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1.
Buried layers of boron in silicon have been made by 1 MeV implantations up to a dose of 1013 cm?2. The annealing of the implantation damage has been studied with Van der Pauw and Hall measurements. It is concluded that lattice damage reduces the mobility only for annealing temperatures below 600°C. The average mobilities measured after annealing at temperatures above 600°C correspond accurately to the values calculated from the most recent literature data, based on scattering by the lattice and by the active impurities. Complete activation was obtained after 60 min annealing at 700°C.  相似文献   

2.
We report the use of tungsten-halogen lamps for rapid (−10 s) thermal annealing of ion-implanted (100) GaAs under AsH3/Ar and N2 atmospheres. Annealing under flowing AsH3/Ar was carried out without wafer encapsulation. Rapid capless annealing activated implants in GaAs with good mobility and surface morphology. Typical mobilities were 3700–4500 cm2/V-s for n-layers with about 2×1017cm−3 carrier concentration and 50–150 cm2/v-s for 0.1–5xl019 cm−3 doped p-layers. Rapid thermal annealing was performed in a vertical quartz tube where different gases (N2, AsH3/H2, AsH3/Ar) can be introduced. Samples were encapsulated with SiO when N2 was used. Tungsten-halogen lamps of 600 or 1000 W were utilized for annealing GaAs wafers ranging from 1 to 10 cm2 in area and 0.025 to 0.040 cm in thickness. The transient temperature at the wafer position was monitored using a fine thermocouple. We carried out experiments for energies of 30 to 200 keV, doses of 2×1012 to 1×1015 cm−2, and peak temperatures ranging from 600 to 1000‡C. Most results quoted are in the 700 to 870‡C temperature range. Data on implant conditions, optimum anneal conditions, electrical characteristics, carrier concentration profiles, and atomic profiles of the implanted layers are described. Presented at the 25th Electronic Materials Conference, Burlington, VT, June 22, 1983.  相似文献   

3.
Room temperature and elevated temperature sulfur implants were performed into semi-insulating GaAs and InP at variable energies and fluences. The implantations were performed in the energy range 1–16 MeV. Range statistics of sulfur in InP and GaAs were calculated from the secondary ion mass spectrometry atomic concentration depth profiles and were compared with TRIM92 values. Slight in-diffusion of sulfur was observed in both InP and GaAs at higher annealing temperatures for room temperature implants. Little or no redistribution of sulfur was observed for elevated temperature implants. Elevated temperature implants showed higher activations and higher mobilities compared to room temperature implants in both GaAs and InP after annealing. Higher peak electron concentrations were observed in sulfur-implanted InP (n ≈ 1 × 1019 cm−3) compared to GaAs (n ≈ 2 × 1018 cm−3). The doping profile for a buried n+ layer (n ≈ 3.5 × 1018 cm−3) of a positive-intrinsic-negative diode in GaAs was produced by using Si/S coimplantation.  相似文献   

4.
Photoluminescence (PL) and reflection spectra of undoped and Mg-doped GaN single layers grown on sapphire substrates by metalorganic vapor phase epitaxy (MOVPE) were investigated in a wide range of temperatures, excitation intensities, and doping levels. The undoped layers show n-type conductivity (μ=400 cm2/Vs, n=3×1017 cm−3). After annealing at T=600–700°C, the Mg-doped layers showed p-type conductivity determined by the potential-profiling technique. A small value of the full width at half maximum (FWHM=2.8 meV) of the excitonic emission and a high ratio between excitonic and deep level emission (≈5300) are evidences of the high layer quality. Two donor centers with activation energies of 35 and 22 meV were observed in undoped layers. A fine structure of the PL band with two narrow lines in the spectral range of the donor-acceptor pair (DAP) recombination was found in undoped layers. An anomaly was established in the temperature behavior of two groups of PL lines in the acceptor-bound exciton and in donor-acceptor pair regions in Mg doped layers. The lower energy line quenched with increasing temperature appreciably faster than the high energy ones. Our data does not agree with the DAP recombination model. It suggests that new approaches are required to explain the recombination mechanisms in undoped and Mg-doped GaN epitaxial layers.  相似文献   

5.
Chemical and damage effects are used to explain the influence of complementary species on the activation of co-implanted InP. Recently Raoet al. have shown that the damage is the effective mechanism of enhancing activation efficiency and preventing in-diffusion in the P/Be and Ar/Be co-implanted InP. We have confirmed the results and further examined the role of the complementary species by varying their doses. Activation efficiencies as high as 75% and 69.5% were observed in the P/Be and Ar/Be co-implantation, respectively, which can be compared with 31.7% activation in the Be single implantation. Both activation efficiency and in-diffusion decreased as doses of P and Ar increased, that is, as the amount of damage increased. P/Be had always higher activation efficiency than that of Ar/Be when the doses of co-implants are equal. The ratio of the difference in the two activation efficiencies to that of P/Be was the largest at 1014 cm−2 of co-implant dose. This behavior was attributed to the chemical effect of the co-implanted P. Photoluminescence results near the band edge showed that the intensity of the main peaks of Be single implantation decreased with increasing P and Ar doses.  相似文献   

6.
The dependence of carrier concentration and mobility profiles on the dose of 400 keV Se ions implanted into Cr-doped semi-insulating GaAs, and on the annealing temperature has been studied for doses ranging from 3 × 1012/cm2 to 2 × 1015/cm2 and for annealing temperatures between 800 and 1000°C. Sputtered aluminum oxy-nitride and silicon nitride films were used as encapsulants for protection of the implanted surface during annealing treatments. The carrier profiles exhibited deep tails for implantations along both random and {110} planar directions. It was found that annealing temperatures of 900°C or above were necessary to obtain high carrier density and mobility values for implantation doses above 1 × 1014/cm2. Samples encapsulated with aluminum oxy-nitride films exhibited 3 to 4 times higher carrier concentration values and also slightly higher mobility values than those encapsulated with silicon nitride films. The maximum carrier concentration obtained was about 4 × 1018/cm3 with aluminum oxy-nitride films as the encapsulant.  相似文献   

7.
Halogen lamp rapid thermal annealing was used to activate 100 keV Si and 50 keV Be implants in In0.53Ga0.47As for doses ranging between 5 × 1012−4 × 1014 cm−2. Anneals were performed at different temperatures and time durations. Close to one hundred percent activation was obtained for the 4.1 × 1013 cm−2 Si-implant, using an 850° C/5 s anneal. Si in-diffusion was not observed for the rapid thermal annealing temperatures and times used in this study. For the 5 × 1013 cm−2 Be-implant, a maximum activation of 56% was measured. Be-implant depth profiles matched closely with gaussian profiles predicted by LSS theory for the 800° C/5 s anneals. Peak carrier concentrations of 1.7 × 1019 and 4 × 1018 cm−3 were achieved for the 4 × 1014 cm−2 Si and Be implants, respectively. For comparison, furnace anneals were also performed for all doses.  相似文献   

8.
To obtain highly conductive buried layers in InP:Fe, MeV energy Si, S, and Si/ Simplantations are performed at 200°C. The silicon and sulfer implants gave 85 and 100 percent activation, respectively, for a fluence of 8 × 1014 cm−2. The Si/S co-implantation also gave almost 100 percent donor activation for a fluence of 8 × 1014 cm−2 of each species. An improved silicon donor activation is observed in the Si/S co-implanted material compared to the material implanted with silicon alone. The peak carrier concentration achieved for the Si/S co-implant is 2 × 1019 cm3. The lattice damage on the surface side of the profile is effectively removed after rapid thermal annealing. Multiple-energy silicon and sulfur implantations are performed to obtain thick and buried n+ layers needed for microwave devices and also hyper-abrupt profiles needed for varactor diodes.  相似文献   

9.
The objective of this work is to study the incorporation process of Zn in InP and related ternary and quaternary layers for long wavelength laser applications in comparison with the alternative acceptor Mg. In InP above a critical concentration of (1–2)×1018 cm?3 a sudden onset of dopant diffusion during growth is observed for Zn and for Mg as well. This diffusion during growth can be markedly reduced by counter-doping with Si (Fermi level effect). Below the critical concentration Zn dopant profiles exhibit the same steep flanks as Mg dopant profiles suggesting the same low diffusion coefficients. However, Zn appears to be more suitable forp-type doping of InP, GaInAs and GaInAsP, because an accurate control of the dopant level in the epitaxial layers is easier to achieve with Zn than with Mg.  相似文献   

10.
Room-temperature photoluminescence (PL) has been studied in AlGaN/GaN superlattices and GaN epitaxial layers implanted with 1-MeV erbium at a dose of 3 × 1015 cm?2 and annealed in argon. The intensity of PL from Er3+ ions in the superlattices exceeds that for the epitaxial layers at annealing temperatures of 700–1000°C. The strongest difference (by a factor of ~2.8) in PL intensity between the epitaxial layers and the superlattices and the highest PL intensity for the superlattices are observed upon annealing at 900°C. On raising the annealing temperature to 1050°C, the intensity of the erbium emission from the superlattices decreases substantially. This circumstance may be due to their thermal destruction.  相似文献   

11.
We report on the intentional ρ-type doping of GaAs layers grown in an UHV system from molecular beams of arsine (AsH3) and mixtures of frimethyl gallium (TMG) and friethyl gallium (TEG). The entire doping range between 1014 cm-3 (growth from pure TEG) and 1020 cm-3 (growth from pure TMG) can be covered by using mixtures of TMG and TEG. As revealed by SIMS and photoluminescence (PL) carbon is the dominant acceptor in the layers. Comparison of the Hall mobility and of the PL spectra shows that the quality of our films equals that of the best LPE and MBE grown ρ-type GaAs layers.  相似文献   

12.
We report the results of the transport properties and the recombination mechanisms of indium-doped HgCdTe(211)B (x ≈ 23.0% ± 2.0%) layers grown by molecular beam epitaxy. We have investigated the origin(s) of the background doping limitation in these layers. Molecular beam epitaxially grown layers exhibit excellent Hall characteristics down to indium levels of 2 x 1015 cm−3. Electron mobilities ranging from (2-3) x 105 cm2/v-s at 23K were obtained. Measured lifetime data fits very well with the intrinsic band-to-band recombinations. However, below 2 x 1015 cm−3 doping levels, mobility vs temperature curves starts to reflect nonuniformity in carrier distribution. Also, when we reduced the Hg vacancy concentration down to 1012 cm−3 range, by annealing at 150°C, Hall characteristics shows an increase in the nonuniformity in the epilayers. It was found that after annealed at 150°C, the obtained SR defect level has a different origin than the previously obtain Hg-vacancy related defect level.  相似文献   

13.
Al,Al/C and Al/Si implantations in 6H-SiC   总被引:1,自引:0,他引:1  
Multiple-energy Al implantations were performed with and without C or Si coimplantations into 6H-SiC epitaxial layers and bulk substrates at 850°C. The C and Si co-implantations were used as an attempt to improve Al acceptor activation in SiC. The implanted material was annealed at 1500, 1600, and 1650°C for 45 min. The Al implants are thermally stable at all annealing temperatures and Rutherford backscattering via channeling spectra indicated good lattice quality in the annealed Al-implanted material. A net hole concentration of 8 × 1018 cm−3 was measured at room temperature in the layers implanted with Al and annealed at 1600°C. The C or Si co-implantations did not yield improvement in Al acceptor activation. The co-implants resulted in a relatively poor crystal quality due to more lattice damage compared to Al implantation alone. The out-diffusion of Al at the surface is more for 5Si co-implantation compared to Al implant alone, where 5Si means a Si/Al dose ratio of 5.  相似文献   

14.
The electrical properties of C-implanted <100> GaAs have been studied following rapid thermal annealing at temperatures in the range from 750 to 950°C. This includes dopant profiling using differential Hall measurements. The maximum p-type activation efficiency was found to be a function of C-dose and annealing temperature, with the optimum annealing temperature varying from 900°C for C doses of 5 × 1013 cm−2 to 800°C for doses ≥5 × 1014cm−2. For low dose implants, the net p-type activation efficiency was as high as 75%; while for the highest dose implants, it dropped to as low as 0.5%. Moreover, for these high-dose samples, 5 × 1015 cm−2, the activation efficiency was found to decrease with increasing annealing temperature, for temperatures above ∼800°C, and the net hole concentration fell below that of samples implanted to lower doses. This issue is discussed in terms of the amphoteric doping behavior of C in GaAs. Hole mobilities showed little dependence on annealing temperature but decreased with increasing implant dose, ranging from ∼100 cm2/V·s for low dose implants, to ∼65 cm2/V·s for high dose samples. These mobility values are the same or higher than those for Be-, Zn-, or Cd-implanted GaAs.  相似文献   

15.
Hall mobilities and resistance area products RoA of infrared diodes in epitaxial Pb1-xSnxSe layers on CaF2 covered Si(111) substrates were correlated with threading dislocation densities p. The low temperature saturation Hall mobilities were entirely determined by p and proportional to their mean spacing 1/ √ρ. For the photodiodes, the R0A values at low temperatures were inversely propor-tional to ρ. A model where each dislocation in the active area of the diodes causes a shunt resistance correctly describes the results, the value of this resistance for a single dislocation is 1.2 GΩ for PbSe at 85K. The dislocation densities were in the 2 × 107 to 5 × 108cm-2 range for the 3-4 μm thick as-grown layers. Higher R0A values are obtainable by lowering these densities by thermal annealing, which sweeps the threading ends of the misfit dislocations to the edges of the sample.  相似文献   

16.
The production and annealing of damage in (100) InP implanted with Se+ ions at 77 K, room temperature and 180°C have been studied by channeling and differential Hall measurements. For ion energies from 100 to 400 keV, fluences of 1014 and 1015 cm?2 produce amorphous layers which extend to the surface in samples implanted at 77 K or room temperature, while the samples implanted at 180°C remain crystalline. According to the channeling measurements, amorphous layers less than 2000 Å thick produced by either 77 K or room-temperature implants are completely reordered by annealing at 750°C for 10 min, while the post-anneal residual disorder of thicker layers is linearly dependent on the initial amorphous layer thickness. After annealing, samples implanted at 180°C have higher sheet carrier concentrations and mobilities but considerably broader carrier concentrations than samples similarly implanted at either 77 K or room temperature, even when the amorphous layers in the latter samples are completely reordered. It is considered that for most applications heated implants should be used to avoid the formation of amorphous layers.  相似文献   

17.
Rapid thermal annealing (RTA) technology offers potential advantages for GaAs MESFET device technology such as reducing dopant diffusion and minimizing the redistribution of background impurities. LEC semi-insulating GaAs substrates were implanted with Si at energies from 100 to 400 keV to doses from 1 × 1012 to 1 × 1014/cm2. The wafers were encapsulated with Si3N4 and then annealed at temperatures from 850-1000° C in a commercial RTA system. Wafers were also annealed using a conventional furnace cycle at 850° C to provide a comparison with the RTA wafers. These implanted layers were evaluated using capacitance-voltage and Hall effect measurements. In addition, FET’s were fabricated using selective implants that were annealed with either RTA or furnace cycles. The effects of anneal temperature and anneal time were determined. For a dose of 4 × 1012/cm2 at 150 keV with anneal times of 5 seconds at 850, 900, 950 and 1000° C the activation steadily increased in the peak of the implant with overlapping profiles in the tail of the profiles, showing that no significant diffusion occurs. In addition, the same activation could be obtained by adjusting the anneal times. A plot of the equivalent anneal times versus 1/T gives an activation energy of 2.3 eV. At a higher dose of 3 × 1013 an activation energy of 1.7 eV was obtained. For a dose of 4 × 1012 at 150 keV both the RTA and furnace annealing give similar activations with mobilities between 4700 and 5000 cm2/V-s. Mobilities decrease to 4000 at a dose of 1 × 1013 and to 2500 cm2/V-s at 1 × 1014/cm2. At doses above 1 × 1013 the RTA cycles gave better activation than furnace annealed wafers. The MESFET parameters for both RTA and furnace annealed wafers were nearly identical. The average gain and noise figure at 8 GHz were 7.5 and 2.0, respectively, for packaged die from either RTA or furnace annealed materials.  相似文献   

18.
Hall and drift mobilities in molecular beam epitaxial grown GaAs   总被引:1,自引:0,他引:1  
A series of nominally undoped and Si-doped GaAs samples have been grown by molecular beam epitaxy (MBE) with Hall concentrations ranging from 1015 to 1019 cm−3 and mobilities measured at 77 and 300K by Hall-van der Pauw methods. Drift mobilities were calculated using the variational principle method and Hall scattering factors obtained from a relaxation-time approximation to permit cross-correlation of experimental data with drift or Hall mobilities and actual or Hall electron concentrations. At 77K, both high purity and heavily doped samples are well represented by either drift or Hall values since piezoelectric acoustic phonon scattering and strongly screened ionized impurity scattering hold the Hall factor close to unity in the respective regimes. Between n≊1015 and 1017 cm−3, where lightly screened ionized impority scattering predominates, Hall mobility overestimates drift mobility by up to 50 percent and Hall concentration similarly underestimates n. At 300K, polar optical phonons limit mobility and a Hall factor up to 1.4 is found in the lowest doped material, falling close to unity above about 1016 cm−3. Our calculation also agrees remarkably well with the Hall mobility of the highest purity MBE grown sample reported to date.  相似文献   

19.
In this report, the influence of magnesium doping on the characteristics of InGaN/GaN multiple quantum wells (MQWs) was investigated by means of atomic force microscopy (AFM), photoluminescence (PL), and X-ray diffraction (XRD). Five-period InGaN/GaN MQWs with different magnesium doping levels were grown by metalorganic chemical vapor deposition. The AFM measurements indicated that magnesium doping led to a smoother surface morphology. The V-defect density was observed to decrease with increasing magnesium doping concentration from ∼109 cm−2 (no doping) to ∼106 cm−2 (Cp2Mg: 0.04 sccm) and further to 0 (Cp2 Mg: 0.2 sccm). The PL measurements showed that magnesium doping resulted in stronger emission, which can be attributed to the screening of the polarization-induced band bending. XRD revealed that magnesium doping had no measurable effect on the indium composition and growth rate of the MQWs. These results suggest that magnesium doping in MQWs might improve the optical properties of GaN photonic devices.  相似文献   

20.
The epitaxial layers of Hg1−xCdxTe (0.17≦×≦0.3) were grown by liquid phase epitaxy on CdTe (111)A substrates using a conventional slider boat in the open tube H2 flow system. The as-grown layers have hole concentrations in the 1017− 1018 cm−3 range and Hall mobilities in the 100−500 cm2/Vs range for the x=0.2 layers. The surfaces of the layers are mirror-like and EMPA data of the layers show sharp compositional transition at the interface between the epitaxial layer and the substrate. The effects of annealing in Hg over-pressure on the properties of the as-grown layers were also investigated in the temperature range of 250−400 °C. By annealing at the temperature of 400 °C, a compositional change near the interface is observed. Contrary to this, without apparent compositional change, well-behaved n-type layers are obtained by annealing in the 250−300 °C temperature range. Sequential growth of double heterostructure, Hgl−xCdxTe/Hgl−yCdyTe on a CdTe (111)A substrate was also demonstrated.  相似文献   

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