Characterization and modeling of diglycidyl ether of bisphenol‐a epoxy cured with aliphatic liquid amines

The characterization by DMA and compressive stress‐strain behavior of an epoxy resin cured with a number of liquid amines is studied in this work along with predictions of the associated properties using Group Interaction Modeling (GIM). A number of different methods are used to assign two of the input parameters for GIM, and the effect on the predictions is investigated. Excellent predictions are made for the glass transition temperature, along with good predictions for the beta transition temperature and modulus for the majority of resins tested. Predictions for the compressive yield stress and strain are less accurate, due to a number of factors, but still show reasonable correlation with the experimental data. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 3130–3141, 2013     

Synthesis,characterization, and properties of low viscosity tetra‐functional epoxy resin N,N,N′,N′‐ tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane

Tetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF₃‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131, 40009.     

Tetrafunctional epoxy as an all‐purpose modifier for homopolymerized bisphenol A diglycidyl ether

In some applications, homopolymerized epoxies, which offer better biocompatibility and lower water absorption than amine‐ and anhydride‐cured epoxy, are more preferable; however, using homopolymerized epoxy as matrix in composites still remains a challenge. Herein, homopolymerized bisphenol A diglycidyl ether curing systems with simultaneously improved tensile strength, impact strength, and glass transition temperature (T_g) were achieved by addition of small amounts of tetra‐functional epoxies (TFTEs) with different spacer lengths. Effects of spacer length in TFTE on thermal and mechanical properties were investigated. Results indicated that TFTE with the longest spacer length shows the best mechanical performance. In addition, effects of TFTE loading on thermal and mechanical properties were discussed. Compared with neat bisphenol A diglycidyl ether, addition of 5% tetraglycidyl‐1,10‐bis(triphenylmethane) decane leads to simultaneous improvements in tensile strength, impact strength, and T_g. Effects of thermal cycling on the mechanical properties were also reported. Results suggest that the modified homopolymerized epoxy shows good performances and could be used as matrix materials and possibly in some dental applications. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46431.     

Low dielectric thermoset. I. Synthesis and properties of novel 2,6‐dimethyl phenol‐dicyclopentadiene epoxy

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant 2,6‐dimethyl phenol‐dicyclopentadiene novolac was epoxidized to 2,6‐dimethyl phenol‐dicyclopentadiene epoxy. The structures of novolac and epoxy were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis, mass spectroscopy (MS), nuclear magnetic resonance spectroscopy (NMR), and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol‐dicyclopentadiene epoxy was then cured with 4,4‐diaminodiphenyl methane (DDM), phenol novolac (PN), 4,4‐diaminodiphenyl sulfone (DDS), and 4,4‐diaminodiphenyl ether (DDE). Thermal properties of cured epoxy resins were studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermal gravimetric analysis (TGA). These data were compared with those of the commercial bisphenol A epoxy system. Compared with the bisphenol A epoxy system, the cured 2,6‐dimethyl phenol‐ dicyclopentadiene epoxy resins exhibited lower dielectric constants (～3.0 at 1 MHz and 2.8 at 1 GHz), dissipation factors (～0.007 at 1 MHz and 0.004 at 1 GHz), glass transition temperatures (140–188°C), thermal stability (5% degradation temperature at 382–404°C), thermal expansion coefficients [50–60 ppm/°C before glass‐transition temperature (T_g)], and moisture absorption (0.9–1.1%), but higher modulus (～2 Gpa at 60°C). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2607–2613, 2003     

Plasticizing effect of biodegradable dipropylene glycol bibenzoate and epoxidized linseed oil on diglycidyl ether of bisphenol A based epoxy resin

Major limitation for use of epoxy thermosets in engineering applications is its sudden brittle failure. In the present study dipropylene glycol dibenzoate (DPGDB) based plasticizer is used to modify diglycidyl ether of bisphenol A (DEGEBA) based epoxy resin system via simple blending technique. Bio-based epoxidized linseed oil was also used to modify epoxy resin system and compared with DPGDB modified resin. For DPGDB modified resin storage modulus and loss modulus of the epoxy system modified with 10% plasticizer increased by 7.54% and 12.24%, respectively. The primary mechanism responsible for such behavior is improved crosslinking density. With 5% plasticizer loading, flexural strength increased by 21%. There was an improvement of 312.74% in strain at failure for 10% plasticizer loading, while preserving its mechanical strength. It was found that DPGDB based modification was better than epoxidized linseed oil modification.     

Synthesis and properties of fluorinated biphenyl‐type epoxy resin

A novel fluorinated biphenyl‐type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl‐type phenolic resin, which was prepared by the condensation of 3‐trifluoromethylphenol and 4,4′‐bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3–2.5 Pa s) at 120–122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409–415°C, high glass‐transition temperature of 139–151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117–121 MPa as well as tensile strength of 71–72 MPa. The thermally cured fluorinated biphenyl‐type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5–0.8 × 10¹⁷ Ω cm and surface resistivity of 0.8–4.6 × 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8–4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6–3.8 × 10^?3. It was found that the fluorinated epoxy resins have improved dielectric properties, lower moisture adsorption, as well as better flame‐retardant properties compared with the corresponding commercial biphenyl‐type epoxy resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

A novel tetra‐functional epoxy monomer with mesogenic groups was synthesized and characterized by ¹H‐NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T_g) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol‐A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra‐functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 °C, and T_g‐less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 °C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46181.     

Synthesis of amine‐cured,epoxy‐layered silicate nanocomposites: The influence of the silicate surface modification on the properties

Fluorohectorites were rendered organophilic through the cation exchange of sodium intergallery cations for protonated monoamine, diamine, and triamine oligopropyleneoxides and octadecylamine, benzylamine, and adducts of octadecylamine and benzylamine with diglycidyl ether of bisphenol A (DGEBA). The influence of the silicate surface modification and compatibility on the morphology and thermal and mechanical properties was examined. Surface modification with protonated octadecylamine and its adduct with DGEBA promoted the formation of microscale domains of silicate layers separated by more than 50 Å, as evidenced by transmission electron microscopy and wide‐angle X‐ray scattering. Young's modulus of these two nanocomposites increased parabolically with the true silicate content, whereas conventionally filled composites exhibited a linear relationship. The highest fracture toughness was observed for conventionally filled composites. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 2643–2652, 2002     

Synthesis and properties of poly(ether imide)s derived from 2,5‐bis(3,4‐dicarboxyphenoxy)biphenyl dianhydride and aromatic ether–diamines

A series of poly(ether imide)s (PEIs) with light colors and good mechanical properties were synthesized from 2,5‐bis(3,4‐dicarboxyphenoxy)biphenyl dianhydride and various aromatic ether–diamines via a conventional two‐step polymerization technique that included ring‐opening polyaddition at room temperature to poly(amic acid)s (PAAs) followed by thermal imidization. The precursor PAAs had inherent viscosities ranging from 0.71 to 1.19 dL/g and were solution‐cast and thermally cyclodehydrated to flexible and tough PEI films. All of the PEI films were essentially colorless, with ultraviolet–visible absorption cutoff wavelengths between 377 and 385 nm and yellowness index values ranging from 10.5 to 19.9. These PEIs showed high thermal stabilities with glass‐transition temperatures of 206–262°C and decomposition temperatures (at 10% weight loss) higher than 478°C. They also showed low dielectric constants of 3.39–3.72 (at 1 MHz) and low water absorptions below 0.85 wt %. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Thermoplastic‐modified epoxy resins cured with different functionalities amine mixtures: Morphology,thermal behavior,and mechanical properties

Epoxy matrices inherent brittleness and poor crack resistance make necessary some form of toughening. In this work, to improve their fracture toughness and ductility epoxy matrices were modified by changing its architecture and by the addition of a third component. The matrices architecture were modified by stoichiometrically reacting a bifunctional epoxy resin with different functionalities amine mixtures, one of which being a monoamine that plays the role of chain extender. In the modification by the addition of a third component, poly(methyl methacrylate) (PMMA) was selected as modifier. PMMA is initially miscible with epoxy/amine systems but can phase separate during curing. The kinetics and miscibility of these systems were studied previously. At constant curing conditions, materials from completely opaque (phase separated) to transparent (miscible) can be obtained with the increase in monoamine content. In this work, the effects of the modifier content and of the monoamine : diamine ratio in stoichiometric epoxy/amine mixtures on the resultant morphologies as well as on their thermal and mechanical properties was studied.© 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis and properties of novel trifunctional epoxy triglycidyl of 4‐(4‐aminophenoxy)phenol with high toughness

A trifunctional epoxy containing oxyphenylene unit, triglycidyl of 4‐(4‐aminophenoxy)phenol (TGAPP) was synthesized and characterized. The chemical structure of TGAPP was confirmed with FTIR and ¹H‐NMR. DSC analysis revealed that the reactivity of TGAPP with curing agent 4, 4′‐diaminodiphenylsulfone (DDS) was significantly lower than that of triglycidyl para‐aminophenol (TGPAP). Rheological analysis showed that the processing window of TGAPP/DDS was 20°C wider compared with that of TGPAP/DDS. The thermal and mechanical properties of cured TGAPP/DDS were investigated and compared with those of the cured TGPAP/DDS. Experimental results showed that, due to the introduction of oxyphenylene unit, the heat resistance and flexural strength were slightly reduced, while the tensile strength and impact strength were enhanced. SEM also confirmed that the introduction of oxyphenylene unit could enhance the toughness of the TGAPP/DDS as evident from ridge formation. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41878.     

Synthesis and characterization of organosoluble and transparent polyimides derived from trans‐1,2‐bis(3,4‐dicarboxyphenoxy)cyclohexane dianhydride

A novel dianhydride, trans‐1,2‐bis(3,4‐dicarboxyphenoxy)cyclohexane dianhydride (1,2‐CHDPA), was prepared through aromatic nucleophilic substitution reaction of 4‐nitrophthalonitrile with trans‐cyclohexane‐1,2‐diol followed by hydrolysis and dehydration. A series of polyimides (PIs) were synthesized from one‐step polycondensation of 1,2‐CHDPA with several aromatic diamines, such as 2,2′‐bis(trifluoromethyl)biphenyl‐4,4′‐diamine (TFDB), bis(4‐amino‐2‐trifluoromethylphenyl)ether (TFODA), 4,4′‐diaminodiphenyl ether (ODA), 1,4‐bis(4‐aminophenoxy)benzene (TPEQ), 4,4′‐(1,3‐phenylenedioxy)dianiline (TPER), 2,2′‐bis[4‐(3‐aminodiphenoxy)phenyl]sulfone (m‐BAPS), and 2,2′‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]sulfone (6F‐BAPS). The glass transition temperatures (T_gs) of the polymers were higher than 198°C, and the 5% weight loss temperatures (T_d5%s) were in the range of 424–445°C in nitrogen and 415–430°C in air, respectively. All the PIs were endowed with high solubility in common organic solvents and could be cast into tough and flexible films, which exhibited good mechanical properties with tensile strengths of 76–105 MPa, elongations at break of 4.7–7.6%, and tensile moduli of 1.9–2.6 GPa. In particular, the PI films showed excellent optical transparency in the visible region with the cut‐off wavelengths of 369–375 nm owing to the introduction of trans‐1,2‐cyclohexane moiety into the main chain. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42317.     

Synthesis and properties of novel polyimides from 3‐(4‐aminophenylthio)‐N‐aminophthalimide

A novel, asymmetric diamine, 3‐(4‐aminophenylthio)‐N‐aminophthalimide, was prepared from 3‐chloro‐N‐aminophthalimide and 4‐aminobenzenethiol. The structure of the diamine was determined via IR and ¹H‐NMR spectroscopy and elemental analysis. A series of polyimides were synthesized from 3‐(4‐aminophenylthio)‐N‐aminophthalimide and aromatic dianhydrides by a conventional two‐step method in N,N‐dimethylacetamide and by a one‐step method in phenols. These polyimides showed good solubility in 1‐methyl‐2‐pyrrolidinone, m‐cresol, and p‐chlorophenol, except polyimide from pyromellitic dianhydride, which was only soluble in p‐chlorophenol. The 5% weight loss temperatures of these polyimides ranged from 460 to 498°C in air. Dynamic mechanical thermal analysis indicated that the glass‐transition temperatures of the polyimides were in the range 278–395°C. The tensile strengths at break, moduli, and elongations of these polyimides were 146–178 MPa, 1.95–2.58 GPa, and 9.1–13.3%, respectively. Compared with corresponding polyimides from 4,4′‐diamiodiphenyl ether, these polymers showed enhanced solubility and higher glass‐transition temperatures. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and properties of 4,4′‐(hexafluoroisopropylidene) diphenol cured 2,2‐bis(4‐cyanatophenyl) propane

A novel easily curing system of 2,2‐bis(4‐cyanatophenyl) propane(BACY) was prepared by employing 4,4′‐(Hexafluoroisopropylidene) Diphenol (BPAF) as modifier. The curing efficiency of BPAF was evaluated by means of differential scanning calorimetry (DSC) and Fourier translation infrared spectroscopy analysis (FTIR). It was found that the exothermic peak temperature (T_p) was 168 °C when the content of BPAF/BACY was 15/85 by weight, while the temperature of BACY was 215 °C under the same conditions when trace of cobalt(III) acetylacetonate(CoAt(III)) was added. Besides, BPAF/BACY system owned outstanding properties including excellent curing characteristics, high shear strength, remarkable dielectric properties and high thermal stability in contrast to BACY, 4,4′‐(1‐methylethylidene) bisphenol(BPA)/BACY, and nonylphenol(NoP)/BACY systems. Moreover, the properties of cured BPAF/BACY modified by different proportions of BPAF were studied in detail. It was shown that moderate BPAF was conducive to most properties of polycyanurate, and the optimal proportion of BPAF/BACY was 15/85 by weight. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44518.     

Preparation and properties of composites based on melamine‐formaldehyde foam and nano‐Fe3O4

In this work, a novel melamine‐formaldehyde‐Fe₃O₄ foam was prepared from a mixture containing melamine‐ethanolamine‐formaldehyde resin, melamine‐glycol‐formaldehyde resin and carboxylated Fe₃O₄ nanoparticles by microwave foaming method. The two resins were characterized by ¹³C‐NMR, respectively. The structures of foams, mechanical and fire‐retardant properties were experimentally characterized separately by scanning electron microscopy, universal testing machine, limit oxygen index, thermogravimetry‐differential thermal analysis, and Fourier transform infrared spectra. The effects of the resin viscosity, emulsifier, nucleating agent, curing agent, silicone oil, microwave heating time and blowing agent on the structure of foam were investigated. Results showed that the properties of foam were decided by not only the molecular structure but also structure of foam, and the carboxylated Fe₃O₄ nanoparticles can improve the toughness and flame retardant properties of magnetic foam obviously from both aspects. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2688–2697, 2013     

Structure and toughness of polyethersulfone (PESU)‐modified anhydride‐cured tetrafunctional epoxy resin: Effect of PESU molecular mass

A tetrafunctional, anhydride hardened epoxy resin (EP) was modified with polyethersulfones (PESU) of different molecular mass (MM) without using additional solvent in 10 wt %. The morphology, thermal, and fracture mechanical properties of the EP/PESU systems were determined. PESU was present as dispersed phase in the EP matrix. The final morphology of EP/PESU depended on MM of PESU. PESU of low and medium MM formed submicron scale spherical droplets, whereas PESU of high MM was present in micron scale inclusions of complex (sea‐island) structure. With increasing MM of PESU, the fracture mechanical properties, and especially the fracture energy, were increased. This was traced to differences in the morphology (dispersion of PESU) of the EP/PESU systems triggering different failure mechanisms. The onset of thermal degradation was slightly reduced, whereas the char yield enhanced by PESU modification compared with the reference EP. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Comparing reinforcement strategies for epoxy networks using reactive and non‐reactive fortifiers

Improvements in physical, mechanical, and thermal properties of an epoxy network are made with the use of a unique class of molecules that reinforce the network at the molecular scale. These molecules are commonly referred to as antiplasticizers or fortifiers. In this contribution, two types of fortifiers are incorporated into the model epoxy network. One, dimethyl methylphosphonate, is a simple additive while the other, diethyl phosphoramidate, contains a reactive amine and is cured as part of the network. The two approaches provide some unique differences in the physical and mechanical properties of the networks. Several mechanisms of fortification are discussed and correlated to the observed properties. In addition, it is shown that the fortifiers improve the rheological characteristics of the epoxy resin and act as fire‐retardants in the cured network. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4606–4615, 2006     

Polyurethane‐modified epoxy resin: Solventless preparation and properties

A polyurethane‐modified epoxy resin system with potential as an underfill material in electronic packaging and its preparation procedure were studied. The procedure enabled the practical incorporation of an aliphatic polyurethane precursor, synthesized from poly(ethylene glycol) and hexamethylene diisocyanate without a solvent, as a precrosslinking agent into a conventional epoxy resin. With a stoichiometric quantity of the polyurethane precursor added to the epoxy (ca. 5 phr), the polyurethane‐modified epoxy resin, mixed with methylene dianiline, exhibited a 36% reduction in the contact angle with the epoxy–amine surface, a 31% reduction in the cure onset temperature versus the control epoxy system, and a viscosity within the processable range. The resultant amine‐cured thermosets, meanwhile, exhibited enhanced thermal stability, flexural strength, storage modulus, and adhesion strength at the expense of a 5% increase in the coefficient of thermal expansion. Exceeding the stoichiometric quantity of the polyurethane precursor, however, reduced the thermal stability and modulus but further increased the coefficient of thermal expansion. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Novel epoxidized hyperbranched poly(phenylene oxide): Synthesis and application as a modifier for diglycidyl ether of bisphenol A

A novel epoxidized hyperbranched poly(phenylene oxide) (EHPPO) is designed and synthesized successfully. The structure of EHPPO is characterized by Fourier transform infrared spectra‐ and quantitative ¹³C nuclear magnetic resonance spectrum. The synthesized EHPPO is added into diglycidyl ether of bisphenol A as a modifier in different ratios to form hybrids and cured by an anhydride curing agent. Effects of EHPPO addition on the properties of the cured hybrids are investigated. Thermal mechanical analysis results suggest that addition of EHPPO can increase the free volume of the cured hybrid materials. Dynamic mechanical analysis characterizations show that the crosslinking density increases with the increase in EHPPO content. Furthermore, addition of EHPPO results in an improvement in thermal and mechanical properties. The toughening mechanism is also discussed. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013