Preparation and properties of thermally stable copolyimides based on novel second‐order nonlinear–optical chromophore containing diamines

Thermally stable copolyimides were prepared from two novel second‐order nonlinear optical chromophores containing diamines, 4‐nitro‐4′‐[N‐(4,6‐di‐β‐aminoethylamino)‐1,3,5‐triazin‐2‐yl]aminoazobenzene (M1) and 4‐nitro‐4′‐[N‐(4,6‐di‐4‐aminophenylamino)‐1,3,5‐triazin‐2‐yl]aminoazobenzene (M2); two codiamines, 4,4′‐diamino‐3,3′‐dimethyl diphenylmethane (MMDA) and bis‐(3‐aminopropyl)‐1,1′,3,3′‐tetramethyldisiloxane (SiDA); and 3,3′,4,4′‐diphenyl ether tetracarboxylic acid dianhydride (OPDA). All copolyimides possess high glass transition temperatures (T_g's) between 237 and 271°C. Copolyimides based on M2 do not exhibit an obvious change in T_g as the M2 content is increased, while those based on M1 show a slight decrease in T_g as the M1 content is increased. All copolyimides exhibit high thermal decomposition temperatures. The copolyimides are soluble in aprotic solvents such as NMP, DMAc, DMF, DMSO, and 1,4‐butyrolactone. Some are even soluble in common low boiling point solvents such as THF and chloroform. The refractive index of a copolyimide is increased as the chromophore content is increased, while the birefringence of a copolyimide does not exhibit strong dependence on the chromophore content. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1619–1626, 2000     

Synthesis and characterization of novel borosiloxane‐containing aromatic copolyimides with excellent thermal stability and low coefficient of thermal expansion

The properties of borosiloxane‐containing copolyimides with borosiloxane in the main chain and in the side chain were studied. Two series of borosiloxane‐containing copolyimides were synthesized by the reaction of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA ) and 2,3′,3,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA ) with p ‐phenylenediamine (PDA ), 4,4′‐oxydialinine (4,4′‐ODA ) and different borosiloxane diamine monomers (BSiAs ). The synthesized borosiloxane‐containing copolyimides exhibited better solubility than borosiloxane‐free copolyimides and showed high glass transition temperatures (320–360 °C), excellent thermal stability (570–620 °C for T ₁₀), great elongation at break (10% ? 14%) and a low coefficient of thermal expansion (14–24 ppm °C^?1). More specifically, the copolyimides containing BSiA‐2 formed nano‐scale protrusions and the copolyimides containing BSiA‐1 formed micro‐scale protrusions. The contact angles of the copolyimides increased from 72° for neat copolyimide to 96° for 5% of borosiloxane in the main chain of the copolymer up to 107° for 10% of borosiloxane in the side chain of the copolymer. © 2017 Society of Chemical Industry     

Structure and properties for conterminously linked polymer of copoly(amic acid) with triallyl isocyanurate and bismaleimide

The copoly(amic acid)s were prepared from two various diamines 2,2′‐bis (4‐aminophenoxy phenyl) hexafluoropropane or 2,2′‐bis (4‐aminophenoxy phenyl) propane and amine‐terminated oligosiloxane, respectively, with aromatic tetracarboxylic dianhydride (3,3′,4,4′‐benzophenone tetracarboxylic dianhydride). The resulted copoly(amic acid) with various mole ratio of triallyl isocyanurate (TAIC)/4,4′‐bismaleimidophenylmethane (BMI) were subsequently thermally imidized to the corresponding copolyimides. These polymers were characterized using viscometer, differential scanning calorimetry, thermogravimetric analyses, dynamic mechanical analysis (DMA), dielectric analyzer, and scanning electron microscope. The dielectric constant (D_K) and dissipation factor (D_f) of copolyimides with TAIC/BMI were much lower than that of copolyimides without TAIC/BMI. Furthermore, the formation of copolyimides also would enhance their thermal stability and solubility. DMA of copolymers showed only a glass transition temperature (T_g), indicating a random structure and an amorphous state. The morphology of copolyimides revealed no phase separation. This indicates that the homogeneous state has been achieved in this coreaction system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and properties of rigid‐rod polyimide/silica hybrid materials by sol–gel process

Polyimide (PI) materials with a low coefficient of thermal expansion (CTE) while still retaining high strength and toughness are desirable in various applications. In this study a sol–gel process was used to incorporate silica into homopolyimides and copolyimides with highly rigid structures in an attempt to pursue this aim. A number of highly rigid monomers were used, including pyromellitic dianhydride (PMDA), p‐phenylene diamine (PPA), m‐phenylene diamine (MPA), benzidine, 2,4‐diaminotoluene, and o‐toluidine. No homopolyimide flexible films were obtained. However, it was possible to obtain flexible films from the copolyimides. Therefore, a copolyimide based on PPA, MPA, and PMDA (PPA/MPA = 2/1 mol) was then chosen as the matrix to prepare the PI/silica hybrids. Flexible films were obtained when the silica content was below 40 wt %. The hybrid films possessed low in‐plane CTEs ranging from 14.9 to 31.1 ppm with the decrease of the silica content. The copolyimide film was strengthened and toughened with the introduction of an appropriate amount of silica. The thermal stability and the Young's modulus of the hybrid films increased with the increase of the silica content. The silica particle size was assessed by scanning electron microscopy and was about 100 nm for the hybrids containing 10 and 20 wt % silica and 200–500 nm for the hybrids containing 30 and 40 wt % silica. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 794–800, 2001     

Highly soluble and thermally stable copolyimides modified with trifluoromethyl and siloxane

A series of highly soluble aromatic polyimides with excellent thermal properties were fabricated by traditional two‐step polycondensation reaction of dianhydride monomer 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride) or 4,4‐(hexafluoroisopropylidene)diphthalic anhydride with diamine monomer 1,3‐bis(4‐aminophenoxy)benzene or 1,3‐bis(3‐aminopropyl) tetramethyldisiloxane in N,N‐dimethylacetylamide solvent. Results revealed that copolyimide of PI‐4 containing trifluoromethyl and tetramethyldisiloxane possessed excellent solubility and remarkable thermal properties. PI‐4 could dissolve well in common low boiling point solvents such as THF of up to 80 mg/mL and acetone of 40 mg/mL. Moreover, the 10% weight loss temperature of the PI‐4 was 539°C and the T_g value of the PI‐4 was 311°C. PI‐4 might be easily cast into flexible and tough films applied in optoelectronic devices. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41713.     

Synthesis of highly transparent and thermally stable copolyimide with fluorine-containing dianhydride and alicyclic dianhydride

The development of optical films is highly desirable for applications in flexible displayers. In this work, a copolyimide (co-PI) film with high thermal stability and high transparency was prepared by the copolymerization of 2,2′-bis(trifluoromethyl)-4,4′-diaminodiphenyl ether, cyclobutanetetracarboxylic dianhydride, and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA). The effects of aliphatic dianhydride and fluorine dianhydride monomers on the optical, thermal, and mechanical properties of the co-PIs were discussed in detail based on the experimental results and theoretical simulations. We found that the preparation of polyimide (PI) based on the combination of two dianhydrides could obtain the PI film with excellent comprehensive performance due to nonconjugated structure and strong electron-withdrawing effect. Through the structure and composition optimization, a PI film of PI-6FDA-70 with T_g of 300 °C, T_d10% more than 500 °C, the average transparency of 90% and the elongation at the breakage more than 8% was prepared. Such molecular design provides a practical approach to develop high-performance colorless PI films. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48603.     

Gas transport properties in (6FDA‐RTIL)‐(6FDA‐MDA) block copolyimides

This article reports synthesis and structure property studies of block copolyimides synthesized using diamino room temperature ionic liquids (RTIL) as diamine monomers. Specifically, polyimide oligomers of different lengths were synthesized using 2,2‐bis (3,4‐carboxylphenyl) hexafluoropropane dianhydride (6FDA) and diamino RTIL (1,3‐di(3‐aminopropyl) imidazolium bis[(trifluoromethyl) sulfonyl] imide). These oligomers were copolymerized with 6FDA and m‐phenylenediamine (MDA) using in situ polymerization to form (6FDA‐RTIL)‐(6FDA‐MDA) block copolyimides. The impact of the length and relative concentration of 6FDA‐RTIL oligomer in the copolymer on the resulting thermal, physical, and gas transport properties was monitored. As the concentration of the 6FDA‐RTIL segments increased, the backbone of the block copolyimides became more flexible resulting in a decrease in the glass transition temperature (T_g) and an increase in the density. The permeabilities of the RTIL containing copolyimides were consistently lower than those of the base polyimide, 6FDA‐MDA, with some increase in selectivities. Interestingly, the permeabilities of films produced with the low molecular weight oligomers were very different than those produced with same composition of the high molecular weight oligomers. This may be indicative of very different morphologies within these copolyimides. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43077.     

Effect of monomer composition on properties of copolyimides derived from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride/4,4′‐oxydianiline/1,3‐bis (4‐aminophenoxy)benzene

A series of uncontrolled molecular weight homopolyimides and copolyimides based on 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA)/4,4′‐oxydianiline (4,4′‐ODA)/1,3‐bis(4‐aminophenoxy)benzene (TPER) were synthesized. All the polyimides displayed excellent thermal stability and mechanical properties, as evidenced by dynamic thermogravimetric analysis and tensile properties testing. A singular glass transition temperature (T_g) was found for each composite from either differential scanning calorimetry (DSC) or dynamic mechanical analysis (DMA), but the values determined from tan δ of DMA were much different from those determined from DSC and storage modulus (E′) of DMA. The Fox equation was used to estimate the random T_g values. Some composites exhibited re‐crystallization after quenching from the melt; upon heating, multi‐melting behavior was observed after isothermal crystallization at different temperatures. The equilibrium melting temperature was estimated using the Hoffman‐Weeks method. Additionally, DMA was conducted to obtain E′ and tan δ. Optical properties were strongly dependent on the monomer composition as evidenced by UV‐visible spectra. X‐ray diffraction was used to interpret the crystal structure. All the results indicated that composites with TPER composition ≥ 70% were dominated by the TPER/s‐BPDA polyimide phase, and ≤40% by the 4,4′‐ODA/s‐BPDA polyimide phase. When the ratio between the two diamines was close to 1:1, the properties of the copolyimides were very irregular, which means a complicated internal structure. Copyright © 2011 Society of Chemical Industry     

Copolyimides from 2,3,3′,4′-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride with 4,4′-oxydianiline

A series of copolyimides were prepared via the polyamide acids (polyamic acids) from the reaction of 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) and pyromellitic dianhydride (PMDA) with 4,4′-oxydianiline (4,4′-ODA) at dianhydride molar ratios of 9:1, 7:3, 1:1, 3:7 and 1:9. Homopolymers and a 1:1 polymer blend were also prepared. Films from the 7:3, 1:1 and 3:7 molar ratio polyamide acids reacted for 5-6 h at ambient temperature were brittle, whereas films from the same polyamide acids reacted for 24-48 h at ambient temperature were fingernail creaseable. The difference was apparently due to the initial formation of incompatible block domains that underway randomization upon longer reaction time. The differential scanning calorimetric (DSC) curves of some of the brittle films quenched after heating to 400 °C had two apparent glass transition temperatures (T_gs), indicative of two block domains. The creaseable films quenched after heating to 400 °C had single T_gs. Wide-angle X-ray diffraction showed all films to be amorphous even though the initial DSC curves showed strong endothermic peaks, generally associated with crystalline melts. These strong endotherms near the T_g region were thought to be due to relaxation of regions in the highly stressed films. Films of copolyamide acids from the reaction of 1:1 molar ratios of 3,3′,4,4′-oxydiphthalic anhydride/a-BPDA and 3,3′,4,4′-biphenyltetracarboxylic dianhydride/a-BPDA with 4,4′-ODA reacted for 6 h were fingernail creaseable. The chemistry and the properties of the copolymers are compared with those of the homopolymers.     

Effects of aromatic carboxylic dianhydrides on thermomechanical properties of polybenzoxazine‐dianhydride copolymers

Enhanced thermomechanical properties of bisphenol‐A based polybenzoxazine (PBA‐a) copolymers obtained by reacting bisphenol‐A‐aniline‐type benzoxazine (BA‐a) resin with three different aromatic carboxylic dianhydrides, i.e., pyromellitic dianhydride (PMDA), 3,3′,4,4′ biphenyltetracarboxylic dianhydride (s‐BPDA), or 3,3′,4,4′ benzophenonetetracarboxylic dianhydride (BTDA) were reported. Glass transition temperature (T_g), of the copolymers was found to be in the order of PBA‐a:PMDA>PBA‐a:s‐BPDA>PBA‐a:‐BTDA. The difference in the T_g of the copolymers is related to the rigidity of the dianhydride components. Furthermore, the T_g of PBA‐a:BTDA, PBA‐a:s‐BPDA, and PBA‐a:BTDA films was observed to be significantly higher than that of the neat PBA‐a owing to the enhanced crosslink density by the dianhydride addition. This greater crosslink density results from additional ester linkage formation between the hydroxyl group of PBA‐a and the anhydride group of dianhydrides formed by thermal curing. Moreover, the copolymers exhibit enhanced thermal stability with thermal degradation temperature (T_d) ranging from 410°C to 426°C under nitrogen atmosphere. The char yield at 800°C of the copolymers was found to be remarkably greater than that of the neat PBA‐a with a value up to 60% vs. that of about 38% of the PBA‐a. Toughness of the copolymer films was greatly improved compared to that of the neat PBA‐a. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Preparation and properties of polyimide/silica hybrid composites based on polymer‐modified colloidal silica

A new type of polyimide/silica (PI/SiO₂) hybrid composite films was prepared by blending polymer‐modified colloidal silica with the semiflexible polyimide. Polyimide was solution‐imidized at higher temperature than the glass transition temperature (T_g) using 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐diaminodiphenyl ether (ODA). The morphological observation on the prepared hybrid films by scanning electron microscopy (SEM) pointed to the existence of miscible organic–inorganic phase, which resulted in improved mechanical properties compared with pure PI. The incorporation of the silica structures in the PI matrix also increased both T_g and thermal stability of the resulting films. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 2053–2061, 2006     

Syntheses and properties of polyimides derived from diamines containing 2,5‐disubstituted pyridine group

A series of novel homo‐ and copolyimides containing pyridine units were prepared from the heteroaromatic diamines, 2,5‐bis (4‐aminophenyl) pyridine and 2‐(4‐aminophenyl)‐5‐aminopyridine, with pyromelltic dianhydride (PMDA), and 3,3′, 4,4′‐biphenyl tertracarboxylic dianhydride (BPDA) via a conventional two‐step thermal imidizaton method. The poly(amic acid) precursors have inherent viscosities of 1.60–9.64 dL/g (c = 0.5 g/dL in DMAC, 30°C) and all of them can be cast and thermally converted into flexible and tough polyimide films. All of the polyimides show excellent thermal stability and mechanical properties. The polyimides have 10% weight loss temperature in the range of 548–598°C in air. The glass transition temperatures of the PMDA‐based samples are in the range of 395–438°C, while the BPDA‐based polyimides show two glass transition temperatures (T_g1 and T_g2), ranging from 268 to 353°C and from 395 to 418°C, respectively. The flexible films possess tensile modulus in the range of 3.42–6.39 GPa, strength in the range of 112–363 MPa and an elongation at break in the range of 1.2–69%. The strong reflection peaks in the wide‐angle X‐ray diffraction patterns indicate that the polyimides have a high packing density and crystallinity. The polymer films are insoluble in common organic solvents exhibiting high chemical resistance. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1844–1851, 2006     

Anisotropic dielectric properties of polyimides consisting of various molar ratios of meta to para diamine with trifluoromethyl group

A series of copolyimides based on pyromellitic dianhydride (PMDA) with various molar fractions of 4,4′‐(hexafluoro‐isopropylidene)dianiline (4,4′‐6F) and 3,3′‐(hexafluoro‐isopropylidene)dianiline (3,3′‐6F) were synthesized by a two‐step method. The five different composition copolyimides in the fozrm of {(PMDA+3,3′?6F)_m/ (PMDA+4,4′?6F)_n were mainly characterized using a dielectric analyzer (DEA) by single surface sensor (in‐plane direction) and thin film parallel plate sensor (out‐of‐plane direction) measurements. DSC, TMA, and XRD were also used to study the structure property. The increasing of molar ratio of para diamine in the copolyimide system up to 35% affected glass transition temperature, coefficient of thermal expansion, in‐plane dielectric constant and out‐of‐plane dielectric constant of copolyimides, correspondingly. The in‐plane dielectric constant was higher than that of the out‐of plane constant for our polyimide films. Anisotropy δε of the dielectric constants was 0.14 for CPI(100/o)a, 0.19 for CPI(85/15)a, 0.11 for CPI(75/25)a, and 0.05 for CPI(65/35)a. The difference in curing history also exhibited an effect on solvent diffusion behavior in our polymer system. Polymers cured at a slower curing rate had smaller CTE than that cured at a faster curing rate, as confirmed by X‐ray diffraction results. Polymers with smaller CTEs had larger dielectric constants at a slower curing rate, and vice versa. The experimental results suggested that CPI(65/35) a with smaller dielectric anisotropy could solve the crosstalk problem and provide equal electrical insulation in microelectronic devices. Therefore, a smaller and faster IC device could, it is hoped, be achieved, with smaller spacing between adjacent metal lines.     

Preparation and properties of polyimide/carbon nanotube composite films with electromagnetic wave absorption performance

The polyimide (PI)/carbon nanotube (CNT) films including 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), p-phenylenediamine (p-PDA), and CNTs were prepared, which have prominent electromagnetic (EM) wave absorption performance. Experimental analyses of the mechanical properties, thermal stabilities, coefficient of thermal expansion (CTE), the glass transition temperature (T_g), and EM parameter revealed the beneficial effects of the CNTs on the resulting composite films. In particular, when the content of CNTs is 6 wt%, the film shows the highest EM wave absorption performance, which exhibits the effective absorption bandwidth of 2.72 GHz with the matching thickness of only 2.0 mm. These results indicate that PI-based films have a certain potential application in the area of EM wave-absorbing materials.     

Incorporating bis‐benzimidazole into polyimide chains for effectively improving thermal resistance and dimensional stability

Heteroaromatic 6,6′‐bis[2‐(4‐aminobenzene)benzimidazole] and its corresponding copolyimides were synthesized to produce high temperature resistant polyimides (PIs). Due to the rigidity and aromaticity of heterocyclic bis‐benzimidazole, and the increased hydrogen bonding interactions, these PIs were found to have a high glass transition temperature (T_g) over 457 °C, which also guarantees a better dimensional stability with a coefficient of thermal expansion (CTE) lower than 10 ppm K^?1 in a wider temperature range of 50–400 °C. In addition, the PIs exhibit excellent thermal stability (5% weight loss temperature higher than 559 °C) along with outstanding mechanical properties. This study demonstrates the viability to access PIs with ultrahigh T_g and low CTE in a wider range of temperature by the incorporation of bis‐benzimidazole moieties. © 2019 Society of Chemical Industry     

Optically transparent aromatic poly(ester imide)s with low coefficients of thermal expansion. 2: Effect of the introduction of alkyl‐substituted p‐biphenylene units

A series of ester‐linked tetracarboxylic dianhydrides (TA‐X) were synthesized from trimellitic anhydride chloride and 4,4′‐biphenol analogs containing different numbers and positions of methyl substituents. Aromatic poly(ester imide)s (PEsIs) were polymerized from TA‐Xs and 2,2′‐bis(trifluoromethyl)benzidine to investigate the film properties systematically. A significant substituent effect on the target properties (T_g, optical transparency, the linear coefficient of thermal expansion (CTE) and ductility) was observed. A PEsI containing 2,2′,3,3′,5,5′‐hexamethyl‐substituted p‐biphenylene units was chemically imidized in a homogeneous state. It was highly soluble at room temperature, even in less hygroscopic non‐amide solvents such as cyclopentanone (CPN), and provided a stable CPN solution with a high solid content. The CPN‐cast PEsI film was almost colorless as suggested from the rather low yellowness index (3.2), high light transmittance at 400 nm (71.5%) and very low haze (1.15%). This PEsI film also had a high T_g (294 °C, determined by thermomechanical analysis) in addition to a low CTE (21.7 ppm K^?1), moderate film ductility and very low water uptake. A structural modification of the PEsI by copolymerization with a tetracarboxylic dianhydride with a rigid/linear structure was effective in further reducing the CTE while maintaining the other excellent target properties. Thus, some of the PEsIs developed in this work are promising candidates as novel plastic substrates for use in image display devices. © 2017 Society of Chemical Industry     

Synthesis and properties of ultralow dielectric constant porous polyimide films containing trifluoromethyl groups

In this research, a series of porous copolyimide (co‐PI) films containing trifluoromethyl group (CF₃) were facilely prepared via a phase separation process. The co‐PI were synthesized by the reaction of benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride (BTDA) with two diamines of 4,4′‐diaminodiphenyl ether (ODA) and 3‐trifluoromethyl‐4,4'‐diaminodiphenyl ether (FODA) with various molar ratios. The flexible and tough porous co‐PI films with about 300 μm thickness and 8～10 μm average diameter could be obtained by solution casting conveniently. The thermal properties of the obtained porous co‐PI films were excellent with a glass transition temperature at 270 °C ～ 280 °C and only 5% weight loss in temperature from 530 °C to 560 °C under nitrogen atmosphere. In addition, the dielectric and hydrophobic properties of porous co‐PI films were remarkably improved owing to the presence of trifluoromethyl groups (CF₃) in the polymer chains. Moreover, our synthesized porous co‐PI films also showed good mechanical properties. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44494.     

Synthesis and properties of poly(imide siloxane) block copolymers with different block lengths

Several poly(imide siloxane) block copolymers with the same bis(γ‐aminopropyl)polydimethylsiloxane (APPS) content were prepared. The polyimide hard block was composed of 4,4′‐oxydianiline and 3,3′,4,4′‐diphenylthioether dianhydride (TDPA), and the polysiloxane soft block was composed of APPS and TDPA. The length of polysiloxane soft block increased simultaneously with increasing the length of polyimide hard block. For better understanding the structure–property relations, the corresponding randomly segmented poly(imide siloxane) copolymer was also prepared. These copolymers were characterized by FT‐IR, ¹H‐NMR, dynamic mechanical thermal analysis, thermogravimetric analysis, polarized optical microscope, rheology and tensile test. Two glass transition temperatures (T_g) were found in the randomly segmented copolymer, while three T_gs were found in the block copolymers. In addition, the T_gs, storage modulus, tensile modulus, solubility, elastic recovery, surface morphology and complex viscosity of the copolymers varied regularly with increasing the lengths of both blocks. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Synthesis and properties of hydrogen‐bonded poly(amide‐imide) hybrid films

Poly(amide‐imide), PI, hybrid films are prepared by using sol–gel techniques. First, the poly(amide amic acid) with controlled block chain length of 5000 and 10,000 g/mol and uncontrolled chain length are synthesized by condensation reaction with 4,4′‐diaminodiphenyl ether (ODA), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), trimellitic anhydride chloride (TMAC) and terminated with p‐aminopropyltrimethoxysilane (APrTMOS). And then the imidization reactions of poly (amide amic acid) are proceeded to obtain the poly (amide‐imide) hybrid film. Hybrid films with 5000 g/mol block chain length possess higher storage modulus, lower glass transition temperature and damping intensity comparing to films with 10,000 g/mol block chain length. The addition of TMAC to the poly(amide‐imide) hybrids is due to the increase of toughness and intermolecular hydrogen bonding, which is the average strength of intermolecular bonding and studied by the hydrogen‐bonded fraction (f_bonded), frequency difference (Δν) and shiftment. Meanwhile, PI hybrid films containing more APrTMOS and TMAC content possess higher thermal and mechanical properties. On the other hand, hybrid films with 10,000 g/mol block chain length and more TMAC content have higher gas permeabilities than other films. The degradation temperatures of 5 wt % loss of all hybrid films are all higher than 540°C and increased as the increase of TMAC content. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Colorless polyimides with low coefficient of thermal expansion derived from alkyl‐substituted cyclobutanetetracarboxylic dianhydrides

Alkyl‐substituted cyclobutanetetracarboxylic dianhydrides (CBDAs) were synthesized by photo‐dimerization of alkyl‐substituted maleic anhydrides to obtain novel colorless polyimides (PIs). Dimethyl‐substituted CBDA (DM‐CBDA) showed much higher polymerizability with various diamines than conventional cycloaliphatic tetracarboxylic dianhydrides and led to high molecular weights of PI precursors. Polyaddition of non‐substituted CBDA and trans‐1,4‐cyclohexanediamine (t‐CHDA) was completely inhibited by salt formation in the initial reaction stage. The use of DM‐CBDA allowed the formation of a homogeneous/viscous PI precursor solution by overcoming the salt formation problem. The prominent substituent effect probably reflects how the methyl substituents of DM‐CBDA contributed to increasing the salt solubility. Some of the thermally imidized DM‐CBDA‐based systems simultaneously possessed non‐coloration, low coefficient of thermal expansion (CTE), very high T_g exceeding 300 °C and very low dielectric constant. Copolymerization was very effective for improving the solubility of DM‐CBDA‐based PIs. The copolyimide cast films prepared via chemical imidization displayed a further decreased CTE without sacrificing other target properties, suggesting that the present materials can be useful as plastic substrates in display devices. The mechanism of self‐chain orientation behavior during solution casting is also discussed. A potential application of the copolyimide systems as optical compensation film materials in liquid crystal displays is proposed. © 2013 Society of Chemical Industry .