Effects of SiC Nanodispersion on the Thermoelectric Properties of <Emphasis Type="Italic">p</Emphasis>-Type and <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Alloys

Polycrystalline p-type Bi_0.5Sb_1.5Te₃ and n-type Bi₂Te_2.7Se_0.3 thermoelectric (TE) alloys containing a small amount (vol.% ≤5) of SiC nanoparticles were fabricated by mechanical alloying and spark plasma sintering. It was revealed that the effects of SiC addition on TE properties can be different between p-type and n-type Bi₂Te₃-based alloys. SiC addition slightly increased the power factor of the p-type materials by decreasing both the electrical resistivity (ρ) and Seebeck coefficient (α), but decreased the power factor of n-type materials by increasing both ρ and α. Regardless of the conductivity type, the thermal conductivity was reduced by dispersing SiC nanoparticles in the Bi₂Te₃-based alloy matrix. As a result, a small amount (0.1 vol.%) of SiC addition increased the maximum dimensionless figure of merit (ZT _max) of the p-type Bi_0.5Sb_1.5Te₃ alloys from 0.88 for the SiC-free sample to 0.97 at 323 K, though no improvement in TE performance was obtained in the case of n-type Bi₂Te_2.7Se_0.3 alloys. Importantly, the SiC-dispersed alloys showed better mechanical properties, which can improve material machinability and device reliability.     

Improvement of Thermoelectric Power Factor of Hydrothermally Prepared Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Compared with its Solvothermally Prepared Counterpart

We report on the successful hydrothermal synthesis of Bi_0.5Sb_1.5Te₃, using water as the solvent. The products of the hydrothermally prepared Bi_0.5 Sb_1.5Te₃ were hexagonal platelets with edges of 200–1500 nm and thicknesses of 30–50 nm. Both the Seebeck coefficient and electrical conductivity of the hydrothermally prepared Bi_0.5Sb_1.5Te₃ were larger than those of the solvothermally prepared counterpart. Hall measurements of Bi_0.5Sb_1.5Te₃ at room temperature indicated that the charge carrier was p-type, with a carrier concentration of 9.47 × 10¹⁸ cm⁻³ and 1.42 × 10¹⁹ cm⁻³ for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively. The thermoelectric power factor at 290 K was 10.4 μW/cm K² and 2.9 μW/cm K² for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively.     

Effects of Cooling Rate on Thermoelectric Properties of <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>(Se<Subscript>0.4</Subscript>Te<Subscript>0.6</Subscript>)<Subscript>3</Subscript> Compounds

A series of Bi₂(Se_0.4Te_0.6)₃ compounds were synthesized by a rapid route of melt spinning (MS) combined with a subsequent spark plasma sintering (SPS) process. Measurements of the Seebeck coefficient, electrical conductivity, and thermal conductivity were performed over the temperature range from 300 K to 520 K. The measurement results showed that the cooling rate of melt spinning had a significant impact on the transport properties of electrons and phonons, effectively enhancing the thermoelectric properties of the compounds. The maximum ZT value reached 0.93 at 460 K for the sample prepared with the highest cooling rate, and infrared spectrum measurement results showed that the compound with lower tellurium content, Bi₂(Se_0.4Te_0.6)₃, possesses a larger optical forbidden gap (E _g) compared with the traditional n-type zone-melted material with formula Bi₂(Se_0.07Te_0.93)₃. Our work provides a new approach to develop low-tellurium-bearing Bi₂Te₃-based compounds with good thermoelectric performance.     

Response of thermoelectric parameters of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> films to secondary recrystallization

Flash evaporation is used to grow Bi_0.5Sb_1.5Te₃ films 1200 nm thick on mica substrates. The average lateral crystallite sizes in the as-grown films are ~800 nm. The (0001) plane in the crystallites is preferentially parallel to the substrate plane. After heat treatment in an argon atmosphere, the effective lateral size of crystallites in which the third-order axis is perpendicular to the substrate plane increased by a factor of 3–5. The crystallites were preferentially oriented in the substrate plane as well. The thermoelectric-power parameter of Bi_0.5Sb_1.5Te₃ films after their heat treatment in an inert environment increased approximately twofold to values close to that of the corresponding single crystals.     

Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> Superlattices Grown by Nanoalloying

In this work, Bi₂Te₃-Sb₂Te₃ superlattices were prepared by the nanoalloying approach. Very thin layers of Bi, Sb, and Te were deposited on cold substrates, rebuilding the crystal structure of V₂VI₃ compounds. Nanoalloyed super- lattices consisting of alternating Bi₂Te₃ and Sb₂Te₃ layers were grown with a thickness of 9 nm for the individual layers. The as-grown layers were annealed under different conditions to optimize the thermoelectric parameters. The obtained layers were investigated in their as-grown and annealed states using x-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive x-ray (EDX) spectroscopy, transmission electron microscopy (TEM), and electrical measurements. A lower limit of the elemental layer thickness was found to have c-orientation. Pure nanoalloyed Sb₂Te₃ layers were p-type as expected; however, it was impossible to synthesize p-type Bi₂Te₃ layers. Hence the Bi₂Te₃-Sb₂Te₃ superlattices consisting of alternating n- and p-type layers showed poor thermoelectric properties.     

Thermoelectric properties of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> ribbons prepared by melt spinning

The results of studying the thermoelectric properties of p-type Bi_0.5Sb_1.5Te₃ alloy samples prepared by melt spinning quenching are presented. The material after melt spinning is shaped as thin ribbons and has a quasi-amorphous structure. The thermoelectric properties (thermoelectric power and electrical resistance) and crystallization processes of as-prepared melt-spun ribbons are studied at 300–800 K for the first time. The stability range of the initial state, the crystallization-onset temperature, and the effect of thermal annealing on the thermoelectric-power factor of the alloy are determined.     

Features of reflection spectra of single crystals of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> solid solutions in the region of plasma effects

Reflectance spectra of single crystals of Bi₂Te₃-Sb₂Te₃ solid solutions containing 0, 10, 25, 40, 50, 60, 65, 70, 80, 90, 99.5, and 100 mol % of Sb₂Te₃ have been studied in the range of 400–4000 cm⁻¹ at the temperature T = 291 K and with orientation of the vector of the electric-field strength E perpendicular to the trigonal axis of the crystal C ₃ (E ⊥ C ₃). The shape of the spectra is characteristic of plasma reflection; the spectra include the features in the range 1250–3000 cm⁻¹ corresponding to the optical band gap E _{g opt}. The features become more pronounced as the content of Bi₂Te₃ is increased to 80 mol % in the composition of the Bi₂Te₃-Sb₂Te₃ solid solution. A further increase in the content of Sb₂Te₃ is accompanied by discontinuities in the functional dependences of the parameters characterizing the plasma oscillations of free charge carriers on the solid-solution composition and also by a sharp increase in E _{g opt}.     

Electrochemical Deposition and Characterization of Thermoelectric Ternary (Bi x Sb1?x )2Te3 and Bi2(Te1?y Se y )3 Thin Films

Thermoelectric thin films of the ternary compounds (Bi _x Sb_1?x )₂Te₃ and Bi₂(Te_1?y Se _y )₃ were synthesized using potentiostatic electrochemical deposition on gold-coated silicon substrates from aqueous acidic solutions at room temperature. The surface morphology, elemental composition, and crystal structure of the deposited films were studied and correlated with preparation conditions. The thermoelectric properties of (Bi _x Sb_1?x )₂Te₃ and Bi₂(Te_1?y Se _y )₃ films, i.e., Seebeck coefficient and electrical resistivity, were measured after transferring the films to a nonconductive epoxy support. (Bi _x Sb_1?x )₂Te₃ thin films showed p-type semiconductivity, and the highest power factor was obtained for film deposited at a relatively large negative potential with composition close to Bi_0.5Sb_1.5Te₃. In addition, Bi₂(Te_1?y Se _y )₃ thin films showed n-type semiconductivity, and the highest power factor was obtained for film deposited at a relatively small negative potential, having composition close to Bi₂Te_2.7Se_0.3. In contrast to Bi₂Te_2.7Se_0.3 thin films, an annealing treatment was required for Bi_0.5Sb_1.5Te₃ thin films to achieve the same magnitude of power factor as Bi₂Te_2.7Se_0.3. Therefore, Bi₂Te_2.7Se_0.3 thin films appear to be good candidates for multilayer preparation using electrochemical deposition, but the morphology of the films must be further improved.     

Thermoelectric Characteristics of <Emphasis Type="Italic">p</Emphasis>-Type (Bi,Sb)<Subscript>2</Subscript>Te<Subscript>3</Subscript>/(Pb,Sn)Te Functional Gradient Materials with Variation of the Segment Ratio

The p-type (Bi,Sb)₂Te₃/(Pb,Sn)Te functional gradient materials (FGMs) were fabricated by hot-pressing mechanically alloyed (Bi_0.2Sb_0.8)₂Te₃ and 0.5 at.% Na₂Te-doped (Pb_0.7Sn_0.3)Te powders together at 500°C for 1 h in vacuum. Segment ratios of (Bi,Sb)₂Te₃ to (Pb,Sn)Te were varied as 3:1, 1.3:1, and 1:1.6. A reaction layer of about 350-μm thickness was formed at the (Bi,Sb)₂Te₃/(Pb,Sn)Te FGM interface. Under temperature differences larger than 340°C applied across a specimen, superior figures of merit were predicted for the (Bi,Sb)₂Te₃/(Pb,Sn)Te FGMs to those of (Bi_0.2Sb_0.8)₂Te₃ and (Pb_0.7Sn_0.3)Te. With a temperature difference of 320°C applied across a specimen, the (Bi,Sb)₂Te₃/(Pb,Sn)Te FGMs with segment ratios of 3:1 and 1.3:1 exhibited the maximum output powers of 72.1 mW and 72.6 mW, respectively, larger than the 63.9 mW of (Bi_0.2Sb_0.8)₂Te₃ and the 26 mW of 0.5 at.% Na₂Te-doped (Pb_0.7Sn_0.3)Te.     

Effect of Deformation Temperature on Texture and Thermoelectric Properties of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Prepared by Hot-Press Deformation

The effects of deformation temperature on texture and thermoelectric properties of p-type Bi_0.5Sb_1.5Te₃ sintered materials were investigated. The sintered materials were prepared by mechanical alloying and hot-press sintering. The hot-press deformation was performed at 723 K and 823 K by applying mechanical pressure in a graphite die. Then, the materials were extruded in the direction opposite to the direction of applied pressure. X-ray diffraction and electron backscattered diffraction patterns showed that the hexagonal c-plane tended to align along the extruded direction when the samples were deformed at high temperatures. The thermoelectric power factor was increased by high-temperature hot-press deformation because of the low electrical resistivity that originated from the c-plane orientation.     

Thermoelectric Properties of Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript> and Ni<Subscript>0.06</Subscript>Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript>

Mo₃Sb₇, crystallizing in the Ir₃Ge₇ type structure, has poor thermoelectric (TE) properties due to its metallic behavior. However, by a partial Sb-Te exchange, it becomes semiconducting without noticeable structure changes and so achieves a significant enhancement in the thermopower with the composition of Mo₃Sb₅Te₂. Meanwhile, large cubic voids in the Mo₃Sb₅Te₂ crystal structure provide the possibility of filling the voids with small cations to decrease the thermal conductivity by the so-called rattling effect. As part of the effort to verify this idea, we report herein the growth as well as measurements of the thermal and electrical transport properties of Mo₃Sb_5.4Te_1.6 and Ni_0.06Mo₃Sb_5.4Te_1.6.     

Influence of Nanoinclusions on Thermoelectric Properties of <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> Nanocomposites

n-Type Bi₂Te₃ nanocomposites with enhanced figure of merit, ZT, were fabricated by a simple, high-throughput method of mixing nanostructured Bi₂Te₃ particles obtained through melt spinning with micron-sized particles. Moderately high power factors were retained, while the thermal conductivity of the nanocomposites was found to decrease with increasing weight percent of nanoinclusions. The peak ZT values for all the nanocomposites were above 1.1, and the maximum shifted to higher temperature with increasing amount of nanoinclusions. A maximum ZT of 1.18 at 42°C was obtained for the 10 wt.% nanocomposite, which is a 43% increase over the bulk sample at the same temperature. This is the highest ZT reported for n-type Bi₂Te₃ binary material, and higher ZT values are expected if state-of-the-art Bi₂Te_3−x Se _x materials are used.     

Thermal Stability of Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> in Contact with Ti and TiN

The thermal stability of a Ge₂Sb₂Te₅ chalcogenide layer in contact with titanium and titanium nitride metallic thin films has been investigated mainly using x-ray diffraction and elastic nuclear backscattering techniques. Without breaking vacuum, Ti and TiN have been deposited on Ge₂Sb₂Te₅ material using magnetron sputtering. Thermal treatments have been performed in a 10⁻⁷ mbar vacuum furnace. On annealing up to 450°C, the TiN metallic film does not interact with the chalcogenide film, but at the same time adhesion problems and instabilities in contact resistance arise. To improve the adhesion and eventually stabilize the contact resistance, an interfacial Ti layer has been considered. At 300°C, a TiTe₂ compound is formed by interacting with Te segregated from the Ge₂Sb₂Te₅ layer. At higher temperatures, the Ti layer decomposes the chalcogenide film, forming several compounds tentatively identified as GeTe, Ge₃Ti₅, Ge₅Ti₆, TiTe_2,, and Sb₂Te₃. It has been found that the properties of the Ge₂Sb₂Te₅ film can be retained by controlling the decomposition rate of the chalcogenide layer, which is achieved by providing a limited supply of Ti and/or by depositing a Te-rich Ge₂Sb₂Te₅ film.     

Effect of Composition on Thermoelectric Properties in PbTe-Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> Composites

The solidification of alloys in the Bi₂Te₃-PbTe pseudobinary system at off- and near-eutectic compositions was investigated for their microstructure and thermoelectric properties. Dendritic and lamellar structures were clearly observed due to the phase separation and the existence of a metastable ternary phase. In this system, three phases with different compositions were observed: binary Bi₂Te₃, PbTe, and metastable PbBi₂Te₄. The Seebeck coefficient, electrical resistivity, and thermal conductivity of ternary alloys as well as binary compounds were measured. The phonon thermal conductivities of Pb-Bi-Te alloys were lower than those in binary PbTe and Bi₂Te₃, which could have resulted from the increased interfacial area between phases due to the existence of the metastable ternary phase and the resultant phase separation.     

Magnetic susceptibility of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> alloys

The magnetic susceptibility of Czochralski-grown single crystals of Bi₂Te₃-Sb₂Te₃ alloys containing 0, 10, 25, 40, 50, 60, 65, 70, 80, 90, 99.5, or 100 mol % Sb₂Te₃ has been investigated. The magnetic susceptibility of these crystals was determined at the temperature T = 291 K and the magnetic field H oriented parallel (χ_‖) and perpendicularly (χ_⊥) to the trigonal crystallographic axis C ₃. A complicated concentration dependence of the anisotropy of magnetic susceptibility χ_‖/χ_⊥ has been revealed. The crystals with the free carrier concentration p ≈ 5 × 10¹⁹ cm^?3 do not exhibit anisotropy of magnetic susceptibility. The transition to the isotropic magnetic state occurs for the compositions characterized by a significantly increased (from 200 to 300 meV) optical bandgap.     

Electrical and Structural Real-Time Changes in Thin Thermoelectric (Bi<Subscript>0.15</Subscript>Sb<Subscript>0.85</Subscript>)<Subscript>2</Subscript>Te<Subscript>3</Subscript> Films by Dynamic Thermal Treatment

A recent trend in thermoelectrics is miniaturization of generators or Peltier coolers using the broad spectrum of thin-film and nanotechnologies. Power supplies for energy self-sufficient micro and sensor systems are a wide application field for such generators. It is well known that thermal treatment of as-deposited p-type (Bi_0.15Sb_0.85)₂Te₃ films leads to enhancement of their power factors. Whereas up to now only the start (as-deposited) and the end (after annealing) film stages were investigated, herein for the first time, the dynamical changes of sputter-deposited film properties have been observed by real-time measurements. The electrical conductivity shows a distinct, irreversible increase during a thermal cycle of heating to about 320°C followed by cooling to room temperature. The interpretation of the Seebeck and Hall coefficients points to an enhancement in Hall mobility after annealing. In situ x-ray diffractometry shows the generation of an additional Te phase depending on temperature. This is also confirmed by energy-dispersive x-ray microanalysis and the corresponding mapping by scanning electron microscopy. It is presumed that the Te enrichment in a separate, locally well-defined phase is the reason for the improvement in the integral film transport properties.     

Thermoelectric Properties of Spark Plasma-Sintered In<Subscript>4</Subscript>Se<Subscript>3</Subscript>-In<Subscript>4</Subscript>Te<Subscript>3</Subscript>

We report the thermoelectric properties of spark plasma-sintered In₄Se₃-In₄Te₃ materials. For comparison, pure In₄Se₃ and In₄Se₃ (80 wt.%)/In₄Te₃ (20 wt.%) mixture samples were prepared. In₄Se₃ and In₄Te₃ powders were synthesized by a conventional melting process in evacuated quartz ampoules, and a spark plasma method was used for the sintering of the pure In₄Se₃ and mixture samples. Thermoelectric and structural characterizations were carried out, and the mixing effect of In₄Se₃ and In₄Te₃ on the thermoelectric properties was investigated.     

Specific thermoelectric properties of lightly doped Bi<Subscript>2</Subscript>(TeSe)<Subscript>3</Subscript> solid solutions

Electrical and thermoelectric properties of a lightly doped n-Bi₂Te_2.7Se_0.3 solid solution have been studied in the temperature range 77–300 K. The results are compared with data for the compound PbTe_0.9Se_0.1 with a similar magnitude of the Seebeck coefficient S at 84 K. Along with lower thermal conductivity, Bi₂Te_2.7Se_0.3 has a higher electrical conductivity σ and a much weaker temperature dependence. As a result, the power coefficient S ²σ in optimal samples begins to decrease only when the density of minority carriers becomes significant. In this case, |S| considerably exceeds the standard value of 200 μV/K. The reduction of the electron density reduces the thermoelectric figure of merit Z at its maximum and slightly lowers the temperature of the maximum; therefore, the expected effect on the average value of Z in the range 77–300 K is absent. Similar behavior is observed in Bi₂Te_2.88Se_0.12, although the effect is less pronounced. The experimental results are discussed taking into account possible changes in the dominant scattering mechanisms, carrier density, and electron energy spectrum. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 38, No. 7, 2004, pp. 811–815. Original Russian Text Copyright ? 2004 by Konstantinov, Prokof’eva, Ravich, Fedorov, Kompaniets.     

Effect of Electric Current on the Performance of Bi<Subscript>1.2</Subscript>Sb<Subscript>4.8</Subscript>Te<Subscript>9</Subscript> Thermoelectric Material Prepared by a Field-Activated Pressure-Assisted Sintering Process

Field-activated pressure-assisted sintering (FAPAS) was applied to sinter Bi_1.2Sb_4.8Te₉ thermoelectric materials under different conditions, including no-current sintering (NCS), low-density current sintering (LCS), and high-density current sintering (HCS). The effect of the current density on the final thermoelectric performance of the products was investigated. Applying a higher-density electric current and shorter dwell time can improve the thermoelectric performance of the sample by increasing its electric conductivity and decreasing its thermal conductivity. The maximum figure of merit ZT values of the NCS, LCS, and HCS samples were 0.46, 0.48, and 0.57, respectively. Therefore, applying a high-density electric current in the sintering process may be an effective way to obtain Bi_1.2Sb_4.8Te₉ thermoelectric material with high ZT value.     

Preparation and Thermoelectric Properties of Nanoporous Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Alloys

n-Type nanoporous Bi₂Te₃-based thermoelectric materials with different porosity ratios have been prepared by spark plasma sintering (SPS). The microstructure and phase morphology have been analyzed by x-ray diffraction (XRD) and field-emission scanning electron microscopy (FESEM), and the thermoelectric properties of the SPS samples have been measured. Experimental results show that the nanoporous structures lying in the sheet layers and among the plate grains of the Bi₂Te₃ bulk material can lead to an increase in the Seebeck coefficient and a decrease in the thermal conductivity, thus leading to an enhanced figure of merit.