接触角的图像处理与检测

介绍了接触角法测定表面洁净度的基本原理,并针对表面液滴图像的特点,采用图像处理技术测量表面接触角.首先利用中值滤波算法对图像进行预处理;然后利用边缘检测和轮廓跟踪等算法提取液滴的边界曲线;最后采用以多项式作为基函数的最小二乘拟合算法拟合液滴边界曲线,继而求导得到接触角.结果表明,当选用四阶或五阶多项式为拟合函数,拟合采...     

基于聚酰亚胺介质的单平面微液滴驱动芯片

根据介电润湿(EWOD)原理,建立了电润湿力与驱动电压的关系,提出一种基于聚酰亚胺介质的单平面微液滴驱动芯片设计方案。该芯片利用MEMS技术在铬版玻璃上分别制作出金属微电极阵列和聚酰亚胺介质膜,再使用聚四氟乙烯分散液进行疏水处理,通过在电极阵列和微液滴之间直接施加电压以实现微液滴的驱动。对单平面微液滴驱动芯片的液滴介电润湿效应进行了仿真分析,结果表明仅使用疏水层便可观察到明显的介电润湿现象,接触角测量值与理论值吻合较好。使用该驱动芯片成功实现了微液滴的稳定传输,传输速度达到3.31 mm/s左右,并在实验基础上分析了传输速度与驱动电压幅值和频率的关系。     

基于改进等效电容模型的数字微流控液滴定位反馈系统

基于介电润湿(EWOD)效应的数字微流控技术是近十年来出现的一种能够在平面上操控体积为微升、纳升级别液滴的新技术。为了满足对数字微流控中液滴精准驱动与控制的迫切需求,结合现有的液滴定位方法的研究,设计了改进的等效电容模型,该模型方法在无输入参数下实现多液滴的定位。基于该液滴定位模型,提出了驱动参数的反馈优先级调整策略,最终实现了一套具备驱动、定位及反馈一体的数字微流控控制系统。实验结果表明提出的方案有利于提高微液滴的连续输运的成功率,在同样的芯片参数结构下,成功率提高了接近40%,对数字微流控系统进一步的应用研究具有一定指导意义。     

基于介电润湿效应的微液滴操控

基于介电润湿的微液滴操控已被众多学者实现,但微液滴接触角在饱和阶段随电压变化的数学关系仍未得到较好解决,为此,基于能量最小化原理对Young-Lippmann方程进行了补充和改进.结合理论计算和数值仿真设计了一种叉齿状驱动电极单元数字微流控芯片,并加工出介电层分别为SiO2及SiO2-Si3N4-SiO2两种结构的芯片.实验结果表明,在接触角饱和阶段,所改进的Young-Lippmann方程能在一定程度上反映微液滴接触角的变化趋势.此外,SiO2-Si3N4-SiO2复合介电层结构中的微液滴操控电压低于SiO2单一介电层中微液滴操控电压.     

非球面液滴微透镜的轮廓测量方法

对液滴透镜面形的精确测量是用液滴法制作非球面液滴透镜的关键问题之一。提出了一种基于数字图像处理的测量非球面液滴微透镜轮廓的方法,利用光学成像系统将非球面液滴透镜的轮廓成像在CCD接收面上,通过图像采集卡读入计算机,并经图像处理得出透镜面形表达式,以便研究液滴微透镜在不同电场强度下轮廓的变化规律。图像处理的主要步骤包括：对特定区域采取平滑预处理,去除噪声;利用阈值法将灰度图二值化;对二值化后的图像进行轮廓检测;提出了一种简单有效的方法矫正图像的水平偏转;对矫正过后的液滴轮廓的数据进行多项式拟合,分析液滴透镜在不同电压下的各个拟合参数的变化。实验证明：这种方法用于测量非球面液滴微透镜简单、有效,解决了非球面微透镜制作过程中的液滴轮廓的实时测量问题,有助于低像差非球面液滴微透镜的研制。     

基于介电润湿的微流控液滴定位与反馈系统研究

基于介电润湿效应的数字微流控技术是近年来出现的一种能够在平面上操控体积为微升、纳升级别液滴的新技术。针对目前对微流控精准驱动与控制的迫切需求,从介电润湿驱动机理分析入手,开展微量液滴驱动理论研究,设计实现了一款低电压驱动微流控芯片。同时通过建立液滴模型与分析液滴连续运动的特性,提出一个改进的芯片-液滴等效电容系统模型。根据这个模型,设计一套高智能化和精确度的液滴运动定位反馈系统。液滴移动实验表明设计的液滴定位反馈系统能精确地定位液滴当前的运动位置与状态。实时地把定位信息准确地反馈到驱动系统,提高了液滴移动的连续性和液滴移动速度。     

用于微流控芯片系统的超疏水表面的制备

为了分析超疏水表面的物理特性及应用前景,介绍了粗糙超疏水表面的两种理论模型,提出了一种基于MEMS加工技术的超疏水表面制备工艺,即利用ICP刻蚀工艺制备规则的硅方柱,并用旋转涂覆TeflonAF1600作为疏水薄膜,制备了疏水特性可控的硅表面。对接触角进行了测量,结果表明,在平整Teflon薄膜表面上,去离子水液滴的本征接触角约为117°,在边长间距比为10μm/35μm的方柱表面上的去离子水液滴显现接触角可达170°。另处,还给出了为避免Wenzel液滴出现的“安全”设计参数(方柱间距边长比小于2.5),以及一种基于润湿性梯度的微流体操控方案。     

基于介电润湿的数字微流控系统液滴精准生成与分裂

基于介电润湿(EWOD)效应的数字微流控(DMF)系统能实现微升级别的多个液滴移动、分裂、合成等操作.针对目前基于EWOD的DMF系统液滴生成和分裂精度不高、效率低、难以精准控制的问题,在传统的电极设计基础上,设计了一种可以实现液滴精准生成和分裂的混合型驱动电极的EWOD芯片,并且研制了能与设计芯片匹配的驱动控制系统....     

一种测量微液滴电湿效应的新方法

基于特定的“导电基片/绝缘膜层”电湿效应模 型,提出了一种新颖的接触角测量方法。用平板电极代 替传统针状电极并改传统侧面拍摄为垂直拍摄,搭建了基于新方法的实验装置。本文装置包 括显微拍摄系统、 微液滴测试盒、反射光源和透射光源。提取了不同电压下的一系列圆环轮廓图,测量了圆环 的内外径,结 合内外径差与接触角的关系,得到了接触角随电压变化的关系曲线,获得了与理论值一致的 微液滴电湿效应变化规律。与传统方法相比,本文方法操作简便,精度高。     

三种保偏光纤几何参数测量算法

介绍了利用光纤端面图像采集和图像处理技术进行熊猫型保偏光纤几何参数测量的方法,重点介绍了三种图像处理算法——基于灰度分割和直方图分布的算法、基于Canny边缘检测和改进Hough变换的算法、基于Canny边缘检测和圆边界点选取的算法及其实现。利用三种方法对不同的光纤端面图像进行了处理,并对处理结果进行了对比分析。结果显示:三种算法均可用于熊猫型保偏光纤几何参数测量,针对不同的光纤端面图像选择合适的处理算法,可以实现快速、准确的测量。通过提高端面图像的分辨率,可以提高保偏光纤几何参数测量精度,基于该方法开发的自动化测量系统已成功应用于保偏光纤的质量与一致性实验。     

Measurement of Surface Tension of Epoxy Resins Used in Dispensing Process for Manufacturing Thin Film Transistor-Liquid Crystal Displays

This paper presents an inverse method for measuring the surface tension of the epoxy resins used in the dispensing process for manufacturing TFT-LCD based on droplet images. A direct method, which is capable of predicting the profile of an axisymmetric liquid droplet, is developed, and then the direct method is incorporated with a droplet imaging system to build up a measurement system for determination of the surface tension of the epoxy resins. When applying the surface tension measurement method, one only needs to give the density of the liquid and identify the geometric parameters of the liquid droplet, such as the droplet volume and the contact angle, through the imaging system. This approach has been used to determine surface tension of various epoxy resins. Finally, for testing the accuracy of the approach, some commonly used fluids are tested. Results show that the approach leads to satisfactory accuracy.     

Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques

Quality inspection of deposited solder pastes is critical in surface mounting processes. As surface-mount technology (SMT) component pitches decrease, three-dimensional (3-D) measurement of solder pastes has become more and more important in ensuring solder joint reliability. Currently, the 3-D measurements for solder pastes are mainly performed by laser-based systems. However, they suffer from low inspection speed due to the physical line-scanning process. In this paper, a fast and cost-effective 3-D measurement system for deposited solder pastes is proposed. The proposed system uses a liquid crystal display (LCD)-based phase shifting technique to perform full-field 3-D measurement of solder pastes with high accuracy. Experiments have shown that the 3-D profiling and volume measurement of solder pastes are very efficient and effective with the proposed system. The volume measurement repeatability is in the micrometer range. The processing time of the proposed 3-D measurement system for an image of 640/spl times/480 pixels is less than 1 s on a typical personal computer.     

A dynamic model for predicting the motion of solder droplets during assembly

The dynamic motion of a solder droplet during assembly is a complex, unsteady, free surface problem involving surface tension and viscous effects. The motion of the droplet is coupled with the motion of the component or chip to be assembled and involves dynamic contact lines. A methodology based on a non-uniform rational b-spline (NURBS) discretization has been developed for the dynamic analysis of the droplet motion. A surface energy based formulation has been developed to incorporate the surface tension effects. The developed methodology leads to an updated Lagrangian scheme with a Galerkin in space and Least square in time formulation. The NURBS representation used for the spatial discretization enables the method to handle problems involving complex droplet geometries. The ability of the NURBS representation to provide both global and local control, along with the least square method used in this methodology, enables us to develop an unconditionally stable time integration scheme which can be optimized to achieve desired accuracy and numerical dissipation efficiently. A sample problem of droplet shape evolution has been solved to demonstrate the path prediction capability of the proposed methodology. In future, the method can be applied to solve various real world dynamic motion problems associated with droplets.     

空间高分辨率光学系统几何畸变标定技术

遥感相机光学系统畸变系数作为影响相机在轨成像质量的关键因素,其检测精度一直以来都是遥感相机研制过程中的核心环节。传统的测角法主要依靠高精度二维转台,实现了光学系统视场角与像高之间的精准对应,该方法对测试设备和测试环境要求苛刻。随着相机焦距、口径和体积的增大,对于转台设备的尺寸与测量精度也日渐提升,单纯依靠提升测试设备性能无法满足后续各类高性能遥感相机的研制需求,尤其对于垂直装调类超大口径空间高分辨率光学系统,该方法不可行。在传统精密测角法的基础上,提出一种基于干涉原理的空间高分辨率光学系统几何畸变标定技术,相比于传统的精密测角法,该方法在同等测试精度的基础上,具备更广泛的适用性,其不再受限于测试设备的尺寸与精度限制,可同时满足各种类型遥感相机的畸变测试需求。文中详细介绍了该畸变测试方的基本原理、测试方法与误差链路,并对该畸变测试方法进行了应用验证,将结果与传统畸变测试方法进行对照,表明该方法的测试精度满足遥感相机的研制要求且适用范围更广,对航天长焦距大口径遥感相机研制及畸变测试有参考借鉴意义。     

Enhanced solder joint bonding strength of electronic packaging with electrowetting effect

This paper reports a novel method to enhance solder ball or solder ring bonding strength by using electrowetting-on-dielectric (EWOD) effect. With a low melting point, the metal Sn has been widely used in electronic packaging technology. Since Sn will be molten into liquid when the temperature is increased above the melting point, the method for treating liquid can be herein employed. Contact angle of the molten Pb-free balls or ring structure on silicon substrate have been experimentally changed by applying electric field across the thin dielectric film between the molten solder and the conductive silicon substrate. The contact area between the solder and the substrate is enlarged due to the decrease of the contact angle. Our testing results on the EWOD enhanced packaging structures of solder balls, flip-chip and solder ring hermetic package generally show about 50% enhancement in bonding shear strength. The significantly enhanced solder link bonding strength is hopeful for improving packaging reliability and is promising to be used in high performance silicon based electronic or microelectromechanic SiP (system in package) technologies.     

片式元件SMT焊点三维形态计算与试验测量

由于ＳＭＴ中焊点形态影响焊点质量和可靠性，国外对ＳＭＴ焊点形态的预测和控制研究有所重视。文中用有限元方法对ＲＣ３２１６片式元件焊点三维形态进行计算，考虑了焊点钎料量对焊点三维形态的影响；提出了一种用触针测量法研究点三维形态的实验方法，并对计算结果和实验结果进行了比较，结果表明，计算结果与实验结果吻合良好。     

The volumetric erosion of electrical contacts

In this paper a method for measuring the volume of eroded electrical contacts is presented. The main emphasis is on the measurement of volume relative to a contact support surface, allowing severely eroded contacts to be measured. A noncontact system is described, which allows contacts to be evaluated for volume change without the contact being removed from contact supports. The accuracy of the measurement method is discussed and results show how the volume measurement can be used to evaluate contact performance. Results are presented on the erosion characteristics of Ag/SnO₂ contacts used in automotive relays. A new measurement methodology is presented which will allow for the evaluation of the performance of relay contacts in devices     

Formation of Pb/63Sn solder bumps using a solder droplet jetting method

Formation processes of Pb/63Sn solder droplets using a solder droplet jetting have not been sufficiently reported. Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process. First, this paper presents the optimization of jet conditions of Pb/63Sn solder droplets and the formation process of Pb/63Sn solder bumps using a solder droplet jetting method. Second, interfacial reactions and mechanical strength of jetted Pb/63Sn solder bumps and electroless Ni-P/Au UBM joints have been investigated. Interfacial reactions have been investigated after the second solder reflow and aging, and results were compared with those of solder bumps formed by a solder screen-printing method. Third, jetted solder bumps with variable bump sizes have been demonstrated by a multiple jetting method and the control of waveform induced to a jet nozzle. Multiple droplets jetting method can control various height and size of solder bumps. Finally, real applications of jetted Pb/63Sn solder bumps have been successfully demonstrated on conventional DRAM chips and integrated passive devices (IPDs).     

Electrical Nanocontact Between Bismuth Nanowire Edges and Electrodes

Three methods for attaching electrodes to a bismuth nanowire sample were investigated. In the first and second methods, thin layers of titanium and copper were deposited by ion plating under vacuum onto the edge surface of individual bismuth nanowire samples that were encapsulated in a quartz template. Good electrical contact between the electrodes and the nanowire was achieved using silver epoxy and conventional solder on the thin-film layers in the first and second methods, respectively. In the third method, a low-melting-point solder was utilized and was also successful in achieving good electrical contact in air atmosphere. The connection methods showed no difference in terms of resistivity temperature dependence or Seebeck coefficient. The third method has an advantage in that nanocontact is easily achieved; however, diffusion of the solder into the nanowire allows contamination near the melting point of the solder. In the first and second methods, the thin-film layer enabled electrical contact to be more safely achieved than the direct contact used in the third method, because the thin-film layer prevented diffusion of binder components.     

Reliability analysis and design for the fine-pitch flip chip BGA packaging

The geometry of solder joints in the flip chip technologies is primarily determined by the associated solder volume and die/substrate-side pad size. In this study, the effect of these parameters on the solder joint reliability of a fine-pitched flip chip ball grid array (FCBGA) package is extensively investigated through finite element (FE) modeling and experimental testing. To facilitate thermal cycling (TC) testing, a simplified FCBGA test vehicle with a very high pin counts (i.e., 2499 FC solder joints) is designed and fabricated. By the vehicle, three different structural designs of flip chip solder joints, each of which consists of a different combination of these design parameters, are involved in the investigation. Furthermore, the associated FE models are constructed based on the predicted geometry of solder joints using a force-balanced analytical approach. By way of the predicted solder joint geometry, a simple design rule is created for readily and qualitatively assessing the reliability performance of solder joints during the initial design stage. The validity of the FE modeling is extensively demonstrated through typical accelerated thermal cycling (ATC) testing. To facilitate the testing, a daisy chain circuit is designed, and fabricated in the package for electrical resistance measurement. Finally, based on the validated FE modeling, parametric design of solder joint reliability is performed associated with a variety of die-side pad sizes. The results show that both the die/substrate-side pad size and underfill do play a significant role in solder joint reliability. The derived results demonstrate the applicability and validity of the proposed simple design rule. It is more surprising to find that the effect of the contact angle in flip chip solder joint reliability is less significant as compared to that of the standoff height when the underfill is included in the package.