降低CCD转移驱动电压摆幅仿真技术研究

降低CCD的转移驱动电压摆幅对于减小器件的功耗有着积极的作用.通过对CCD电荷转移过程的原理进行分析,建立了CCD转移驱动电压摆幅的仿真模型,并从势垒注入、多晶硅电极间隙、栅介质层厚度等方面进行了仿真分析,找出了影响CCD转移驱动电压摆幅的关键因素,同时利用该模型得到了降低CCD转移驱动电压摆幅的优化条件.最后采用仿真结果进行了流片验证,CCD的驱动电压摆幅由原来的7V降低到了4V,验证了仿真结果的有效性.     

一种无电阻高电源抑制比的CMOS带隙基准源

提出一种输出低于1V的、无电阻高电源抑制比的CMOS带隙基准源(BGR).该电路适用于片上电源转换器.用HJTC0.18μm CMOS工艺设计并流片实现了该带隙基准源,芯片面积(不包括pad和静电保护电路)为0.031mm2.测试结果表明,采用前调制器结构,带隙基准源电路的输出在100Hz与lkHz处分别获得了-70与-62dB的高电源抑制比.电路输出一个0.5582V的稳定参考电压,当温度在0～85℃范围内变化时,输出电压的变化仅为1.5mV.电源电压VDD在2.4～4V范围内变化时,带隙基准输出电压的变化不超过2mV.     

一种无电阻高电源抑制比的CMOS带隙基准源

提出一种输出低于1V的、无电阻高电源抑制比的CMOS带隙基准源(BGR).该电路适用于片上电源转换器.用HJTC0.18μm CMOS工艺设计并流片实现了该带隙基准源,芯片面积(不包括pad和静电保护电路)为0.031mm2.测试结果表明,采用前调制器结构,带隙基准源电路的输出在100Hz与lkHz处分别获得了-70与-62dB的高电源抑制比.电路输出一个0.5582V的稳定参考电压,当温度在0～85℃范围内变化时,输出电压的变化仅为1.5mV.电源电压VDD在2.4～4V范围内变化时,带隙基准输出电压的变化不超过2mV.     

基于CCD工艺提取MOS模型的电路验证

对基于CCD工艺提取的BSIM3v3模型,在CCD片上放大器电路上进行了验证,通过在直流、瞬态和交流条件下对比电路的仿真数据和实际测试数据,验证了该模型,即提取的模型能够满足电路模拟的要求。     

一种用于天文望远镜的低噪声CCD读出电路

设计了一种用于天文望远镜的低噪声电荷耦合器件(Charge Coupled Devices,CCD)读出电路.该读出电路主要包括电容增益电路、单端转差分电路、双斜率积分电路以及缓冲器电路.CCD读出电路采用SMIC 0.18μm1P6M CMOS工艺实现.后仿真结果表明,在电源电压3.3V,输入信号67kHz,输出信号80mV峰值时,输出信号动态范围86dB,等效输入噪声2.523nV/Hz1/2,整体功耗1.25mW.     

电子倍增CCD驱动电路设计

提供了一种针对电子倍增CCD(EMCCD)驱动电路的设计方案。通过FPGA编程产生符合EMCCD时序要求的信号波形,采用EL7457高速MOSFET驱动芯片对FPGA输出信号进行电平转换以满足EMCCD驱动电压要求,并由分立的推挽放大电路驱动高电压信号,输出电压20~50 V可调,像素读出频率达5 MHz。实验结果表明,该驱动电路能够使EMCCD正常工作输出有效信号。     

应用于智能相机的图像采集电路实现

介绍了一种基于CCD图像传感器的图像采集电路.给出了CPLD驱动面阵CCD获取图像并由相关双采样和模数转换器完成模数转换的系统框图,并在此基础上介绍了ICX415面阵CCD的驱动时序与驱动电路实现.给出了通过VHDL语言对CPLD编程的思路,通过对波形的仿真验证了驱动时序的正确性.     

4路长积分时间CCD成像电路的设计与实现

基于CCD47-20和CCD55-30探测器设计了一种4路探测器成像电路。由于积分时间长,该系统可以在弱光条件下实现高灵敏度成像。建立了探测器的驱动电路模型,分析了CCD探测器对驱动的要求,以选择合适的驱动芯片;在分析探测器噪声特性的基础上,通过相关双采样法和合理的滤波器设置抑制了电路噪声。针对4路探测器信号处理电路之间的串扰问题进行了分析和对比,为合理的PCB布局布线提供了参考。该成像电路与商用镜头搭配使用后已成功获取了微光条件下的低噪声外景图像。     

掌形仪数据采集系统的设计

人体掌形识别对掌形数据的准确性要求很高,这对数据采集电路的低噪声和准确性提出了更高要求.根据CCD图像传感器需复杂驱动时序和空间采样离散模拟信号输出的特点,采用FPGA做CCD时序驱动电路、用前置电路对CCD输出信号做后级处理.由DSP对CCD数据进行A/D采集后存储到外扩大容量SDRAM存储器中.由实际硬件电路测出的实验结果表明,系统的可靠性、稳定性很好.为掌形识别系统提供了准确的数据保证.     

芯片I/O缓冲及ESD电路设计

文章详细介绍了基于CMOS的芯片I/O缓冲电路分类,功能,电路及版图设计的一些考虑以及芯片引脚的静电保护问题.     

An on-chip ESD protection circuit with low trigger voltage inBiCMOS technology

A novel low-trigger dual-direction on-chip electrostatic discharge (ESD) protection circuit is designed to protect integrated circuits (ICs) against ESD surges in two opposite directions. The compact ESD protection circuit features low triggering voltage (~7.5 V), short response time (0.18-0.4 ns), symmetric deep-snap-back I-V characteristics, and low on-resistance (~Ω). It passed the 14-kV human body model (HBM) ESD test and is very area efficient (~80 V/μm width). The new ESD protection design is particularly suitable for low-voltage or multiple-power-supply IC chips     

一种多电源域专用数字电路的静电失效分析及提升研究

在静电放电(ESD)能力考核时,一种多电源域专用数字电路在人体模型(HBM)1 700 V时失效。通过HBM测试、激光束电阻异常侦测(OBIRCH)失效分析方法,定位出静电试验后失效位置。根据失效分析结果并结合理论分析,失效是静电二极管的反向静电能力弱所致。利用晶体管替换静电二极管,并对OUT2端口的内部进行静电版图优化设计。改版后,该电路的ESD防护能力达2 500 V以上。该项研究结果对于多电源域专用数字电路的ESD失效分析及能力提升具有参考价值。     

IC设计中的ESD保护技术探讨

ESD是集成电路设计中最重要的可靠性问题之一。IC失效中约有40%与ESD/EOS(电学应力)失效有关。为了设计出高可靠性的IC,解决ESD问题是非常必要的。文中讲述一款芯片ESD版图设计,并且在0.35μm 1P3M 5V CMOS工艺中验证,成功通过HBM-3000V和MM-300V测试。这款芯片的端口可以被分成输入端口、输出端口、电源和地。为了达到人体放电模型(HBM)-3000V和机器放电模型(MM)-300V,首先要设计一个好的ESD保护网络。解决办法是先让ESD的电荷从端口流向电源或地,然后从电源或地流向其他端口。其次,给每种端口设计好的ESD保护电路,最后完成一张ESD保护电路版图。     

ESD Protection Design With On-Chip ESD Bus and High-Voltage-Tolerant ESD Clamp Circuit for Mixed-Voltage I/O Buffers

Considering gate-oxide reliability, a new electrostatic discharge (ESD) protection scheme with an on-chip ESD bus (ESD_BUS) and a high-voltage-tolerant ESD clamp circuit for 1.2/2.5 V mixed-voltage I/O interfaces is proposed. The devices used in the high-voltage-tolerant ESD clamp circuit are all 1.2 V low-voltage N- and P-type MOS devices that can be safely operated under the 2.5-V bias conditions without suffering from the gate-oxide reliability issue. The four-mode (positive-to-V_SS, negative-to-V_SS, positive-to-V_DD, and negative-to-V_DD) ESD stresses on the mixed-voltage I/O pad and pin-to-pin ESD stresses can be effectively discharged by the proposed ESD protection scheme. The experimental results verified in a 0.13-mum CMOS process have confirmed that the proposed new ESD protection scheme has high human-body model (HBM) and machine-model (MM) ESD robustness with a fast turn-on speed. The proposed new ESD protection scheme, which is designed with only low- voltage devices, is an excellent and cost-efficient solution to protect mixed-voltage I/O interfaces.     

A novel on-chip electrostatic discharge (ESD) protection withcommon discharge line for high-speed CMOS LSIs

A novel on-chip electrostatic discharge (ESD) protection for high-speed CMOS LSI's that operate at higher than 500 MHz has been developed. Introduction of a newly developed common discharge line (CDL) can completely eliminate the protection device influence on the inner circuit operation. This enables minimization of the I/O capacitance by shrinking the dimension of the output transistor, which also serves as a protection device in conventional devices. This new protection (CDL protection) was applied to a high-speed DRAM of which I/O pin capacitance specification is 2 pF. As a result, the ESD tolerance of 4 kV for the charged device model test, 4 kV for the human body model test, and 700 V for the machine model test were obtained. In addition, the DRAM data rate higher than 660 MHz at room temperature was achieved. The results show significant improvement for both ESD and the I/O capacitance, compared with the conventional structure     

利用键合线提高ESD保护电路射频性能的研究

提出了一种利用键合线提高ESD保护电路射频性能的新型片外ESD保护电路结构。该新型结构在不降低ESD保护电路抗静电能力前提下,提高了ESD保护电路射频性能。针对一款达林顿结构ESD保护电路,制作了现有ESD保护电路结构和新型ESD保护电路结构的测试板级电路,测试结果表明:两种ESD保护电路结构的抗静电能力均达到20 kV,现有ESD保护电路结构在0～4.3 GHz频段内衰减系数均小于1 dB,反射损耗系数均小于-10 dB,最高工作频率为4.3 GHz;新型ESD保护电路结构在0～5.6 GHz频段内衰减系数均小于1 dB,反射损耗系数均小于-10 dB,最高工作频率为5.6 GHz。     

一种系统级封装的ESD保护技术

介绍了一种系统级封装(SiP)的ESD保护技术.采用瞬态抑制二极管(TVS)构建合理的ESD电流泄放路径,实现了一种SiP的ESD保护电路.将片上核心芯片的抗ESD能力从HBM 2 000 V提升到8 000 V.SiP ESD保护技术相比片上ESD保护技术,抗ESD能力提升效果显著,缩短了开发周期.该技术兼容原芯片封...     

Optimized ESD protection circuits for high-speed MOS/VLSI

New electrostatic discharge (ESD) protection circuits for MOPS/VLSI provide typical 2.7-ns delays and protection against voltage spikes up to 2200 V (limit of test circuit) in some cases. These circuits contain some traditional elements plus new features including a gate-drain connected thin-oxide device to achieve the very low protected node voltage (~2 V) required for advanced thin gate oxide technologies. In addition, for CMOS application, these all-NMOS (or PMOS) circuits would offer a high degree of latchup immunity. For both positive and negative spikes, single-pulse and repeated-pulse test data were obtained for six different test conditions. Electrical and physical analyses show dominant failure modes. Because techniques used to improve protection tend to degrade speed, a figure of merit is proposed to assist a fair comparison between different ESD protection circuit designs.     

Complementary-SCR ESD protection circuit with interdigitatedfinger-type layout for input pads of submicron CMOS IC's

A new ESD protection circuit with complementary SCR structures and junction diodes is proposed. This complementary-SCR ESD protection circuit with interdigitated finger-type layout has been successfully fabricated and verified in a 0.6 μm CMOS SRAM technology with the LDD process. The proposed ESD protection circuit can be free of VDD-to-VSS latchup under 5 V VDD operation by means of a base-emitter shorting method. To compensate for the degradation on latching capability of lateral SCR devices in the ESD protection circuit caused by the base-emitter shorting method, the p-well to p-well spacing of lateral BJT's in the lateral SCR devices is reduced to lower its ESD-trigger voltage and to enhance turn-on speed of positive-feedback regeneration in the lateral SCR devices. This ESD protection circuit can perform at high ESD failure threshold in small layout areas, so it is very suitable for submicron CMOS VLSI/ULSI's in high-pin-count or high-density applications     

深亚微米CMOS电路多电源全芯片ESD技术研究

深亚微米CMOS电路具有器件特征尺寸小、复杂度高、面积大、数模混合等特点,电路全芯片ESD设计已经成为设计师面临的一个新的挑战。多电源CMOS电路全芯片ESD技术研究依据工艺、器件、电路三个层次进行,对芯片ESD设计关键点进行详细分析,制定了全芯片ESD设计方案与系统架构,该方案采用SMIC0.35μm 2P4M Polycide混合信号CMOS工艺流片验证,结果为电路HBM ESD等级达到4 500 V,表明该全芯片ESD方案具有良好的ESD防护能力。