Preparation and characteristics of Nb-doped indium tin oxide thin films by RF magnetron sputtering

Niobium-doped indium tin oxide(ITO:Nb)thin films are fabricated on glass substrates by radio frequency(RF)magnetron sputtering at different temperatures.Structural,electrical and optical properties of the films are investigated using X-ray diffraction(XRD),atomic force microscopy(AFM),ultraviolet-visible(UV-VIS)spectroscopy and electrical measurements.XRD patterns show that the preferential orientation of polycrystalline structure changes from(400)to(222)crystal plane,and the crystallite size increases with the increase of substrate temperature.AFM analyses reveal that the film is very smooth at low temperature.The root mean square(RMS)roughness and the average roughness are 2.16 nm and 1.64 nm,respectively.The obtained lowest resistivity of the films is 1.2×10-4?.cm,and the resistivity decreases with the increase of substrate temperature.The highest Hall mobility and carrier concentration are 16.5 cm2/V.s and 1.88×1021 cm-3,respectively.Band gap energy of the films depends on substrate temperature,which is varied from 3.49 eV to 3.63 eV.     

Effects of the ZnO buffer layer and Al proportion on AZO film properties

To evaluate the influence of the ZnO buffer layer and Al proportion on the properties of ZnO: Al (AZO)/ZnO bi-layer films, a series of AZO/ZnO films are deposited on the quartz substrates by electron beam evaporation. The X-ray diffraction measurement shows that the crystal quality of the films is improved with the increase of the film thickness. The electrical properties of the films are investigated. The carrier concentration and Hall mobility both increase with the increase of buffer layer thickness. However, the resistivity reaches the lowest at about 50 nm-thick buffer layer. The lowest resistivity and the maximum Hall mobility are both obtained at 1 wt% Al concentration. But the optical transmittance of all the films is greater than 80% regardless of the buffer layer thickness with Al concentration lower than 5 wt% in the visible region.     

金属有机物化学气相淀积法生长的Si掺杂GaN薄膜的应力，结构与电学特性研究

The stresses, structural and electrical properties of n-type Si-doped GaN films grown by metaiorganic chemical vapor deposition （MOCVD） are systemically studied. It is suggested that the main stress relaxation is induced by bending dislocations in low doping samples. But for higher doping samples, as the Si doping concentration increases, the in-plane stresses in the grown films are quickly relaxed due to the rapid increase of the edge dislocation densities. Hall effect measurements reveal that the carrier mobility first increases rapidly and then decreases with increasing Si doping concentration. This phenomenon is attributed to the interaction between various scattering process. It is suggested that the dominant scattering process is defect scattering for low doping samples and ionized impurity scattering for high doping samples.     

掺杂硅微通道板的帕尔贴效应

The Seebeck coefficient is determined from silicon microchannel plates (Si MCPs) prepared by photo-assisted electrochemical etching at room temperature (25 ℃). The coefficient of the sample with a pore size of 5 × 5 μm², spacing of 1 μm and thickness of about 150 μm is -852 μV/K along the edge of the square pore. After doping with boron and phosphorus, the Seebeck coefficient diminishes to 256 μV/K and -117 μV/K along the edge of the square pore, whereas the electrical resistivity values are 7.5 × 10^-3 Ω·cm and 1.9 × 10^-3 Ω·cm, respectively. Our data imply that the Seebeck coefficient of the Si MCPs is related to the electrical resistivity and is consistent with that of bulk silicon. Based on the boron and phosphorus doped samples, a simple device is fabricated to connect the two type Si MCPs to evaluate the Peltier effect. When a proper current passes through the device, the Peltier effect is evidently observed. Based on the experimental data and the theoretical calculation, the estimated intrinsic figure of merit ZT of the unicouple device and thermal conductivity of the Si MCPs are 0.007 and 50 W/(m·K), respectively.     

Substrate temperature effect on the photophysical and microstructural properties of fluorine-doped tin oxide nanoparticles

Transparent conducting oxide of fluorine-doped tin oxide (FTO) thin films was deposited from chemical solutions of tin chloride and ammonium fluoride using streaming process for electroless and electrochemical deposition (SPEED) at substrate temperature 450, 500, and 530 ℃ respectively. The effect of substrate temperatures on the microstructural properties such as crystallite size, dislocation density, micro strain, volume of the unit cell, volume of the nanoparticles, number of the unit cell, bond length and the lattice constants were examined using XRD technique. Only reflections from (110) and (200) planes of tetragonal SnO₂ crystal structure were obvious. The peaks are relatively weak indicating that the deposited materials constitute grains in the nano dimension. Hall measurements, which were done using van der Pauw technique, showed that the FTO films are n-type semiconductors. The most favorable electrical values were achieved for the film grown at 530 ℃ with low resistivity of 7.64×10^-4Ω·cm and Hall mobility of -9.92 cm²/(V·s).     

RF-MBE Grown AlGaN/GaN HEMT Structure with High Al Content

A Si doped AlGaN/GaN HEMT structure with high Al content (x=43%) in the barrier layer is grown on sapphire substrate by RF-MBE.The structural and electrical properties of the heterostructure are investigated by the triple axis Xray diffraction and Van der PauwHall measurement,respectively.The observed prominent Bragg peaks of the GaN and AlGaN and the Hall results show that the structure is of high quality with smooth interface.The high 2DEG mobility in excess of 1260cm2／（V·s） is achieved with an electron density of 1.429e13cm－2 at 297K,corresponding to a sheet-densitymobility product of 1.8e16V－1·s－1.Devices based on the structure are fabricated and characterized.Better DC characteristics,maximum drain current of 1.0A/mm and extrinsic transconductance of 218mS/mm are obtained when compared with HEMTs fabricated using structures with lower Al mole fraction in the AlGaN barrier layer.The results suggest that the high Al content in the AlGaN barrier layer is promising in improving material electrical properties and device performance.     

Intrinsic Limits of Electron Mobility in Modulation-Doped AlGaN/GaN 2D Electron Gas by Phonon Scattering

We theoretically present the intrinsic limits to electron mobility in the modulation-doped AIGaN/GaN two-dimensional electron gas （2DEG） due to effects including acoustic deformation potential （DP） scattering, piezoelectric scattering （PE）, and polar-optic phonon scattering （POP）. We find that DE and PE are the more significant limiting factors at intermediate temperatures of 40 K to 250 K, while POP becomes dominant as room temperature is approached. Detailed numerical results are presented for the change of electron mobility with respect to temperature and carrier density. We conclude that these three types of phonon scattering, which are generally determined by the material properties but not the technical processing, are hard limits to the 2DEG mobility.     

Top Contact Pentacene Organic Thin Film Field Effect Transistors

Using pentacene as an active material, the organic thin film transistors were fabricated on Si_(3)N_(4)/p-Si substrates by using RF-magnetron sputtered amorphous aluminium as the gate electrode contact, and using highly doped Si as the gate electrode and substrate with plasma-enhanced chemical vapor deposited (PECVD) silicon nitride as gate dielectric. Pentacene thin films were deposited by thermal evaporation on dielectrics as the active layer, then RF-magnetron sputtered amorphous aluminium was used as the source and drain contacts. Measurement results show that field effect mobility and threshold voltage are 0.043 cm~2/(V·s) and 12.6 V, respectively, and on-off current ratio is nearly 1×10~(3).     

INFLUENCE OF LASER RECRYSTALLIZATION AND HYDROGEN ANNEALING ON ELECTRICAL CHARACTERISTICS OF POLYSILICON

Asenic ions are implanted with doses of 5×10~(11)—5×10~(15)/cm~2 into LPCVD polysilicon films onSiO_2 isolating substrate.The polysilicon films have been recrystallized with CW Ar~+ laser beforeimplantation.Electrical measurements show that the resistivity is lowered and the mobility is increasedsignificantly at low doping concentration(～10~(17)As~+/cm~3).Plasma     

Residual Strain and Electronic Characteristics of Si-doped GaN

The residual strain and the damage induced by Si implantation in GaN samples have been studied, as well as the electronic characteristics. These as-grown samples are implanted with different doses of Si（1 × 10^14 cm^-2, 1×10^15 cm^-2 or ] × 10^16 cm^-2, ]00 keV） and following annealed by rapid thermal anneal（RTA） at 1 000℃ or 1 100℃ for 60 s. High resolution X-ray diffractometer（HRXRD） measurement reveals that the damage peak induced by the implantation appears and increases with the rise of the impurity dose, expanding the crystal lattice. The absolute value of biaxial strain decreases with the increase of the annealing temperature for the same sample. RT-Hall test reveals that the sample annealed at 1 100℃ acquires higher mobility and higher carrier density than that annealed at 1 000 ℃, which reflects that the residual strain（or residual stress） is the main scattering factor. And the sample C3（1 × 10^16 cm^-2 and annealed at 1100 ℃） acquires the best electronic characteristic with the carrier density of 3.25 × 10^19 cm^-3 and the carrier mobility of 31 cm2/（V·S）.     

银掺杂氧化亚铜薄膜的制备及其光电性能

采用水热法以Cu片为基底,Cu(NO_3)_2为铜源,十二烷基苯磺酸钠(SDBS)为添加剂,通过调节Ag^+浓度,制备不同Ag掺杂Cu_2O(Ag/Cu_2O)薄膜。研究了样品的光电性能及电容-电压特性等,并用X射线衍射(XRD)、扫描电子显微镜(SEM)和能谱仪(EDS)对其晶体结构、形貌及组成进行了表征。结果表明,当体系中Ag^+浓度为0.03 mmol/L时,Ag/Cu_2O薄膜的光电性能最佳,光电压和光电流密度分别为0.458 5 V和3.011 mA·cm^-2,比Cu_2O薄膜分别提高了0.205 1 V和1.359 mA·cm^-2;Ag/Cu_2O薄膜的载流子浓度达到3.10×10²⁰ cm^-3,比Cu_2O薄膜提高了2.38×10²⁰ cm^-3。XRD,SEM和EDS结果显示,Ag/Cu_2O薄膜的结晶性比Cu_2O薄膜好,但其粒径有所增大,Ag/Cu_2O薄膜中Ag元素的原子数分数为0.13%。     

电子束沉积技术生长WZO-TCO薄膜及其特性研究

采用电子束沉积技术生长w掺ZnO（WZO,ZnO：w）透明导电氧化物（TCO）薄膜（即WZO-TCO薄膜）并研究了衬底温度（100-350℃）对薄膜微观结构、表面形貌以及光电性能的影响。实验表明,随着衬底温度的升高,薄膜的晶体质量取得明显改善（从非晶化状态转变到结晶状态）,生长的WZO薄膜呈现C轴择优取向[即（002）...     

基于溶液法的金属诱导碟型晶畴多晶硅薄膜和薄膜晶体管的研究

以非晶硅为晶化前驱物,采用镍盐溶液浸沾的方法可以得到超大尺寸碟型晶畴结构的低温多晶硅薄膜.所得多晶硅薄膜的平均晶畴尺寸大约为50 μm,空穴的最高霍尔迁移率为30.8 cm~2/V·s,电子的最高霍尔迁移率为45.6 cm~2/V·s.用这种多晶硅薄膜为有源层,所得多晶硅TFT的场效应迁移率典型值为70～80 cm~2 /V·s,亚阈值斜摆幅为1.5 V/decade,开关电流比为1.01×10~7,开启电压为-8.3 V.另外,P型的TFT在高栅偏压和热载流子偏压下具有良好的器件稳定性.     

B—implantation and Annealing for SiGe Epilayers^①②

Si0.8Ge0.2strained epilayer were grown on Si substrates by rapid thermal process/very low pressure-chemical vapor deposition(RTP/VLP-CVD)and implanted with boron at 40keV,a dosage of 2.5×10^4cm^-2.Rapid thermal annealing(RTA)and steady-state furnace annealing with different temperature and time period were performed for comparison.Results indicate that RTA is better than furnace annealing.After RTA at750℃-850℃ for 10 s or at 700℃for 40s，the implantation induced damage can be removed,the carrier mobility was about 300cm^2/V·s and the activity was nearly 100%.     

钝化处理对Al2O3/InP MOS电容界面特性的影响

制备了Al/Al_2O_3/InP金属氧化物半导体(MOS)电容,分别采用氮等离子体钝化工艺和硫钝化工艺处理InP表面。研究了在150、200和300 K温度下样品的界面特性和漏电特性。实验结果表明,硫钝化工艺能够有效地降低快界面态,在150 K下测试得到最小界面态密度为1.6×10¹⁰ cm^-2·eV^-1。与硫钝化工艺对比,随测试温度升高,氮等离子体钝化工艺可以有效减少边界陷阱,边界陷阱密度从1.1×10¹² cm^-2·V^-1降低至5.9×10¹¹ cm^-2·V^-1,同时减少了陷阱辅助隧穿电流。氮等离子体钝化工艺和硫钝化工艺分别在降低边界陷阱和快界面态方面有一定优势,为改善器件界面的可靠性提供了依据。     

退火温度对SnF2掺杂SnO2薄膜性能的影响

利用电子束蒸镀技术在石英玻璃上沉积SnF2掺杂SnO2(FTO)薄膜.研究了不同退火温度对FTO薄膜结构和光电性能的影响.研究结果表明:升高退火温度可促进FTO薄膜中晶粒逐渐变大,结晶度变好,同时薄膜在可见光范围内的透射率随着退火温度升高逐渐增加,吸收边发生蓝移,禁带宽度显著变宽,这是由于载流子浓度增加导致的Moss-Burstein效应.升高温度时,薄膜电学性能随着退火温度升高有了很大改善,700℃退火处理后得到电阻率低至2.74×101 Ω·cm、载流子浓度为2.09×1020 cm-3、迁移率为9.93 cm2·V 1·s 1的FTO薄膜.     

电子束沉积In2O3基W-Mo共掺薄膜的特性研究

利用电子束反应沉积技术制备了高迁移率I2O3基W-Mo共掺(IMWO,I<,2>O<,3>:WO<,3>/MoO<,3>)薄膜,研究了不同等量WO<,3>-MoO<,3>掺杂浓度对薄膜的微观结构、光学性能和电学性能的影响.IMWO薄膜的表面形貌呈现"类金字塔"型.随着WO<,3>-MoO<,3>共掺量的增加,IMWO薄...     

高纯SiC粉料中杂质浓度的控制和测试

采用燃烧合成法制备碳化硅(SiC)粉料,调整氢气和氩气体积流量比以及高纯氯化氢气体体积流量,使氮、铝和钒浓度低于二次离子质谱仪的检测下限,硼和钛浓度接近检测下限。使用制备的高纯SiC粉料生长单晶,获得电阻率大于1×10^9Ω·cm的衬底,粉料达到高纯半绝缘水平。通过研究发现,增加氢气体积流量可以降低粉料中的氮浓度,并使氮浓度低于检测限1×10^16 cm^-3,但是氢气体积流量过高会加重坩埚损耗,影响坩埚寿命和工艺稳定性;高纯氯化氢气体可以降低粉料中硼、铝、钒和钛的浓度,但其体积流量不宜过大,否则会引入新的氮杂质;粉料的色度a^*值与氮浓度呈反比关系,利用分光色差仪测试色度a^*值判断粉料氮浓度高低。     

Electron Mobility of Doped Strained Si1-x Gex Alloys Grown on Si(100) Substrate^①②

The electron mobility for strained Si1-xGex alloy layer grown on Si(100) substrate has been calculated for doping rage of 10^17 cm^-3 to 10^20 cm^-3with Ge contents of 0.0≤x≤1.0.The results show a decrease in the mobility with increasing of Ge content and doping concentration.The electron mobility in-plane is foud to be smaller than the perpendicular component.     

Depletion Mode HEMT with Refractory Metal Silicide WSi Gate

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