Molecular dynamics simulation of hydrogen enhancing dislocation emission

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Chemisorption-facilitated dislocation emission and motion, and induced nucleation of brittle nanocrack

Using a special TEM constant deflection device, the change in dislocation configuration ahead of a loaded crack tip before and after adsorption of Hg atoms and the initiation of liquid metal-induced nanocracks (LMIC) have been observed. The results show that chemisorption of Hg atoms can facilitate dislocation emission, multiplication and motion. Nanocracks will be initiated in the dislocation-free zone (DFZ) or at the crack tip when chemisorption-facilitated dislocation emission, multiplication and motion reach a critical condition. On the basis of the available experimental evidence concerning liquid metal embnttlement (LME), a new mechanism for this phenomenon is considered. This involves the fact that the decrease in surface energy induced by chemisorption of Hg atoms results in a reduction in the critical stress intensity factors for dislocation emission and the resistance for dislocation motion. On the other hand, the plastic work and KIC will decrease with the decrease in the surface energy.     

Molecular Dynamics Simulation and Experimental Proof of Hydrogen-enhanced Dislocation Emission in Nickel

A quasi three dimensions molecular dynamic method was used to simulate the effect of hydrogen on dislocation emission and crack propagation in nickel. In situ observation in a transmission electron microscope (TEM) was used to confirm the simulation results. The simulation result indicated that hydrogen solubilized in nickel decreased the critical stress intensity for the dislocation emission, i.e., hydrogen enhanced dislocation emission. In situ observation in TEM showed that hydrogen enhanced dislocation emission and motion before the initiation of hydrogen-induced crack.     

Stress distribution and effective stress intensity factor of a blunt crack after dislocation emission

The stress fields induced by a dislocation and its image dislocations around a narrow elliptic void are formulated. Based on the solution, the stress distribution and effective stress intensity factor of a blunt (elliptic) crack were calculated under mode I constant loading. The results show that a dislocation-free zone (DFZ) is formed after dislocation emission. There exists a second stress peak in the DFZ except a stress peak at the blunt crack tip. With an increase in the applied stress intensity factor Kla or the friction stress T, of the material, the DFZ size and the peak stress at the crack tip decrease, but the peak stress in the DFZ and the effective stress intensity factor Klf presiding at the crack tip increase. Because of dislocation shielding effects, shielding ratio Kla/Klf increases with increasing Kla, but it decreases with increasing Tf.     

Film-induced stress enhancing stress corrosion cracking of austenitic stainless steel

A constant deflection device designed for use within a transmission electron microscopy (TEM) was used to investigate the change in dislocation configuration ahead of a crack tip during stress corrosion cracking (SCO of type 310 austenitic stainless steel in a boiling MgCI2 solution, and the initiation process of stress corrosion microcrack. Results showed that corrosion process during SCC enhanced dislocation emission, multiplication and motion. Microcracks of SCC were initiated when the corrosion-enhanced dislocation emission and motion reached critical state.A passive film formed during corrosion of austenitic stainless steel in the boiling MgCI2 solution generated a tensile stress. During SCC, the additive tensile stress generated at the metal/passive film interface helps enhance dislocation emission and motion.     

Mode Ⅰ Plane Crack Interacting with an Interfacial Crack Along a Circular Inhomogeneity

Cracks,inhomogeneityandtheirinteractions playanimportantroleincompositematerial.Anda lotofresearchworkaboutthiscanbefoundinopen literatures[1,2].Inthispaper,theelasticinteractionofthemodeⅠplanecrackwithaninterfacialcrackalongacircu larinhomogeneityisdealtwith.Thedislocationden sity,themodesⅠstressintensityfactors(SIFs)of theplanecrackareobtainednumericallybyhandlinga newkindofdislocationequilibriumequation.1ProblemStatementandFormula tion Thegeometryandcoordinatesystemoftheprob lemareshow…     

TEM Study on Hydrogen-Induced Cracking of Fe3Al Alloy

Hydrogen-induced cracking (HIC) of Fe3AI alloy was studied by in silo transmission electron microscope (TEM). Electron transparent specimens were moaned onto a constant displacement device. Stress was applied to the specimen by using a bolt through the device. The results showed that hydrogen enhanced the dislocation emission and motion in Fe3Al alloy. A dislocation free zone (DFZ) was formed following the dislocation emission. Microcrack initiated in the DFZ or at the main crack tip when the emission reached a critical extension. Hydrogen played an important role in the process of brittle fracture of Fe,AI alloy.     

KⅠ和KⅡ等值条件下Ⅰ-Ⅱ复合型裂纹的边翼分叉和偏折

利用奇异应力边界多裂纹开裂的几何模型,研究了应力强度因子K_Ⅰ和K_Ⅱ等值情况下的Ⅰ-Ⅱ复合型裂纹复杂开裂行为,给出了边翼分叉开裂和折裂对应的能量释放率、能量型开裂驱动力、临界开裂角或临界应力强度因子。通过此方法预计的临界折裂角理论值与已有的文献中2024-T3铝合金试样实验值吻合,与En3B低碳钢和一定条件下的铝试样最大偏差为8.9%。     

边界元法在断裂力学数值计算中的应用研究

给出一个适用于平面断裂力学分析的新边界积分方程,在此方程的基础上建立了边界元数值计算方法.对Griffith裂纹问题进行了编程计算,用裂尖位错密度与应力强度因子的关系计算出了该问题的应力强度因子.     

双材料混合型界面裂纹尖端应力场、位移场

研究了正交异性双材料中心穿透界面裂纹问题。在特征方程组的判别式都小于零的情形下,求解一类广义重调和方程组边值问题,通过构造新的应力函数,推出了Ⅰ型、Ⅱ型、混合型界面裂纹尖端的应力场、位移场及应力强度因子的解析表达式。其结果没有振荡奇异性及裂纹面没有相互嵌入现象,当上下半平面材料参数相同时,可获得正交异性单材料的应力场、位移场。     

公路隧道二次衬砌裂损病害机理研究

公路隧道二次衬砌裂损病害对隧道结构的稳定性有着很大影响,为研究公路隧道二次衬砌裂损病害发生的机理,首先划分了衬砌裂损病害的3种类型,并对每种裂损类型展开了力学行为分析.以断裂力学作为切入点,研究了在围岩荷载及结构自身作用下衬砌产生的裂缝的发展规律,通过获取应力强度因子K、J积分、以及裂纹面的最大张开位移δ求得裂纹尖端应力和应变值,在此基础上,通过最大周向应力理论分析了Ⅰ型＋Ⅱ型复合裂纹发生的临界条件.根据最大周向应力σθ所对应的应力强度因子值来对比临界强度因子值KIC,判断二次衬砌裂纹是否会发生扩展以及分析衬砌裂损病害发生的可能.获得了一系列有益的结论,能够对公路隧道二次衬砌裂损病害机理的理论研究和工程应用提供一定的参考和借鉴.     

法向压缩载荷对II型裂纹扩展的影响规律研究

压剪共同作用下裂纹是地下岩体中广泛存在的,为了研究法向压缩载荷对剪切型即II型裂纹扩展的影响规律,利用砂岩制作了单边裂纹试件,通过岩石剪切实验系统对不同法向压缩载荷作用下的裂纹进行了剪切实验研究,结果表明法向压缩载荷对裂纹的起裂及扩展起到抑制作用,随着裂纹法线压缩载荷的增大,裂纹起裂角逐渐减小;同时,得出法向压缩载荷与II型裂纹极限应力强度因子之间的关系,随着法向压缩载荷增大,岩石II型裂纹极限应力强度因子也随之增大。运用ABAQUS模拟软件,对不同压缩载荷作用下压剪裂纹的扩展进行模拟研究,得出了裂纹尖端II型应力强度因子随压缩载荷的变化规律。     

6061Al/SiCp淬火后残余应力对阻尼性能影响的模拟

采用喷射共沉积方法制备了6061Al/SiCp金属基复合材料(MMC),利用有限元方法对其淬火态下的热残余应力和阻尼性能进行了模拟,计算结果表明,淬火态试样的基体材料中存在显著的残余拉应力,而且水淬态试样要高于干冰淬火态试样,根据位错阻尼机制,基体中的拉伸内应力将有助于位错的开动,从而降低了临界应变振幅的大小,提高了应变振幅相关效应,表现为内耗值有所改善.最后,实验结果再次验证了上述理论分析.     

Hydrogen-induced cracking and its anisotropy of a PZT ferroelectric ceramics

The physical properties of ceramics will be degraded by charging and restored by outgassing at 650℃[1,2]. This means that atomic hydrogen can enter into ceramics through diffusion during charging. The electrical properties of the integrated PZT capacitors will be deteriorated by an-nealing in low pressure hydrogen, and the inter-layer dielectric or top electrode adhesion will be destroyed in high pressure hydrogen[3]. For an aluminum ceramics, hydrogen-induced cracking (HIC) or delayed fail…     

三点弯曲-剪切试样的应力强度因子

利用一种边界元法研究具有偏移边裂纹的三点弯曲-剪切试样.该边界元方法由Crouch与Starfield提出的常位移不连续单元和笔者最近提出的裂尖位移不连续单元构成.在该边界元方法实施过程中,左、右裂尖位移不连续单元分别置于裂纹的左、右裂尖处,而常位移不连续单元则分布于除了裂尖位移不连续单元占据的位置之外的整个裂纹面及其他边界.算例说明这种边界元法不论对无限大还是对有限大平面弹性复杂裂纹问题的应力强度因子的计算都是非常有效的.对具有偏移边裂纹的三点弯曲-剪切试样的应力强度因子进行了详细的研究,给出了数值结果.     

基于流场复势的空间裂纹止裂应力强度因子分析

选择带有圆形埋藏裂纹的金属构件作为研究对象。在向金属构件通入脉冲电流时,可以将金属构件内电流绕圆盘裂纹的流动比作在流体力学平面势流中流体绕平板流动的情况,给出电流流动的复势函数,进而推导出电流密度,据此推求热源功率,最后确定带有圆形埋藏裂纹的金属构件脉冲放电瞬间的热应力强度因子,结合只有外载荷作用下的金属构件裂纹尖端的机械载荷应力强度因子,给出外载荷作用下带有埋藏裂纹金属构件脉冲放电瞬间的综合应力强度因子。     

基于位错模型的动态裂纹应力强度因子和位错分布函数的求解方法

采用自相似函数的方法,获得了运动裂纹的应力、位移、动态应力强度因子及位错分布函数的表达式.在给定的载荷边界条件下,利用编制的Matlab程序获得了扩展裂纹动态应力强度因子随时问变化规律和位错分布函数图像,所得结论对利用位错模型来研究动态裂纹扩展有重要的参考价值.     

薄板中孔边裂纹与独立裂纹的相互作用

研究有孔边裂纹与独立裂纹的薄板在远程受弯曲作用时的响应.利用叠加原理,将原问题转化为两个含有孔边裂纹的子问题,远程弯曲只存在于第一子问题.在第二子问题中,假定沿独立裂纹线的位置存在一个连续分布的角位错,使之在此处得到的面力与第一子问题所得到的相抵消,形成自由表面的裂纹,通过基于点位错解的奇异积分方程得到连续分布位错的解.给出了板弯曲问题基于位错密度函数的应力强度因子的表达式,求得孔边裂纹及独立裂纹应力强度因子的数值解,考察了薄板在远程弯曲时方形孔边裂纹和线裂纹的应力强度因子变化.     

一种确定双重应力强度因子的数值方法

基于奇异点附近的位移场和奇异应力场,提出了一种利用普通的数值分析结果确定双重应力强度因子的数值方法和提高应力强度因子求解精度的结点选取方法,并把确定V形切口与裂纹的应力强度因子问题统一起来,利用有限元软件MSC／Nastran对Ⅰ-Ⅱ型复合平面裂纹以及V型切口问题进行了具体计算。计算结果表明,所提出的方法具有通用性强、精度高的特点,便于实际工程应用。     

An investigation of corrosion-induced stress during SCC

TEM (Transmission Electron Microscope) observations show that corrosion process during stress corrosion cracking (SCC) enhances dislocation emission and motion; and microcrack of SCC initiates when the corrosion-enhanced dislocation emission and motion reaches a certain condition. The passive film or dealloyed layer formed during corrosion or SCC can induce a large tensile stress, which can assist the applied stress to enhance dislocation emission and motion, and then SCC occurs. Experiments show that the variation of SCC susceptibility of brass,α-Ti and stainless steel with the applied potential and pH value of the solution is consistent with that of the corrosion-induced additive stress. Molecular dynamics simulations show that a dealloyed layer can generate a tensile stress; and the corrosion (dealloyed layer)-induced tensile stress can assist the applied stress to enhance dislocation emission and crack propagation.