共查询到15条相似文献,搜索用时 109 毫秒
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在流动的还原性气氛中,研究了共晶Sn3.8Ag0.7Cu焊料与不同Fe含量的Fe-Ni合金层的液固界面反应行为。结果表明:低Fe含量的Fe-83Ni镀层与共晶Sn3.8Ag0.7Cu焊料具有较快的液固界面反应速率,高Fe含量的Fe-53Ni镀层与共晶Sn3.8Ag0.7Cu焊料具有较慢的液固界面反应速率,在界面处可以观察到致密的FeSn2白色化合物层。而Fe-74Ni镀层与共晶Sn3.8Ag0.7Cu焊料的液固界面反应速率介于二者之间。当共晶Sn3.8Ag0.7Cu焊料与Fe-Ni镀层反应时,界面处生成的致密的FeSn2白色化合物,可以有效地阻止Fe-Ni镀层的快速消耗。 相似文献
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用电镀工艺制备了Fe-Ni镀层,研究了还原气氛保护下共晶Sn3.8Ag0.7Cu焊料在Fe-Ni镀层上的反应润湿行为。结果表明:在共晶Sn3.8Ag0.7Cu与Fe-74Ni反应润湿体系观察到了伪部分润湿行为。在铺展球冠的前沿,可以明显地看到有液态膜伸出主液体铺展前沿。随着回流时间的增加,液态膜逐渐长大。共晶Sn3.8Ag0.7Cu焊料与Fe-74Ni电镀合金层的液固界面生成了一层FeSn2化合物,还有大量Cu/Ni/Sn化合物进入焊料内部。 相似文献
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通过热风回流焊制备了Cu/Sn3.0Ag0.5Cu/Cu对接互连焊点,测试了未通电及6.5 A直流电下通电36 h和48 h后焊点的剪切强度.结果表明,电迁移显著地降低了焊点的剪切强度,电迁移36 h使剪切抗力降低约30%,电迁移48 h降低约50%.SEM观察断口和界面形貌表明,界面金属间化合物增厚使断裂由韧性向脆性... 相似文献
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《现代表面贴装资讯》2012,(3):12-12
根据欧盟的立法和法规,许多公司都努力在电子制造装配中放弃对卤素的使用,特别是溴化物和氟化物。最近Zestron首次就无卤焊锡膏在后续组装件清洗工艺中的影响进行了研究。本研究目的是为了找出替代性活化剂对后续清洗工艺可能造成的影响,确保在切换到无卤免洗焊锡膏后选择正, 相似文献
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焊膏印刷技术及无铅化对其的影响 总被引:2,自引:2,他引:2
伴随电子组装的高密度和元件的微小化,细间距引脚对焊膏印刷提出了更高要求。为了保证产品质量,制定合理的印刷工艺,针对焊膏印刷技术及工艺参数设定进行了探讨,提出了改进焊膏印刷技术的工艺和方法。 相似文献
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研究了Sb和稀土化合物的添加对Sn3.0Ag0.5Cu无铅焊料焊接界面金属间化合物层生长的影响。研究结果表明,固态反应阶段界面化合物层的生长快慢排序如下:v(SAC0.4Sb0.1LaB6/Cu)v(SAC0.4Sb/Cu)v(SAC0.1LaB6/Cu)v(SAC/Cu)。计算各种界面IMC生长的激活能Q结果表明,Sn3.0Ag0.5Cu/Cu界面IMC生长的激活能最高,为92.789 kJ,其他焊料合金Sn3.0Ag0.5Cu0.4Sb0.1LaB6/Cu,Sn3.0Ag0.5Cu0.1LaB6/Cu和Sn3.0Ag0.5Cu0.4Sb/Cu界面IMC生长的激活能分别为85.14,84.91和75.57 kJ。在老化温度范围内(≤190℃),Sn3.0Ag0.5Cu0.4Sb0.1LaB6/Cu的扩散系数(D)最小,因而其界面化合物的生长速率最慢。 相似文献
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J. G. Maveety P. Liu J. Vijayen F. Hua E. A. Sanchez 《Journal of Electronic Materials》2004,33(11):1355-1362
The microstructure and shear strength characteristics of pure Sn and the eutectic compositions of Sn-37Pb, Sn-0.7Cu, and Sn-3.5Ag
prepared under identical reflow conditions but subjected to two different cooling conditions were evaluated at room temperature.
For the four solders, the ultimate shear strength increased with increasing strain rate from 10−5 s−1 to 10−1 s−1. Decreasing the cooling rate tended to decrease the ultimate shear strength for both the Sn-0.7Cu and Sn-3.5Ag solders. The
effects of work hardening resulting from increased strain rate were more prevalent in quench-cooled (QC) samples. 相似文献
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The solid-state, cross-interaction between the Ni layer on the component side and the Cu pad on the printed circuit board
(PCB) side in ball grid array (BGA) solder joints was investigated by employing Ni(15 μm)/Sn(65 μm)/Cu ternary diffusion couples. The ternary diffusion couples were prepared by sequentially electroplating Sn and Ni on a
Cu foil and were aged isothermally at 150, 180, and 200°C. The growth of the intermetallic compound (IMC) layer on the Ni
side was coupled with that on the Cu side by the mass flux across the Sn layer that was caused by the difference in the Ni
content between the (Cu1−x
Ni
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)6Sn5 layer on the Ni side and the (Cu1−y
Ni
y
)6Sn5 layer on the Cu side. As the consequence of the coupling, the growth rate of the (Cu1−x
Ni
x
)6 Sn5 layer on the Ni side was rapidly accelerated by decreasing Sn layer thickness and increasing aging temperature. Owing to
the cross-interaction with the top Ni layer, the growth rate of the (Cu1−y
Ni
y
)6Sn5 layer on the Cu side was accelerated at 150°C and 180°C but was retarded at 200°C, while the growth rate of the Cu3Sn layer was always retarded. The growth kinetic model proposed in an attempt to interpret the experimental results was able
to reproduce qualitatively all of the important experimental observations pertaining to the growth of the IMC layers in the
Ni/Sn/Cu diffusion couple. 相似文献