基于等效层理论的薄膜滤光片中心波长消偏振膜系设计

针对薄膜滤光片倾斜入射时产生的偏振光中心波长分离现象和偏振相关损耗,本文利用等效层理论设计了倾斜入射下中心波长消偏振的100GHz信道间隔滤光片膜系结构,实现了薄膜滤光片的角度和波长调谐。首先通过相位关系分析,计算了滤光片间隔层的消偏振等效折射率,实现了不同偏振光中心波长的对准。然后,根据等效层理论,设计三层对称膜层结构实现了对间隔层中心波长消偏振等效折射率的替换。与原有的五层规整低偏振薄膜滤光片相比,本文提出的膜系结构更为简单,对消偏振等效折射率的替换更为精确。仿真和实验结果表明:该膜系结构的薄膜滤光片能实现0~20°倾斜入射的偏振光中心波长对准,偏振光波长偏离度小于0.03nm,波长调谐范围能达到35nm。     

陷波滤光片的类褶皱设计

针对当前陷波滤光片设计方法中,因需要大量薄层和折射率连续渐变而导致的制作难度较高的问题,介绍了一种陷波滤光片的类褶皱膜系设计方法。此方法中,每层薄膜的层内折射率不变,层间折射率呈离散型渐变,每层为1个光学厚度,膜系模拟计算的光谱很好,并可降低制造工艺难度。给出了膜系的基本结构形式,并分析了其中各参数对陷波滤光片光谱的影响,指出了参数变化对光谱影响的基本规律。通过对典型膜系设计,模拟分析了膜厚偏差和折射率偏差对光谱的影响。结果表明,膜系对膜厚偏差更加敏感,为膜系镀制工艺中的误差控制提供了理论依据。     

干涉滤光片特性的膜厚修正法

当前,多层膜干涉滤光片的制备已达到相当高的水平。因而,随着彩色电视、电影和照相技术等的发展,这类滤光片获得了广泛的应用,同时对滤光片的性能提出越来越严格的要求。从现有镀膜工艺水平出发,膜系计算与制备工艺密切结合,计算出令人满意的干涉滤光片膜系,并且根据实验曲线分析制备工艺中的厚度控制误差,这是我们感兴趣的问题。     

消应力消偏振胶合棱镜二向色膜的设计与制备

根据薄膜的偏振效应,运用Essential Macleod光学薄膜设计软件,完成DVD棱镜中消偏振二向色膜的设计,并采用光控法精确控制膜层厚度,制备出了满足客户要求的消偏振分光棱镜。残余应力大的薄膜容易产生脱膜现象,使得薄膜失去所需功能。为了消除薄膜应力,从膜料之间应力匹配关系及制备工艺2个方面,提出了控制薄膜应力的设计思想,并对其影响进行了讨论,利用镀膜前后光圈变化来反映膜层应力的大小。制备过程中,通过设计制作可调工装来改变镀膜有效孔径,通过调节标准块来满足非常严格的镀膜有效孔径要求。本文给出了该棱镜的消偏振膜系的设计和试验结果。     

EDFA增益平滑滤光片的容差特性模拟分析

在讨论EDFA增益平滑滤光片镀制过程中监控方法及误差产生机理的基础上,利用自建的计算机膜厚容差模拟程序,分析了滤光片的容差特性,找出了膜系中影响膜系性能的对膜厚误差最敏感的膜层.     

6.5～14μm红外长波通滤光片正面膜系的研制

采用了规整膜系作为6．5-14μm红外长波通滤光片正面膜系的初始膜系,针对规整膜系中存在较大通带波纹的现象,利用Macleod光学薄膜分析软件有选择地对部分膜层进行优化。根据优化后的膜系设计结果,采用热电阻真空蒸发镀膜工艺镀制。光谱测试表明,膜系在6．5～14μm工作波段的通带波纹平坦,平均透过率达到88．5％,在3～5．5μm截止范围内Tmax〈0．2％,并具有很好的截止带边缘陡度。该膜系具有工艺简单,膜厚监控易于操作的特点,适用于工业大规模生产。     

EDFA增益平滑滤光片的容差特性模拟分析

在讨论EDFA增益平滑滤光片镀制过程中监控方法及误差产生机理的基础上,利用自建的计算机膜厚容差模拟程序,分析了滤光片的容差特性,找出了膜系中影响膜系性能的对膜厚误差最敏感的膜层.     

EDFA增益平滑滤光片的容差特性模拟分析

在讨论 EDFA增益平滑滤光片镀制过程中监控方法及误差产生机理的基础上 ,利用自建的计算机膜厚容差模拟程序 ,分析了滤光片的容差特性 ,找出了膜系中影响膜系性能的对膜厚误差最敏感的膜层     

极紫外与软X射线非周期多层膜优化设计及初步研制

以周期膜理论为基础,改进了已有的设计方法,通过采用随机数的方法,发展了一种普适的多层膜设计方法,这种方法除可设计一般的周期多层膜,更重要的是它可以根据选定评价因子,设计不同要求的非周期多层膜.根据实际要求,完成了积分反射率最大多层膜、宽带平坦型多层膜、校正光源发射不均匀性多层膜和选波长多层膜等.这些多层膜各有特点,可满足不同应用的要求.用磁控溅射方法对一种宽带多层膜进行了制备.最后的X射线衍射测量和反射率的相对测试表明,与周期膜系相比,非周期多层膜的带宽展宽,反射率积分值增加,但峰值反射率略有降低.     

极紫外与软X射线非周期多层膜优化设计及初步研制

以周期膜理论为基础,改进了已有的设计方法,通过采用随机数的方法,发展了一种普适的多层膜设计方法,这种方法除可设计一般的周期多层膜,更重要的是它可以根据选定评价因子,设计不同要求的非周期多层膜.根据实际要求,完成了积分反射率最大多层膜、宽带平坦型多层膜、校正光源发射不均匀性多层膜和选波长多层膜等.这些多层膜各有特点,可满足不同应用的要求.用磁控溅射方法对一种宽带多层膜进行了制备.最后的X射线衍射测量和反射率的相对测试表明,与周期膜系相比,非周期多层膜的带宽展宽,反射率积分值增加,但峰值反射率略有降低.     

HOM系列高精度光学膜厚监控系统的研制

叙述了新研制的适用于 DWDM窄带滤光片成膜控制的高精度光学膜厚监控系统。该系统在光谱带宽 0 .1 nm条件下 ,暗噪声小于± 0 .0 0 5 % ,性能优于目前的报道。使用它已成功地实现了 1 0 0 GHz,5 0 GHz DWDM窄带滤光片全自动成膜监腔。由其派生出的HOM系列的其他类型光学膜厚监控系统 ,可适用于不同的优质膜的过程控制     

米级弯月面化学薄膜涂覆装备的研制

弯月面化学涂膜技术因其具有大面积、低成本以及高效率等优势成为继旋涂、喷涂等传统涂膜工艺后极具发展潜力的新型化学薄膜涂覆技术。本文针对国家某重大项目对米级光学元件表面的化学薄膜涂覆需求,对基于弯月面涂胶的技术原理进行了系统研究,分析了涂胶压强、基片和狭缝间距以及材料亲疏水性与涂胶面形态的关系,实现了对弯月液面的精密调控并研制出基于弯月面化学薄膜涂覆技术的装备,在1 400mm×420mm尺寸玻璃基片上实现了光刻胶的均匀涂覆,使整体胶膜厚度误差4%,满足了米级元件表面精密化学薄膜的涂覆需求。     

Development of DWDM Filter Manufacture

1　Ｉｎｔｒｏｄｕｃｔｉｏｎ　　ＲａｐｉｄｄｅｖｅｌｏｐｍｅｎｔｏｆＩｎｔｅｒｎｅｔｄｅｍａｎｄｓａｌａｒｇｅｖｏｌｕｍｅｏｆｉｎｆｏｒｍａｔｉｏｎｔｏｂｅｔｒａｎｓｍｉｔｔｅｄｓｉ ｍｕｌｔａｎｅｏｕｓｌｙ .Ｕｓｉｎｇｔｉｍｅｄｉｖｉｓｉｏｎｍｕｌｔｉｐｌｅｘｉｎｇ(ＴＤＭ )ｔｅｃｈｎｏｌｏｇｙａｔ 40Ｇｂｉｔ/ｓｔｒａｎｓｍｉｓｓｉｏｎｒａｔｅｃａｎｂｅａｃｈｉｅｖｅｄ ,ｉｔｉｓａｌｍｏｓｔｔｈｅｕｐｐｅｒｌｉｍｉｔｏｆｔｈｅＴＤＭｔｅｃｈｎｏｌｏｇｙ ,ｂｕｔｔｈｉｓｔｒａｎｓｍｉｓｓｉｏｎｒａ…     

硫化锌基底上减反膜的镀制

硫化锌是红外波段重要的光学材料 ,在许多光电系统应用中 ,要求镀制适当的减反膜增加其透过率。介绍了硫化锌基底上的减反膜 ,该设计是用薄的氧化钇层作为与硫化锌的结合层 ,用一氧化硅和锗分别作为低、高折射率膜料的膜堆组成的。这种五层膜满足环境稳定性标准 ,在 3μm～ 5 μm波段的某应用范围内平均透过率即可达 96% ,并在 4.2 μm处有超过 98%的峰值透过率。     

用IAD法制作的高密集型分波复合器滤光片的特性

随着高密集型分波复合器需要的不断增加,在光纤通讯领域中,光学薄膜滤光片已经成为了一个很关键的光学元件。在高密集分波复合器中,我们用ＩＡＤ方法制作了低损失、高稳定性的超窄带滤光片并在本文加以讨论。在湿度环境试验中,这种高堆积密度的光学薄膜显示了没有任何波漂。在温度环境试验中,它的热稳定性为０．００１２ｎｍ ／℃。在使用Ｔａ２Ｏ５／ＳｉＯ２,用于１００ＧＨｚ的滤色片的场合下,窄带滤色片的插入损失为０．３４ｄＢ。在使用Ｎｂ２Ｏ５／ＳｉＯ２,用于２００ＧＨ２ 的滤色片的场合下,插入损失为０．１７ｄＢ,两者都显示了极好的分光光谱特性,甚至半宽为０．６６ｎｍ 的情况下,它们的截面ＳＥＭ 微结构显示了非晶结构,平坦的表面与界面。     

涂层材料热特性参数对点接触弹流润滑的影响

为探究涂层材料热特性参数对点接触弹流润滑的影响,选择3种不同方法制备的类金刚石（DLC）涂层和氧化锆陶瓷涂层,构建考虑涂层热特性的点接触弹流润滑模型,分析涂层材料、涂层厚度和润滑剂的流变性对接触区润滑性能的影响。结果表明：在弹流润滑状态下具有不同热特性的4种表面涂层导致了膜厚的差异,固体表面温度及润滑区温度场会随涂层热惯性变化;热惯性最小的DLC涂层加在快速运动表面能获得更高的膜厚;随着涂层厚度的增加,会引起固体表面的温度升高,使摩擦因数降低;非牛顿流体对压力、膜厚的影响很小,但与牛顿流体相比,能获得相对较低的温度。在弹流润滑状态下,涂层覆在快表面对于减小摩擦、提高膜厚是有益的。     

Structure analysis of sputter-coated and ion-beam sputter-coated films: a comparative study

Gold, platinum and tungsten films were deposited by low energy input (7 mA, 450 V), or high deposition rate (80 mA, 1500 V), diode sputter coating and by ion beam sputter coating. Film structures on Formvar coated grids and on the surface of coated erythrocytes, resin embedded, sectioned, and recorded at high magnification in a TEM were compared using computer-assisted measurements and analysis of film thickness and grain size. The average grain size of the thinnest gold and platinum films was relatively independent of the mode or rate of deposition but as the film thickness increased, significant differences in grain size and film structure were observed. Thick platinum or gold films deposited by low energy input sputter coating contained large grain size and electron transparent cracks; however, more even films with narrower cracks but larger grain size were produced at high deposition rates. Ion beam sputter coated gold had relatively large grain size in 10 nm thick films, but beyond this thickness the grains coalesced to form a continuous film. Platinum films deposited by ion beam sputter coating were even and free of electron transparent cracks and had a very small grain size (1–2 nm), which was relatively independent of the film thickness. Tungsten deposition either by low energy input or ion beam sputter coating resulted in fine grained even films which were free of electron transparent cracks. Such films remained granular in substructure and had a grain size of about 1 nm which was relatively independent of film thickness. Tungsten films produced at high deposition rates were of poorer quality. We conclude that thick diode sputter coated platinum and gold films are best deposited at high deposition rates provided the specimens are not heat sensitive, the improvement in film structure being more significant than the slight increase in grain size. Thick diode or ion beam sputter coated gold films should be suitable for low resolution SEM, and thin discontinuous gold films for medium resolution SEM. Diode sputter coated platinum should be suitable for medium resolution SEM and ion beam sputter coated platinum for medium and some high resolution SEM. 1–5 nm thick tungsten films, deposited by low energy input or ion beam sputter coating should be suitable for high resolution SEM, particularly where contrast is of less importance than resolution.     

Spin‐coated epoxy resin embedding technique enables facile SEM/FIB thickness determination of porous metal oxide ultra‐thin films

A facile nonsubjective method was designed to measure porous nonconductive iron oxide film thickness using a combination of a focused ion beam (FIB) and scanning electron microscopy. Iron oxide films are inherently nonconductive and porous, therefore the objective of this investigation was to optimize a methodology that would increase the conductivity of the film to facilitate high resolution imaging with a scanning electron microscopy and to preserve the porous nature of the film that could potentially be damaged by the energy of the FIB. Sputter coating the sample with a thin layer of iridium before creating the cross section with the FIB decreased sample charging and drifting, but differentiating the iron layer from the iridium coating with backscattered electron imaging was not definitive, making accurate assumptions of the delineation between the two metals difficult. Moreover, the porous nature of the film was lost due to beam damage following the FIB process. A thin layer plastication technique was therefore used to embed the porous film in epoxy resin that would provide support for the film during the FIB process. However, the thickness of the resin created using conventional thin layer plastication processing varied across the sample, making the measuring process only possible in areas where the resin layer was at its thinnest. Such variation required navigating the area for ideal milling areas, which increased the subjectivity of the process. We present a method to create uniform thin resin layers, of controlled thickness, that are ideal for quantifying the thickness of porous nonconductive films with FIB/scanning electron microscopy.     

Tribological Performance of UHMWPE and PFPE Coated Films on Aluminium Surface

A thin layer of Ultra High Molecular Weight Polyethylene (UHMWPE) or UHMWPE + PFPE is coated onto cylindrical aluminium (Al) pin (4.6 mm diametre) surface with the aim of providing wear resistant coating on this soft and tribologically poor metal. The coefficient of friction and wear life of the coated samples are investigated on a pin-on-disk tribometre under different normal loads (394–622 g) and two sliding speeds (0.1 and 0.31 m/s) against uncoated Al disk as the counterface. Both coatings provide coefficient of friction values in the range of 0.02–0.2 as compared to 0.4–1.0 for uncoated Al. There is tremendous improvement in the wear life of the pin, with UHMWPE + PFPE film giving wear life approximately twice to thrice higher than that with only UHMWPE film. A thin polymer film is transferred to the disk surface during sliding providing very long-term wear life (continuous low coefficient of friction) despite visual removal of the film from the pin surface. The present films will have applications in gears and bearings as solid or boundary lubricants for automotive and aerospace component.     

Mechanisms of blistering and chipping of a scratch-resistant coating

In most cases, scratching of the surface of a polymeric glass elicits brittle behavior. Industrial solutions have been successfully used to improve the scratch resistance of polymeric glasses and a common way is to coat the substrate with a thin film. However, one of the limitations of this method is the risk of cracking and chipping. The origin of the success of the coating technique is still of great research interest and further work will be required to explain the improvement in scratch resistance and predict the cracking in anti-scratch coatings. The present study contributes to these aims.

Using a single-asperity scratching device allowing in situ observation of the scratch, the fracturing of a thin (3.5 μm) nano-composite coating deposited on a viscoelastic–viscoplastic substrate (polycarbonate) was investigated under different conditions of temperature and scratching speed. Four types of fracture mechanisms were observed, depending on these two variables. The processes involved in deformation of the system were: (i) delamination (blister formation) and fracture (chipping) of the coating and (ii) viscoelastic–viscoplastic deformation of the substrate. Image analyses were performed on video sequences of the different processes leading to damage of the film. The quantitative results are discussed in terms of the damage mechanisms involved.