环氧树脂/氧化锌晶须/氮化硼导热绝缘复合材料的研究

以环氧树(脂EP)为基体,分别以氧化锌晶(须ZnOw)和ZnOw/氮化硼(BN)混合物为导热填料,制备了EP导热绝缘复合材料。研究了填料含量对复合材料导热性能、电绝缘性能及力学性能的影响,并利用扫描电镜对复合材料的断面形貌进行了观察。结果表明:随着导热填料含量的增大,复合材料的导热系数和介电常数增大,体积电阻率下降,而拉伸强度呈先增大后减小的趋势;在填料含量相同的情况下,EP/ZnOw/BN复合材料比EP/ZnOw复合材料具有更好的导热性能;当填料体积分数为15%时,EP/ZnOw/BN复合材料的热导率为1.06W/(mK)而,EP/ZnOw复合材料的热导率仅为0.98W/(mK)。     

环氧树脂/玻璃布/BN导热复合材料的制备与性能研究

采用高温模压成型法制备环氧树脂(EP)/玻璃布/氮化硼(BN)导热复合材料。探讨了BN用量和偶联剂处理对复合材料力学性能、导热性能和介电性能等影响。结果表明:当w(BN)=15%时,复合材料的冲击强度较高;导热性能随着BN用量的增加而增大;当w(BN)=25%时,改性复合材料的热导率为0.901 2 W/(m.K),此时复合材料仍保持较低的介电常数和介电损耗。当BN用量相同时,偶联剂表面处理可有效改善复合材料的力学性能和导热性能。     

PB-1/BN导热复合材料的制备及性能研究

以聚丁烯-1(PB-1)为基体,二维片状氮化硼(BN)为导热填料,采用模压成型的方法制备了PB-1/BN导热复合材料。研究了BN用量对PB-1/BN导热复合材料导热性能、力学性能、流变性能以及结晶性能的影响。结果表明:BN的加入使复合材料的导热性能明显提高,当BN用量为50%时,复合材料的导热系数达到1.28 W/(m·K),与纯PB-1相比提高了266%;随着BN用量的增加,复合材料的力学性能明显下降;同时,其结晶温度和结晶度也有不同程度降低。     

Microwave‐assisted in situ polymerization of polycaprolactone/boron nitride composites with enhanced thermal conductivity and mechanical properties

Polycaprolactone/boron nitride (PCL/BN) composites were prepared by microwave‐assisted ring‐opening polymerization of ε‐caprolactone (ε‐CL). In order to improve the dispersibility and interfacial interaction between BN fillers and PCL matrix, hydroxyl functional BN (mBN) was first prepared to be used as a macroinitiator for ε‐CL. Then BN grafted PCL (BN‐g‐PCL) copolymers were obtained via the in situ method, which acted as in situ compatibilizers in the PCL/BN composites. Various techniques were applied to characterize the mBN and PCL/BN composites. The Fourier transform infrared spectroscopy results confirm the structure of the BN‐g‐PCL copolymer. Field emission SEM graphs exhibit that, for the PCL/mBN composites, the mBN presents a homogeneous dispersion in the matrix and interfacial adhesion between the PCL and mBN is improved. These are beneficial for enhancing the thermal conductivity of the PCL/mBN composites. Notably, the PCL/mBN composite with 5 wt% mBN loading achieves the highest thermal conductivity of 0.55 W m^?1 K^?1, which is 2.75 times higher than that of pure PCL, 0.20 W m^?1 K^?1. This indicates that the excellent dispersion and interfacial adhesion could lead to the construction of continuous thermal conductive paths at a low BN loading and reduce the heat loss caused by phonon scattering in the interface. Furthermore, mBN could help to improve the mechanical properties of the composite. On adding 5 wt% mBN, the tensile strength and tensile modulus of the composite are 1.58 and 2.05 times higher, respectively, than those of PCL. © 2020 Society of Chemical Industry     

无机填料粒子的几何特征对环氧树脂灌封胶导热性能的影响

以Al2O3、Si3N4、BN、SiO2和AlN五种无机填料作为环氧树脂(EP)灌封胶的导热填料,研究了填料的种类、粒径大小和颗粒形态等对EP灌封胶热导率的影响。结果表明:EP灌封胶的热导率随着导热填料用量的增加而增大;当φ(BN)=35%(相对于总体积而言)时,相对最大热导率为2.12 W/(m·K),其值约为EP基体的10倍。填料粒子的几何特征对EP灌封胶的导热性能具有较大的影响;当Al2O3粒径为48μm时,EP灌封胶的相对最大热导率为1.3 W/(m·K);填料粒子过大或过小都会降低EP灌封胶的导热性能。层片状填料粒子可以获得较大的堆积密度,在EP灌封胶中能有效形成导热通道,增加其热导率。     

Thermal behavior and dielectric property analysis of boron nitride‐filled bismaleimide‐triazine resin composites

Bismaleimide‐triazine (BT) resin/hexagonal boron nitride (h‐BN) composites are prepared, and the effects of h‐BN content on the thermal and dielectric properties are studied in the view of structure–property relationship. It is found that the introduction of the BN in the BT resin dramatically improve the thermal conductivity of BT resin. The thermal conductivity of the composites is up to 1.11 W/m.K, with an h‐BN concentration of 50 wt %, which is increased by six times compared with the pure BT resin. The BT resin/h‐BN composites also exhibit excellent thermal properties, with the glass transition temperatures above 200°C, and thermal decomposition temperatures over 390°C. Moreover, the composites possess good dielectric properties. Their dielectric constant and loss tangent (tan δ) are less than 4.5 and 0.015, respectively. The results indicate that the BT resin/h‐BN composites are promising as efficient heat‐releasing materials in the high‐density electronic packaging technology. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

碳纳米管材料导热性能的实验研究

本文对碳纳米管与环氧树脂(Epoxy-EP)复合材料的导热性能进行了定量的研究,探索了CNTs/EP复合材料的制备方法,运用Hotdisk热常数分析仪研究了CNTs/EP复合材料的导热系数;利用CNTs/EP两相复合材料的导热理论模型得到了室温下单壁碳纳米管(Single-Wall Carbon Nanotubes-SWCNTs)的导热系数为3980 W/(m.K),双壁碳纳米管的导热系数(Double-Wall Carbon Nanotubes-DWCNTs)为3580 W/(m.K),以及多壁碳纳米管(Multi-Wall Carbon Nanotubes-MWCNTs)的导热系数为2860 W/(m.K)。     

BN填充PA6基导热绝缘复合材料导热性能研究

以聚酰胺6（PA6）为基体, 氮化硼（BN）作为导热填料,经双螺杆挤出机熔融共混,模压成型制得导热绝缘复合材料。研究了BN含量、粒径、形状和不同BN粒径复配对复合材料导热性能的影响,并研究了BN含量和粒径对复合材料绝缘性能的影响。结果表明,在各种粒径下,复合材料热导率均随BN填充量的增加而增大;在BN粒径为5 μm、填充量为25 %（体积分数,下同）时,复合材料热导率达到1.2187 W/(m·K);在BN填充量相同时,填料粒径对复合材料热导率的影响不是简单的单调规律,呈现50、100 μm时较小,1、5、15 μm时较大,150 μm时最大的规律;片状BN填料比球状BN填料更有利于提高复合材料的热导率;2种不同粒径填料复配所填充的复合材料的热导率大于单一粒径填充的复合材料;5 μm与150 μm粒径BN复配,在填充量为20 %,配比为1:3时,复合材料的热导率最大,达到1.3753 W/(m·K),为纯PA6的4.9倍;在不同BN含量和粒径下,复合材料体积电阻率均能达到10000000000000 Ω·cm以上,满足绝缘性能。     

Thermal conductivity and mechanical properties of polyimide composites with mixed fillers of BN flakes and SiC@SiO2 whiskers

Polyimide (PI) composites with mixed fillers of BN flakes and SiC whiskers exhibit enhanced thermal conductivity and mechanical properties. In order to improve dispersion and interaction of these mixed fillers within the PI matrix, BN flakes were modified by a titanate coupling agent while SiC whiskers were oxidized at 750°C for 60 minutes to produce SiC@SiO₂ followed by silane coupling agent modification. PI composites reached a maximum thermal conductivity of 0.95 W/m K at volume fraction of mixed fillers of 27.6 vol% when the weight ratio of BN flakes to SiC@SiO₂ whiskers was 1:4. The enhanced thermal conductivity is likely attributed to the formation of heat conductive networks constructed by BN flakes and SiC@SiO₂ whiskers and the improved interfacial affinity between fillers and matrix. The optimized Nielsen-mold confirms the distribution and morphology of fillers affect the thermal conductivity of PI composites. In addition, SiC whiskers enhanced the mechanical property of PI composites and the influence of fillers on the mechanical property was further elaborated.     

高导热低介电性单组分EP灌封胶的研制

以双酚A型环氧树脂(EP)为基体树脂、线性酚醛树脂(PF)和双氰胺为固化剂、烯丙基缩水甘油醚(AGE)为活性稀释剂、2-乙基-4-甲基咪唑为固化促进剂、氮化硼(BN)和三氧化二铝(A12O3)为导热填料,制备单组分EP灌封胶。采用单因素试验法优选出制备灌封胶的最佳工艺条件,并对灌封胶的导热系数、介电常数、剪切强度和玻璃化转变温度(Tg)等进行了表征。结果表明:制备高导热低介电性单组分EP灌封胶的最佳工艺条件是m(EP)∶m(PF)∶m(活性稀释剂)∶m(BN)=10∶3∶2∶6、w(固化促进剂)=w(流平剂)=0.5%(相对于EP质量而言)和固化条件为"120℃/0.5 h→170℃/1 h",此时其剪切强度为42.37 MPa、介电常数为4.6和导热系数为1.214 W/(m.K)。     

Thermal and electrical properties of aluminum nitride/boron nitride filled polyamide 6 hybrid polymer composites

The effects of boron nitride (BN) and aluminum nitride fillers on polyamide 6 (PA6) hybrid polymer composites were investigated. In particular, the thermal and electrical conductivity, thermal transition, thermal degradation, mechanical and morphological properties and chemical bonds characteristic of the materials with crystal structure of BN and aluminum nitride (AlN) filled PA6 prepared at different concentrations were characterized. Thermal conductivity of hybrid systems revealed a 1.6-fold gain compared to neat PA6. The highest thermal conductivity value was obtained for the composite containing 50 vol% additives (1.040 W/m K). A slight improvement in electrical conductive properties of composites appears and the highest value was obtained for the 50 vol% filled composite with only an increase by 3%. The microstructure of these composites revealed a homogeneous dispersion of AlN and BN additives in PA6 matrix. For all composites, one visible melting peak around 220°C related to the α-form crystals of PA6 was detected in correlation with the X-ray diffraction results. An improved thermal stability was obtained for 10 vol% AlN/BN filled PA6 composite (from 405.41°C to 409.68°C). The tensile strength results of all composites were found to be approximately 22% lower than pure PA6.     

EP/GNs/MWCNTs复合材料的导热性能

以多壁碳纳米管(MWCNTs)和石墨烯纳米微片(GNs)为导热填料,环氧树脂(EP)为基体采用溶剂和超声分散法,制备了EP/GNs/MWCNTs导热复合材料,并与EP/MWCNTs及EP/GNs复合材料的导热性能进行了对比。采用透射电子显微镜观察其微观结构,采用Hot Disk热导率测试仪测试其导热性能,采用差示扫描量热法和热重分析仪测试其耐热性及热稳定性。结果表明,MWCNTs和GNs共同作为EP导热填料时,相比于单组分填料(MWCNTs或GNs)更易形成导热网络;EP的热导率、玻璃化转变温度(Tg)和热分解温度均随着MWCNTs或GNs含量的增加而提高,其中,GNs更有利于提高EP的热导率和热分解温度,MWCNTs更有利于提高EP的Tg。在相同的导热填料含量下,相对于其中的任一单一填料,MWCNTs/GNs共同作用时,对热导率的提高有更显著的效果,且随着其中GNs比例的增加,热导率逐渐增大。当GNs和MWCNTs的体积分数分别为0.6%和0.4%时,EP/GNs/MWCNTs复合材料的热导率、Tg和起始分解温度分别为0.565 W/(m·K),152℃和316℃,分别比纯EP提高了132.5%,34.5%和8.2%。     

环氧树脂／碳化硅晶须导热复合材料的制备研究

用共混复合-浇注成型法制备环氧树脂／碳化硅晶须（EP／SiCw）导热复合材料,研究了导热填料种类、形状、用量和表面处理对复合材料的导热性能、力学性能和热性能的影响。结果表明,SiCw较SiCp更易改善材料的导热性能,热导率随SiCw用量的增加而增大,当SiCw体积分数为42．1％时,复合材料热导率为0．9611W／（m·K）;力学性能随SiCw用量的增加先增加后降低。表面处理有利于提高复合材料的导热性能和力学性能。SiCw的加入使环氧树脂的耐热性提高、Tg降低。     

环氧树脂/玻纤/BN导热绝缘复合材料制备研究

采用高温模压成型法制备环氧树脂/玻纤/BN导热复合材料,探讨了BN用量对复合材料力学性能、导热性能和电性能的影响,结果表明.当BN用量为10%时,复合材料的冲击强度和弯曲强度较佳;导热性能随BN用量的增加而提高,当BN用量为20%耐.热导率为0.7438 W/mk,此时复合材料仍保持较好的绝缘性能.     

Effect of N–Ni coordination bond on the electrical and thermal conductivity of epoxy resin/nickel-coated graphite

The agglomeration of nickel-coated graphite (NCG) in epoxy resin (EP) composites leads to low electrical conductivity of EP composites, which limits their development in electronic devices and multilayer circuits. In order to improve the electrical and thermal conductivity of NCG/EP composites, ethylenediamine (EDA) was used to modify NCG and compared with pure NCG-filled EP composites. It was found that the conductive effect of modified composites with 20 wt% filler is better than that of unmodified composites with 40 wt% filler. The results of Fourier transform infrared spectroscopy and thermogravimetric analysis of EDA-modified NCG (ENCG) showed that a coordination adsorption reaction occurred between EDA and NCG, forming N–Ni coordination bonds. When the filling amount of ENCG was 40 wt%, the conductivity and thermal conductivity of the composite are improved most significantly. The volume resistivity was reduced from 2.636 to 0.109 Ω cm, a decrease of 95.85%, and the thermal conductivity was improved from 0.517 to 0.968 W/(m K), an increase of 87.23%, respectively. Meanwhile, ENCG has better dispersion in the EP matrix than NCG.     

聚偏氟乙烯/类基体基团修饰石墨烯导热复合材料研究

采用含类基体基团的乙烯基三甲氧基硅烷修饰氧化石墨烯(GO),再用"一锅法"将其还原得到功能化石墨烯(F-GE),通过溶剂浇注法制备出界面性能优良的聚偏氟乙烯导热复合材料(PVDF/F-GE).利用红外光谱仪(FTIR)、扫描电子显微镜(SEM)、热导率测试仪、电子拉力试验机对复合材料的改性状态、微观形貌、导热性能和力学...     

Biphenyl liquid crystal epoxy containing flexible chain: Synthesis and thermal properties

A biphenyl type liquid crystal epoxy (LCE) monomer 4,4′-di(2,3-epoxyhexyloxy)biphenyl (LCBP4) containing flexible chain was synthesized and the curing behavior was investigated using 4,4′-diaminodiphenylmethane (DDM) as the curing agent. The effect of curing condition on the formation of the liquid crystalline phase was examined. The cured samples show good mechanical properties and thermal stabilities. Moreover, the relationship between thermal conductivity and structure of liquid crystalline domain was also discussed. The samples show high thermal conductivity up to 0.28–0.31 W/(m*K), which is 1.5 times as high as that of conventional epoxy systems. In addition, thermal conductive filler, Al₂O₃, was introduced into LCBP4/DDM to obtain higher thermal conductive composites. When the content of Al₂O₃ was 80 wt%, the thermal conductivity of the composite reached to 1.86 W/(m*K), while that of diglycidyl ether of bisphenol A (Bis-A) epoxy resin/DDM/Al₂O₃ was 1.15 W/(m*K). Compared with Bis-A epoxy resin, the formation of liquid crystal domains in the cured LCE resin enhanced the thermal conductivity synergistically with the presence of Al₂O₃. Furthermore, the introduction of Al₂O₃ also slightly increased the thermal stabilities of the cured LCE.     

PP/滑石粉导热绝缘复合材料的制备与性能研究

采用聚丙烯(PP)为基体,不同粒径滑石粉为填料,通过双螺杆挤出机挤出制备导热绝缘的PP滑石粉复合材料。在滑石粉用量为3O%的条件下,探讨了粒径分别为3.6,6,12,30,50 μm的滑石粉对PP猾石粉复合材料的热导率、体积电阻率、力学性能和结晶性能的影响。结果表明,随着滑石粉粒径的减小,复合材料的拉伸强度和弯曲强度呈先增大后减小的变化趋势,而其热导率则呈先减小后增大的变化趋势。填充粒径为12μm的滑石粉时,复合材料的拉伸强度和弯曲强度达到最大值,分别为29.92MPa和52.58MPa,比纯PP分别提高了5.5%和12.8%。填充粒径为50μm的滑石粉时,复合材料的热导率最大,达到0.3237W/(m*K),比纯PP提高了32.7%。填充1:l的粒径为12μm和30μm滑石粉混合物时,PP复合材料的热导率为0.3184W/(m*K),高于相应的填充单一粒径滑石粉的PP复合材料。此外,所制备的PP滑石粉复合材料的体积电阻率均大于10^8Ω*cm     

高导热高介电BT/SiC/PA6复合材料的制备及性能研究

以聚酰胺(PA6)为基体,氮化硅(SiC)为导热填料,钛酸钡(BT)为介电填料,通过热压法制备出系列复合材料;研究了不同粒径填料的搭配对材料导热与介电性能的影响。结果表明:在填充量较低时,使用混合粒径导热填料能产生一定的级配效应,从而提高复合材料的导热性能。总填充量为26%时,以4∶1的比例,用粒径为0.5~0.7μm和3μm的SiC共同填充PA6,制备获得了最高导热系数为0.9198W/(m·K)的复合材料,而不同粒径、不同功能的混合功能填料还能产生协同效应,进一步提升材料的导热性能并使材料同时获得较好的介电性能,当SiC填充量为20%,BT填充量为20%时,复合材料的导热系数达到1.1110W/(m·K),介电常数到达16(100Hz),损耗保持在0.075(100Hz)左右。     

Effects of phenolic resin contents on microstructures and properties of c/sic-diamond composites

In this paper, C/SiC-diamond composites were obtained by chemical vapor infiltration (CVI) and reactive melt infiltration (RMI), and the effects of phenolic resin contents on the microstructures and properties of as-obtained C/SiC-diamond composites were studied. The results suggested a significant influence of phenolic resin contents on the pore structure of the composites before reactive melt infiltration (RMI), as well as phase composition and density of the matrix after RMI. The mechanical properties of composites were shown to correlate with the threshold effect of phenolic resin. Sample R5 prepared with high phenolic resin contents displayed significantly declined mechanical properties. On the other hand, adjustment of the phenolic resin content yielded samples with maximum room temperature thermal conductivity reaching 14.75 W/(m·K). The theoretical thermal conductivity of the composites calculated by the Hasselman-Johnson (H-J) theoretical model was estimated to 24.52 W/(m·K). Overall, the increase in phenolic resin content led to unreacted diamond-C regions and the formation of substantial porosity. These features reduced the thermal conductivity of the resulting C/SiC-diamond composites.