Au/PLT/Pt铁电薄膜电容的电学性能

用 Sol- Gel方法研制了 PL T[(Pb0 .83 L a0 .17) Ti O3 ]铁电薄膜 ,结合非挥发性铁电存储器对铁电电容的要求 ,研究了 Au/ PL T/ Pt铁电电容和漏电流、剩余极化、疲劳、开关特性和揭电常数等性能。对厚度为 0 .4 μm的薄膜 ,5 V时的剩余极化强度 Pr=2 2 μC/ cm2 ,矫顽场强度 Ec=6 0k V/ cm,相对介电常数约 130 0 ,漏电流 Id=3.2× 10 -8A/ mm2 ,开关特性优良。疲劳测试表明 ,对Vpp=10 V的锯齿信号 ,经 4 .5× 10 11周期后 ,剩余极化强度衰减 2 0 %。上述性能表明 ,该 PL T膜能用于非挥发性铁电存储器的试制     

PZT铁电薄膜的制备及电学性能研究

使用硝酸锆作锆源的溶胶－凝胶方法制备ＰＺＴ铁电薄膜。他们的电学性能被测试包括电滞回线，电流Ｉ（ｔ）特性，漏电流，矫顽场疲劳和老化。测到的ＰＺＴ薄膜剩余极化８．２μＣ／ｃｍ~２，矫顽场６８ｋＶ／ｃｍ．簿膜的寿命可超过１０~（１１）周期。     

硅硼玻璃相对Bi3.15La0.75Ti3O12铁电薄膜性能的影响

采用加入硅硼玻璃相的溶胶-凝胶(Sol-Gol)技术,以无机物为原料,在低温下成功制备了Pt/Ti/SiO2/Si衬底上Bi3.15La0.75Ti3O12(BLT)铁电薄膜.XRD、AFM分析及电学性能的测i式结果表明,600～650℃退火处理的加入硅硼玻璃相BLT铁电薄膜具有单一的层状钙钛矿结构;薄膜表面平整无裂纹、致密,薄膜为多晶生长;其剩余极化强度(2Pr)为27.09 μC/cm2,矫顽场E约为53.1 kV/cm;室温下,在测试频率为1 MHz,经1.0×1011极化反转后,剩余极化值下降约10%,具有良好的抗疲劳特性;薄膜的漏电流密度低于9×10-10 A/cm2.玻璃相提高了薄膜的致密度和抗疲劳特性,降低了薄膜的漏电流密度,对剩余极化强度影响有限.     

酚磺乙胺对酶法测定肌酐结果的影响

采用加入硅硼玻璃相的溶胶-凝胶(Sol-Gol)技术,以无机物为原料,在低温下成功制备了Pt/Ti/SiO2/Si衬底上Bi3.15La0.75Ti3O12(BLT)铁电薄膜.XRD、AFM分析及电学性能的测i式结果表明,600～650℃退火处理的加入硅硼玻璃相BLT铁电薄膜具有单一的层状钙钛矿结构;薄膜表面平整无裂纹、致密,薄膜为多晶生长;其剩余极化强度(2Pr)为27.09 μC/cm2,矫顽场E约为53.1 kV/cm;室温下,在测试频率为1 MHz,经1.0×1011极化反转后,剩余极化值下降约10%,具有良好的抗疲劳特性;薄膜的漏电流密度低于9×10-10 A/cm2.玻璃相提高了薄膜的致密度和抗疲劳特性,降低了薄膜的漏电流密度,对剩余极化强度影响有限.     

基于原子力显微技术的PZT薄膜铁电性能研究

针对现有测试技术不能直接获得纳米尺度铁电薄膜电滞回线的问题,提出了将原子力显微镜与铁电分析仪连用的方法,研究了锆钛酸铅(PZT)薄膜样品的电滞回线.结果表明,应用铁电分析仪与原子力显微镜联用的测试技术能表征铁电薄膜的电滞回线,在无顶电极测试条件下,测试得到的电滞回线很不对称,且剩余极化值较大.     

睾酮对内皮细胞表达细胞因子的影响

针对现有测试技术不能直接获得纳米尺度铁电薄膜电滞回线的问题,提出了将原子力显微镜与铁电分析仪连用的方法,研究了锆钛酸铅(PZT)薄膜样品的电滞回线.结果表明,应用铁电分析仪与原子力显微镜联用的测试技术能表征铁电薄膜的电滞回线,在无顶电极测试条件下,测试得到的电滞回线很不对称,且剩余极化值较大.     

光诱导化学汽相淀积非晶硅薄膜及其在太阳电池中的应用

本文较系统地评述了光诱导化学汽相淀积(LCVD)技术淀积非晶硅薄膜的开发现状,主要介绍了LCVD淀积非晶硅薄膜 的机理.评价了LCVD淀积非晶硅薄膜的电学和光学特性,最后介绍了这种薄在制备晶硅太阳电池方面的应用.     

Sol-Gel法制备Bi4Ti3O12薄膜及其性能研究

采用溶胶-凝胶(Sol-Gel)法在Pt/Ti/SiO2/Si衬底上制备了Bi4Ti3O12(BTO)铁电薄膜,利用X-射线衍射仪(XRD)和原子力显微镜(AFM)对其晶格结构和表面形貌进行了表征,制备的BTO薄膜具有单一的钙钛矿晶格结构和表面平整致密。对700℃退火的BTO薄膜进行了铁电性能和疲劳特性测试,在测试电压为6 V时,剩余极化值2Pr约为12.5μC/cm2,矫顽电场2Ec约为116.7 kV/cm;经1×109次极化反转后,剩余极化值下降了24%,对其疲劳机理进行了探讨。     

衬底对钛酸铋铁电薄膜生长及性能的影响

采用溶胶–凝胶工艺在Si和Pt/Ti/SiO2/Si两种衬底上制备了Bi4Ti3O12铁电薄膜,研究了衬底对Bi4Ti3O12铁电薄膜生长及性能的影响。研究表明:Pt/Ti/SiO2/Si基Bi4Ti3O12薄膜的剩余极化较高但易出现焦绿石相,而Si基Bi4Ti3O12薄膜易于沿c轴取向生长,有利于改善铁电薄膜与硅衬底之间的界面特性,但8mC/cm2的剩余极化却比前者有所降低。     

铁电薄膜Bi3.2Nd0.8Ti3O12的制备及其特性的研究

用脉冲激光淀积法成功地在p-Si底片上制备了高c轴取向的Bi3．2Nd0．8Ti3O12铁电薄膜，研究了薄膜的铁电性能及疲劳特性。研究表明，用钕Nd替代Bi的3．2Nd0．8Ti3O12薄膜具有较好电滞回线（P-E），在应用电压为10V，测试频率为1MHz下，其剩余极化（Pr）及矫顽场（E）分别达到27μC／cm^2和70kV／cm。更为重要的是，Au／Bi3．20Nd0.80Ti3O12／p-Si（100）电容在读／写开关次数达到10^10后仍表现出较好的抗疲劳特性。     

Influence of the annealing temperature on the ferroelectric properties of niobium-doped strontium–bismuth tantalate

Characteristics of ferroelectric thin films of niobium-doped strontium–bismuth tantalate (SBTN), which were deposited by magnetron sputtering on Pt/TiO₂/SiO₂/Si substrates, are investigated. To form the ferroelectric structure, deposited films were subjected to subsequent annealing at 700–800°C in an O₂ atmosphere. The results of X-ray diffraction showed that the films immediately after the deposition have an amorphous structure. Annealing at 700–800°C results in the formation of the Aurivillius structure. The dependences of permittivity, residual polarization, and the coercitivity of SBTN films on the modes of subsequent annealing are established. Films with residual polarization 2P_r = 9.2 µC/cm², coercitivity 2E_c = 157 kV/cm, and leakage current 10^–6 A/cm² are obtained at the annealing temperature of 800°C. The dielectric constant and loss tangent at frequency of 1.0 MHz were ε = 152 and tan δ = 0.06. The ferroelectric characteristics allow us to use the SBTN films in the capacitor cell of high density ferroelectric random-access non-volatile memory (FeRAM).     

Synthesis of the PZT films deposited on pt-coated (100) Si substrates for nonvolatile memory applications

Ferroelectric lead-zirconate-titanate (PZT) thin films were deposited by the pulsed laser deposition technique on Pt-coated (100) Si substrates. This study was focused on the investigation of the PZT film growth on (100) Si substrate at varying deposition parameters and electrical characterization of the films including hysteresis loop and fatigue properties by RT66A Standardized Ferroelectric Test System. PZT deposited at higher temperature (575°C in 450 mTorr O₂ partial pressure) showed the best crystalline structure. The remnant polarization and the retained polarization of the ferroelectric capacitors were 13 μC/cm² and 20 μC/cm², respectively. The crystallographic properties of the films were determined using the x-ray diffractometer method. The cross-sectional transmission electron microscope results showed very smooth interfaces among different layers of films.     

电极对PZT铁电薄膜性能的影响

用溶胶－凝胶法制备ＰＺＴ铁电薄膜。以Ｐｔ／Ｔｉ／ＳｉＯ２／Ｓｉ为底电极，Ａｕ为上电极，形成金属－铁电薄膜－金属结构的铁电电容器。研究电极对ＰＺＴ铁电薄膜结构和电性能的影响，实验发现，金属Ｔｉ的厚度会影响ＰＺＴ铁电薄膜的结构。界面层的存在使介电系数、自发极化、矫顽电压、漏电流都与薄膜的厚度有关。     

(Pb_(1-x)Sr_x)TiO_3系铁电薄膜的极化反转特性

采用磁控溅射技术在Si基底上制备了(Pb1-xSrx)TiO3(简称PST)铁电薄膜,采用双极性、双脉冲方波电压测试了其极化反转特性。测试结果表明,所制备的PST铁电薄膜的电流密度峰值达10-4A/mm2量级,开关时间可达1.0 ms左右,极化反转特性较好,有望未来在Si基集成单片红外探测焦平面阵列研制中加以应用。     

Sol-Gel processing of Nb-doped Pb(Zr,Ti)O3 thin films for ferroelectric memory applications

The ferroelectric properties of Nb-doped PZT thin films prepared by a sol-gel method were evaluated relative to memory device application requirements. Within the range of 0 to 4 mol %, Nb-doping of PZT compositions near the morphotropic phase boundary region (i.e. PZT 53/47) enhanced overall ferroelectric properties by reducing the te-tragonal distortion of the unit cell. A 4 mol % Nb-doped PZT 53/47 thin film (0.26 μm) had a coercivity of 8 V/ μm, a remanence ratio of 0.54, a switchable polarization of 45 μC/cm², and a specific resistivity of 3 x 10⁹ Ω-cm. Nb-doping levels in excess of 5 mol had a detrimental effect on the resulting thin film ferroelectric properties. X-ray diffraction (XRD) analysis of highly doped films showed development of a significant PbO phase accompanied by diffraction line broadening of the perovskite phase. As such, it was postulated that the creation of excessive lead vacancies in the PNZT lattice resulted in PbO accumulation at the grain boundaries which impeded grain growth, and hence, adversely affected ferroelectric switching performance. The fatigue performance of the sol-gel derived thin film capacitor system was a function of switching voltage. At switching fields sufficient to saturate the polarization, the endurance of the thin film capacitor was greater than 10⁹ cycles. Cycling with lower fields reduced endurance values, but in all cases, the switchable polarization decreased linearly with the logarithm of cycles. Nb-doping did not have a significant effect on the fatigue performance.     

Pb(Zr_(0.52)Ti_(0.48))O_3 memory capacitor on Si with a polycrystalline silicon/SiO_2 stacked buffer layer

Pb(Zr_(0.52)Ti_(0.48))O_3(PZT) thin films have been deposited on a p-type Si substrate separated by a polycrystalline silicon/SiO_2 stacked buffer layer.The X-ray diffraction peaks of the PZT thin films prepared on the polycrystalline silicon annealed at different temperatures were measured.In addition,the polarization of the Pt/PZT/polycrystalline silicon capacitor has been investigated.The memory capacitor of the metal/ferroelectric/polycrystalline silicon/SiO_2/semiconductor structure annealed at 650℃...     

The role of grain-boundary on the hydrogen-induced degradation inthin-film ferroelectric capacitors

The electrical properties of thin-film ferroelectric capacitors are known to degrade severely when exposed to hydrogen. In this study, we directly measured the effects of the grain boundary on the hydrogen-induced degradation in ferroelectric Pb(Zr, Ti)O₃ (PZT) thin films by the location of the top Pt electrode either inside the grains or at the grain boundary. A strong relationship between the grain boundary and the electrical properties of ferroelectric capacitors as a result of hydrogen annealing was found. The degradation of the electrical properties in thin-film ferroelectric capacitors after hydrogen annealing is mainly due to the presence of the grain boundary in the ferroelectric thin film     

不同厚度PZT薄膜的制备及电性能特性研究

采用sol-gel（溶胶-凝胶）法在Pt/Ti/SiO2/Si基底上分别制备了厚度为400nm,600nm,800nm的PZT（锆钛酸铅,Zr/Ti=52/48）薄膜,研究了厚度对薄膜介电性能与铁电性能的影响。通过对薄膜的铁电性能与介电性能进行测试,分析了不同厚度薄膜的剩余极化强度、介电常数与介电损耗;通过对介电调谐率与最大正切损耗的计算,进一步分析了薄膜的介电调谐性能。实验结果表明,薄膜的介电常数与介电损耗随薄膜厚度的增大而增加;厚度为600nm的薄膜具有最好的介电调谐性能与铁电性能。     

Si基Bi_4Ti_3O_(12)薄膜电滞回线及铁电性能的研究

采用溶胶-凝胶(Sol-Gel)法直接在p-Si衬底上制备生长Bi4Ti3O12铁电薄膜,研究了Ag/Bi4Ti3O12/p-Si异质结电滞回线的特征及Bi4Ti3O12薄膜的铁电性能。空间电荷层的存在使Si基Bi4Ti3O12铁电薄膜呈不对称的电滞回线并导致薄膜的极化减弱。退火温度同时影响了薄膜的晶粒尺寸和薄膜中的载流子浓度,而这两种因素对铁电性能的影响是相反的。Bi4Ti3O12薄膜的铁电性能随退火温度的变化是两种因素共同作用的结果。     

Electrical properties of Pb(Zr,Ti)O3 films prepared on ITO glass

Pb(Zr,Ti)O₃ thin films were successfully prepared on a Pt bottom electrode with indium tin oxide coated glass substrates using RF magnetron sputtering. Use of the indium tin oxide coated glass substrate reduced the fatigue characteristics and provided for excellent crystallization of the Pb(Zr,Ti)O₃ thin films. The polarization versus fatigue characteristics showed 10% degradation after 10⁹ cycles. These results indicate that Pt/indium tin oxide double electrodes can be improved both in terms of fatigue and ferroelectric properties through the use of Pb(Zr,Ti)O₃ thin films on glass substrates, resulting in better performance than metal electrodes.