Deposition of Pb(Zr,Ti)O3 Thin Films by Metal-Organic Chemical Vapor Deposition Using β-diketonate Precursors at Low Temperatures

Lead zirconate titanate (PZT) thin films were deposited by metal-organic chemical vapor deposition (MOCVD) using β-diketonate precursors and 0₂ at temperatures below 500°C on variously passivated Si substrates. PZT thin films could not be deposited on bare Si substrates, owing to a serious diffusion of Pb into the Si substrate during deposition. Pt/SiO₂/Si substrates could partially block the diffusion of Pb, but a direct deposition of PZT thin films on the Pt/SiO₂/Si substrates resulted in a very inhomogeneous deposition. A TiO₂ buffer layer deposited on Pt/SiO₂/Si substrates could partially suppress the diffusion of Pb and produce homogeneous thin films. However, the crystallinity of PZT thin films deposited on the TiO₂-buffered Pt/SiO₂/Si substrate was not good enough, and the films showed random growth direction. PZT thin films deposited on the PbTiO₃-buffered Pt/SiO₂/Si substrates had good crystallinity and a- and c-axis oriented growth direction. However, the PZT thin film deposited at 350°C showed fine amorphous phases at the grain boundaries, owing to the low chemical reactivities of the constituent elements at that temperature, but they could be crystallized by rapid thermal anneaiing (RTA) at 700°C. PZT thin film deposited on a 1000-å PbTiO₃,-thin-film-buffered Pt/SiO₂/Si substrate at 350°C and rapid thermally annealed at 700°C for 6 min showed a single-phase perovskite structure with a composition near the morphotropic boundary composition.     

Effect of Orientation on the Ferroelectric Behavior of (Pb,Sr)TiO3 Thin Films

Pb_0.6Sr_0.4TiO₃ (PST) ferroelectric thin films were prepared on two different substrates by sol–gel methods. Films derived on the LaNiO(LNO)/Pt/Ti/SiO₂/Si substrates showed a strong (100) preferred orientation. The PST thin films grown on the LNO/Pt/Ti/SiO₂/Si(100) substrate showed a non-uniform rounded grain size distribution and have a larger polarization and lower coercive field E _c. The dependence of electrical properties derived on the Pt/Ti/SiO₂/Si and LNO/Pt/Ti/SiO₂/Si substrates has been studied, with a focus on the change of dielectric constant versus direct current (DC) bias field. The dielectric and ferroelectric properties of the Pb_0.6Sr_0.4TiO₃ thin films deposition on two kinds of substrates were investigated as a function of temperature, frequency and DC bias field.     

Preparation of 0.7Pb(Mg1/3Nb2/3)O3–0.3PbTiO3 Thin Films Via a Polyvinylpyrrolidone-Assisted Aqueous Sol–Gel Process and Dielectric Properties

Pb(Mg_1/3Nb_2/3)O₃–PbTiO₃ (PMN–PT) thin films were prepared by spin coating using aqueous solutions of metal salts containing polyvinylpyrrolidone, where niobium oxide layers and lead—magnesium–titanium oxide layers were laminated on Pt(111)/TiO _x /SiO₂/Si(100) substrates and fired at 750° or 800°C. 250 ± 20 nm thick 0.7PMN–0.3PT thin films of a single-phase perovskite could be prepared, and the film fired at 750°C had dielectric constants and dielectric loss of 1900 ± 350 and 0.13 ± 0.03, respectively, exhibiting polarization-electric field hysteresis with a remanent polarization of 5.1 μC/cm² and a coercive field of 21 kV/cm.     

Fabrication and Properties of Sol–Gel-Derived BiScO3–PbTiO3 Thin Films

BiScO₃–PbTiO₃ (BSPT) thin films near the morphotropic phase boundary were successfully fabricated on Pt(111)/Ti/SiO₂/Si substrates via an aqueous sol–gel method. The thin films exhibited good crystalline quality and dense, uniform microstructures with an average grain size of 50 nm. The dielectric, ferroelectric, and piezoelectric properties of the sol–gel-derived BSPT thin films were investigated. A remanent polarization of 74 μC/cm² and a coercive field of 177 kV/cm were obtained. The local effective piezoelectric coefficient d ^*₃₃ was 23 pC/N at 2 V, measured by a scanning probe microscopy system. The dielectric peak appeared at 435°C, which was 80°C higher than that of Pb(Ti, Zr)O₃ thin films.     

Titanium Diffusion into (K0.5Na0.5)NbO3 Thin Films Deposited on Pt/Ti/SiO2/Si Substrates and Corresponding Effects

Lead-free (K_0.5Na_0.5)NbO₃ (KNN) thin films were prepared on Pt/Ti/SiO₂/Si substrates by a sol–gel processing method, and titanium diffusion from the substrates into the KNN films under different thermal treatment conditions were investigated by the secondary ion mass spectroscopy depth profile and X-ray photoelectron spectroscopy surface analysis. Titanium diffusion was evident in all the KNN thin films, which was further aggravated not only by increasing the annealing temperature, but also surprisingly by higher ramping rate attributed to the resulting larger grain boundaries. The pronounced effects of the titanium diffusion and the resulting substitution of Ti⁴⁺ for Nb⁵⁺ with different valence states on the composition, structure, and electrical properties of the KNN thin films are analyzed and discussed. The results showed that the Ti diffusion from the substrate played a crucial role in affecting the structure and electrical properties of the ferroelectric KNN thin films deposited on Pt/Ti/SiO₂/Si substrate.     

Pb-Diffusion Barrier Layers for PbTiO3 Thin Films Deposited on Si Substrates by Metal Organic Chemical Vapor Deposition

The interfaces between metal organic chemical vapor deposited PbTiO₃ thin films and various diffusion barrier layers deposited on Si substrates were investigated by transmission electron microscopy. Several diffusion barrier thin films such as polycrystalline TiO₂, amorphous TiO₂, ZrO₂, and TiN were deposited between the PbTiO₃ thin film and Si substrate, because the deposition of PbTiO₃ thin films on bare Si substrates produced Pb silicate layers at the interface irrespective of the deposition conditions. The TiO₂ films were converted to PbTiO₃ by their reaction with diffused Pb and O ions during PbTiO₃ deposition at a gubstrate temperature of 410°C. Further diffusion of Pb and O induces formation of a Pb silicate layer at the interface. ZrO₂ did not seem to react with Pb and O during PbTiO₃ deposition at the same temperature, but the Pb and O ions that diffused through the ZrO₂ layer formed a Pb silicate layer between the ZrO₂ and Si substrate. The TiN films did not seem to react with Pb and O ions during the deposition of PbTiO₃ at 410°C, but reacted with PbTiO₃ to form a lead-deficient pyrochlore during postdeposition rapid thermal annealing at 700°C. However, TiN could effectively block the diffusion of Pb and O ions into the Si substrate and the formation of Pb silicate at the interface.     

Electrical and Pyroelectric Properties of Highly (001)-Oriented (Pb0.76Ca0.24)TiO3 Thin Films Grown by a Sol–Gel Process

Highly (001)-oriented (Pb_0.76Ca_0.24)TiO₃ (PCT) thin films were grown on Pt/Ti/SiO₂/Si substrates using a sol–gel process. The PCT film with a highly (001) orientation showed well-saturated hysteresis loops at an applied field of 800 kV/cm, with remanent polarization ( P _r) and coercive electric field ( E _c) values of 23.6 μC/cm² and 225 kV/cm, respectively. At 100 kHz, the dielectric constant and dielectric loss values of these films were 117 and 0.010, respectively. The leakage-current density of the PCT film was 6.15 × 10⁻⁸A/cm² at 5 V. The pyroelectric coefficient ( p ) of the PCT film was measured using a dynamic technique. At room temperature, the p values and figures-of-merit ( F _D) of the PCT film were 185 μC/m²K and 1.79 × 10⁻⁵ Pa^−0.5, respectively.     

In-Plane Polarized 0.7Pb(Mg1/3Nb2/3)O3–0.3PbTiO3 Thin Films

Ferroelectric 0.7Pb(Mg_1/3Nb_2/3)O₃–0.3PbTiO₃ (PMN-PT) thin films were deposited on ZrO₂/SiO₂/silicon substrates using a chemical-solution-deposition method. Using a thin PZT film as a seed layer for the PMN-PT films, phase-pure perovskite PMN-PT could be obtained via rapid thermal annealing at 750°C for 60 s. The electrical properties of in-plane polarized thin films were characterized using interdigitated electrode arrays on the film surface. Ferroelectric hysteresis loops are observed with much larger remanent polarizations (∼24 μC/cm²) than for through-the-thickness polarized PMN-PT thin films (10–12 μC/cm²) deposited on Pt/Ti/Si substrates. For a finger spacing of 20 μm, the piezoelectric voltage sensitivity of in–plane polarized PMN-PT thin films was ∼20 times higher than that of through-the-thickness polarized PMN-PT thin films.     

The Effect of Deposition Temperature and Postanneal on the Bi3.63Pr0.3Ti3O12 thin Films Prepared by RF-Magnetron Sputtering Method

Praseodymium doped Bi₄Ti₃O₁₂ (BTO) thin films with composition Bi_3.63Pr_0.3Ti₃O₁₂ (BPT) were successfully prepared on Pt/Ti/SiO₂/Si substrates by RF-magnetron sputtering method at substrate temperatures ranging between 500° and 750°C. The structural phase and orientation of the deposited films were investigated in order to understand the effect of the deposition temperature on the properties of the BPT films. As the substrate temperature was increased to 700°C, the films started showing a tendency of assuming a c -axis preferred orientation. At lower temperatures, however, polycrystalline films were formed. The Pt/BPT/Pt capacitor showed an interesting dependence of the remnant polarization (2 P _r) as well as dc leakage current values on the growth temperature. The film deposited at 650°C showed the largest 2 P _r of 29.6 μC/cm². With the increase of deposited temperature, the leakage current densities of films decreased at the same applied field and the film deposited at 750°C exhibited the best leakage current characteristics. In addition, the ferroelectric fatigue and Raman measurements were carried out on the as-prepared, postannealed in air and postannealed in oxygen BPT films. It was revealed that the BPT film postannealed in air exhibited the weakest fatigue-resistance characteristics and highest frequency shifted Raman vibration modes, indicating the highest oxygen vacancy concentration in this film.     

Structural Variation of the BaTi4O9 Thin Films Grown by RF Magnetron Sputtering

BaTi₄O₉ thin films were grown on a Pt/Ti/SiO₂/Si substrate using rf magnetron sputtering and the structure of the thin films were then investigated. For the films grown at low temperature (≤350°C), an amorphous phase was formed during the deposition, which then changed to the BaTi₅O₁₁ phase when the annealing was conducted below 950°C. However, when the annealing temperature was higher than 950°C, a BaTi₄O₉ phase was formed. On the contrary, for the films grown at high temperature (>450°C), small BaTi₄O₉ grains were formed during the deposition, which grew during the annealing. The homogeneous BaTi₄O₉ thin films were successfully grown on Pt/Ti/SiO₂/Si substrate when they were deposited at 550°C and subsequently rapid thermal annealed at 900°C for 3 min.     

Properties of Compositionally Graded BiScO3–PbTiO3 Thin Films Fabricated by a Sol–Gel Process

The compositionally graded BiScO₃–PbTiO₃ (BSPT) thin films were fabricated on Pt/Ti/SiO₂/Si by a sol–gel method. For the up-graded thin film, the PbTiO₃ content increased from the film–substrate interface to the surface of the film, while the down-grade thin film showed the opposite trend. The graded thin films exhibited single-phase structures and dense microstructures. The dielectric and ferroelectric properties of the thin films were investigated. The results showed that the compositionally graded BSPT thin films had similar remanent polarization value but a higher dielectric constant, dielectric tunability, and piezoelectric coefficient d ₃₃ compared with the homogeneous thin film with a composition of 0.36BiScO₃–0.64PbTiO₃ at the morphotropic phase boundary.     

Texture Control of Sol-Gel Derived Pb(Mg1/3Nb2/3)O3–PbTiO3 Thin Films Using Seeding Layer

Lead magnesium niobium titanate (PMNT) thin films with a composition near the morphotropic phase boundary were prepared on conventional Pt(111)/Ti/SiO₂/Si substrates using a modified sol-gel process. A PbO seeding layer was introduced to the interface between the PMNT layer and the substrate to enhance the [001]-preferential orientation of the PMNT film. Single-phase perovskite PMNT films with highly [001]-preferential orientation were obtained at reduced annealing temperatures compared with the PMNT films directly deposited on the same substrates. The dielectric and ferroelectric properties of the prepared PMNT films were evaluated as a function of annealing temperature.     

Influence of Crystal Structure on the Fatigue Properties of Pb1−xLax(Zry', Tiz)O3 Thin Films Prepared by Pulsed-Laser Deposition Technique

Lead lanthanum zirconate titanate (Pb_{1− x} La _x (Zr _y ,Ti _z )O₃, PLZT) films containing [00 l ] preferentially oriented grains were produced successfully on YBa₂Cu₃O_{7− x} -coated (YBCOcoated) SrTiO₃ (STO) or YBCO/CeO₂-coated silicon substrates; films containing randomly oriented grains were created on platinum-coated silicon substrates. The latter possessed significantly inferior ferroelectric properties, a fact ascribed to the presence of a paraelectric phase (TiO₂) at the PLZT/platinum interface. On the other hand, the PLZT/YBCO/STO films exhibited better electrical properties than did the PLZT/YBCO/CeO₂/Si films, and this phenomenon was attributed to better alignment of the grains in normal and in-plane orientations. In terms of fatigue properties, the [00l] textured films that were deposited on YBCO/CeO₂/Si substrates possessed substantially superior polarization-switching-cycle endurance versus the randomly oriented films grown on Pt(Ti)/Si substrates. Moreover, the tetragonal films behaved much more satisfactorily than did the rhombohedral PLZT films. The ferroelectric parameters of tetragonal PLZT films showed no significant degradation up to 10⁹ polarization switching cycles, whereas the remnant polarization and coercive force of the rhombohedral PLZT films had already degraded to 80% of their initial values after 10⁸ cycles.     

Fabrication and Characterization of Pyroelectric Ba0.8Sr0.2TiO3 Thin Films by a Sol-Gel Process

A sol-gel process was used to prepare pyroelectric Ba_0.8Sr_0.2TiO₃ thin films with large columnar grains (100–200 nm in diameter) on Pt/Ti/SiO₂/Si substrates, via using a 0.05 M solution precursor. The relationship between dielectric constant and temperature (ɛ_r- T ) showed two distinctive phase transitions in the Ba_0.8Sr_0.2TiO₃ thin films. Both the remnant polarization and the coercive field decreased as the temperature increased from −73°C to 40°C. Its low dissipation factor (tan δ= 2.6%) and high pyroelectric coefficient ( p = 4.6 × 10⁻⁴ C·(m²·K)⁻¹ at 33°C), together with its good insulating properties, made the prepared Ba_0.8Sr_0.2TiO₃ thin films promising for use in uncooled infrared detectors and thermal imaging applications.     

Ferroelectric Thin Films of Bismuth-Containing Layered Perovskites: Part I, Bi4Ti3O12

Ferroelectric thin films of bismuth-containing layered perovskite Bi₄Ti₃O₁₂ have been fabricated by a metalorganic decomposition (MOD) method. Crack-free and crystalline films of ∼5000 Å thickness have been deposited on Pt/Ti/SiO₂/Si substrates. Different heat treatments have been studied to investigate the nucleation and growth of perovskite Bi₄Ti₃O₁₂ crystallites. If the same composition and final annealing temperature are used, films with different orientations are obtained by different heating schedules. These films show a large anisotropy in ferroelectric properties. Theoretical considerations are presented to suggest that nucleation control is responsible for texture and grain-size evolution. Moreover, the origin of the ferroelectric anisotropy is rooted in the two-dimensional nature of layered polarization.     

Effects of Heating Profiles on the Orientation and Dielectric Properties of 0.5Pb(Mg1/3Nb2/3)O3-0.5PbTiO3 Thin Films by Chemical Solution Deposition

0.5Pb(Mg_1/3Nb_2/3)O₃-0.5PbTiO₃ thin films were prepared on Pt(111)/Ti/SiO₂/Si(100) substrates by varying the film formation procedures and heating processes. Depending on the multilayer film formation and appropriate heating process, the films were grown with a preferential orientation. The films showed a (100)-preferred orientation and large grain-size distribution when they were directly heat-treated after deposition of amorphous layers. The films showed a (111)-preferred orientation and small grain-size distribution when formed layer-by-layer or directly heating amorphous thin films with a perovskite seed layer. These results were explained by the effect of a seed layer. Saturation polarization of the (111)-preferred films was ∼35 µC/cm², which was somewhat higher than that of the (100)-preferred film. In contrast, the dielectric constant of the (100)-preferred film was ∼1600, which was larger than that of the (111)-preferred film.     

Effect of Low-Energy Accelerated Ion Bombardment on the Properties of Metal-Organic Decomposition Derived SrBi2(Ta,Nb)2O9 Thin Films Processed at Low Temperature

Ferroelectric SrBi₂(Ta,Nb)₂O₉ (SBTN) thin films were deposited on Pt (200 nm)/TiO _x (40 nm)/SiO₂ (100 nm)/Si substrates by metal-organic decomposition. The effects of bombardment from accelerated argon and oxygen ions on the properties of SBTN thin films were investigated. It was found that the argon ion bombardment could decrease the crystallization temperature owing to the increase of internal energy of the films. Also, the oxygen vacancies at the interface between the SBTN film and platinum bottom electrode or at grain boundaries in the film were passivated through the oxygen ion treatment, resulting in the improved electrical properties. By optimizing the process parameters and using bombardment of accelerated argon and oxygen ions, SBTN films with good ferroelectric and electrical properties could be obtained, at a temperature as low as 650°C.     

Effects of Plasma Bombardment on the Initial Growth of (Ba,Sr)TiO3 Films and Their Properties

Magnetron-sputtered (Ba,Sr)TiO₃ films were grown on Pt/SiO₂/Si and MgO substrates that were located inside and outside the plasma region. The effects of plasma bombardment on the properties of the grown films were observed. The films that were grown outside the plasma region exhibited better crystallinity, higher dielectric constants, higher electrical conductivity, and rougher surfaces than those that were grown inside the plasma region. However, plasma bombardment did not affect the initial growth of the films on Pt/SiO₂/Si or MgO substrates, as explored by atomic force microscopy. The films that were grown on Pt/SiO₂/Si showed island growth characteristics, whereas those that were grown on MgO substrates revealed layer-by-layer growth characteristics. Possible explanations for the different growth mechanisms are provided.     

Ferroelectric and Dielectric Properties of Bilayered PMN–PT/BNdT Thin Films

Bilayered thin films consisting of Pb(Mg_1/3Nb_2/3)O₃–PbTiO₃ and (Bi_3.15Nb_0.85)Ti₃O₁₂ (PMN–PT/BNdT) layers have been successfully deposited on Pt/Ti/SiO₂/Si substrate by RF sputtering. Their ferroelectric and dielectric behaviors can be tailored by varying the thicknesses of the two constituent ferroelectric layers. An enhancement in both remanent polarization and fatigue resistance is observed by increasing the layer thickness of BNdT, which also leads to an increase in coercive field. The bilayered ferroelectric thin films demonstrate electrical behaviors in association with space charge at low frequencies, which can account for the observed ferroelectric and fatigue properties, as confirmed by frequency and impedance studies.     

Fatigue-Free Lead Zirconate Titanate (Pb(Zr,Ti)O3)-Based Capacitors Co-modified by Lanthanum and Lithium for Nonvolatile Memories

Pb_0.98(La_{1− x} Li _x )_0.02(Zr_0.55Ti_0.45)O₃(PLLZT with 0.1 ≤ x ≤ 0.7) thin films were sol-gel-grown on Pt(111)/Ti/SiO₂/Si substrates, employing a thin lead zirconate titanate (PZT) template layer. Films annealed at >550°C showed a highly (111)-oriented preferential growth. Typical values of the switchable remanent polarization (2 P _r) and the coercive field ( E _c) of the PLLZT/PZT/Pt film capacitor for x = 0.3 were 50 μC/cm² and 39 kV/cm, respectively, at 5 V. All the PLLZT/PZT/Pt capacitors (for 0.1 ≤ x ≤ 0.7) exhibited fatigue-free behavior up to 6.5 × 10¹⁰ switching cycles, a quite stable charge retention profile with time, and high 2 P _rvalues, all which assure their suitability for nonvolatile ferroelectric memories.