Thermoelectric Properties of Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript> and Ni<Subscript>0.06</Subscript>Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript>

Mo₃Sb₇, crystallizing in the Ir₃Ge₇ type structure, has poor thermoelectric (TE) properties due to its metallic behavior. However, by a partial Sb-Te exchange, it becomes semiconducting without noticeable structure changes and so achieves a significant enhancement in the thermopower with the composition of Mo₃Sb₅Te₂. Meanwhile, large cubic voids in the Mo₃Sb₅Te₂ crystal structure provide the possibility of filling the voids with small cations to decrease the thermal conductivity by the so-called rattling effect. As part of the effort to verify this idea, we report herein the growth as well as measurements of the thermal and electrical transport properties of Mo₃Sb_5.4Te_1.6 and Ni_0.06Mo₃Sb_5.4Te_1.6.     

Thermal Stability of Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> in Contact with Ti and TiN

The thermal stability of a Ge₂Sb₂Te₅ chalcogenide layer in contact with titanium and titanium nitride metallic thin films has been investigated mainly using x-ray diffraction and elastic nuclear backscattering techniques. Without breaking vacuum, Ti and TiN have been deposited on Ge₂Sb₂Te₅ material using magnetron sputtering. Thermal treatments have been performed in a 10⁻⁷ mbar vacuum furnace. On annealing up to 450°C, the TiN metallic film does not interact with the chalcogenide film, but at the same time adhesion problems and instabilities in contact resistance arise. To improve the adhesion and eventually stabilize the contact resistance, an interfacial Ti layer has been considered. At 300°C, a TiTe₂ compound is formed by interacting with Te segregated from the Ge₂Sb₂Te₅ layer. At higher temperatures, the Ti layer decomposes the chalcogenide film, forming several compounds tentatively identified as GeTe, Ge₃Ti₅, Ge₅Ti₆, TiTe_2,, and Sb₂Te₃. It has been found that the properties of the Ge₂Sb₂Te₅ film can be retained by controlling the decomposition rate of the chalcogenide layer, which is achieved by providing a limited supply of Ti and/or by depositing a Te-rich Ge₂Sb₂Te₅ film.     

Thermoelectric Properties of Cu-doped Bi<Subscript>0.4</Subscript>Sb<Subscript>1.6</Subscript>Te<Subscript>3</Subscript> Prepared by Hot Extrusion

Cu_0.003Bi_0.4Sb_1.6Te₃ alloys were prepared by using encapsulated melting and hot extrusion (HE). The hot-extruded specimens had the relative average density of 98%. The (00l) planes were preferentially oriented parallel to the extrusion direction, but the specimens showed low crystallographic anisotropy with low orientation factors. The specimens were hot-extruded at 698 K, and they showed excellent mechanical properties with a Vickers hardness of 76 Hv and a bending strength of 59 MPa. However, as the HE temperature increased, the mechanical properties degraded due to grain growth. The hot-extruded specimens showed positive Seebeck coefficients, indicating that the specimens have p-type conduction. These specimens exhibited negative temperature dependences of electrical conductivity, and thus behaved as degenerate semiconductors. The Seebeck coefficient reached the maximum value at 373 K and then decreased with increasing temperature due to intrinsic conduction. Cu-doped specimens exhibited high power factors due to relatively higher electrical conductivities and Seebeck coefficients than those of undoped specimens. A thermal conductivity of 1.00 Wm^?1 K^?1 was obtained at 373 K for Cu_0.003Bi_0.4Sb_1.6Te₃ hot-extruded at 723 K. A maximum dimensionless figure of merit, ZT _max = 1.05, and an average dimensionless figure of merit, ZT _ave = 0.98, were achieved at 373 K.     

Nitrogen-doped Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> films for nonvolatile memory

Nitrogen-doped Ge₂Sb₂Te₅ (GST) films for nonvolatile memories were prepared by reactive sputtering with a GST alloy target. Doped nitrogen content was determined by using x-ray photoelectron spectroscopy (XPS). The crystallization behavior of the films was investigated by analyzing x-ray diffraction (XRD) and differential scanning calorimetry (DSC). Results show that nitrogen doping increases crystallization temperature, crystallization-activation energy, and phase transformation temperature from fcc to hexagonal (hex) structure. Doped nitrogen probably exists in the grain vacancies or grain boundaries and suppresses grain growth. The electrical properties of the films were studied by analyzing the optical band gap and the dependence of the resistivity on the annealing temperature. The optical band gap of the nitrogen-doped GST film is slightly larger than that of the pure GST film. Energy band theory is used to analyze the effect of doped nitrogen on electrical properties of GST films. Studies reveal that nitrogen doping increases resistivity and produces three relatively stable resistivity states in the plot of resistivity versus annealing temperature, which makes GST-based multilevel storage possible. Current-voltage (I-V) characteristics of the devices show that nitrogen doping increases the memory’s dynamic resistance, which reduces writing current from milliampere to microampere.     

Characterization of Ge<Subscript>22</Subscript>Sb<Subscript>22</Subscript>Te<Subscript>56</Subscript> and Sb-Excess Ge<Subscript>15</Subscript>Sb<Subscript>47</Subscript>Te<Subscript>38</Subscript> Chalcogenide Thin Films for Phase-Change Memory Applications

A phase-change memory device that utilizes an antimony (Sb)-excess Ge₁₅Sb₄₇Te₃₈ chalcogenide thin film was fabricated and its electrical properties were measured and compared with a similar device that uses Ge₂₂Sb₂₂Te₅₆. The resulting electrical characteristics exhibited I _reset values of 14 mA for Ge₂₂Sb₂₂Te₅₆ and 10.6 mA for Ge₁₅Sb₄₇Te₃₈. Also, the set operation time (t _set) for the device using Ge₁₅Sb₄₇Te₃₈ films was 140 ns, which was more than twice as fast as the Ge₂₂Sb₂₂Te₅₆ device. The relationship between the microstructure and the improved electrical performance of the device was examined by means of transmission electron microscopy (TEM).     

Beneficial Effect of S-Filling on Thermoelectric Properties of S<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Co<Subscript>4</Subscript>Sb<Subscript>11.2</Subscript>Te<Subscript>0.8</Subscript> Skutterudite

In this work, Te-doped and S-filled S _x Co₄Sb_11.2Te_0.8 (x = 0.1, 0.15, 0.2, 0.25, 0.3, 0.4) skutterudite compounds have been prepared using solid state reaction and spark plasma sintering. Thermoelectric measurements of the consolidated samples were examined in a temperature range of 300–850 K, and the influences of S-addition on the thermoelectric properties of S _x Co₄Sb_11.2Te_0.8 skutterudites are systematically investigated. The results indicate that the addition of sulfur and tellurium is effective in reducing lattice thermal conductivity due to the point-defect scattering caused by tellurium substitutions and the cluster vibration brought by S-filling. The solubility of tellurium in skutterudites is enhanced with sulfur addition via charge compensation. The thermal conductivity decreases with increasing sulfur content. The highest figure of merit, ZT = 1.5, was obtained at 850 K for S_0.3Co₄Sb_11.2Te_0.8 sample, because of the low lattice thermal conductivity.     

Solid-State Synthesis of Te-Doped Mg<Subscript>2</Subscript>Si

Te-doped Mg₂Si (Mg₂Si:Te _m , m = 0, 0.01, 0.02, 0.03, 0.05) alloys were synthesized by a solid-state reaction and mechanical alloying. The electronic transport properties (Hall coefficient, carrier concentration, and mobility) and thermoelectric properties (Seebeck coefficient, electrical conductivity, thermal conductivity, and figure of merit) were examined. Mg₂Si was synthesized successfully by a solid-state reaction at 673 K for 6 h, and Te-doped Mg₂Si powders were obtained by mechanical alloying for 24 h. The alloys were fully consolidated by hot-pressing at 1073 K for 1 h. All the Mg₂Si:Te _m samples showed n-type conduction, indicating that the electrical conduction is due mainly to electrons. The electrical conductivity increased and the absolute value of the Seebeck coefficient decreased with increasing Te content, because Te doping increased the electron concentration considerably from 10¹⁶ cm⁻³ to 10¹⁸ cm⁻³. The thermal conductivity did not change significantly on Te doping, due to the much larger contribution of lattice thermal conductivity over the electronic thermal conductivity. Thermal conduction in Te-doped Mg₂Si was due primarily to lattice vibrations (phonons). The thermoelectric figure of merit of intrinsic Mg₂Si was improved by Te doping.     

Thermoelectric properties of the Mg<Subscript>2</Subscript>Ge<Subscript>0.3</Subscript>Sn<Subscript>0.7</Subscript> solid solution with <Emphasis Type="Italic">p</Emphasis>-type conductivity

The thermoelectric properties of the Mg₂Ge_0.3Sn_0.7 solid solution doped with Ga and Li are studied. The samples with a hole concentration as high as 5 × 10²⁰ cm^–3 are obtained. The temperature dependences of the thermopower, electrical conductivity, and thermal conductivity are measured in the range from room temperature to 800 K. A higher mobility of free charge carriers is observed in the samples doped with lithium than in the samples doped with gallium. The largest thermoelectric figure of merit in the samples under study amounts to 0.42 at 700 K.     

Effects of SiC Nanodispersion on the Thermoelectric Properties of <Emphasis Type="Italic">p</Emphasis>-Type and <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Alloys

Polycrystalline p-type Bi_0.5Sb_1.5Te₃ and n-type Bi₂Te_2.7Se_0.3 thermoelectric (TE) alloys containing a small amount (vol.% ≤5) of SiC nanoparticles were fabricated by mechanical alloying and spark plasma sintering. It was revealed that the effects of SiC addition on TE properties can be different between p-type and n-type Bi₂Te₃-based alloys. SiC addition slightly increased the power factor of the p-type materials by decreasing both the electrical resistivity (ρ) and Seebeck coefficient (α), but decreased the power factor of n-type materials by increasing both ρ and α. Regardless of the conductivity type, the thermal conductivity was reduced by dispersing SiC nanoparticles in the Bi₂Te₃-based alloy matrix. As a result, a small amount (0.1 vol.%) of SiC addition increased the maximum dimensionless figure of merit (ZT _max) of the p-type Bi_0.5Sb_1.5Te₃ alloys from 0.88 for the SiC-free sample to 0.97 at 323 K, though no improvement in TE performance was obtained in the case of n-type Bi₂Te_2.7Se_0.3 alloys. Importantly, the SiC-dispersed alloys showed better mechanical properties, which can improve material machinability and device reliability.     

Thermoelectric properties of Bi<Subscript>2</Subscript>Te<Subscript>2.4</Subscript>Se<Subscript>0.6</Subscript> solid solutions of different particle-size composition

The thermoelectric properties of n-type Bi₂Te_2.4Se_0.6 solid solution prepared by the vacuum hot pressing of powder mixtures with different particle sizes are investigated. The powders were prepared by the mechanical grinding of ingots and melt spinning. The microstructure and fracture pattern of a sample cleavage surface are analyzed using scanning electron microscopy and optical microscopy. The thermoelectric characteristics (the Seebeck coefficient, electrical conductivity, and thermal conductivity) are measured at room temperature and in the temperature range of 100–700 K.     

Thermoelectric Properties of the Pseudobinary Alloy (Ag<Subscript>0.365</Subscript>Sb<Subscript>0.558</Subscript>Te)<Subscript>0.975</Subscript>(GeTe)<Subscript>0.025</Subscript> Prepared by Spark Plasma Sintering

Ag-Sb-Te-Ge-based alloys have received great attention in recent years. In the present work we prepared the pseudobinary alloy (Ag_0.365Sb_0.558Te)_0.975 (GeTe)_0.025 using spark plasma sintering and evaluated its thermoelectric (TE) properties over the temperature range from 318 K to 551 K. Rietveld analysis revealed that about 1.3 at.% Ge atoms occupy the Sb sites and that the alloy exhibits the same crystal structure as AgSbTe₂. By using back-scattered electron imaging, we observed two instead of one phase in the sample. The small white AgSbTe₂ chunks embedded in the matrix can substantially scatter phonons. Compared with the transport properties of Ag_0.365Sb_0.558Te, we obtained a slightly increased Seebeck coefficient and reduced thermal conductivity without sacrificing electrical conductivity. The highest TE figure of merit, ZT, was 0.69 at 551 K, whereas that of the ternary alloy Ag_0.365Sb_0.558Te was 0.61 at the corresponding temperature, suggesting that (Ag_0.365Sb_0.558Te)_0.975(GeTe)_0.025 has the potential to improve TE performance with optimization of its chemical composition.     

Switching effects in the films based on Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript>

Experimental results on the switching effects related to the phase transitions in Ge₂Sb₂Te₅ in the presence of external voltage or laser irradiation are presented. An electron model of the reversible switching is discussed.     

Thermal Stability of Barium and Indium Double-Filled Skutterudite Ba<Subscript>0.3</Subscript>In<Subscript>0.2</Subscript>Co<Subscript>3.95</Subscript>Ni<Subscript>0.05</Subscript>Sb<Subscript>12</Subscript> Coated by SiO<Subscript>2</Subscript> Nanoparticles

Filled skutterudite thermoelectric (TE) materials have been extensively studied to search for better TE materials in the past decade. However, there is no detailed investigation about the thermal stability of filled skutterudite TE materials. The evolution of microstructure and TE properties of nanostructured skutterudite materials fabricated with Ba_0.3In_0.2Co_3.95Ni_0.05Sb₁₂/SiO₂ core–shell composite particles with 3 nm thickness shell was investigated during periodic thermal cycling from room temperature to 723 K in this work. Scanning electronic microscopy and electron probe microscopy analysis were used to investigate the microstructure and chemical composition of the nanostructured skutterudite materials. TE properties of the nanostructured skutterudite materials were measured after every 200 cycles of quenching in the temperature range from 300 K to 800 K. The results show that the microstructure and composition of Ba_0.3In_0.2Co_3.95Ni_0.05Sb₁₂/SiO₂ nanostructured skutterudite materials were more stable than those of single-phase Ba_0.3In_0.2Co_3.95Ni_0.05Sb₁₂ bulk materials. The evolution of TE properties indicates that the electrical and thermal conductivity decrease along with an increase in the Seebeck coefficient with increasing quenching up to 2000 cycles. As a result, the dimensionless TE figure of merit (ZT) of the nanostructured skutterudite materials remains almost constant. It can be concluded that these nanostructured skutterudite materials have good thermal stability and are suitable for use in solar power generation systems.     

Phase transitions in thin Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> chalcogenide films according to Raman spectroscopy data

Data on the Raman spectra of thin Ge₂Sb₂Te₅ chalcogenide semiconductor films are reported. The study is performed with the purpose of determining the temperatures of phase transitions initiated by laser radiation.     

Thermoelectric properties of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> ribbons prepared by melt spinning

The results of studying the thermoelectric properties of p-type Bi_0.5Sb_1.5Te₃ alloy samples prepared by melt spinning quenching are presented. The material after melt spinning is shaped as thin ribbons and has a quasi-amorphous structure. The thermoelectric properties (thermoelectric power and electrical resistance) and crystallization processes of as-prepared melt-spun ribbons are studied at 300–800 K for the first time. The stability range of the initial state, the crystallization-onset temperature, and the effect of thermal annealing on the thermoelectric-power factor of the alloy are determined.     

Influence of Element Substitution on Corrosion Behavior of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Compounds

Atmospheric water may condense on the surface of Bi₂Te₃-based compounds constituting the Peltier module, depending on the operating environment used. In the stage of disposal, Bi₂Te₃-based compounds may come into contact with water in waste disposal sites. There are very few publications about the influence of condensed water on Peltier modules. Bi₂Te₃-Sb₂Te₃ or Bi₂Te₃-Bi₂Se₃ pseudo binary system compounds are used as p-type material or n-type material, respectively. The lattice distortion will be induced in the crystal of Bi₂Te₃-based compounds by element substitution due to the reduction in their thermal conductivity. However, the influence of element substitution on the corrosion behavior of Bi₂Te₃-based compounds remains unclear. In this study, the influence of element substitution on the corrosion behavior of Bi₂Te₃-based compounds with practical compositions has been investigated. Bi_0.5Sb_1.5Te₃ or Bi₂Te_2.85Se_0.15 was prepared by the vertical Bridgman method. The electrochemical properties at room temperature were evaluated by cyclic voltammetry in a standard three-electrode cell. The working electrolyte was a naturally aerated 0.6 or 3.0 mass% NaCl solution. From the tendency for corrosion potential for all the samples, the corrosion sensitivity of ternary compounds was slightly higher than that of binary compounds. From the trend of current density, it was found that Bi_0.5Sb_1.5Te₃ had a corrosion resistance intermediate between Bi₂Te₃ and Sb₂Te₃. On the other hand, corrosion resistance was affected despite a small amount of Se substitution, and the corrosion resistance of Bi₂Te_2.85Se_0.15 was close to or lower than that of Bi₂Se₃. From the observation results of the corrosion products, the trends of morphology and composition of corrosion products for Bi_0.5Sb_1.5Te₃ or Bi₂Te_2.85Se_0.15 were consistent with those of Sb₂Te₃ or Bi₂Se₃, respectively. From the results of x-ray photoelectron spectroscopy for the electrolyte after testing, the possibility that a corrosion product diffuses to the environment including the salt was suggested in Bi_0.5Sb_1.5Te₃. However, the amount of dissolved corrosion product was very low, and the chemical stability of the corrosion product was not changed or improved by element substitution.     

Improvement of Thermoelectric Power Factor of Hydrothermally Prepared Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Compared with its Solvothermally Prepared Counterpart

We report on the successful hydrothermal synthesis of Bi_0.5Sb_1.5Te₃, using water as the solvent. The products of the hydrothermally prepared Bi_0.5 Sb_1.5Te₃ were hexagonal platelets with edges of 200–1500 nm and thicknesses of 30–50 nm. Both the Seebeck coefficient and electrical conductivity of the hydrothermally prepared Bi_0.5Sb_1.5Te₃ were larger than those of the solvothermally prepared counterpart. Hall measurements of Bi_0.5Sb_1.5Te₃ at room temperature indicated that the charge carrier was p-type, with a carrier concentration of 9.47 × 10¹⁸ cm⁻³ and 1.42 × 10¹⁹ cm⁻³ for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively. The thermoelectric power factor at 290 K was 10.4 μW/cm K² and 2.9 μW/cm K² for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively.     

Features of the charge-transport mechanism in layered Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> single crystals doped with chlorine and terbium

The temperature dependences (T = 5−300 K) of the resistivity in the plane of layers and in the direction perpendicular to the layers, as well as the Hall effect and the magnetoresistance (H < 80 kOe, T = 0.5−4.2 K) in Bi₂Te₃ single crystals doped with chlorine and terbium, are investigated. It is shown that the doping of Bi₂Te₃ with terbium atoms results in p-type conductivity and in increasing hole concentration. The doping of Bi₂Te₃ with chlorine atoms modifies also the character of its conductivity instead of changing only the type from p to n. In the temperature dependence of the resistivity in the direction perpendicular to layers, a portion arises with the activation conductivity caused by the hopping between localized states. The charge-transport mechanism in Bi₂Te₃ single crystals doped with chlorine is proposed.     

Thermoelectric Properties of Layer-Antiferromagnet CuCrS<Subscript>2</Subscript>

We have performed a detailed study of the electrical and thermal conductivities and thermoelectric power behavior of an antiferromagnetic-layer compound of chromium, CuCrS₂, from 15 K to 300 K. Unlike previous studies, we find noninsulating properties and sensitive dependence on the preparation method, the microstructure, and the flaky texture formed in polycrystalline samples after extended sintering at high temperatures. Flakes are found to be metallic, with strong localization effects in the conductivity on cooling to low temperatures. The antiferromagnetic transition temperature T _N (=40 K) remains essentially unaffected. The Seebeck coefficient is found to be in the range of 150 μV/K to 450 μV/K, which is exceptionally large, and becomes temperature independent at high temperatures, even for specimens with low resistivity values of 5 mΩ cm to 200 mΩ cm. We find the thermal conductivity κ to be low, viz. 5 mW/K cm to 30 mW/K cm. This can be attributed mostly to the dominance of lattice conduction over electronic conduction. The value of κ is further reduced by disorder in Cu occupancy in the quenched phase. We also observe an unusually strong dip in κ at T _N, which is probably due to strong magnetocrystalline coupling in these compounds. Finally we discuss the properties of CuCrS₂ as a heavily doped Kondo-like insulator in its paramagnetic phase. The combination of the electronic properties observed in CuCrS₂ makes it a potential candidate for various thermoelectric applications.