一种新型非球面高效研磨方法的研究

针对目前非球面加工的难题，提出了一种利用弯曲成形法制作磨具来实现非球面高效研磨的新方法。阐述了弯曲成形法高效研磨的原理，建立了磨具弯曲成形的数学模型，分析了磨具成形的等距线误差。实验结果表明：采用弯曲成形法制作的磨具成形精度较高，面形精度达到微米级；采用该方法研磨非球面零件是可行的，能满足中等精度的非球面零件研磨加工要求；效率高、成本低，有很好的开发和应用前景。     

薄型非球面弹性变形面形复制加工技术研究

提出一种新型非球面加工技术——弹性变形面形复制加工技术,该技术综合利用光学玻璃材料的线弹性特性以及面形复制加工机理,将复杂的非球面加工转变为简易的平面加工,适合加工薄型大曲率半径非球面。阐述弹性变形面形复制加工技术的基本机理,随后以直径为40 mm、顶点曲率半径为2 500 mm的抛物面作为目标面形,通过有限元仿真确定使工件与靠模紧密贴合所需的工件最小去除厚度,建立加工过程的材料去除模型,并由此确定加工时间。在所搭建的弹性变形面形复制加工系统上进行加工试验,试验结果证明所建立材料去除模型有效。最终工件加工面形精度为PV 0.62 μm。对加工面形精度影响因素进行分析,并提出改进工件加工面形精度的措施。     

研磨轮结构参数对工件加工精度的影响

通过建立研磨轮和工件的相对运动数学模型，得出研磨轮在工件上的切削运动轨迹方程，由此得到超精密平面研磨中，不同结构参数研磨轮的滑移轨迹长度，引入精度系数的概念，用于评价不同结构参数研磨轮对工件的加工效果，采用微粒金刚石研磨轮对单晶硅和压电陶瓷材料进行研磨实验的结果表明，使用设计合理的研磨轮可以提高研磨的加工精度。     

Influence of Cavitation on Unsteady Vortical Flows in a Side Channel Pump

Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces. The finite element simulation results were in good agreement with the experimental results.     

Surface finishing of flat pieces when submitted to lapping kinematics on abrasive disc dressed under several overlap factors

In machining of pieces that require surface finishing levels finer than grinding can offer, it is necessary to use specific finishing processes. However, these processes, which have lapping as the most classic representative, are usually difficult to setup and demand much time in setting the large number of variables. This paper discusses the investigation of an abrasive process for finishing of flat workpieces based on the combination of important grinding and lapping characteristics. Instead of loosing abrasive grains between the workpiece and the lapping plate, a resinoid grinding wheel of hot-pressed silicon carbide is fixed on the plate of a device resembling to a lapping machine. The grinding wheel is dressed with a single-point diamond for maintaining its form flat and mainly for interfering in the workpieces surface finishing by varying of the overlap factor (Ud). It was noticed that the studied process can simplify the setup and make it easier than in lapping, which is a painstaking process. The surface roughness values and flatness deviations showed to be comparable to those achieved in lapping, or even better. The best surface roughness and flatness deviation found were Ra = 0.8 nm and 0.4 μm with Ud = 3, respectively. The workpiece material was made of quenched and tempered SAE 4340 steel, reaching a hardness of 60 HRC. The process was also monitored by acoustic emission (AE), which indicates to be a promising and suitable technique to be used in this process. Compared to lapping, there is an additional advantage of a less contaminated workpiece surface with a shiny appearance.     

研磨压力对固结聚集体磨料垫自修正影响

固结磨料研磨过程中磨料的微破碎是实现固结磨料垫自修正特性的主要途径,研磨压力是影响磨粒微破碎的关键参数。选用单晶金刚石和聚集体金刚石作为磨粒制备固结磨料垫,在15 kPa压力下以石英玻璃为加工对象进行研磨实验,比较两者的材料去除率及加工稳定性;制备了4种陶瓷结合剂含量的聚集体金刚石,并制备成固结聚集体金刚石磨料垫,探索了不同压力下的固结聚集体金刚石磨料垫的自修正性能;分析了研磨后的工件表面粗糙度和表面微观形貌。结果表明:采用固结聚集体金刚石磨料垫,研磨后工件表面粗糙度低,去除效率稳定;在15~21 kPa的压力下,结合剂含量次高的聚集体金刚石研磨效率高,材料去除率达到8.94~12.43μm/min,加工性能较稳定,研磨后的工件表面粗糙度R a在60 nm左右;在3.5~7 kPa压力下,结合剂含量次低的聚集体金刚石研磨性能较稳定,材料去除率在2.67~3.12μm/min,研磨后的表面粗糙度R a在40 nm左右。高结合剂含量的聚集体金刚石磨粒更适合高研磨压力条件,而低结合剂的聚集体金刚石磨粒更适合于低研磨压力。     

砂轮约束磨粒喷射精密光整加工材料去除机理研究

基于磨粒特征尺寸与砂轮、工件间液膜厚度比值的变化,研究了砂轮约束磨粒喷射精密光整加工材料去除机理。分析了在两体加工及三体加工模式条件下,单颗磨粒运动特点以及磨粒由两体研磨加工向三体抛光加工转变的临界条件。实验证明,砂轮约束磨粒喷射光整加工中,随着加工循环的增加,工件表面微观形貌变化规律与理论分析相同,实验结果和理论分析吻合很好。     

梯度功能研抛盘力学模型与材料均匀去除试验

针对材料非均匀去除问题,提出了一种基于梯度功能研抛盘的新颖加工方法。以Preston方程为理论基础,开展了梯度功能研抛盘与工件接触应力的数值模拟和弹性力学计算,通过半逆解法推导接触应力方程,建立了一套关于梯度功能研抛盘的双层结构力学模型与工件材料去除水平的预测体系。在ZrO2陶瓷上进行了不同部位材料去除速率研磨试验,以平均材料去除速率的标准差为各区域均匀性去除的评价标准,试验结果表明,在0~30 min、30~60 min、60~90 min三个时间段,采用梯度功能研抛盘加工后的标准差分别为6.47 nm/min、3.76 nm/min、5.09 nm/min,而普通研抛盘加工后的标准差分别为55.23 nm/min、54.73 nm/min、35.92 nm/min。两种盘均维持在150~400 nm/min的材料去除速率,但梯度功能研抛盘在加工过程中能同时实现材料的均匀去除,减少工件研磨后的修整工序,使加工过程简单高效。     

Machining fixture layout design using ant colony algorithm based continuous optimization method

In any machining fixture, the workpiece elastic deformation caused during machining influences the dimensional and form errors of the workpiece. Placing each locator and clamp in an optimal place can minimize the elastic deformation of the workpiece, which in turn minimizes the dimensional and form errors of the workpiece. Design of fixture configuration (layout) is a procedure to establish the workpiece–fixture contact through optimal positioning of clamping and locating elements. In this paper, an ant colony algorithm (ACA) based discrete and continuous optimization methods are applied for optimizing the machining fixture layout so that the workpiece elastic deformation is minimized. The finite element method (FEM) is used for determining the dynamic response of the workpiece caused due to machining and clamping forces. The dynamic response of the workpiece is simulated for all ACA runs. This paper proves that the ACA-based continuous fixture layout optimization method exhibits the better results than that of ACA-based discrete fixture layout optimization method.     

硬脆性材料用柔性磨具研磨的加工表面粗糙度建模

通过分析磨粒与工件表面的作用过程,建立了硬脆性材料柔性磨具加工表面粗糙度的理论预测模型.以橡胶结合剂金刚石研磨盘为柔性磨具、蓝宝石衬底为工件,在不同弹性模量、磨粒浓度、磨粒粒度和研磨压力下开展研磨试验,将不同研磨条件下的表面粗糙度试验值与理论预测值进行比较,发现试验结果与理论模型预测结果的趋势一致,且预测误差为7.71...     

等距面误差对抛物面廓形精度的影响

在抛物面加工中,对工件的已加工表面上引起的等距面误差进行了理论分析和计算。用三点法求出理论曲线的最小平移距离,再用两点距离法建立磨具加工面上各点误差的数学模型,该模型适合各类二次曲线磨具等距线误差的计算。实验结果表明磨具等距线误差变化范围为 0~0.7 μm,成形精度能满足大多数工件的面形精度要求,且磨具两端的最大误差为0.624 14 μm,同时,等距面误差随刀具或磨具的磨损量,以及抛物面的曲率的增大而增大,结果证明了该方法的有效性。     

Machining performance of a grooved tool in dry machining Ti-6Al-4 V

In this paper, dry machining experiment of Ti-6Al-4 V was carried out to investigate the machining performance of a grooved tool in terms of its wear mechanisms and the effects of cutting parameters (cutting speed, feed rate, and cutting depth) on tool life and surface roughness of the machined workpiece. The results showed that chip-groove configuration substantially improved the machining performance of cutting tool. The main wear mechanisms of the grooved tool were adhesive wear, stripping wear, crater wear, and dissolution-diffusion wear. The resistance to chipping was enhanced due to the decrease of contact pressure of tool-chip interface. And the resistance to plastic deformation of tool nose was weakened at the cutting speed of more than 60 m/min. The appropriate cutting speed and feed rate were less than 70 m/min and 0.10 mm/r, respectively. With cutting speed increasing, the surface roughness of machined workpiece decreased. A high feed rate helped the formation of higher surface roughness except 0.21 mm/r. When cutting depth increased, tool nose curvature and phase transformation of workpiece material had great impact on surface roughness.     

A study on the magneto-assisted spiral polishing on the inner wall of the bore with magnetic hot melt adhesive particles (MHMA particles)

The spiral polishing mechanism employed a fast turning screw rod to drive the abrasive for workpiece surface polishing. In this study, the powerful ring magnet installed around the workpiece would attract the self-developed magnetic hot melt adhesive particles (MHMA particles) during the process of polishing, driving the SiC particles against the workpiece, the inner wall of the bore. At the same time, the flexibility of MHMA particles helped improve the surface quality of the bore by preventing the SiC particles from heavily scratching it. The effects of magnetic flux density, size and concentration of SiC particles, concentration of MHMA particles, viscosity of silicone oil, revolution speed of the spindle as well as machining time and machining gap on operation temperature, slurry viscosity, surface roughness, and material removal were discussed and the best parameter combination was identified based on the results of the experiment. The effects of each machining parameter on the finished surface topography of the workpiece were also examined. Both analysis of variance and F-test indicated that magnetic flux density and the concentration of MHMA particles were the two most important variables affecting the surface roughness. In other words, magnetic force helped improve spiral polishing. Furthermore, the results showed that adding new MHMA particles to the slurry greatly improved the surface quality, at a rate of 90 %, and reduced the workpiece surface roughness from 0.9 μm down to 0.094 μm.     

Influence of electrical conditions on performance of electrical discharge machining with powder suspended in working oil for titanium carbide deposition process

This paper describes the influence of the discharge current and the pulse duration on the titanium carbide (TiC) deposition process by electrical discharge machining (EDM) with titanium (Ti) powder suspended in working oil. Although the influence of the electrical conditions for removal EDM has been investigated, the criteria for deposition have not been discussed. In the experiments, a 1-mm copper rod was used for an electrode to prevent the flushing of working oil from the gap between the electrode and a workpiece. Ti powder reacted with the cracked carbon from the working oil, then depositing a TiC layer on a workpiece surface. A major criterion of the deposition or removal was the discharge energy over a pulse duration of 10 μs. A thickness of the TiC layer became the maximum at a certain discharge current and pulse duration. Larger discharge energy and power promoted the removal by heat and pressure caused by the discharge. The removal was classified further into two patterns; cracks were observed on the Ti-rich surface in removal pattern 1 and a workpiece was simply removed in removal pattern 2. The maximum hardness of the deposition was 2000 Hv. The workpiece about 10 μm beneath its surface was also hardened because of the dispersion of TiC. The machining conditions for the hardest deposition did not coincide with those for the highest one. Therefore, the discharge current and pulse duration should be optimized for the deposition.     

Surface integrity of silicon wafers in ultra precision machining

Silicon wafers are the most extensively used material for integrated circuit (IC) substrates. Before taking the form of a wafer, a single crystal silicon ingot must go through a series of machining processes, including slicing, lapping, surface grinding, edge profiling, and polishing. A key requirement of the processes is to produce extremely flat surfaces on work pieces up to 350 mm in diameter. A total thickness variation (TTV) of less than 15 μm is strictly demanded by the industry for an 0.18 μm IC process. Furthermore, the surfaces should be smooth (R_a<10 nm) and have minimum subsurface damage (<10 μm) before the final etching and polishing. The end product should have crack-free mirror surfaces with a micro-roughness less than 1.8 Å. In this paper, experiments are conducted to investigate the effects of various parameters on the subsurface damage of ground silicon wafers.     

ZF6重火石玻璃非球面数控加工技术的研究

由于重火石玻璃的密度很大,材料较软,在数控加工过程中难以控制材料的去除量。现主要针对Ф62mm ZF6非球面凸透镜,对铣磨成型工艺、抛光工艺、抛光设备及抛光液等相关工艺参数进行了研究,采用弹性模预抛光与小抛头修正抛光相结合的两步研抛法对零件表面快速抛光,给出了一套规范的ZF6玻璃非球面的数控加工工艺,同时保证了零件具有较高的面形精度,实现了该非球面元件的快速批量生产。Ф62mm口径非球面最终面形精度达到0．5μm以下,表面光洁度达到Ⅲ级,明显改善成像质量,减少系统中光学零件数目,满足了非球面的使用要求。     

MACHINING CHARACTERISTICS OF COMPLEX SURFACES USING FAST TOOL SERVO SYSTEM

Optical components with complex surfaces are more and more widely applied, but it is very difficult to manufacture these components by using traditional mechanical fabricating methods. Fast tool servo system can manufacture these complex surfaces or microstructures efficiently and accurately. The relative position between the tool and workpiece surface will vary continuously in the fast tool servo machining process, owing to the height change of workpiece profile in the same circle, and this will worsen the cutting conditions and debase the machining accuracy. In this paper, the cutting characteristics are studied in the fast tool servo machining process of complex workpiece, including the varying rule of cutting angle, and its influences on the rake angle and back angle, and the choice of machining parameters. Furthermore, the conditions for identifying tool interference are given. On the basis of the above work, two kinds of typical complex workpieces are manufactured by using fast tool servo system, including radial sinusoidal workpieces and lens array. The measuring results indicate that surface accuracy can reach 0.14 μm (peak-to-valley value) and the roughness is less than 10 nm (mean value).     

基于工件弹性变形的薄型非球曲面(玻璃)零件加工方法研究

针对传统非球曲面加工技术存在对设备依赖度高及加工效率较低等问题,研究了薄型非球曲面零件的弹性变形加工法,并基于材料弹性变形特性,将非球曲面加工转变为平面加工。通过理论计算及ABAQUS有限元仿真确定了平板玻璃工件在均匀压力及周边简支条件下的弹性变形面型,并对工件进行了弹性变形加工实验;加工面型与理论面型误差的最小均方根、峰谷值分别为1.66μm与2.80μm,验证了使用弹性变形加工方法进行薄型非球曲面零件加工的有效性。     

光学材料研磨亚表面损伤快速检测及其影响规律研究

基于印压断裂力学理论,针对光学材料研磨加工过程建立了亚表面损伤深度与表面粗糙度间关系的理论模型,以实现亚表面损伤深度的快速、准确和非破坏性检测。使用磁流变抛光斑点技术测量了K9玻璃在不同研磨条件下的亚表面损伤深度,对上述理论模型进行实验验证。最后,分析了研磨加工参数对亚表面损伤深度的影响规律,提出了以提高光学零件加工效率为目的的研磨加工策略。研究表明：光学材料研磨后亚表面损伤深度与表面粗糙度成单调递增的非线性关系,该幂函数的幂为4/3。磨粒粒度对亚表面损伤深度的影响最显著,研磨盘硬度的影响次之,而研磨压力和研磨盘公转速度的影响基本可以忽略。     

Lubricity of Surface Hydrogel Layers

Many biological interfaces provide low friction aqueous lubrication through the generation and maintenance of a high water content polymeric surface gel. The lubricity of such gels is often attributed to their high water content, high water permeability, low elastic modulus, and their ability to promote a water film at the sliding interface. Such biological systems are frequently characterized as “soft,” where the elastic moduli are on the order of megapascals or even kilopascals. In an effort to explore the efficacy of such systems to provide lubricity, a thin and soft hydrogel surface layer (~5 μm in thickness) with a water content of over >80 % was constructed on a silicone hydrogel contact lens, which has a water content of approximately 33 %. Nanoindentation measurements with colloidal probes on atomic force microscopy (AFM) cantilevers revealed an exceedingly soft elastic modulus of ~25 kPa. Microtribological experiments at low contact pressures (6–30 kPa) and at slow sliding speeds (5–200 μm/s) gave average friction coefficients below μ = 0.02. However, at higher contact pressures, the gel collapsed and friction loops showed a pronounced stick–slip behavior with breakloose or static friction coefficient above μ = 0.5. Thus, the ability of the soft surface hydrogel layers to provide lubricity is dependent on their ability to support the applied pressure without dehydrating. These transitions were found to be reversible and experiments with different radii probes revealed that the transition pressures to be on the order of 10–20 kPa.