Growth and fabrication of a mid-wavelength infrared focal plane array based on type-II InAs/GaSb superlattices

We present the fabrication of a mid-wavelength infrared focal plane array(FPA)based on type-II InAs/GaSb strain layer superlattices(SLs).The detectors contain a 400-period 8 ML InAs/8 ML GaSb SL active layer,which is grown by solid source molecular beam epitaxy on GaSb(100)N type substrates.Lattice mismatch between the superlattices and GaSb substrate achieves 148.9 ppm.The full width at half maximum of the first order satellite peak from X-ray diffraction was 28 arcsec.Single element detectors and FPA with a 128 128 pixels were fabricated using citric acid based solution wet chemical etching.Chemical and physical passivation effectively reduces the surface leakage and this process was characterized by I–V measurement.The devices showed a 50%cut-off wavelength of 4.73 m at 77 K.The photodiode exhibited an R0A of 103cm2.The FPA was characterized with an integration time of 0.5 ms and F/2.0 optics at 77 K and the average blackbody detectivity of the detectors is 2.01 109cm Hz1=2/W.     

TV/4 dual-band HgCdTe infrared focal plane arrays with a 25-εm pitch and spatial coherence

The purpose of this paper is to present the electro-optical performances of dual-band infrared detectors operating in a fully spatially coherent mode, with a small pixel pitch. The successive steps of device fabrication are first exposed, including molecular beam epitaxy (MBE), technological processing, and readout circuit design. It is shown that very high-quality multiple layer heterostructures of HgCdTe can be grown and processed into 256×256 arrays of 25-μm pitch mesas, each mesa including two photodiodes with different cutoff wavelengths ranging in the midwave infrared (MWIR). Characterization of these focal plane arrays (FPAs) shows very good homogeneity, low defect density, and operabilities usually above 99% for both response and noise equivalent thermal difference (NETD).     

Comparison of InGaSb/InAs superlattice structures grown by MBE on GaSb, GaAs, and compliant GaAs substrates

This paper contains the characterization results for indium arsenide/indium gallium antimonide (InAs/InGaSb) superlattices (SL) that were grown by molecular beam epitaxy (MBE) on standard gallium arsenide (GaAs), standard GaSb, and compliant GaAs substrates. The atomic force microscopy (AFM) images, peak to valley (P-V) measurement, and surface roughness (RMS) measurements are reported for each sample. For the 5 μm×5 μm images, the P-V heights and RMS measurements were 37 ? and 17 ?, 12 ? and 2 ?, and 10 ? and 1.8 ? for the standard GaAs, standard GaSb, and compliant GaAs respectively. The high resolution x-ray diffraction (HRXRD) analysis found different 0^th order SL peak to GaSb peak spacings for the structures grown on the different substrates. These peak separations are consistent with different residual strain states within the SL structures. Depending on the constants used to determine the relative shift of the valance and conduction bands as a function of strain for the individual layers, the change in the InAs conduction band to InGaSb valance band spacing could range from +7 meV to −47 meV for a lattice constant of 6.1532 ?. The cutoff wavelength for the SL structure on the compliant GaAs, control GaSb, and control GaAs was 13.9 μm, 11 μm, and no significant response, respectively. This difference in cutoff wavelength corresponds to approximately a −23 meV change in the optical gap of the SL on the compliant GaAs substrate compared to the same SL on the control GaSb substrate.     

HgCdTe/Si materials for long wavelength infrared detectors

The heteroepitaxial growth of HgCdTe on large-area Si substrates is an enabling technology leading to the production of low-cost, large-format infrared focal plane arrays (FPAs). This approach will allow HgCdTe FPA technology to be scaled beyond the limitations of bulk CdZnTe substrates. We have already achieved excellent mid-wavelength infrared (MWIR) and short wavelength infrared (SWIR) detector and FPA results using HgCdTe grown on 4-in. Si substrates using molecular beam epitaxy (MBE), and this work was focused on extending these results into the long wavelength infrared (LWIR) spectral regime. A series of nine p-on-n LWIR HgCdTe double-layer heterojunction (DLHJ) detector structures were grown on 4-in. Si substrates. The HgCdTe composition uniformity was very good over the entire 4-in. wafer with a typical maximum nonuniformity of 2.2% at the very edge of the wafer; run-to-run composition reproducibility, realized with real-time feedback control using spectroscopic ellipsometry, was also very good. Both secondary ion mass spectrometry (SIMS) and Hall-effect measurements showed well-behaved doping and majority carrier properties, respectively. Preliminary detector results were promising for this initial work and good broad-band spectral response was demonstrated; 61% quantum efficiency was measured, which is very good compared to a maximum allowed value of 70% for a non-antireflection-coated Si surface. The R₀A products for HgCdTe/Si detectors in the 9.6-μm and 12-μm cutoff range were at least one order of magnitude below typical results for detectors fabricated on bulk CdZnTe substrates. This lower performance was attributed to an elevated dislocation density, which is in the mid-10⁶ cm⁻² range. The dislocation density in HgCdTe/Si needs to be reduced to <10⁶ cm⁻² to make high-performance LWIR detectors, and multiple approaches are being tried across the infrared community to achieve this result because the technological payoff is significant.     

LWIR HgCdTe on Si detector performance and analysis

We have fabricated a series of 256 pixel×256 pixel, 40 μm pitch LWIR focal plane arrays (FPAs) with HgCdTe grown on (211) silicon substrates using MBE grown CdTe and CdSeTe buffer layers. The detector arrays were fabricated using Rockwell Scientific’s double layer planar heterostructure (DLPH) diode architecture. The 78 K detector and focal plane array (FPA) performance are discussed in terms of quantum efficiency (QE), diode dark current and dark current operability. The FPA dark current and the tail in the FPA dark current operability histograms are discussed in terms of the HgCdTe epitaxial layer defect density and the dislocation density of the individual diode junctions. Individual diode zero bias impedance and reverse bias current-voltage (I-V) characteristics vs. temperature are discussed in terms of the dislocation density of the epitaxial layer, and the misfit stress in the epitaxial multilayer structure, and the thermal expansion mismatch in the composite substrate. The fundamental FPA performance limitations and possible FPA performance improvements are discussed in terms of basic device physics and material properties.     

Linear x-ray detector array made on bulk CdZnTe for 30∼100 keV energy

A CdZnTe detector grown by the high pressure Bridgman (HPB) growth technique was tested using high energy x-rays (30∼100 keV), and the performance was compared with a commercially available Nal scintillating detector of 5 cm thickness. The charge collection efficiency of a CdZnTe detector is as high as 90% at relatively low electric field, 600 V/cm. At high x-ray photon energies, the detection efficiency is reduced due to the thickness of the CdZnTe. A 32 channel linear array was fabricated on 1.2∼1.7 mm thick CdZnTe, of which the detector area was 175 × 800 μm² and the pitch size 250 μm. The measured dark current for the 16 element detector was as low as 0.1 pA at 800 V/cm with an excellent uniformity. Energy spectra were measured using a Co⁵⁷ radiation source. A small pixel effect and charge sharing were observed. The energy resolution was improved and compared with the large area detector. The array detector gave an average 5.8% full-width-half-maximum (FWHM) at 122 keV photopeak. The large area detector of the same material before fabrication exhibited a low energy tail at the photopeak, which limits the photopeak FWHM to 8%.     

Reactive Ion Etching of GaAs, GaSb, InP and InAs in Cl2／Ar Plasma

Reactive ion etching characteristics of GaAs,GaSb,InP and InAs using Cl_2/Ar plasma have been investigated,it is that,etching rates and etching profiles as functions of etching time,gas flow ratio and RF power.Etch rates of above 0.45 μm/min and 1.2 μm/min have been obtained in etching of GaAs and GaSb respectively, while very slow etch rates (<40 nm/min) were observed in etching of In-containing materials,which were linearly increased with the applied RF power.Etched surfaces have remained smooth over a wide range of plasma conditions in the etching of GaAs,InP and InAs,however,were partly blackened in etching of GaSb due to a rough appearance.     

Mid-wavelength InAs/GaSb type-Ⅱ superlattice barrier detector with nBn design and M barrier

This study reports the performance of an InAs/GaSb type-Ⅱ superlattices(T2SLs) detector with nBn structure for mid-wavelength infrared(MWIR) detection. An electronic band structure of M barrier is calculated using 8-band k·p method, and the nBn structure is designed with the M barrier. The detector is prepared by wet etching, which is simple in manufacturing process. X-ray diffraction(XRD) and atomic force microscope(AFM) characteristics indicate that the detector material has good crystal quali...     

MOCVD of bandgap-engineered HgCdTe p-n-N-P dual-band infrared detector arrays

We report the implementation of recent advances in metalorganic chemical vapor deposition (MOCVD) for in situ growth of four-layer HgCdTe mid wave/ long wave (MW/LW) simultaneous dual-band 64 × 64 infrared detector arrays. This independently accessed, simultaneous, double-heterojunction p-n-N-P dualband detector has two back-to-back stacked photodiodes grown on CdZnTe (100) substrates. The LW photodiode is a p-on-n heterojunction grown on top of an MW N-on-P heterojunction photodiode. Secondary ion mass spectrometry depth profiles of these 28 μ m thick p-n-N-P dual-band films show four well-defined regions of alloy composition and doping, and agree well with the device design. 64 × 64 arrays of dual-band detectors were fabricated from these films using electron cyclotron resonance dry etching and CdTe passivation, and hybridized to a dual-band readout chip. Two bump inter-connects in each unit cell provide independent electrical access to the back-to-back MW and LW photodiodes, and allow the MW and LW photocurrents to be separate and independent. The dualband infrared focal plane arrays (IRFPAs) spectral response data at 78K are well-behaved and are fully consistent with that observed in individual singleband LW p-on-n and MW N-on-P heterojunction devices of the same design. The hybridized 64 × 64 duai-band FPAs have MW and LW average in-band quantum efficiencies of 79 and 67%, and median D* values of 4.8 × 10¹¹ and 7.1 × 10¹⁰ cm-√Hz/W, in the respective spectral bands at 78K. The data demonstrate that MOCVD has progressed significantly toward being a practical and viable vapor phase in situ growth technology for advanced bandgap-engineered HgCdTe detector arrays.     

带有热沉结构的全镂空光读出红外焦平面阵列

A substrate-free optical readout focal plane array(FPA) operating in 8-12μm with a heat sink structure (HSS) was fabricated and its performance was tested.The temperature distribution of the FPA with an HSS investigated by using a commercial FLIR IR camera shows excellent uniformity.The thermal cross-talk effect existing in traditional substrate-free FPAs was eliminated effectively.The heat sink is fabricated successfully by electroplating copper,which provides high thermal capacity and high thermal conductivity,on the frame of substrate-free FPA. The FPA was tested in the optical-readout system,the results show that the response and NETD are 13.6 grey/K(F / # = 0.8) and 588 mK,respectively.     

Thermal lens study of the Tris(2,2’-bipyridyl)iron(Ⅱ) tetrafluoroborate

Experimental results of thermal lens measurements for Tris(2,2’-bipyridyl)iron(II) tetrafluoroborate solution are reported using the dual beam technique. The temporal evaluation of thermal lens was observed at input pump power of I=47 mW. The thermal lens effect was observed with increasing the pump power intensity as well. The evolution time of thermal lens and the fitting of the experimental transient curve were useful to evaluate the parameters of the Tris(2,2’-bipyridyl)iron(Ⅱ) tetrafluoroborate solution.     

应用于核辐射探测器的CdMnTe晶体的缺陷研究

A laser scanning confocal microscope(LSCM) and a field-emission scanning electron microscope(FESEM) were used to study the defects in CdMnTe crystals,such as twin boundaries,Te inclusions,and dislocations. Twin boundaries were usually decorated with Te inclusions,which could induce dislocations.The optical,electrical properties and detector performance of CdMnTe crystals with twins and free of twins were compared.The results showed that the wafers with a high density of twins usually had lower average IR transmittance and poorer crystalline quality.Besides,the energy spectra indicated that twin boundaries in a CdMnTe detector had a negative effect on detector performance;the values of both the energy resolution and(μτ)_e were nearly half of those for a single crystal detector.     

Imaging one-dimensional and two-dimensional planar photodiode detectors fabricated by ion milling molecular beam epitaxy CdHgTe

Imaging one-dimensional (1-D) and two-dimensional (2-D) arrays of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) planar photodiodes were fabricated by ion milling of vacancy-doped molecular beam epitaxy Cd_xHg_1−xTe layers. Sixty-four-element 1-D arrays of 26×26 μm² or 26×56 μm² diodes were processed. Zero-bias resistance-area values (R₀A) at 77 K of 4×10⁶ Θcm² at cutoff wavelength λ_CO=4.5 μm were measured, as well as high quantum efficiencies. To avoid creating a leakage current during ball bonding to the 1-D array diodes, a ZnS layer was deposited on top of the CdTe passivation layer, as well as extra electroplated Au on the bonding pads. The best measured noise equivalent temperature difference (NETD) on a LWIR array was 8 mK, with a median of 14 mK for the 42 operable diodes. The best measured NETD on a MWIR array was 18 mK. Two-D arrays showed reasonably good uniformity of R₀A and zero-bias current (I₀) values. The first 64×64 element 2-D array of 16×16 μm² MWIR diodes has been hybridized to read-out electronics and gave median NETD of 60 mK.     

HgCdTe focal plane arrays for dual-color mid- and long-wavelength infrared detection

Raytheon Vision Systems (RVS, Goleta, CA) in collaboration with HRL Laboratories (Malibu, CA) is contributing to the maturation and manufacturing readiness of third-generation, dual-color, HgCdTe infrared staring focal plane arrays (FPAs). This paper will highlight data from the routine growth and fabrication of 256×256 30-μm unit-cell staring FPAs that provide dual-color detection in the mid-wavelength infrared (MWIR) and long wavelength infrared (LWIR) spectral regions. The FPAs configured for MWIR/MWIR, MWIR/LWIR, and LWIR/LWIR detection are used for target identification, signature recognition, and clutter rejection in a wide variety of space and ground-based applications. Optimized triple-layer heterojunction (TLHJ) device designs and molecular beam epitaxy (MBE) growth using in-situ controls has contributed to individual bands in all dual-color FPA configurations exhibiting high operability (>99%) and both performance and FPA functionality comparable to state-of-the-art, single-color technology. The measured spectral cross talk from out-of-band radiation for either band is also typically less than 10%. An FPA architecture based on a single-mesa, single-indium bump, and sequential-mode operation leverages current single-color processes in production while also providing compatibility with existing second-generation technologies.     

终端式MEMS微波功率传感器的热时间常数研究

A terminating type MEMS microwave power sensor based on the Seebeck effect and compatible with the GaAs MMIC process is presented.An electrothermal model is introduced to simulate the thermal time constant. An analytical result,about 160 ms,of the thermal time constant from the non-stationary Fourier heat equations for the structure of the sensor is also given.The sensor measures the microwave power jumping from 15 to 20 dBm at a constant frequency 15 GHz,and the experimental thermal time constant result is 180 ms.The frequency is also changed from 20 to 10 GHz with a constant power 20 dBm,and the result is also 180 ms.Compared with the analytical and experimental results,the model is verified.     

Feasibility of BCB as an interlevel dielectric in integrated circuits

This paper investigates the feasibility of using an organic polymer based on benzocyclobutene as an interlevel dielectric material in very large scale integrated (VLSI) circuits. The material is a thermoset resin with attractive electrical and mechanical properties for application as an interlevel dielectric in VLSI circuits. It has a low relative dielectric constant of 2.7. The single coating planarization achieved by spin coating the material is superior to currently used materials and makes it a very attractive material for the fabrication of multilevel metal systems. The planarization properties of this material are presented and compared with those of polyimide. The patterning and dry etching of BCB to define 1 μm vias is described. As the material has limited thermal stability at temperatures greater than 350°C, compatible materials for low via resistivity have been investigated using a double level metal structure. The effect of post metal anneals on via resistivity of various via structures is presented. It is found that a low via resistivity of 3 × 10^-9 gW-cm² without any post metal anneal is obtained by using an AlCu/Pd-AlCu metallurgy.     

Terahertz Wave Polarization Beam Splitter Using Asymmetrical Coupler

This study has proposed and numerically demonstrated a compact terahertz wave polarization beam splitter. The splitter is built by using a asymmetrical directional coupler consisting of a bend waveguide and a slot bend waveguides and achieves a high extinction ratio of 24.88 dB and 16.55 dB for cross and through ports. The optimal coupling region length is found to be 26 m. By using such a polarization beam splitter, the size of the terahertz wave system could be reduced significantly. The simulation results show that the designed polarization beam splitter can split TEand TM-polarized terahertz wave into different propagation directions with high efficiency over the terahertz wave frequency range from 9.40 THz to9.65 THz. The device obtained is readily used for a polarization diversity terahertz wave integrated circuit field, particularly for platforms with slot waveguide.     

A comparative study and performance characteristics of ion-implanted and heterojunction short-wave infrared HgCdTe focal-plane arrays

Short-wave infrared (SWIR) HgCdTe focal-plane arrays (FPAs) with a cutoff wavelength of 2.5 μm have been produced using both planar ion-implanted and heterojunction-mesa device structures. The two-dimesnional FPAs are comprised of a 320×256 format with 30-μm pixel pitch and are cooled by a multistage thermo-electric (TE) cooler. Measured R₀A values of the two types of device structures show similar results below about 130 K because of the performance-limiting effect of the surface passivation of the heterojunction. However, a substantial difference is seen above 130 K and up to 300 K between the two structures types, with the heterojunction-mesa p-on-n device having an order of magnitude higher R₀A value than the planar ion-implanted n-on-p configuration. The difference in the R₀A values is reflected in the FPA images of the two different device types, where at 200 K, both FPAs display a clear picture with the n-on-p implanted device having a somewhat lesser resolution. However, no image can be seen from the planar-implanted FPA at 300 K, whereas the heterojunction-mesa FPA still exhibits a notable image at this temperature. These differences are examined and are attributed largely to higher diffusion and generation-recombination (g-r) currents that are thought to be prevalent in the ion-implanted n-on-p device structure. Yet, baking studies carried out show the ion-implanted diodes to be slightly more robust, as experiments reveal that they tend to survive a 120°C heat treatment longer than the mesa devices, which tend to degrade after a certain period of time. The nature of n-type donors in ion-implanted diodes is discussed, and a new theory based on Te antisites is proposed to explain recent experimental findings.     

Surface roughening in ion implanted 4H-silicon carbide

Silicon carbide (SiC) devices have the potential to yield new components with functional capabilities that far exceed components based on silicon devices. Selective doping of SiC by ion implantation is an important fabrication technology that must be completely understood if SiC devices are to achieve their potential. One major problem with ion implantation into SiC is the surface roughening that results from annealing SiC at the high temperatures which are needed to activate implanted acceptor ions, boron or aluminum. This paper examines the causes and possible solutions to surface roughening of implanted and annealed 4H-SiC. Samples consisting of n-type epilayers (5 × 10¹⁵ cm⁻³, 4 μm thick) on 4H-SiC substrates were implanted with B or Al to a total dose of 4 × 10¹⁴ cm⁻² or 2 × 10¹⁵ cm⁻², respectively. Roughness measurements were made using atomic force microscopy. From the variation of root mean square (rms) roughness with annealing temperature, apparent activation energies for roughening following implantation with Al and B were 1.1 and 2.2 eV, respectively, when annealed in argon. Time-dependent activation and surface morphology analyses show a sublinear dependence of implant activation on time; activation percentages after a 5 min anneal following boron implantation are about a factor of two less than after a 40 min anneal. The rms surface roughness remained relatively constant with time for anneals in argon at 1750°C. Roughness values at this temperature were approximately 8.0 nm. Annealing experiments performed in different ambients demonstrated the benefits of using silane to maintain good surface morphology. Roughnesses were 1.0 nm (rms) when boron or aluminum implants were annealed in silane at 1700°C, but were about 8 and 11 nm for B and Al, respectively, when annealed in argon at the same temperature.     

基于标准CMOS工艺用于非制冷红外探测器的低成本红外吸收结构

This paper introduces a low-cost infrared absorbing structure for an uncooled infrared detector in a standard 0.5 m CMOS technology and post-CMOS process. The infrared absorbing structure can be created by etching the surface sacrificial layer after the CMOS fabrication, without any additional lithography and deposition procedures. An uncooled infrared microbolometer is fabricated with the proposed infrared absorbing structure.The microbolometer has a size of 6565 m2and a fill factor of 37.8%. The thermal conductance of the microbolometer is calculated as 1.3310 5W/K from the measured response to different heating currents. The fabricated microbolometer is irradiated by an infrared laser, which is modulated by a mechanical chopper in a frequency range of 10–800 Hz. Measurements show that the thermal time constant is 0.995 ms and the thermal mass is 1.3210 8J/K. The responsivity of the microbolometer is about 3.03104V/W at 10 Hz and the calculated detectivity is 1.4108cm Hz1=2/W.