MEMS壁剪应力传感器热效应的数值模拟

借助计算流体动力学(CFD)商业软件FLUENT,采用数值模拟的方法,对基于MEMS的壁剪应力传感器热交换效应进行了分析。计算结果表明:在壁剪应力传感器的热膜下方加入真空腔或者空气腔是十分必要的。针对水流中测量的计算结果显示,真空腔和空气腔在整个计算区域的温度场分布以及对流体的传热效率的差别不大,而空腔可以明显地减小底层的热损失,这对提高剪应力传感器的灵敏度是十分有利的。此外,MEMS壁剪应力传感器的尺寸效应对传热效率也存在影响。     

Design and simulation of a thermo transfer type MEMS based micro flow sensor for arterial blood flow measurement

Thermo transfer type MEMS (Micro Electro Mechanical System) based micro flow sensing device have promising potential to solve the limitation of implantable arterial blood flow rate monitoring. The present paper emphasizes on modeling and simulation of MEMS based micro flow sensing device, which will be capable of implantable arterial blood flow rate measurement. It describes the basic design and model architecture of thermal type micro flow sensor. A pair of thin film micro heaters is designed through MEMS micro machining process and simulated using CoventorWare; a finite element based numerical code. A rectangular cross section micro channel has been modeled where in micro heater and thermal sensors are embedded using the same CoventorWare tools. Some promising and interesting results of thermal dissipation depending upon very small amount of flow rate through the micro channel are investigated. It is observed that measuring the variation of temperature difference between downstream and upstream, the variation of fluid flow rate in the micro channel can be measured. The numerical simulation results also shows that the temperature distribution profile of the heated surface depends upon microfluidic flow rate i.e. convective heat transfer is directly proportional to the microfluidic flow rate on the surface of the insulating membrane. The simplified analytical model of the thermo transfer type flow sensor is presented and verified by simulation results, which are very promising for application in arterial blood flow rate measuring in implantable micro devices for continuous monitoring of cardiac output.     

一种飞行器燃料温控系统设计与优化

高空长航时飞行器由于长时间处于低温使用环境中,飞行器的燃料及其供给系统需进行温度控制功能设计,以保障飞行器长时间正常运行,以免造成飞行器损坏;飞行器燃料所处的低温环境受到内外部多种热源影响,且与飞行器的飞行任务剖面密切相关,温度环境复杂且难以有效计算仿真;针对飞行器在复杂低温环境中对燃料进行温度控制功能的需求,以及飞行器对温控系统高可靠性要求、资源条件限制苛刻等限制条件,开展了温控系统设计和优化,并完成了硬件设计和系统仿真;由于地面试验和真实环境差异较大,单一地面试验很难模拟真实热环境,对系统优化设计造成困难,针对性开展热环境分析,系统方案设计、地面试验和飞行试验联合验证,优化系统方案,实现了一种高效可靠,且易于工程应用的燃料贮箱温控功能,取得了良好的工程应用效果,同时该优化设计方法具有一定的扩展性。     

Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications

Silicon carbide (SiC) is a promising material for applications in harsh environments. Standard silicon (Si) microelectromechanical systems (MEMS) are limited in operating temperature to temperatures below 130°C for electronic devices and below 600°C for mechanical devices. Due to its large bandgap SiC enables MEMS with significantly higher operating temperatures. Furthermore, SiC exhibits high chemical stability and thermal conductivity. Young’s modulus and residual stress are important mechanical properties for the design of sophisticated SiC-based MEMS devices. In particular, residual stresses are strongly dependent on the deposition conditions. Literature values for Young’s modulus range from 100 to?400?GPa, and residual stresses range from 98 to?486?MPa. In this paper we present our work on investigating Young’s modulus and residual stress of SiC films deposited on single crystal bulk silicon using bulge testing. This method is based on measurement of pressure-dependent membrane deflection. Polycrystalline as well as single crystal cubic silicon carbide samples are studied. For the samples tested, average Young’s modulus and residual stress measured are 417?GPa and 89?MPa for polycrystalline samples. For single crystal samples, the according values are 388?GPa and 217?MPa. These results compare well with literature values.     

微结构气体传感器的优化设计

利用SiO2相对于SiNx有更低的热导率,作为膜式微气体传感器的热绝缘和电绝缘层,而单晶Si适合通过各向异性腐蚀形成倒杯状结构来支撑SiO2膜。将膜式微气体传感器中的加热器和信号电极设计在一个平面上,以减小工艺复杂度,获得较高的加热效率。利用有限元分析工具ANSYS分析比较加热器和信号电极在不同宽度与间距时的温度分布。当设定加热器宽度为50μm,信号电极宽度50μm,加热器和信号电极间距为25μm,微气体传感器将获得更低的功耗和比较均匀的中心温度分布,有利于传感器整体性能的提高。     

A new in situ residual stress measurement method for a MEMS thin fixed-fixed beam structure

A new method is described to measure the in situ residual stress state in a thin fixed-fixed beam structure used in microelectromechanical systems (MEMS). The methodology can be applied to devices at the anticipated operational and environmental temperatures. The new technique makes use of differences in the thermal expansion coefficient between the thin beam and the substrate. The residual stress distribution is determined by matching the thermal deflections from a finite element model (FEM) to measured deflections of the beam. All previous residual stress measurement methods for MEMS suspended structures reported a uniformly distributed residual stress. Experimental data coupled with the new analytical method suggests that this may not be adequate for the case of a suspended thin structure with nonplanar surface topology. A stress gradient through the thickness must be included in the determination of the stress state of the beam. The new method indicates a spatially varying residual stress distribution and is capable of de-coupling the mean stress and the stress gradient through the thickness. It was found through an extensive literature review that the quantification of the stress gradient in a thin suspended structure has never been reported. The de-coupling makes the prediction of the stress state at different temperature points possible. Details of the new method are demonstrated and discussed by the use of a capacitive radio frequency (RF) MEMS switch.     

高于室温环境的热式气体微流量传感器性能分析

为了探索平板微热管的传热特性,了解微热管内不同温度区间的蒸汽传输特性,开展了热式气体微流量传感器及其检测系统的设计。设计了一种便于探索最佳温度测量点的热式微流量传感器结构,利用MEMS工艺进行加工制作,在不同环境温度下对其性能进行了测试,得到了环境温度与热式微流量传感器性能的关系。基于MSP430单片机和C＃语言自主开发了流量传感器检测系统,可对一定范围内的流量进行实时检测,并实时绘制流速随时间的变化曲线。研究表明,采用本文设计的热式微流量传感器结构,可以检测高于室温环境下的微流量气体,并可通过提高加热器温度或改变测温电阻对的测量位置来提高测量灵敏度。     

A parametrized three-dimensional model for MEMS thermal shear-stress sensors

This paper presents an accurate and efficient model of MEMS thermal shear-stress sensors featuring a thin-film hotwire on a vacuum-isolated dielectric diaphragm. We consider three-dimensional (3-D) heat transfer in sensors operating in constant-temperature mode, and describe sensor response with a functional relationship between dimensionless forms of hotwire power and shear stress. This relationship is parametrized by the diaphragm aspect ratio and two additional dimensionless parameters that represent heat conduction in the hotwire and diaphragm. Closed-form correlations are obtained to represent this relationship, yielding a MEMS sensor model that is highly efficient while retaining the accuracy of three-dimensional heat transfer analysis. The model is compared with experimental data, and the agreement in the total and net hotwire power, the latter being a small second-order quantity induced by the applied shear stress, is respectively within 0.5% and 11% when uncertainties in sensor geometry and material properties are taken into account. The model is then used to elucidate thermal boundary layer characteristics for MEMS sensors, and in particular, quantitatively show that the relatively thick thermal boundary layer renders classical shear-stress sensor theory invalid for MEMS sensors operating in air. The model is also used to systematically study the effects of geometry and material properties on MEMS sensor behavior, yielding insights useful as practical design guidelines.     

MEMS Scanning Calorimeter With Serpentine-Shaped Platinum Resistors for Characterizations of Microsamples

We report a new design and operation of a microelectromechanical systems (MEMS) differential scanning calorimeter (DSC) for heat-capacity measurements. The sensor consists of a 500-nm silicon nitride membrane supported by four bridges on a silicon wafer. On one side of the membrane, a serpentine-shaped platinum layer is deposited and used as both a resistive heater and a thermometer during the DSC measurement. This MEMS design can provide a self-alignment between the DSC cell and the material to be analyzed in order to prevent its deposition on the sloping side walls of the silicon frame. According to FEM calculations, the system exhibits good thermal isolation and high uniformities in the temperature field in the sensing area of the device. To evaluate the use of this calorimetric device for liquid samples, we measure the heat of vaporization of nanoliter-scale water droplets with high preciseness using the calorimeter in both scanning and heat conduction modes.     

基于有限元法的MEMS加速度计热应力分析

残余应力对MEMS器件的力学性能、可靠性和寿命都有较大的影响。基于MEMS电容式加速度计,采用热结构耦合场分析方法,对热应力的影响进行了仿真分析,并和实验结果进行比较。结果表明热应力不是影响器件性能的主要因素,而仿真模型中未考虑到的一些物理因素和工艺误差则可能是主要因素。针对课题组加速度计的制备过程从工艺的角度提出了相应的改进措施,为加速度计温度补偿模型的完善以及改版设计提供参考。     

Measurement technique for the thermal properties of thin-film diaphragms embedded in calorimetric flow sensors

In diaphragm-based micromachined calorimetric flow sensors, convective heat transfer through the test fluid competes with the spurious heat shunt induced by the thin-film diaphragm where heating and temperature sensing elements are embedded. Consequently, accurate knowledge of thermal conductivity, thermal diffusivity, and emissivity of the diaphragm is mandatory for design, simulation, optimization, and characterization of such devices. However, these parameters can differ considerably from those stated for bulk material and they typically depend on the production process. We developed a novel technique to extract the thermal thin-film properties directly from measurements carried out on calorimetric flow sensors. Here, the heat transfer frequency response from the heater to the spatially separated temperature sensors is measured and compared to a theoretically obtained relationship arising from an extensive two-dimensional analytical model. The model covers the heat generation by the resistive heater, the heat conduction within the diaphragm, the radiation loss at the diaphragm’s surface, and the heat sink caused by the supporting silicon frame. This contribution summarizes the analytical heat transfer analysis in the microstructure and its verification by a computer numerical model, the measurement setup, and the associated thermal parameter extraction procedure. Furthermore, we report on measurement results for the thermal conductivity, thermal diffusivity, and effective emissivity obtained from calorimetric flow sensor specimens featuring dielectric thin-film diaphragms made of plasma enhanced chemical vapor deposition silicon nitride.     

导弹天线罩参数化有限元建模和热可靠性分析

基于Pro/ENGINEER,Patran和MSC Nastran,以坚晶石导弹天线罩为研究对象,结合参数化有限元建模方法,将天线罩结构尺寸、材料性能和热流输入等作为随机因素,使用蒙特卡罗数字模拟法对其进行热可靠性分析,详述参数化建模和可靠性分析的流程,得到天线罩热应力的概率分布、随机因素与热应力的变化关系以及天线罩热可靠度等可靠性分析数据.结果显示,本文的天线罩热可靠度为99.93%.本研究证实对导弹天线罩进行参数化有限元建模和可靠性分析的可行性.     

Electro-thermal analysis of an embedded boron diffused microheater for thruster applications

One of the important design criteria of micropropulsion systems in particular VLM is the type of microheater, its layout and placement with a view to achieve uniform heating of propellant, fast heat transfer efficiency with minimum input power. Thrust produced by microthruster not only depends on the structural geometry of the thruster and propellant flow rate, but also on the chamber temperature to produce super saturated dry stream at the exit nozzle. Detailed design of microheater in thermal and electrical domains using co-solvers available in MEMS software tools along with material’s thermal property, temperature dependence of electrical resistivity and thermal conductivity have been considered in the present work to achieve precise modeling and experimental accuracy of heater operation. The chamber temperature was analytically calculated and subsequently the required resistance and power were estimated. The boron diffused microheaters of meanderline configuration in silicon substrate has been designed and its finite element based electro-thermal modeling was employed to predict the heater characteristics. The variation of microheater temperature with time, applied voltage and along chamber length has been determined from the modeling. Subsequently the designed microheater was realized on silicon wafer by lithography and boron diffusion process and its detailed testing was evaluated. It was found that boron diffused resistor of 820 Ω can generate 405 K temperature with applied input power 2.4 W. Finally the simulated results were validated by experimental data.     

Elastic–plastic thermal stress analysis in a thermoplastic composite disc applied linear temperature loads via FEM

The aim of this study is to obtain thermal stresses in a thermoplastic composite disc unidirectionally reinforced by steel fibers. Finite element method was used to calculate the thermal elastic and elastic–plastic stress distributions within the composite disc. Therefore, the solution was carried out using the ANSYS software. The temperature loading was chosen so as to vary linearly from inner surface to outer surface along the radial sections of the disc. Linear thermal loads were selected as to differ from each other. They were also adjusted from 90 to 130 °C. Thermal stresses were formed within the disc by the linear temperature loads due to its having different thermal expansion coefficients in radial and tangential directions. In line with the thermal analysis results, the magnitudes of the tangential stress components for both elastic and elastic–plastic solutions were above the radial stress components. In addition, the residual stress components were also calculated using both elastic and elastic–plastic solution results. The results obtained pointed out that the magnitudes and distributions of the thermal stresses and residual stresses were greatly influenced by the increase in linear temperature loads.     

Thermal stress analysis of skew plates by finite element method

Thermal stresses are induced in general due to nonuniform temperature distribution or due to the boundary restriction. Most of the work reported so far deals with either plates with edges clamped in plane of the plate or plates with stress free edges. While studying buckling or post-buckling problems, one should ideally analyse the plates with mixed in-plane boundary conditions. Hence, in the present analysis, thermal stress analysis of skew plates with mixed in-plane boundary conditions using finite element approach is attempted. In addition, the effect of in-plane boundary conditions on the thermal stresses is also discussed.     

Rapid thermal annealing of polysilicon thin films

In comparison with conventional heat treatment, high-temperature rapid thermal annealing (RTA) in a radio frequency (RF) induction-heated system can reduce or eliminate residual stresses in thin films in a few seconds. In this work, changes in the stress level due to the RTA of polycrystalline silicon thin films were studied as a function of annealing time and temperature. The corresponding variations in the microstructure and surface layer of the thin films were experimentally investigated by a variety of analytical tools. The results suggest that the residual stress evolution during annealing is dominated by two mechanisms: 1) microstructure variations of the polysilicon thin film and 2) effects of a surface layer formed during the heat treatment. The fact that the microstructure changes are more pronounced in samples after conventional heat treatment implies that the effects of the formed surface layer may dominate the final state of the residual stress in the thin film     

基于有限元的PCB板上关键元件热可靠性分析

电子设备不断地微型化,热设计就显得越来越重要。体积小、布局紧凑,导致元件温升越高,从而大大降低系统的可靠性。为此文章从热传输原理出发,运用ANSYS有限元软件分析印刷电路板(PCB)上关键元件工作时的温度场分布,确定PCB的高温区和低温区。并通过实例计算不同布局的PCB的温度场,通过比较得出较为合理布局方式。优化布局,降低PCB板的最高温度,提高系统的可靠性。     

Influence of environmental temperature on the dynamic properties of a die attached MEMS device

Die attach is one of the major processes that may induce unwanted stresses and deformations into micro-electro-mechanical systems (MEMS). The thermo-elastic coupling between the die and package may affect the performance of MEMS under various temperature loads, causing unreasonable effects of the output signal, such as zero offset, temperature coefficient of offset (TCO), nonlinearity, ununiformity and hysteresis, etc. A complete characterization of these effects is critical for a more reliable design. This work presents experimental studies of the temperature effects on the dynamic properties of MEMS. Microbridges and strain gauges with different dimensions were used as test structures. They were surface-micromachined on test chips and the chips were die attached on organic laminate substrates using epoxy bonding as well as tape adhering. The material and dimension of the substrate were specially defined to amplify the magnitude of the coupled deformation for the convenience of investigation. Modal frequencies of the microbridges under a set of controlled environmental temperature before and after die attach were measured using a laser Doppler vibrometer system. The average initial residual strain was also measured from the strain gauges to help analyze the dynamic behavior. Nonlinear TCO of the frequencies were observed to be as large as 2,500–5,000 ppm for the epoxy-bonded samples, in contrast with much smaller values for the tape-adhered and unpackaged ones. The frequencies recovered to their original values beyond the curing temperature of the epoxy. A distributed feature was also observed in frequencies of the microbridges with the same length but at different locations of the chip with a maximum relative difference of 20%. The process of thermal cycling and wire bonding was also applied to the samples and caused tender shifts of the frequencies. The experiments reveal major factors that are related to the temperature effects of die attached MEMS and the results are useful for improving the reliability of a package–device co-design.     

An integrated simulation for the whole forming process of the picture tube panel

An integrated model for the whole forming operation of the picture tube panel is developed in this paper, which couples the behaviors of glass and mold. The molten glass is modeled by an incompressible Newtonian liquid undergoing flow. And a three-dimensional finite element method is used to perform the simulation of the fluid and heat flow. A local one-dimensional transient analysis in the thickness direction is adopted for the part cooling stage after pressing, which employs the finite-difference method. The mold heat transfer is established by boundary conditions analysis and its numerical implementation is a three-dimensional boundary element method. The glass and mold simulations are coupled by matching the temperature and heat flux on the glass-mold interface. For residual stresses analysis, a thermo-rheologically simple viscoelastic material model is introduced to consider the stresses relaxation effect and to describe the mechanical behavior according to the temperature change. The shrinkage of formed parts induced by the residual stresses is calculated based on the theory of shells, represented as an assembly of flat elements formed by combining the constant strain and the discrete Kirchhoff triangular elements. A thermoelastic model is presented to predict the deformation of the mold blocks during pressing, which is based on the steady mold temperature field and thermoelastic boundary element method.     

A comparison between a linear- and a non-linear three-dimensional thermal analysis of a radial gas turbine wheel

Various rotating components of a gas turbine engine are subjected to high temperatures as well as high centrifugal forces. Abrupt temperature variations often introduce thermal stresses. These must of course be considered when the designer is faced with the problem of predicting the low cycle fatigue life of the relevant component.Particularly at higher temperatures the material behaviour is non-linear and may influence the accuracy of the computed results. Both the thermal conductivity- and the heat capacity properties become more and more temperature-dependent in higher temperature regions. In addition, convective heat transfer at heat exposed surfaces are temperature-dependent.This paper describes a linear- and two non-linear three-dimensional temperature field analyses of a radial gas turbine wheel. In one of the non-linear analyses the material properties were made temperature-dependent, whereas the second non-linear analysis had constant material properties but temperature-dependent heat transfer coefficients.The results obtained show that for the analyzed gas turbine wheel, a linear analysis will produce results which deviate insignificantly from the results obtained in a much costlier non-linear analysis. This is true for material properties and convective heat transfer coefficients that are non-linear only to a moderate extent. It is also fair to assume that this may be concluded for heat conduction problems of the same category, e.g. analysis of other machinery components, nuclear reactor design problems, etc.