共查询到20条相似文献,搜索用时 109 毫秒
1.
GaAs MESFET和HEMT的中子辐射效应研究 总被引:2,自引:1,他引:1
本文介绍了GaAs MESFET和HEMT的中子辐射效应。依据中子辐射损伤机理,分析了器件参数与中子辐射剂量Φ的依从关系,其中,器件参数包括物理参数ND、NS、VS,μ和电参数IDS、gm、Vp、G等。 相似文献
2.
3.
4.
借助一新的工艺模拟与异质器件模型用CAD软件──POSES(Poisson-SchroedingerEquationSolver),对以AlGaAs/InGaAs异质结为基础的多种功率PHEMT异质层结构系统(传统、单层与双层平面掺杂)进行了模拟与比较,确定出优化的双平面掺杂AlGaAs/InGaAs功率PHEMT异质结构参数,并结合器件几何结构参数的设定进行器件直流与微波特性的计算,用于指导材料生长与器件制造。采用常规的HEMT工艺进行AlGaAs/InGaAs功率PHEMT的实验研制。对栅长0.8μm、总栅宽1.6mm单胞器件的初步测试结果为:IDss250~450mA/mm;gm0250~320mS/mm;Vp-2.0-2.5V;BVDS5~12V。7GHz下可获得最大1.62W(功率密度1.0W/mm)的功率输出;最大功率附加效率(PAE)达47%。 相似文献
5.
本文主要论述了英国EEV,美国VariansEimacDivision和WestinghouseElec-tricCorp.以及法国Thomson四家公司在NAB97展示的数字HDTV发射管最新产品:四极管,MSR:速调管,SiC固态器件,IDT和双端四极管Diacrode的主要技术性能,同时也介绍了上述五种HDTV发射管在数字HDTV发射机中的应用实例。 相似文献
6.
用PECVD氮化硅薄膜对GaAs MESFET进行钝化,本文讨论了钝化对器件特性的影响,提出了一种改善GaAs器件表面的方法,结果表明利用该方法和PECVD氮化硅钝化膜改善了器件的栅漏击穿电压。 相似文献
7.
本文主要论述了英国EEV,美国Varian‘sEimacDivision和WestinghouseElectricCorp。以及法国Thomson四家公司在NAB97展示的数字HDTV发射管最新呷极管、MSDC速调管,SiC固态器件,IOT和双端四极管Diacrode的主要技术性能,同时也介绍了上述五种HDTV发射管在数字HDTV发射机中的应用实便。 相似文献
8.
在介绍卫星天然辐射环境和人工核爆辐射环境的基础上,着重分析应用于卫星电子系统中的微电子器件的辐射效应,包括电离辐射效应、瞬态辐射效应和中子辐射效应,并归纳出各种器件抗辐射加固的主要途径和具体方法。涉及的器件包括:CMOS/体硅电路,CMOS/SOS电路,GaAsMESFET及其电路,电荷耦合器件等。 相似文献
9.
星用微电子器件辐射效应及加固途径分析 总被引:3,自引:1,他引:2
在介绍卫星天然辐射环境和人工核爆辐射环境的基础上,着重分析应用于卫星电子系统中的微电子器件的辐射效应,包括电离辐射效应,瞬态辐射效应和中子辐射效应,并归纳出各种器件抗辐射加固的主要途径和具体方法,涉及的器件包括:CMOS/体硅电路,CMOS/SOS电路,GaAsMESFET及其电路,电荷耦合器件等。 相似文献
10.
阐述了功率GaAsMESFET器件热阻测试中温敏参数VGSF和测试电流Im的选取,给出了1~5W器件典型温敏参数的温度测试系数M与测试电流Im的关系。讨论了测试延迟时间tmd对△VGSF测量值的影响和三种校正方法。 相似文献
11.
建立了GaN HEMT器件(氮化镓高电子迁移率晶体管)中子原位测试技术和辐照效应实验方法,开展了GaN HEMT器件脉冲反应堆中子辐照效应实验研究,重点研究了电离辐射和位移损伤对器件性能退化的影响,获取了GaN HEMT中子位移损伤效应敏感参数和效应规律.结果表明,阈值电压、栅极泄漏电流以及漏极电流是中子辐照损伤的敏感... 相似文献
12.
A new one-dimensional (1-D) device model developed for the simulation of neutron radiation effects in silicon avalanche photodiodes is described. The model uses a finite difference technique to solve the time-independent semiconductor equations across a user specified structure. The model includes impact ionization and illumination allowing accurate simulation with minimal assumptions. The effect of neutron radiation damage is incorporated via the introduction of deep acceptor levels subject to Shockley-Read-Hall statistics. Preliminary analysis of an EG&G reverse APD structure is compared with experimental data from a commercial EG&G C30719F APD 相似文献
13.
Sh. M. Eladl 《Microelectronics Journal》2009,40(1):193-196
The ionizing radiation effect on the static and dynamic behavior of an optoelectronic-integrated device composed of a hetrojunction phototransistor and light-emitting diode is studied theoretically. First, the device characteristics before irradiation are investigated based on the equivalent circuit of the constituent devices and the optical feedback inside the device. Second, the effect of neutron irradiation flux on transient behavior of this device is theoretically studied. It was noticed that, the neutron irradiation flux reduces the transient response in both the amplification and switching modes. Also, neutron irradiation flux increases the switching voltage of the device and decreases the output current, this means that the ON state device which exposed to this irradiation flux will turn to the OFF state because it will need higher value of switching voltage. Either increasing the amount of input light or the applied voltage is required to turn the device to the ON state again. This type of models can be exploited as optical amplifier, optical switching device and other applications. 相似文献
14.
15.
K. SubramanianW.P. Kang J.L. Davidson N. GhoshK.F. Galloway 《Microelectronic Engineering》2011,88(9):2924-2929
This paper describes the electrical characteristics of lateral field emission vacuum microelectronic devices comprised of nanodiamond in two terminal (diode) and three terminal (transistor) cathode-gate-anode configuration and their resistance to failure in severe radiation conditions that would shut down conventional solid state electronics. This is the first published data on radiation tolerance of three terminal diamond vacuum lateral field emission devices. No changes in device structure or electrical behavior were observed after exposure to high levels of X-ray or neutron radiation. 相似文献
16.
S. S. Arutyunyan K. A. Kagirin D. V. Lavrukhin S. A. Gamkrelidze N. E. Ivanova 《Russian Microelectronics》2017,46(7):489-493
The radiation stability of AlGaN/GaN HEMT millimeter-wave signal converters with highly mobile electrons irradiated by neutron and gamma radiation is investigated. The following characteristics have been chosen as the parameters for estimating the stability: the output microwave signal range, conversion factor, and the total consumed current. The consumed current dependence on the absorbed dose of gamma radiation and the sample temperature is determined. It is shown that the effect of neutron irradiation upon the characteristics is insignificant, although the gamma irradiation results in a considerable increase of the current consumed due to the formation of nitrogen donor vacancies, annealing of growth acceptor defects, and defect ordering. Six months later, the parameters of the devices returned to the initial values, indicating the restoration of the original state of the substrate’s crystal structure. 相似文献
17.
分析了CCD电离效应和位移损伤机理,建立了一种国产埋沟CCD器件物理模型,实现了CCD信号电荷动态转移过程的数值模拟,计算了1MeV、14MeV中子引起的CCD电荷转移效率的变化规律.建立了线阵CCD辐照效应离线测量系统,实现了CCD辐射敏感参数测试.利用Co-60γ源和反应堆脉冲中子,开展了商用器件总剂量和中子位移损伤效应模拟试验,在不同辐照条件下,给出了暗电流信号、饱和电压信号、电荷转移效率以及像元不均匀性的变化情况. 相似文献
18.
硅光电二极管快中子和氧离子的辐照效应 总被引:4,自引:0,他引:4
研究了硅光电二极管经快中子(注入剂量为10^11cm^-2,能量2.45MeV)和O^+++(注入剂量为10^10cm^-2,能量12MeV)辐照后光电参数的变化规律,并通过光谱光电流的变化,对辐照损伤的空间分布进行了分析。结果表明,两种辐照垃引起器件的光电流下降,暗电流增加,在本实验条件下,快中子造成的损伤轻微且均匀地分布在整个器件体内,而O^+++,辐照损伤区集中在器件表面附近,其损伤国快中子 相似文献
19.