共查询到19条相似文献,搜索用时 78 毫秒
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采用高导热填料球形氧化铝填充环氧胶粘剂,并添加了适量离子捕捉剂有效地控制有害离子的离子迁移,利用该胶粘剂粘接铝箔和铜箔制备成挠性铝基覆铜板。探讨了环氧胶粘剂的热固化温度和时间、球形氧化铝含量对胶膜热导率的影响,通过显微镜测试了导热填料在胶粘剂中的分散均匀性,最后确定最优配方制备出一种综合性能优异的挠性铝基覆铜板。 相似文献
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本文分析了与纸基覆铜板阻燃性有关的各种因素,并拟制了相应的工艺路线,成功开发了无卤阻燃纸基覆铜板,填补了国内空白。 相似文献
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铝合金具有密度小、强度高、导电导热性好及加工简单等优点,基于这些综合性能的优势,其作为结构和散热材料广泛应用于汽车、电子及通讯等领域。然而随着系统及设备向着集成化、小型化、轻量化及高功率等方向发展,以铝为主体的金属材料的散热面临着严峻挑战。本文综述了国内外高导热铝合金及铝基复合材料的研究与开发现状,阐述了铝合金的导热机理以及合金成分和加工工艺等对铝合金导热性能的影响规律,分析了高硅铝、铝-碳化硅、铝-金刚石、铝-石墨片/碳纳米管等系列铝基复合材料的导热特性,展望了高导热铝合金及铝基复合材料研究存在的问题及未来的发展方向。 相似文献
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以环氧改性有机硅树脂为基体, 氮化硅、 氧化铝混合填料为导热粒子制备了导热绝缘涂料。研究了涂料力学性能、 热导率、 电绝缘性、 热稳定性等性能。结果表明: 在填料质量分数40%及较佳的氧化铝与氮化硅质量比时, 涂层拉伸强度为8.02MPa, 断裂延伸率为1.27%, 附着力达到572.2N · cm-2, 热导率高达1.25W · (m · K)-1, 介电常数5.7, 体、 表电阻率分别为3×1013Ω · cm与4.3×1013Ω, 可长期在200℃下使用。与不使用导热填料的环氧改性有机硅树脂涂层相比具有较高的传热能力。 相似文献
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改性聚苯醚在覆铜板中的应用 总被引:2,自引:0,他引:2
聚苯醚 (PPE)是一种高性能热塑性工程塑料 ,具有优异的电性能和耐热性能 ,是高频应用的理想印制电路基材之一。本文综述了使聚苯醚改性成为热固性材料的几种方法和热固性改性聚苯醚覆铜板的性能 相似文献
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固化剂对聚酰亚胺挠性覆铜板剥离强度的影响 总被引:1,自引:0,他引:1
采用双氰胺(DICY)、间苯二胺(m-PDA)、长链柔性二胺(DAMI)固化双酚A型环氧树脂(E-51),制备了三种环氧胶粘剂,分别考察了三种固化剂对挠性覆铜板剥离强度的影响。根据差示扫描量热仪(DSC)曲线,通过t-β外推法得到了各固化剂固化环氧胶粘剂的固化工艺。采用扫描电子显微镜(SEM)考察其不同的破坏形式。结果表明,采用双氰胺固化的环氧胶粘剂粘接的挠性覆铜板,剥离后聚酰亚胺薄膜、铜箔表面都留有大量的胶粘剂,此破坏形式属于内聚破坏。同时双氰胺固化的环氧胶粘剂剥离强度最高,粘接强度达到0.74 N/mm,符合日本JPAC行业标准。 相似文献
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用玻璃纤维布增强、聚全氟乙丙烯改性聚四氟乙烯,制备了高性能聚四氟乙烯覆铜板.系统研究了玻璃纤维布及偶联剂的种类与含量、乳液比例等对覆铜板主要性能的影响.结果表明,聚四氟乙烯与聚全氟乙丙烯相容性能好,聚全氟乙丙烯最佳重量百分数为50%.选用Z6032硅烷偶联剂处理1080玻璃纤维布得到综合性能好的覆铜板.增强改性后,覆铜板剥离强度从1.8kN/m提高到2.26kN/m,抗弯强度从100MPa提高到134 MPa. 相似文献
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LED绝缘铝基板的制备与散热性能研究 总被引:1,自引:0,他引:1
采用硬质阳极氧化工艺制备LED封装用铝基板绝缘层,通过实验分析了制备铝基板过程中氧化时间、草酸浓度、硫酸浓度和电流密度等因素对其氧化膜厚度、击穿电压的影响,得到了制备低热阻铝基板的最佳工艺参数:电流密度3A/dm2,草酸浓度为10g/L,H2SO4浓度150g/L,氧化时间45min。利用原子力显微镜(AFM)观察热冲击后裂纹萌生的情况,结果表明铝基板有微小裂纹,但仍满足绝缘要求,通过对氧化铝膜热阻的测试发现,铝基板与氧化膜的复合热阻在1~3℃/W之间。结果表明用阳极氧化法制备的铝氧化膜满足LED基板对散热及绝缘性的要求。 相似文献
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R. B. Dinwiddie A. J. Whittaker D. G. Onn 《International Journal of Thermophysics》1989,10(5):1075-1084
The thermal transport properties of four commercially available AlN substrates have been investigated using a combination of steady-state and transient techniques. Measurements of thermal conductivity using a guarded longitudinal heat flow apparatus are in good agreement with published room temperature data (in the range 130–170 W · m–1 · K–1). Laser flash diffusivity measurements combined with heat capacity data yielded anomalously low results. This was determined to be an experimental effect for which a method of correction is presented. Low-temperature measurements of thermal conductivity and heat capacity are used to probe the mechanisms that limit the thermal conductivity in AlN.Paper presented at the Tenth Symposium on Thermophysical Properties, June 20–23, 1988, Gaithersburg, Maryland, U.S.A. 相似文献
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K. Hisano 《International Journal of Thermophysics》1997,18(2):535-545
Thermal radiation calorimetry was applied to measure the thermal conductivity of insulating solid specimens. We consider the
system in which a disk-shaped specimen and a flat heater are mounted in a vacuum chamber with the specimen heated on one face
by irradiation. A temperature difference between two faces was observed at elevated temperatures under steady-state conditions.
An apparatus was developed using a thin graphite sheet as the heater element. Disk-shaped Pyrex glass and Pyroceram specimens,
whose surfaces were blackened with colloidal graphite, were used in the measurements. Noncontact temperature measurement was
performed using pyrometers and a thermocouple set in the gap between the heater and the specimen. Deviations of the estimated
thermal conductivities from the recommended values were about 5% in the temperature range 250 to 800°C.
Paper presented at the Fourth Asian Thermophysical Properties Conference, September 5–8, 1995, Tokyo, Japan. 相似文献
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One kind of side chain liquid crystal epoxy(S-LCE) based on biphenyl mesomorphic unit is synthesized from 2,2-bis(hydroxymethyl)propionic acid,4-phenyl phenol,and epichlorohydrin.And the intrinsic thermal conductive liquid crystal epoxy film(LCEF) simultaneously combining with intrinsic self-healing performance is then prepared via thiol-epoxide nucleophilic ring-opening reaction and coating method.1 H NMR and FTIR show that S-LCE and LCEF have been successfully prepared.S-LCE presents nematic liquid crystal from room temperature to 160℃.LCEF maintains nematic liquid crystal performance and shows highly intrinsic thermal conductivity & excellent self-healing performance.Thermal conductivity coefficient(λ)values in vertical direction(λ⊥)and parallel direction(λ‖)of LCEF are 0.33 and 1.25 W/mK,re spectively,much higher than that of general bisphenol A epoxy resin(E-51,λ⊥ of 0.19 W/mK and λ‖ of0.65 W/mK).Tensile strength of LCEF is 10.6 MPa,which can maintain at 90.6 % and 61.3 % after one and four cycles of self-healing behavior,respectively.In addition,LCEF presents a wide service temperature range(-9.8-251℃) and good thermal stability(THRI of 148.5℃).Simultaneously,LCEF has good transparency,flexibility,and tailorability,expected to be utilized in the fields of flexible electronic devices and intelligent structures. 相似文献