Cr/Cu/Ag/Cu/Cr新型银基复合薄膜电极的防氧化性能研究

采用直流磁控溅射技术和光刻工艺制备了Cr/Cu/Ag/Cu/Cr复合薄膜及其电极,研究不同温度热处理对复合薄膜和电极结构、表面形貌和电性能的影响。Ag层与最外层的Cr层之间的Cu层不仅增强了Cr和Ag之间的粘附力,而且起到了牺牲层和氧气阻挡层的作用;Cr和Cu对Ag的双重保护使得薄膜电极在温度小于500℃时电阻率保持较为稳定,约为3.0×10-8~4.2×10-8Ω·m之间。然而由于电极表面氧化和边沿氧化的共同作用,薄膜电极的电阻率在热处理温度超过575℃出现了显著的上升。尽管如此,Cr/Cu/Ag/Cu/Cr薄膜电极仍然是一种能够承受高温热处理并且保持较低电阻率的新型电极,满足场发射平板显示器封接过程中的热处理要求。     

Surface microstructurization of a sputtered magnesium thin film via a solution-immersion route

Surface microstructurization is one of the important procedures to fabricate a superhydrophobic surface of materials. Thus, this study was focused on the modification of the surface microstructure of magnesium materials to tailor its wettability. Bias magnetron sputtering was used to prepare magnesium thin films. In the deposition process, a relatively dense magnesium film was obtained using the bias voltage of 200 V. A solution-immersion method was subsequently applied to modify the surface of the magnesium thin film. A honeycomb-like layer, mainly composed of Mg(OH)₂, was formed on the film's surface after the surface modification. Accordingly, this route provides a basis for the following surface functionization of magnesium materials.     

Abnormal photoluminescence of ZnO thin film on ITO glass

The photoluminescence (PL) properties of ZnO thin films on ITO glass substrate deposited by rf magnetron sputtering with different oxygen partial pressures were studied. It was found that the exciton related emission of ZnO thin films depends on oxygen partial pressure, and that the visible emission related to intrinsic defects has no obvious change with various oxygen partial pressures. Abnormal UV-PL characteristics were observed, and its intensity was obviously enhanced. The emission position has a strong red-shift with increasing excitation intensity, and the emission intensity increases notably with increasing excitation cycle.     

Photocatalytic properties of Au/TiO2 thin films prepared by RF magnetron co-sputtering

Au/TiO₂ thin films with various Au doping contents were deposited on quartz substrates by radio frequency (RF) magnetron co-sputtering. The as-deposited Au/TiO₂ films were characterized by energy-dispersive X-ray spectroscopy (EDS), scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), XRD, and UV-vis techniques. Au doping and UV treatment enhanced the photocatalytic efficiency of TiO₂ thin films. The optimal RF power of the Au target and UV treatment time were 5 W and 1 h, respectively. The enhanced photoactivity of Au(5 W)/TiO₂ thin films with UV treatment is found to result from the increased hydroxyl concentration.     

Mo电极形貌对AIN薄膜择优取向生长的影响

采用射频磁控溅射方法在不同形貌的Mo电极上制备了(002)择优取向的AlN薄膜。采用XRD、FESEM表征了Mo电极及AlN薄膜的结构、表面形貌及择优取向。结果表明,Mo电极的形貌影响AlN薄膜的择优取向生长,在较高溅射气压下沉积的Mo电极晶粒细小、分布均匀,有助于AlN薄膜(002)择优取向生长。     

Determination of diffusion coefficients in film systems on the basis of Fe/Cr and Cu/Cr

This paper presents the results of investigation of condensation stimulated (CSD) and thermal stimulated (TSD) diffusion in nanoscale film systems on the basis of Fe/Cr and Cu/Cr by Auger-electron spectroscopy method. The film systems were built in ultrahigh vacuum. Auger spectrum was traced during condensation after each increase in thickness of 0.5-1 nm or during film systems annealing from 300 to 683 K over 5 h. According to experimental data the concentration profiles were built and the effective coefficients of CSD and TSD were computed by several mathematical methods. The efficiency of these techniques in different cases was analyzed. The most accurate results were obtained with Weeple and Gauss error methods that take into account the thickness of the diffusant source.     

The effects of film thickness variations on the residual stress distributions in coated Cr thin films

Generally, the residual stress of thin film coatings is calculated using Stoney's equation. However, variables in the manufacturing of the coated film, such as crystalline particle size and the unevenness of the thickness of the film, cause the radius of curvature of the beam to vary all over the beam. The cantilever beam curves not only in the axial direction but also in the transverse direction. Therefore, the residual stress in a film coating comprises not only axial residual stress but also transverse residual stress, and its distribution is also not uniform. Under such conditions, Stoney's equation must be modified. In this study, Si was used as a substrate in the production of cantilever beam specimens. Chromium thin films of various thicknesses were coated onto the Si substrates. The 3D digital image correlation technique was used to measure the out‐of‐plane displacement of the specimens at various positions. Then the modified Stoney's equation was used to obtain the axial and transverse residual stress at each measurement point to study the effect of variations in the thickness of the thin film on the magnitude and uniformity of the distribution of the residual stresses. Three thin film thicknesses 1, 2, and 3 μm were studied, and three specimens for each thickness were used. For each specimen, axial and transverse residual stresses were obtained at nine test points, and the equivalent residual stress was calculated. The results of this study reveal that as the difference between the thicknesses of the coating increased, average equivalent residual stress decreased and the distribution of stresses became more uniform. By comparing the corresponding results for the 1‐ and 3‐μm‐thick films revealed that the confidence levels in the average value and uniformity of the equivalent residual stress distribution, which increased with thickness, were 92.81% and 80.57%, respectively.     

退火对溅射ZnO薄膜的形貌和内应力的影响

用超高真空射频磁控溅射技术制备了高C轴取向的ZnO薄膜,用扫描电镜和X射线衍射仪分别研究了退火对ZnO薄膜形貌和内应力的影响.结果表明:适当温度退火后薄膜的形貌和内应力得到改善,通过增氧、缺陷原子的热激活和晶粒融合等可以有效地降低薄膜中由热效应、缺陷效应和粒子注入效应等引起的张应力,薄膜组织致密化并且柱状晶粒取向趋于一致.450℃退火的ZnO薄膜具有最低的张应力和最佳的结晶质量.     

Reactively sputtered GaAsxN1−x thin films

Thin films of GaAs_xN_1−x alloys were deposited by reactive rf magnetron sputtering of GaAs target with a mixture of argon and nitrogen as the sputtering gas. Growth rate was found to decrease from ∼ 7 μm/h to ∼ 2 μm/h as the nitrogen content increased from 0% to 40%. XRD and TEM studies of the films reveal the presence of hexagonal GaN with a significant increase of the lattice parameters in a narrow range of composition of the sputtering gas (5-10% nitrogen), which is attributed to the incorporation of arsenic. The limited availability of nitrogen in the sputtering atmosphere is found to encourage the incorporation of arsenic in the alloy films. Optical absorption coefficient spectra of the films were obtained from reflection and transmission data. The effect of arsenic incorporation is seen in the optical absorption spectra of the films, which show a continuous shift of the absorption edge to lower energies with respect to that of gallium nitride.     

A method for elastic modulus measurements of magnetron sputtered thin films dedicated to mechanical applications

Mechanical properties of thin films may highly differ from those of chemically identical bulk materials. Their knowledge is of paramount importance for coatings manufacturers. In this paper, attention is paid on Young's modulus measurements of PVD magnetron sputtered thin films on metallic substrates. The method is based on the three-point bending test of partially coated stainless steel or titanium alloy substrates. After derivation of the corresponding equations, the method and its accuracy according to qualification tests are first described. Results are then presented for coatings as varied as C, W, Cr(C), and TiN with thicknesses spanning 0.5–10 μm, and deposited under different sputtering conditions. It is first seen that the Young's modulus highly depends on the deposition parameters, varying from the bulk values down to the fourth of this value. In the case of reactive sputtering, the evolution of the modulus with the gas flow is also presented and a correlation with phases or microstructure is observed. It is finally concluded that this kind of test, owing to its simplicity and its reliability, may help on a scientific point of view towards understanding the influence of morphology on mechanical properties, and on a practical basis for ensuring a control quality reference when performed systematically after deposition. Some foreseen extensions of this work to adhesion measurements will be mentioned shortly.     

Properties of n-type ZnN thin films as channel for transparent thin film transistors

In this work we fabricated, by rf magnetron sputtering from a ZnN target, zinc nitride thin films and examined their properties in order to be used as channel layer in thin film transistors. The films were deposited at 100 W rf power and the Ar pressure was 5 mTorr. The zinc nitride thin films were n-type, and depending on the thickness they exhibited low resistivity (10-10^− 2 Ohm?cm), high carrier concentration (10¹⁸-10²⁰ cm^− 3) and very low transmittance values due to the excess zinc in their structure. After annealing at 300 °C, in flowing nitrogen, the films became more conductive, but annealing at higher temperatures deteriorated the electrical properties and became transparent. Transparent thin film transistor having zinc nitride as channel layer exhibited promising transistor characteristics after nitrogen annealing. Improvements in output transistor characteristics due to both material (zinc nitride) and transistor optimization are addressed.     

薄膜生长的计算机模拟

薄膜技术在现代科技领域中有着广泛的应用。人们对薄膜的生长过程通过理论和实验进行了深入的研究，其中计算机模拟是重要的方法，本文概述了对薄膜生长过程的实验观察结果及其理论分析，主要讨论了薄膜生长的计算机模拟中经常采用的方法-蒙特卡罗法和分子动力学方法、描述衬底上成膜粒子运动的一些模型以及在计算机模拟中需注意的一些问题，其中主要包括粒子间的相互作用，入射粒子的能量和粒子上的衬底上的扩散运动。     

Improved adhesion of Au thin films to SiOx/Si substrates by dendrimer mediation

Quantitative evidence of significantly improved interfacial adhesion between Au films and SiO_x/Si substrates induced by an organic dendrimer monolayer was presented. For dendrimer-mediated Au films, nanoscratch tests revealed a critical load that was two times higher than that for films without dendrimer mediation. Atomic force microscopy (AFM) examination of nanoindents revealed much constrained lateral flow of metals in the dendrimer-mediated Au films during nanoindentation, indicating enhanced adhesion due to the presence of the dendrimer layer.     

Corrosion behaviour of CrN/Cr multilayers on stainless steel deposited by unbalanced magnetron sputtering

This paper reports the results of the influence of bilayer period (Λ) and total thickness (f) on the corrosion resistance of magnetron-sputtered CrN/Cr multilayers. Corrosion tests were carried out by potentiodynamic polarization with 0.5 M H₂SO₄ + 0.05 M KSCN solution and electrochemical impedance spectroscopy (EIS) with 3% NaCl solution. Measurements were also taken on the uncoated substrate and hard chromium coatings for comparison. Multilayer microstructure and morphology were studied by X-ray diffraction (XRD), atomic force microscopy (AFM) and scanning electron microscopy (SEM) and chemical composition was studied by energy dispersive X-ray analysis (EDX).The experiments showed that CrN/Cr coatings having lower bilayer period and lower thickness increased their efficiency as a barrier and improved the corrosion resistance of all coatings evaluated.     

Fabrication of cobalt-organic composite thin film via plasma-enhanced chemical vapor deposition for antibacterial applications

In this paper, cobalt (Co)-organic composite thin films were fabricated from an organometallic precursor by plasma-enhanced chemical vapor deposition (PECVD) under various conditions. The amount of Co in the thin film was controlled by adjusting the operating parameters of the PECVD, including the vaporizer temperature, plasma deposition time, and organometallic precursor flow rate. The antibacterial performance of the Co-organic composite thin films with various amounts of Co was tested by a ‘film attachment’ method using Staphylococcus aureus and Escherichia coli. It was observed that the antibacterial performance was enhanced by increasing the amount of Co in the Co-organic composite thin film, and the critical amount of Co for preventing the growth of bacteria was found to be ∼ 1.6 ppm/cm².     

Young's modulus of electroplated Ni thin film for MEMS applications

The Young's modulus of an electroplated nickel (Ni) thin film suitable for microelectromechanical applications has been investigated as a function of process variables: the plating temperature and current density. It was found that the Young's modulus is approximately 205 GPa at plating temperatures less than 60 °C, close to that of bulk Ni, but drastically drops to approximately 100 GPa at 80 °C. The inclusion of ammonium and sulphate ions by hydrolysis is believed to be responsible for the sharp drop. The Young's modulus of 205 GPa is for a Ni film plated at J=2 mA/cm² and it decreases to 85 GPa as the plating current density is increased to 30 mA/cm². The results imply that at low current density, the plating speed is slow and there is sufficient time for the as-plated Ni atoms to rearrange to form a dense coating. At high currents, the plating speed is high, and the limited mass transport of Ni ions leads to a less dense coating.     

Microstructural, mechanical and electrochemical corrosion properties of sputtered titanium-aluminum-nitride films for bio-implants

The effect of aluminum (Al) addition to titanium nitride (TiN) matrix on the structural, mechanical and corrosion resistance properties of titanium-aluminum-nitride was studied. Ti_1−xAl_xN where x = 0, 0.5 and 1 films were coated onto substrates like Si wafer, AISI 316L stainless steel and low carbon steel by a direct current magnetron sputtering process. The layers were sputtered in pure Argon with a substrate temperature maintained at 400 °C, power of 250 W and a sputtering time of 120 min. XRD, TEM-SAED pattern and XPS analyses were made to study the structural properties of these films. Laser Raman spectrum showed the characteristic peaks at 249 and 659 cm⁻¹ for the Ti_0.5Al_0.5N film. AFM analysis showed a relatively smooth surface for the ternary film. Corrosion performance analysis indicated that the Ti_0.5Al_0.5N coated specimen had superior corrosion resistance when compared to TiN and AlN coated substrates. Higher values of nanohardness and lower coefficient of friction were observed for the Ti _0.5Al_0.5N specimen. Blood platelet adhesion experiments were made to examine the interaction between human blood and the materials in vitro.     

无机EL显示器件用高性能介电层的研究

用rf和反应磁控溅射法成功制备了一种总厚度为530～730nm的SrTiO3/Ta2O5复合介电层,获得在500Hz下介电常数为48～73,反映介电损耗的参数ΔVy在0.06～0.15V之间,击穿场强为106～139MV/m,在0.05V/nm的电场下正、反向漏电流在10-9～10-7A/cm2之间,品质因子(εrεoEb)大于5μc/cm2.同时比较了SrTiO3/Ta2O5复合介电层和SrTiO3和Ta2O5单层薄膜的介电性能.把复合膜应用于以ZnS:Mn和Zn2Si0.5Ge0.5O4:Mn为发光材料的器件中,获得了适当的阈值电压和较高的亮度.     

Nanomechanical characterization of sputtered RuO2 thin film on silicon substrate for solid state electronic devices

This paper presents the study on characterizing the mechanical and interfacial properties of ruthenium dioxide (RuO₂) film on silicon substrate using nanoindentation tests. RuO₂ film is deposited by DC reactive magnetron sputtering; the structure and morphology of the film are characterized using X-ray diffraction and scanning electron microscopy, and elastic modulus and hardness are determined by nanoindentation with a standard Berkovich indenter and found to be 232.74 ± 22.03 GPa and 20.43 ± 2.37 GPa, respectively. In addition, the interfacial adhesion properties of RuO₂ film on Si substrate are studied. Spontaneous interfacial delamination is induced by indentations with wedge (90° and 120°) and conical indenter tips. The relationship between the indentation load-displacement (P-h) curves and the interfacial crack initiation and propagation are analyzed by combining FIB sectioning and SEM imaging. Through this analysis, the interface toughness of as-deposited RuO₂ film is found to be 0.046 ± 0.003 J/m² for 90° wedge indentation, 0.050 ± 0.004 J/m² for 120° wedge indentation, and 0.051 ± 0.003 J/m² for conical indentation.     

Cr/CrN多层膜的结构及腐蚀性能研究

利用电弧离子镀设备,在45#钢基体上制备了两种调制比的Cr/CrN多层膜.采用X射线衍射技术(XRD)、扫描电子显微镜(SEM)、电子探针(EPMA)、M273A电化学系统等技术分析了薄膜的相结构、表面形貌、横截面元素分布、模拟海水中的抗腐蚀性能.结果表明:膜层主要由CrN、Cr2N和Cr组成,以Cr2N(111)为择优取向;膜层为Cr层-过渡层-CrN层的"三明治"调制结构;Cr/CrN多层膜结构与中间Cr层的存在可以显著提高基体和单层CrN抗腐蚀性能,45#钢+Cr/CrN(5/10)的防护体系抗腐蚀性能最佳.