环己二醇二缩水甘油醚/环氧树脂固化动力学

对E-44环氧树脂,1,2-环己二醇二缩水甘油醚与E-44环氧树脂的混合物,1,2-环己二醇二缩水甘油醚分别与二氨基二苯基甲烷的固化反应应用示差扫描量热仪(DSC)进行了研究。在E-44环氧树脂中加入1,2-环己二醇二缩水甘油醚后,不但对环氧树脂有较好的稀释作用,降低了环氧体系固化反应的表观活化能,增加了环氧树脂的固化反应活性和固化反应速度,还提高了环氧固化物的力学性能。测定了反应热焓,计算出固化反应的表观活化能分别为46.08 kJ/mol,39.50 kJ/mol,35.58 kJ/mol,相应的固化反应级数分别为0.86,0.84,0.83。     

Synthesis of a self‐emulsifiable waterborne epoxy curing agent based on glycidyl tertiary carboxylic ester and its cure characteristics

A novel self‐emulsifiable waterborne amine‐terminated curing agent for epoxy resin based on glycidyl tertiary carboxylic ester (GTCE) was synthesized through three steps of addition reaction, capping reaction, and salification reaction of triethylene tetramine (TETA) and liquid epoxy resin (E‐44). The curing agent with good emulsifying and curing properties was gradually obtained under condition of the molar ratio of TETA: E‐44 as 2.2: 1 at 65 °C for 4 h, 100% primary amine capped with GTCE at 70 °C for 3 h, and 20% salifiable rate with glacial acetic acid. The curing agent was characterized by Fourier transform‐infrared spectroscopy (FT‐IR). The curing behavior of the E‐44/GTCE‐TETA‐E‐44 system was studied with differential scanning calorimetry (DSC) and FT‐IR. Results showed that the optimal mass ratio for E‐44/GTCE‐TETA‐E‐44 system was 3 to 1, and the curing agent showed a relatively lower curing temperature. The cured film prepared by the self‐emulsifiable curing agent and epoxy resin under the optimal mass ratio displayed good thermal property, hardness, toughness, adhesion, and corrosion resistance. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44246.     

FTIR studies of the curing reactions of palm oil alkyd–melamine enamels

Three alkyds of high hydroxyl numbers with oil lengths of 21, 30, and 41 were prepared from crude palm oil. The excess hydroxyl groups provided good compatibility with melamine resins, and also served as sites for crosslinking reactions. They were made into baking enamels by blending with 20% of a commercial melamine resin. All of them could be cured at temperatures below 200°C although thermodecomposition might occur above 290°C. The dry‐hard time of these enamels cured at temperatures between 140–180°C ranged from 10 to 180 min. Fourier transform infrared spectroscopy could be used to follow the major curing reactions. The absorbance of ? O? H and ? N? CH₂? OCH₃ groups showed significant reduction. The changes in the absorbance of these peaks with time and temperature were investigated. The predominant reaction was identified as the formation of methylene ether linkages. However, the self‐condensation reactions of the amino resin and ester linkages did not occur to any noticeable extent. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 2309–2315, 2001     

Electron beam curing of polymer composites

Electron‐beam (E‐Beam) curing of an epoxy polymer matrix and its composite (reinforced with IM7 Carbon fibers) was studied using a cationic photoinitiator. Photoinitiator concentration, dose, and process temperature were varied to understand their influence on E‐beam curing. Optimal photoinitiator concentration was found to be 5 phr. The curing was due to a primary α reaction with a strong dependence on dose, and a secondary β reaction with a weak dependence on dose and a strong dependence on initiator concentration. The extent of cure increased rapidly with dose until 100 kGy and it approached a plateau value beyond 100 kGy. This plateau value corresponded to incomplete curing by 27% for resin and 22% for composite at a process‐temperature of 22°C. The causes for incomplete curing appear to be the secondary β reaction and diffusional limitation. Increase in process temperature resulted in higher extent of cure at a dose level. The material used in this study was also found to be thermally curable and the reaction onset temperature (measured in a DSC ramp experiment) reduced from about 150°C at 0 kGy to about 50°C at 30 kGy. This indicates that simultaneous thermal curing during E‐beam curing of resin and composite is possible. After thermal post‐curing, the T_g of the E‐beam cured resin increased from 130°C at 200 kGy to a value greater than 370°C and the modulus decreased by 10%. The service temperature and the modulus of the 100% thermally cured resin and the thermally post‐cured (after E‐Beam irradiation) resin were comparable.     

Synthesis,characterization and curing of m-diethylaminophenol-formaldehyde resin

Polycondensation of m-diethylaminophenol with formaldehyde has been studied under various reaction conditions. The resins formed are fusible and soluble in common organic solvents. All the resin samples have been characterized by spectral studies, measurement of solution viscosity, estimation of M?ⁿ and by t.g.a. The curing of selected resin samples by hexamine has been studied both by measuring percentage of cured material as a function of time at different temperatures and by differential scanning calorimetry. The d.s.c. data have been analyzed by various methods to evaluate the gross kinetic parameters of the curing reactions.     

Improving the curing process and thermal stability of phthalonitrile resin via novel mixed curing agents

High curing temperature (including post‐curing temperature) and long curing time of phthalonitrile resins make them thermally stable but difficult to process. In this paper, novel mixed curing agents (CuCl/4,4′‐diaminodiphenylsulfone (DDS) and ZnCl₂/DDS) were firstly designed for solving these problems. Bisphenol‐based phthalonitrile monomer (BP‐Ph; melting point: 228–235 °C) was synthesized and used as the curing precursor. Differential scanning calorimetry results indicated that BP‐Ph cured with CuCl/DDS and ZnCl₂/DDS exhibited curing temperatures close to the melting point of BP‐Ph with curing ending temperatures of 225.4 and 287.1 °C, respectively. Rheologic investigations demonstrated obvious curing reactions of BP‐Ph occurred with the mixed curing agents at 220 °C. Thermogravimetric analysis showed that BP‐Ph cured by CuCl/DDS or ZnCl₂/DDS maintained 95% mass at 573 or 546 °C, respectively, at a post‐curing temperature of 350 °C for 2 h. Reasonable long‐term thermo‐oxidative stability was also demonstrated. When the post‐curing temperature decreased to 290 °C, char yield at 800 °C of BP‐Ph cured by CuCl/DDS was 77.0%, suggesting the curing procedure can be milder when using mixed curing agents. © 2017 Society of Chemical Industry     

Synthesis of polylactide‐based thermoset resin and its curing kinetics

A new class of biobased thermoset resins, methacrylated four‐armed star‐shaped polylactides (M4sPLAs), was prepared. The effect of star architecture, e.g. varying arm length, on the properties of the cured products was examined. Based on differential scanning calorimetry, the non‐isothermal and isothermal curing behaviors of these M4sPLAs were investigated. Various curing kinetic parameters were obtained and elucidated using autocatalytic reaction models. Experimental results indicate that the oligomers can be crosslinked into a rigid network within a curing time varying from several minutes to more than an hour upon thermal initiation. The curing processes of M4sPLAs with varying arm length are different and complex, as indicated by the change of various kinetic parameters, reaction orders and evolutions of activation energy under the test reaction conditions. High crosslinking density is especially effective for improving the thermal stability of polylactide, but also leads to slower degradation rate and deterioration of its impact properties. Copyright © 2012 Society of Chemical Industry     

几种胺类固化剂对环氧树脂固化行为及固化物性能的影响

固化剂结构对环氧树脂的固化行为和固化物性能具有重要影响,本文研究了聚醚胺(D-230)、异佛尔酮二胺(IPDA)和3,3'-二甲基-4,4'-二氨基-二环己基甲烷(DMDC) 3种胺类固化剂与实验室自制的低翻度环氧树脂A进行固化反应.通过薪度分析、红外(FTIR)光谱分析、DSC分析等手段研究了环氧树脂与固化剂反应程度...     

Effect of microencapsulated curing agents on the curing behavior for diglycidyl ether of bisphenol A epoxy resin systems

Microcapsules containing a curing agent, 2‐phenyl imidazole (2PZ), for a diglycidyl ether of bisphenol A (DGEBA) epoxy resin were prepared by a solid‐in‐oil‐in‐water emulsion solvent evaporation technique with poly(methyl methacrylate) (PMMA) as a polymeric wall. The mean particle size of the microcapsules and the concentration of 2PZ were about 10 μm and nearly 10 wt %, respectively. The onset cure temperature and peak temperature of the DGEBA/2PZ–PMMA microcapsule system appeared to increase by nearly 30 and 10°C, respectively, versus those of the DGEBA/2PZ system because of the increased reaction energy of curing. The former could take more than 3 months at room temperature, whereas the latter was cured after only a week. The values of the reaction order (a curing kinetic parameter) for DGEBA/2PZ and DGEBA/2PZ–PMMA microcapsules were quite close, and this showed that the curing reactions of the two samples proceeded conformably. The curing mechanism was investigated, and a two‐step initiation mechanism was considered: the first was assigned to adduct formation, whereas the second was due to alkoxide‐initiated polymerization. The glass‐transition temperature of DGEBA/2PZ was 165.2°C, nearly 20°C higher than the glass‐transition temperatures of DGEBA/2PZ–PMMA microcapsules and DGEBA/2PZ/PMMA microspheres, as determined by differential scanning calorimetry measurements. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

New type of phenolic resin—The curing reaction of bisphenol A based benzoxazine with bisoxazoline and the properties of the cured resin. III. The cure reactivity of benzoxazine with a latent curing agent

The curing reaction of a bisphenol A based benzoxazine [2,2‐bis(3,4‐dihydro‐3‐phenyl‐1,3‐benzoxazine) propane (Ba)] and bisoxazoline with a latent curing agent and the properties of the cured resins were investigated. With a latent curing agent, the ring‐opening reaction of the benzoxazine ring occurred more rapidly, and then the phenolic hydroxyl group generated by the ring‐opening reaction of the benzoxazine ring also reacted with the oxazoline ring more rapidly. The cure time of molten resins from Ba and bisoxazoline with a latent curing agent was reduced, and the cure temperature was lowered, in comparison with those of resins from Ba and bisoxazoline without a latent curing agent. The melt viscosity of molten resins from Ba and bisoxazoline with a latent curing agent was kept around 50 Pa s at 80°C even after 30 min, and molten resins from Ba and bisoxazoline with a latent curing agent showed good thermal stability below 80°C. However, above 170°C, the curing reaction of Ba with bisoxazoline with a latent curing agent proceeded rapidly. Cured resins from Ba and bisoxazoline with a latent curing agent showed good heat resistance, flame resistance, mechanical properties, and electrical insulation in comparison with cured resins from Ba and bisoxazoline without a latent curing agent. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Investigations on the curing of epoxy resins with hexahydrophthalic anhydride

The bifunctional epoxides bisphenol A diglycidyl ether (BADGE) and hexahydrophthalic diglycidyl ester (HHDGE) as well as the monoepoxides phenyl glycidyl ether (PGE) and cyclohexane carboxylic acid glycidyl ester (CHGE) were cured with hexahydrophthalic anhydride (HHPA) in the presence of benzyldimethylamine (BDMA) or 1-methylimidazole (1-MI) as catalysts at 100–140°C. Investigations of the curing kinetics gave sigmoidal-shaped curves with marked induction periods. IR analysis of the cured products revealed that the propagation proceeds not only by the esterification reaction of epoxide with anhydride but also by chain anhydride formation by the reaction of carboxylate with anhydride groups. ¹³C-NMR investigations of the soluble polymers showed that most of the peaks resulting from double bonds could not be assigned to structures formed by initiation reactions that had previously been proposed for the anhydride curing of epoxides. In analogy to a postulated mechanism for the decarboxylation condensation of HHPA alone in the presence of tertiary amines, it is proposed that an isomerization product of HHPA is one of the molecules that initiate the curing reaction.     

Curing octaepoxysilsesquioxane with different curing agents

Octaepoxysilsesquioxane (POSS-Ep) was first synthesized by the hydrolysis and condensation of γ-[(2,3)-epoxypropoxy]propyltrimethoxysilicane (KH-560) with the presence of ethanol and HCl at 55°C for 72 h. Then, it was cured with 4,4′-diaminodiphenylsulfone (DDS) and methylnadic anhydride (MNA), respectively. The curing reactions between POSS-Ep and DDS or MNA were investigated by FTIR. Thermal stability of the cured nanocomposites was studied by TGA. The micromophologies of the obtained hybrids were observed by SEM. FTIR results show that POSS-Ep can be cured completely with DDS or MNA to obtain the final organic–inorganic (O–I) hybrids after the same experimental curing cycle: 120°C/2 h + 140°C/2 h + 160°C/2 h + 180°C/2 h + 200°C/2 h. TGA results show that POSS-Ep/DDS hybrid displays better thermal stability than that of POSS-Ep/MNA hybrid. Initial thermal degradation temperature (Tdi) of POSS-Ep/DDS hybrid is 420°C, 195°C higher than that of POSS-Ep/MNA (225°C). SEM images of the fracture surfaces of the hybrids suggest the cured POSS-Ep possesses good mechanical properties. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

POSS改性BMI树脂固化动力学及固化工艺研究

以双马来酰亚胺(BMI)、二烯丙基双酚A(BA)和七苯基倍半硅氧烷三硅醇(POSS-triol)为原料,采用非等温差示扫描量热(DSC)法研究了BMI/BA/POSS-triol体系的固化反应过程。运用Kissinger极值法、Crane法、Flynn-Wall-Ozawa(FWO)等转化率法和T-β(温度-升温速率)外推法确定了改性树脂体系的固化反应动力学参数和固化工艺参数。结果表明:改性树脂体系的固化反应活化能和反应级数(接近于1)均随POSS-triol用量增加而变化不大,说明POSS-triol的加入并没有明显改变BMI/BA体系的固化反应机理;改性树脂体系的凝胶温度为175.7℃,固化温度为226.9℃,后处理温度为271.7℃。     

芳基乙炔树脂的固化反应动力学及流变行为研究

通过对芳基乙炔树脂的固化动力学研究确定其适宜的固化工艺。采用DSC和流变分析得到芳基乙炔树脂的特征固化参数及其固化度与温度的关系曲线。结果表明,树脂的起始反应温度为127.1℃,反应峰值温度164.2℃,终止反应温度195.1℃。固化动力学参数为:表观活化能E=190.12kJ/mol,反应级数n=1.87,频率因子A=1.995×1019。芳基乙炔树脂的加压固化温度为110～115℃,其起始固化温度为115℃。固化工艺为:115℃/8h+120℃/8h+140℃/2h+160℃/2h+180℃/2h+200℃/2h+220℃/4h。芳基乙炔树脂凝胶前固化过程由化学反应控制,凝胶后属于扩散控制,因此在凝胶时需延长固化时间。     

桐油制备C_(21)聚酰胺环氧固化剂的性能及固化反应动力学研究

以桐油的甲醇酯交换产物桐酸甲酯和丙烯酸为原料,通过Diels-Alder加成反应合成了C21二元酸单甲酯(TMAA),桐酸甲酯和丙烯酸的加成温度为180℃,反应时间3 h,比通用C21二元酸的合成反应温度低70℃。然后用C21二元酸单甲酯和不同多元胺酰胺化制备了3种不同胺值的C21二酸聚酰胺环氧固化剂。机械性能测试显示,C21二元酸聚酰胺和双酚A环氧树脂(DGEBA)的环氧固化物和C36二聚酸聚酰胺650C的DGEBA固化物相比,具有更高的机械强度和模量。胺值为496 mg/g的C21二元酸聚酰胺与DGEBA的固化产物拉伸强度达58.63 MPa,断裂伸长率为3.27%,弹性模量达2 635.84 MPa,弯曲强度达99.9 MPa。差示扫描热分析法(DSC)测得C21二元酸聚酰胺的DGEBA固化物的玻璃化温度分别为108、109和116℃,比C36二聚酸聚酰胺的DGEBA固化物的玻璃化温度高出50℃左右。n级反应机理求取的3种固化剂与DGEBA的固化反应活化能分别为62.179、56.551和59.761 kJ/mol,比C36二聚酸聚酰胺与DGEBA的固化反应活化能高出约10 kJ/mol。固化反应动力学得出固化剂与DGEBA的凝胶温度、固化温度和后固化温度分别为40、90和150℃左右。     

烯丙基酚醛树脂固化行为的研究

利用酚醛树脂与氯丙烯反应,合成出了烯丙基酚醛树脂（APF）,并对其固化过程进行了研究。结果表明,烯丙基酚醛树脂不仅能溶于极性溶剂,还能溶于非极性溶剂,其起始固化温度为180℃,比普通的酚醛树脂高。烯丙基酚醛树脂的固化窗口为44℃,其固化是通过双键的加成反应来实现的,固化后树脂为连续相结构。     

Electron‐beam curing of bismaleimide‐reactive diluent resins

Electron‐beam (E‐beam) curing of 4,4′‐bismaleimidodiphenylmethane (BMPM)/BMI‐1,3‐tolyl/o,o′‐diallylbisphenol A (DABPA)–based bismaleimide (BMI) systems and their mixing with various reactive diluents, such as N‐vinylpyrrolidone (NVP) and styrene, were investigated to elucidate how temperature, electron‐beam dosage, and diluent concentration affect the cure extent. The effect of free‐radical initiator on the cure reactions was also studied. It was found that low‐intensity E‐beam exposures cannot cause the polymerization of BMI. High‐intensity E‐beam exposures give high reaction conversion attributed to a high temperature increase, which induced thermal curing. It was shown that the dilution and activation of NVP in BMI cause a more complete BMI cure reaction under E‐beam radiation. BMI/NVP can be initiated easily by low‐intensity E‐beam without thermal curing. FTIR studies indicate that about 70% of the reaction is complete for BMI/NVP with 200 kGy dosage exposure at 10 kGy per pass. The sample temperature only reaches about 75°C. The free‐radical initiator, dicumyl peroxide, can accelerate the reaction rate at the beginning of E‐beam exposure, but does not affect the final reaction conversion. The increase of the concentration of NVP in the BMI/NVP systems increases the reactive conversions almost linearly. © 2004 Wiley Periodicals Inc. J Appl Polym Sci 94: 2407‐2416, 2004     

聚氨酯柔性固化剂/环氧体系固化动力学及机理

通过不同升温速率下示差扫描量热分析(DSC)研究了自制的聚氨酯柔性固化剂ATPU/环氧树脂E-44体系的固化反应动力学及机理。通过Kissinger和Crane方程求解了表观活化能和反应级数等动力学参数,并运用该参数研究了固化反应速率常数、固化反应速率、固化度等的变化规律及影响因素。通过反应级数的研究证明了固化反应为一复杂反应,不同的固化交联反应同时发生,但主要进行的是伯氨基及仲氨基与环氧基之间的反应,该类反应使得体系得以固化。     

Vinyl acetate ethylene copolymer and nanosilica reinforced epoxidized natural rubber: Effects of sulfur curing systems on cure characteristics,tensile properties,thermal stability,dynamic mechanical properties and oil resistance

This study aimed at preparing nanocomposite from epoxidized natural rubber with about 40 mol% epoxidation (ENR40), vinyl acetate ethylene copolymer (VAE) contained about 70 wt% acetate groups and nanosilica (nSiO₂). Two parts by weight per hundred parts of rubber/resin of nSiO₂ were assembled to 80/20 (w/w) ENR40/VAE blend via latex blending. The resulting nanocomposite latex was coagulated before compounding with curing agents in an internal mixer. Tetrabenzylthiuram disulphide was used as a non‐carcinogenic accelerator in three sulfur vulcanization/curing systems, namely conventional (CV), semi‐efficient (semi‐EV) and efficient (EV) systems. The rubber compounds were sheeted on a two‐roll mill and press‐cured using a compression molding machine. Influence of curing systems on cure characteristics, tensile properties, thermal stability, dynamic mechanical properties and oil resistance of the nanocomposites was investigated. The results revealed that the CV system exhibited the highest crosslink density, tensile properties and storage modulus, while the EV system exhibited the longest scorch and cure time and the highest thermal stability and oil resistance. Moreover, the percentage retention of the tensile properties after thermal aging for CV system was lower than that of semi‐EV and EV systems. However, the pristine ENR40 and 80/20 (w/w) ENR40/VAE blend were also prepared for comparison. J. VINYL ADDIT. TECHNOL., 25:E28–E38, 2019. © 2018 Society of Plastics Engineers     

Study of the isothermal curing of an epoxy prepreg by near‐infrared spectroscopy

The commercial epoxy prepreg SPX 8800, containing diglycidyl ether of bisphenol A, dicyanodiamide, diuron, and reinforcing glass fibers, was isothermally cured at different temperatures from 75 to 110°C and monitored via in situ near‐infrared Fourier transform spectroscopy. Two cure conditions were investigated: curing the epoxy prepreg directly (condition 1) and curing the epoxy prepreg between two glass plates (condition 2). Under both curing conditions, the epoxy group could not reach 100% conversion with curing at low temperatures (75–80°C) for 24 h. A comparison of the changes in the epoxy, primary amine, and hydroxyl groups during the curing showed that the samples cured under condition 2 had lower initial epoxy conversion rates than those cured under condition 1 and that more primary amine–epoxy addition occurred under condition 2. In addition, the activation energy under cure condition 2 (104–97 kJ/mol) was higher than that under condition 1 (93–86 kJ/mol), but a lower glass‐transition temperature of the cured samples was observed via differential scanning calorimetry. The moisture in the prepreg was assumed to account for the different reaction kinetics observed and to have led to different reaction mechanisms. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 87: 2295–2305, 2003