 10¹¹ Ω·cm) at 100 V/cm, low dielectric constant (16.50), and dielectric loss (0.127) at 1 MHz, good thermal conductivity [66.06 W·(m·K)^?1] and relatively high strength (343 MPa) at room temperature.     

The Processing and Characterization of MWCNT/Epoxy and CB/Epoxy Nanocomposites Using Twin Screw Extrusion

This paper presents results of the processing of nanocomposites based on epoxy and nanofillers, namely multiwalled carbon nanotubes (up to 10 wt%) and carbon black (up to 15 wt%). The twin screw extruded nanocomposites showed increases in electrical and thermal conductivities, tensile strength, microhardness and glass transition temperature. Electrical conductivity increased on the order of 10¹¹ at 10 wt% of nanotubes loading and at 15 wt% of carbon black. Greater increases in thermal and mechanical properties were observed in cases of nanotube-dispersed composites more so than others. SEM and AFM were used to examine the dispersion of the fillers.     

Thermal behavior and dielectric property analysis of boron nitride‐filled bismaleimide‐triazine resin composites

Bismaleimide‐triazine (BT) resin/hexagonal boron nitride (h‐BN) composites are prepared, and the effects of h‐BN content on the thermal and dielectric properties are studied in the view of structure–property relationship. It is found that the introduction of the BN in the BT resin dramatically improve the thermal conductivity of BT resin. The thermal conductivity of the composites is up to 1.11 W/m.K, with an h‐BN concentration of 50 wt %, which is increased by six times compared with the pure BT resin. The BT resin/h‐BN composites also exhibit excellent thermal properties, with the glass transition temperatures above 200°C, and thermal decomposition temperatures over 390°C. Moreover, the composites possess good dielectric properties. Their dielectric constant and loss tangent (tan δ) are less than 4.5 and 0.015, respectively. The results indicate that the BT resin/h‐BN composites are promising as efficient heat‐releasing materials in the high‐density electronic packaging technology. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Preparation,characterization, and thermal properties of poly (methyl methacrylate)/boron nitride composites by bulk polymerization

Poly (methyl methacrylate)/boron nitride (PMMA/BN) composites were prepared by dispersing BN particles into methyl methacrylate monomer phase by bulk polymerization method. BN particles modified with silane coupling agent, γ‐methacryloxypropyl trimethoxy silane, were characterized by Fourier transform infrared spectroscopy and thermogravimetric analysis. Effects of modified BN particle content on thermal conductivity were investigated, and the experimental values were compared with those of theoretical and empirical models. With 16 wt% of BN particles, the thermal conductivity of the composite was 0.53 W/(m·K), 1.8 times higher than that of pure PMMA. The microstructures of the PMMA/BN composites were examined by scanning electron microscopy, energy‐dispersive X‐ray analysis, and transmission electron microscopy. Dynamic mechanical analysis and thermogravimetric analysis traces also corroborated the confinement of the polymer in an inorganic layer by exhibiting an increase in glass‐transition temperatures and weight loss temperatures in the thermogram. Mechanical properties and electrical insulation property of the PMMA/BN composites were also determined. These results showed that PMMA/BN composites may offer new technology and business opportunities. POLYM. COMPOS., 36:1675–1684, 2015. © 2014 Society of Plastics Engineers     

Electrical conductivity,dielectric and microwave absorption properties of graphene nanosheets/magnesia composites

Herein, a novel microwave absorbing material with Graphene nanosheets (GNSs) as microwave absorbing filler and magnesia (MgO) as matrix were prepared by hot-pressing sintering. The composites were highly dense with a homogeneous distribution of GNSs. Electrical conductivity, dielectric and microwave absorption properties in X-band were investigated. The results revealed that the electrical conductivity of the GNSs/MgO composites showed a typical percolation-type behavior with a percolation threshold of 3.34 vol%. With GNSs content increased to 3 vol%, the real permittivity, imaginary permittivity and dielectric loss tangent of the composites increased from ～9, ～0 and ～0 to 26–43, 23–28 and 0.55–0.96, respectively. By adjusting the GNSs content, thickness and frequency, the 2.5 vol% GNSs/MgO composite shows the minimum reflection loss of ?36.5 dB at 10.7 GHz and the reflection loss below ?10 dB (90% absorption) ranges from 9.4 to 11.4 GHz with 1.5 mm thickness, exhibiting excellent microwave absorption properties.     

Melt compounded polylactic acid-hexagonal boron nitride-aluminum oxide hybrid composites for electronic applications: impact of hybrid fillers on thermophysical,dielectric, optical,and hardness properties

ABSTRACT

The dielectric, thermophysical, optical, and hardness of pure polylactic acid (PLA) and hBN micropowder and Al₂O₃ nanopowder (1% to 30%) reinforced PLA hybrid composites were investigated. Hybrid composites exhibit improved thermal conductivity (k – 0.54 W/mK), permittivity (?? – 4.6720 @ 1 MHz to 1 GHz) with very low loss tangent (tan δ < 0.02). High absorption in UV region was observed for all hybrid composites. Overall, the prepared hybrid composites can be used as a bio-based dielectric substrates, enclosures, thermal interface material for low temperature applications and UV-absorbable coating materials for fabric, packaging, and storage applications.     

Dielectric properties of epoxy/graphite flakes composites: Influence of loading and surface treatment

Epoxy-rich carbon-based composites are well recognized materials in industries owing to their good mechanical properties and thermal stability. Here, dielectric properties of composites based on bisphenol-A-epoxy resin loaded with 5, 6, 10, and 15 wt% of graphite flakes (GF) have been studied. The frequency and temperature dependence of the dielectric permittivity, dielectric loss, and ac conductivity have been examined in temperature (−103 to 97°C) and frequency (20 Hz–200 kHz) range. Influence of the filler surface chemistry have been studied for composites loaded with 5 wt% GF obtained: (i) under wet milling, without or with adding Triton-100x as a surfactant, or (ii) under dry milling in the presence of KOH. The composite made of epoxy loaded with 5 wt% exfoliated expanded graphite flakes (EEG), was also prepared. The surface treatment with KOH notably increased dielectric constant of the composite, keeping low dielectric loss, while treatment with Triton-100x significantly increased tanδ. The composite loaded with exfoliated expanded graphite shows higher ac conductivity than those obtained with flaky graphite, GF. Possibility to change dielectric properties of the composites without changing the loading content can be used as an approach in tailoring one with desired dielectric properties.     

Synergistic effect of boron nitride and tetrapod‐shaped zinc oxide whisker hybrid fillers on filler networks in thermal conductive HDPE composites

In this paper, in order to investigate and predict the synergistic effect of the tetra‐needle‐shaped zinc oxide whisker (T‐ZnO) and boron nitride (BN) hybrid fillers in the thermal conductive high‐density polyethylene (HDPE) composites, the filler networks were studied through dynamic rheological measurement. Moreover, the crystallinity of the HDPE in the composites, and the thermal and electrical conductivity of the composites were also investigated. It was found that when the ratio of the BN and T‐ZnO in hybrid fillers was 20:10, the HDPE/hybrid fillers composite not only had the highest thermal conductivity but also can maintain the electrically insulating. Furthermore, the gel point of the HDPE/hybrid fillers composites was 11.2 wt%, and it was close to the 10 wt%. Therefore, the synergistic effect of the T‐ZnO and BN hybrid fillers in the HDPE/hybrid fillers composites can be successfully predicted through dynamic rheology date. Simultaneously, the Scanning electron microscope results showed that the T‐ZnO and BN particles can contact each other to form the thermal conductive paths so that the thermal conductivity of the HDPE can be enhanced through addition of the hybrid fillers. In addition, it was also found that the improved thermal conductivity of the HDPE/hybrid fillers composites was not because of a change in the crystallinity of the HDPE in the HDPE/hybrid fillers composites. POLYM. COMPOS., 38:1902–1909, 2017. © 2015 Society of Plastics Engineers     

Preparation,characterization and electrical properties of polyacrylonitrile/huntite composites

We focused on polyacrylonitrile (PAN)/huntite composites to reinforce the polymer prepared by adding different percentages (wt%) of huntite to PAN. The composites were characterized using thermogravimetric analysis, differential scanning calorimetry, fourier transform infrared spectroscopy (FT-IR) and scanning electron microscopy techniques. It was clearly seen that the composites of PAN/huntite have better thermal stability than pure PAN. The effect of the huntite adding to Polyacrylonitrile (PAN) on dc conductivity and dielectric constant was also investigated. Dc conductivity values were increased with increasing temperature. Activation energy values were calculated depending on huntite contents in PAN. Relative dielectric constant values varied in the range of 16.5–21.2 at room temperature at 100 kHz frequency depending on huntite concentrations. All the electrical measurements were performed in dark and vacuum ambient between the temperatures of 295 and 523 K. Dielectric measurements were performed in the frequency range of 40 Hz–100 kHz.     

Thermal and electrical properties of aluminum nitride/boron nitride filled polyamide 6 hybrid polymer composites

The effects of boron nitride (BN) and aluminum nitride fillers on polyamide 6 (PA6) hybrid polymer composites were investigated. In particular, the thermal and electrical conductivity, thermal transition, thermal degradation, mechanical and morphological properties and chemical bonds characteristic of the materials with crystal structure of BN and aluminum nitride (AlN) filled PA6 prepared at different concentrations were characterized. Thermal conductivity of hybrid systems revealed a 1.6-fold gain compared to neat PA6. The highest thermal conductivity value was obtained for the composite containing 50 vol% additives (1.040 W/m K). A slight improvement in electrical conductive properties of composites appears and the highest value was obtained for the 50 vol% filled composite with only an increase by 3%. The microstructure of these composites revealed a homogeneous dispersion of AlN and BN additives in PA6 matrix. For all composites, one visible melting peak around 220°C related to the α-form crystals of PA6 was detected in correlation with the X-ray diffraction results. An improved thermal stability was obtained for 10 vol% AlN/BN filled PA6 composite (from 405.41°C to 409.68°C). The tensile strength results of all composites were found to be approximately 22% lower than pure PA6.     

Properties and application of polyimide‐based composites by blending surface functionalized boron nitride nanoplates

Ball milling was used to decrease the particle size of boron nitride (BN) nanoplates and to form more silylated functionalization of their surface. Such functionalized BN nanoplates enhanced their homogeneous dispersion in polyimide (PI) matrix. Thermal conductivities, thermal stabilities, and dielectric properties were characterized to investigate the particular effects on the performance of PI‐based composites with functionalized BN nanoplates. When the concentration of functionalized BN nanoplates increased to 50 wt %, thermal conductivity of the composite increased up to 1.583 W m^?1 K^?1, and the temperature of final thermal decomposition was improved to 600°C. An increasing trend was found in the dielectric constant of the composites while the dielectric loss decreased with the increase in the fraction. An appropriate fraction of functionalized BN nanoplates in PI‐based composites were necessary to meet the requirement of withstanding drilling forces for the interconnecting through holes of flexible circuits. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41889.     

Thermal,conductivity, and dielectric properties of poly(2-ethyl-2-oxazoline)-polyvinylpyrrolidone blends

Bio-compatible polymer blends of poly(2-ethyl-2-oxazoline) [PEOX] and polyvinylpyrro-lidone [PVP] were prepared at various compositions (80:20, 60:40, 40:60, and 20:80 wt%). These polymer blends were characterized by scanning electron microscopy (SEM) and Fourier transform infrared spectroscopy (FTIR). The thermal stability of the blends was evaluated by thermogravimetry. The kinetic parameters such as activation enthalpy, ?H, activation entropy, ?S, and free energy of activation, ?G, were calculated using kinetic model given by Broido for all the blends. The thermal studies show that PEOX: PVP (20:80) blend has good thermal stability compared to other blends. The results show that thermal stability and decomposition temperature of PEOX was considerably improved by the addition of PVP. The electrical and dielectric properties of PEOX:PVP (80:20) blend were measured in the temperature range of 313 K - 353 K using an LCR meter for the frequency range 100 Hz - 8 MHz. The dielectric studies shows that dielectric constant, dielectric loss and electric modulus decreases with frequency and increases with temperature, whereas AC conductivity increases with frequency and temperature.     

Alkylated modified boron nitride nanosheets/polyimide composite films with advanced thermal conductivity and low dielectric constant

Owing to the rapid development of the latest micro-electronic devices, polymer composite materials that combine high thermal conductivity and low permittivity have aroused the interest of researchers. However, it is a huge challenge to balance the above parameters. In this work, hexagonal boron nitride (h-BN) powder was ultrasonically exfoliated to obtain alkylated boron nitride nanosheets (Alkyl-BNNS). Then, a series of polyimide (PI) composites were synthesized with different amounts of Alkyl-BNNS. Attributed to more robust interfacial non-covalent interactions between Alkyl-BNNS and polymer chains to inhibit interfacial polarization, Alkyl-BNNS can be scattered well in PI substrate. Thus, the obtained PI composite behaved a high thermal conductivity of 6.21 W/(mK) and a low dielectric constant (3.23) under the load of 20 wt%. Besides, Alkyl-BNNS/PI composites have efficient thermal management capability, low water absorption, favorable electrical resistance, and prominent tensile strength. Importantly, these composite films are expected to be excellent candidates in the field of microelectronics.     

Thermal and dielectric properties of the aluminum particle reinforced linear low‐density polyethylene composites

The possibility of obtaining relatively high thermal conductivity and dielectric constant but low dielectric loss polymeric composites by incorporating the core‐shell‐structured aluminum (Al) particles in a linear low‐density polyethylene (LLDPE) by melt mixing and hot pressing was demonstrated in this study. The morphology, thermal and dielectric properties of the composites were characterized using X‐ray diffractions, thermal analysis, scanning electron microscope, and dielectric analyzer. The Al particle decreases the degree of crystallinity and has no appreciable influence on the melting temperature of LLDPE. The thermal conductivity, dielectric constant and loss factor of the composites increase with an increase in Al content at all the frequencies (1 ～ 10⁶ Hz). The thermal conductivity and dielectric constant of the 70 wt% flaky Al particles filled LLDPE are 1.63 W/mK and 50, much higher than those of the spherical Al reinforced one. Moreover, the surface treatment of Al particles with γ‐Aminopropyltriethoxysilane silane coupler improves the thermal conductivity. The dielectric loss factors of the composites still remain at relatively low levels in the measured frequency range. Further, the dielectric permittivity frequency independence in the measured frequency range was observed due to the nanoscale‐Al‐oxide insulating shell of Al. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Study on thermal conductive PA6 composites with 3-dimensional structured boron nitride hybrids

To develop thermally conductive PA6 composites with the aim of decreasing filler content, structure-complexed fillers were fabricated. This research presented an effective approach by noncovalent functionalization of poly(dopamine) (PDA) followed by silver nanoparticles decoration to fabricate 3-dimensional (3-D) structured boron nitride hybrids (BN@PDA@AgNPs). BN hybrids were then introduced into PA6 to prepare thermally conductive PA6 composites. The results demonstrated that PA6/BN hybrids (PMB) composites exhibited higher thermal conducivity compared with PA6/BN composites, which revealed more effective construction of thermal conductive network in the composites with the addition of 3-D structured fillers. The effects of BN hybrids with different loadings on thermal stability, mechanical property, as well as electrical resistance of the composites were also analyzed. Overall, the prepared PMB composites exhibited outstanding performance in thermal conductivity, thermal stability, mechanical property, while retaining good electrical insulating property, which showed a potential application in electronic packaging fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47630.