钢基板厚膜环形电位器的研制

传统的陶瓷基板厚膜环形电位器不能承受高过载。选用不锈钢板作为基板材料,被覆绝缘介质,在其上印制厚膜电路,然后烧结,制作了钢基板厚膜环型电位器。该电位器经过温度循环、抗过载、机械强度和动态射击试验,结果表明:被覆绝缘介质不锈钢基板厚膜环型电位器具有过载值高(18000~20000g)、动态电阻装定精度高(误差小于1%)等优点,满足高过载使用要求。     

半导体用陶瓷绝缘基板成型方法研究

陶瓷材料是半导体器件,特别是大功率半导体器件绝缘基板的重要材料体系。随着半导体器件向大功率化、高频化的不断发展,对陶瓷绝缘基片的导热性和力学性能都提出了更高的要求。成型是陶瓷基板的制备过程的关键环节,也是陶瓷基板制备的难点。本文介绍了流延成型、凝胶注模成型和新型3D打印成型等几种基板成型方法,分析了不同成型方法的特点、优势及技术难点。介绍了了近年来国内外陶瓷基板成型的研究现状,并对其未来发展及应用进行了展望。     

混合导体LTCC基板可靠性研究

从混合导体LTCC基板的微观结构,导体的附着力,导体键合强度,多层互连导带电阻以及基板绝缘电阻等方面,对混合导体LTCC基板的可靠性进行了分析研究。结果表明:基板内部的银导体不存在迁移现象,导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。     

不锈钢基高导热板材表面处理工艺研究

不锈钢基高导热板材因其优良的耐酸碱性和磁吸附性,成功取代了铜基和铝基等常用高导热金属基板材在特殊应用领域如海洋基建设施,船舶工业等易受酸碱侵袭环境下的应用;而在整个不锈钢基板生产制作过程中,不锈钢基板热应力分层起泡问题是困扰业内各生产厂家的一大难点;本文以不锈钢为研究对象,通过从化学和物理角度两个方面对比不同的不锈钢表面处理方式,对其分层起泡问题的改善作用;最后选择了一种钢材粗化、涂布偶联剂＋半固化片相结合的表面处理方式,可以从根本上杜绝不锈钢板分层起泡问题。     

不锈钢基厚膜介质浆料烧结致密化研究

介质浆料的烧结致密化程度对不锈钢基板的绝缘性能具有至关重要的影响。以CaO-Al2O3-SiO2系玻璃为研究对象,制备不锈钢基片用介质浆料,研究该介质浆料的烧结致密化工艺。结果表明在CaO含量为45%,平均粒度为2~3μm的玻璃粉所调制的介质浆料,烧结温度为870℃,烧结时间为10~20min的条件下,获得致密化的介质浆料。     

新产品与新技术（81）

封装基板和积层绝缘新材料     

低温烧成多层陶瓷基板

低温烧成多层陶瓷基板被作为第五代电子元件组装用基板而受到极大重视。本文概述了该基板的开发情况,介绍了它的制造技术,扼要分析了这种基板的主要性能,简述了基板的应用情况。实践表明,要制成性能优异的基板,除了选择合适的材料,采用先进的工艺技术和进行严格操作外,还要解决多层基板高密度、高强度、高绝缘、降低膨胀系数以及控制收缩等许多技术问题。     

T-材料实用性能指南--第一部分:IMPCB性能和可靠性的设计准则

绝缘金属印制板(IMPCB),在电源和导热用途方面,可以替代标准FR-4板或陶瓷基板。IMPCB类材料也就是被称为IMST(绝缘金属基板技术)、MCS(金属芯基板)、HITT金属板和IMS(绝缘金属基板)的总称。该技术作为IMST于20世纪七十年代晚期,在日本已被开发,现已广泛地用于大量的商业和工业产品中,包括功率放大器、电源、马达控制器、HVTV偏转器、UPS、电池充电器、焊接器等。 其基本结构是在铜箔线路和金属基板之间有一薄介质层。其首要技术是在介质材料方面,它必须提供良好的导热率和良好的介电绝缘。该T-Preg介质使用优良的导热填料,它提供格外的导热性能,不致使介质太薄,也没有过多的填料含量。因此,该T-PREG具有许多     

高性能PCB用热塑性树脂膜“IBUKI”

概述了耐热性、尺寸稳定性、高频特性,一次多层性和异种材料粘结性优良的热可塑性树脂膜“IBUKI”的开发。它适用于无芯全层IVH一次多层板,嵌入LSI一次多层板、空腔基板、复合基板和弯曲基板之类的高性能PCB用绝缘基材。     

国外厚薄膜电路水平综述——薄膜电路材料(三)

<正> 一、基板材料 薄膜电路早先采用的基板材料有玻璃、氧化硅、涂釉氧化铝、闪光氧化铝、抛光氧化铝、氧化铍和兰宝石等。近几年来,由于薄膜技术的发展以及薄膜混合IC对元件的要求不断提高,新的基板材料也不断出现,如硅片、绝缘金属基板、珐琅基板、聚酰亚胺和聚四氟乙烯塑料基板等等。     

Zeolite‐Coated Porous Arrays: A Novel Strategy for Enzyme Encapsulation

Zeolite Beta‐coated stainless steel supports with gradient porosity are employed as filter‐panels for lipase encapsulation. Enzyme encapsulation on the stainless steel porous discs is achieved via vacuum infiltration. Subsequently, two lipase‐encapsulated zeolite Beta‐coated stainless steel discs are attached using an adhesive. The zeolite Beta layer on the stainless steel discs largely prevents lipase leaching in comparison to the stainless steel discs without a zeolite layer. The activity of the lipase‐encapsulated, attached zeolite Beta‐coated stainless steel porous discs depends on the thickness of the zeolite Beta layer. It is shown that the biocatalytic performance of the lipase‐encapsulated, attached zeolite Beta‐coated stainless steel supports with a zeolite Beta layer thickness of ≈0.7–1 μm is better than the lipase‐encapsulated, attached zeolite Beta‐coated stainless steel supports with a zeolite Beta layer thickness of ≈2–3 μm in the lipase‐catalyzed transesterification of vinyl propionate with 1‐butanol using n‐hexane as solvent.     

Characterization of environmental stability of pulsed laser deposited oxide ceramic coatings

A systematic investigation of candidate hydrogen permeation materials deposited on various substrates using pulsed laser deposition (PLD) has been performed. The investigation focused on application of leading permeation-resistant material types on stainless steel substrates and evaluation of the stability of the deposited coatings. Type 304L stainless steel substrates were coated with aluminum oxide, chromium oxide, and aluminum. Characterization of the coating-substrate system adhesion was performed using scratch adhesion testing. Coating stability and environmental susceptibility were evaluated for two conditions—air at 350°C and Ar-H₂ at 350°C for up to 100 h. Results from this study have shown these coatings to be robust and the pulsed laser deposition process to be an extremely versatile technology.     

金属/BAS微晶玻璃复合基板的制备与性能研究

制备了与0Cr18Ni9不锈钢热膨胀相匹配的Ba-Al-Si系微晶玻璃,利用流延法将玻璃制成生瓷带。在不锈钢板表面生瓷带经温压烧结后形成金属/微晶玻璃复合基板。电气性能测试结果,介质层厚度>73.5μm时,击穿电压>1.28kV,泄漏电流<0.05mA;微晶玻璃膨胀系数为10×10–6/℃。     

激光功率对镀Cu-Ni低碳钢/不锈钢焊点性能的影响

为了研究激光功率对不锈钢与铜-镍镀层低碳钢激光焊点性能的影响,采用300W的Nd∶YAG激光器焊接不锈钢与铜-镍镀层低碳钢,用光学显微镜观察焊点并测量尺寸,用万能拉伸试验仪测试焊点结合强度。结果表明,随着激光功率的增加,低碳钢一侧焊点截面的尺寸增加。在焊点边缘原镀层区域附近富集的铜会导致裂纹的产生,而激光功率的变化并不能消除焊点边缘铜的富集。激光功率的增加,焊接模式由热导焊向深熔焊过渡,导致焊点的尺寸显著增加,焊点的结合强度提高。该结果对于研究激光功率对铜镍镀层低碳钢/不锈钢激光点焊是有帮助的。     

Poly-Si thin-film transistors on steel substrates

We report the successful fabrication of poly-Si thin-film transistors (TFTs) on stainless steel substrates. The TFTs were fabricated on a 500 μm thick polished stainless steel substrate using furnace crystallized amorphous Si deposited by PECVD. These devices typically have threshold voltages of 8.6 V, linear effective mobilities of 6.2 cm²/V·s and subthreshold slopes of 0.93 decade/V. This work demonstrates the feasibility of poly-Si TFTs on stainless steel substrates and identifies some critical issues involved in poly Si processing on stainless steel. This will enable the fabrication of arrays with integrated drivers on a cheap, flexible and durable substrate for various displays and other large area array microelectronic applications     

厚膜电路式电热元件的金属基片技术

综述了厚膜混合电路用金属基片的技术要求,介绍了基于430不锈钢的有关介质浆料的特性,列举了金属基片在电热元件上的应用。     

Anodic bonding of glass-ceramics to stainless steel coated with intermediate SiO2 layer

The anodic bonding between glass-ceramics and stainless steel (No. 430#) which was coated with SiO₂ layer were investigated. The SiO₂ layers with thickness comprised between 150 and 250 nm were coated on stainless steel surfaces by sol-gel method, the bonding process was achieved at 350 °C and 800 V for 45 min under atmosphere. The micro-topography and the compositions of the bonding interfaces were investigated by XRD, SEM and EDS. The results indicated SiO₂ layers could help the formation of the bonding with glass-ceramics to stainless steel, lithium iron oxide (LiFeO₂) was observed on the surface of glass-ceramics after bonding, and the bonding strength increased with increasing bonding temperature or voltage.     

Investigation of magnetic properties of 2223-BSCCO steel-reinforced tapes

Reinforcing multifilamentary Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/Oy (2223-BSCCO) requires careful evaluation of magnetic losses and, in general, of the quantities related to the hysteresis loop (e.g., coercive field and residual magnetization). In this paper, the results of magnetic quantity measurements performed on superconductive tapes reinforced by both AISI 304 and AISI 316 stainless steel layers are discussed. It is shown that the former kind of steel has power losses higher than the latter. Therefore, from this point of view AISI 316 constitutes a better solution than AISI 304 to reinforce BSCCO-Ag tapes. Comparative measurements performed on the steel layer, the superconductor, and the reinforced tape, separately, allow the different contributions to the total magnetic loss to be singled out. In this way, a relationship between the induced voltages in one single steel layer, in a BSCCO-Ag tape without steel, and in the reinforced structure (BSCCO + 2 steel layers) is derived.