未掺杂CdZnTe与掺铟CdZnTe晶体的热处理

对于未掺杂Cd0.9Zn0.1Te晶片,采用在Cd/Zn气氛下,以In作为气相掺杂源进行热处理;而对于低阻In-Cd0.9Zn0.1Te晶片,则采用在Te气氛下进行热处理.分别研究了不同的热处理条件,包括温度、时间、pIn或pTe等对晶片电学性能、红外透过率以及Te夹杂/沉淀相的影响.结果表明,在Cd/Zn气氛下适当的掺In热处理和在Te气氛下适当的热处理均有效地提高了晶片的电阻率,分别达到2.3×1010和5.7×109Ω·cm,同时晶片的其他性能也得到明显改善.     

未掺杂CdZnTe与掺铟CdZnTe晶体的热处理

对于未掺杂Cd0.9Zn0.1Te晶片,采用在Cd/Zn气氛下,以In作为气相掺杂源进行热处理;而对于低阻In-Cd0.9Zn0.1Te晶片,则采用在Te气氛下进行热处理.分别研究了不同的热处理条件,包括温度、时间、pIn或pTe等对晶片电学性能、红外透过率以及Te夹杂/沉淀相的影响.结果表明,在Cd/Zn气氛下适当的掺In热处理和在Te气氛下适当的热处理均有效地提高了晶片的电阻率,分别达到2.3×1010和5.7×109Ω·cm,同时晶片的其他性能也得到明显改善.     

高阻CdZnTe晶体的退火处理

获得高电阻率的、完整性好的 Cd Zn Te晶体是研制高性能的 Cd Zn Teγ射线探测器的关键 .运用热力学关系估算了 Cd1 - x Znx 熔体平衡分压 ,尝试以 Cd1 - x Znx 合金源替代 Cd源进行 Cd0 .8Zn0 .2 Te晶片的热处理 ,研究了退火对 Cd0 .8Zn0 .2 Te晶片质量的影响 .结果表明 :在 10 6 9K下用 Cd0 .8Zn0 .2 合金源 (PZn=0 .12 2e5 Pa和 PCd=1.2 0e5 Pa)对 Cd0 .8Zn0 .2 Te晶片退火 5天以上 ,可提高晶体电阻率一个数量级和晶体红外透过率 10 %以上 ,并可消除或减小晶片中的 Te沉淀 ,同时避免了 Zn的损失 ,改善 Zn的径向分布 .可见 ,采用 Cd1 - x Zn     

HgCdTe分子束外延In掺杂研究

报道了用 MBE方法生长掺 In的 n型 Hg Cd Te材料的研究结果 .发现 In作为 n型施主在 Hg Cd Te中电学激活率接近 10 0 % ,其施主电离激活能至少小于 0 .6 m e V.确认了在制备红外焦平面探测器时有必要将掺杂浓度控制在～ 3× 10 1 5 cm- 3水平 .比较了高温退火前后 In在 Hg Cd Te中的扩散行为 ,得出在 40 0℃温度下 In的扩散系数约为10 - 1 4 cm2 / s,并确认了 In原子作为 Hg Cd Te材料的 n型掺杂剂的可用性和有效性 .     

高阻CdZnTe晶体的退火处理

获得高电阻率的、完整性好的CdZnTe晶体是研制高性能的CdZnTe γ射线探测器的关键.运用热力学关系估算了Cd1-xZnx熔体平衡分压,尝试以Cd1-xZnx合金源替代Cd源进行Cd0.8Zn0.2Te晶片的热处理,研究了退火对Cd0.8Zn0.2Te晶片质量的影响.结果表明：在1069K下用Cd0.8Zn0.2合金源（PZn=0.122×105Pa和PCd=1.20×105Pa）对Cd0.8Zn0.2Te晶片退火5天以上,可提高晶体电阻率一个数量级和晶体红外透过率10%以上,并可消除或减小晶片中的Te沉淀,同时避免了Zn的损失,改善Zn的径向分布.可见,采用Cd1-xZnx合金源代替Cd源控制进行CZT退火处理优于仅采用Cd源控制的退火处理.     

HgCdTe分子束外延In原子的掺杂特性

报道了用 MBE方法生长掺 In N型 Hg Cd Te材料的研究结果。发现 In作为 N型施主在 Hg Cd Te中的电学激活率接近 1 0 0 % ,其施主电离激活能至少小于 0 .6me V。确认了在制备红外焦平面探测器时有必要将掺杂浓度控制在约 3× 1 0 1 5cm- 3水平。比较了高温退火前后 In在 Hg Cd Te中的扩散行为 ,得出在 40 0°C温度下 In的扩散系数约为 1 0 - 1 4cm2 / sec,确认了 In原子作为 Hg Cd Te材料的 N型掺杂剂的可用性和有效性     

加压布里奇曼法生长大直径HgCdTe晶体

根据加压改进布里奇曼法 ,采用“二次配料”工艺成功地生长了直径 40 mm的大直径 Hg Cd Te (组分 x≈0 .2 0 )晶体 .采用加压技术 ,平衡部分石英安瓶内的高汞蒸汽压 ,有效地避免了石英安瓶的爆裂 ;采用“二次配料”工艺 ,大大降低了生长温度 ;合理选择温度梯度和生长速度 ,获得了有较好结晶性和组分均匀性的 Hg Cd Te晶体 .分析表明 :Hg Cd Te晶片的载流子浓度 n77≤ 4× 10 1 4 cm- 3 ,迁移率 μ77≥ 1× 10 5 cm2 /(V· s) ,少数载流子寿命值 τ≥ 2 .0 μs,80 K时简单的性能测试用光导探测器件的探测率 D*为 1.1× 10 1 0 cm· Hz1 /2 /W.     

新型稀磁半导体Cd1-xMnxIn2Te4的光学和磁学性能

采用垂直Bridgman法制备出了x＝0.1、0.22和0.4的Cd1-xMnxIn2Te4晶体.采用红外透射光谱法研究了晶体的红外光学特性.用超导量子磁强计测量了样品在温度范围5～300K和磁场强度范围0～5T内的磁化强度.在中红外波段透过率曲线变化很小.随着x的增加Cd1-xMnxIn2Te4的光学带隙移向高能端.磁化率倒数χ-1与温度T的关系曲线在高温区服从居里-万斯定律,在低温下x≥0.22时向下偏离该定律.与具有相同Mn2+浓度的Cd1-xMnxTe晶体相比Cd1-xMnxIn2Te4晶体的交换积分常数较小.     

新型稀磁半导体Cd1-xMnxIn2Te4的光学和磁学性能

采用垂直Bridgman法制备出了x＝0.1、0.22和0.4的Cd1-xMnxIn2Te4晶体.采用红外透射光谱法研究了晶体的红外光学特性.用超导量子磁强计测量了样品在温度范围5～300K和磁场强度范围0～5T内的磁化强度.在中红外波段透过率曲线变化很小.随着x的增加Cd1-xMnxIn2Te4的光学带隙移向高能端.磁化率倒数χ-1与温度T的关系曲线在高温区服从居里-万斯定律,在低温下x≥0.22时向下偏离该定律.与具有相同Mn2+浓度的Cd1-xMnxTe晶体相比Cd1-xMnxIn2Te4晶体的交换积分常数较小.     

MnxCd1-xIn2Te4晶体生长及其性能研究

采用ACRT-B法生长了四元稀磁半导体化合物Mn0.1dCd0.9In2dTe4晶体。采用扫描电镜、X射线衍射仪、ISIS能谱仪、Leica定量金相分析仪以及傅里叶变换红外光谱仪研究了晶体中相的结构，形貌、成分及晶片的红外透射光谱。发现晶体生长初始端由于溶质再分配而引起成分偏离配料比，结果出现三种相：α相、β相和β1相，其中α相和β相是在晶体生长过程中形成的，随温度降低，从α相中又析出β1相，当晶体生长到稳定段，完全形成β相，Mn0.1Cd0.9In2Te4晶体从生长初始端到接近稳态区，β1相内规则排列状向不规则排列的近似圆片状发展。禁带宽度为1.2eV的Mn0.1Cd0.9In2Te4在10000～4000cm^-1的近红外波数范围内，其透过率最高达83%，在4000～5000cm^-1的中红外波数范围内透过率为59%～65%。     

Transport properties of undoped Cd0.9Zn0.1Te grown by high pressure bridgman technique

The electron drift mobility of undoped Cd_0.9Zn_0.1Te grown by high-pressure Bridgman method is measured by a time-of-flight technique. The sample shows a room temperature mobility and mobility lifetime product of 950 cm²/Vs and 1.6 × 10⁻⁴cm²/V, respectively. The mobility increases monotonically with decreasing temperature to 3000 cm²/Vs at 100 K. The dominant scattering mechanism for the electron transport is discussed by comparing with the theoretical mobility obtained by iterative solution of the Boltzmann equation.     

The annealing of Cd1−xZnxTe in CdZn vapors

As-grown CdZnTe usually contains defects, such as twins, subgrain boundaries, dislocations, and Te precipitates. It is always important to anneal CdZnTe slices in Cd vapor to eliminate these defects, especially Te precipitates. The exchange of Zn atoms between the slices and the vapor plays an important role during the annealing process. In this paper, the effects of Zn partial pressure on the properties of the annealed slices are studied carefully by measuring the concentration profiles, the infrared (IR) transmission spectra, and the x-ray rocking curves. It was found that a surface layer with different compositions and possibly different structure from the bulk crystal formed during the annealing of CdZnTe samples in the saturated Zn vapor. The accumulation of excess Te in the surface layer helps to increase the IR permeability of the bulk crystal greatly. To improve the crystallization quality, a lower Zn-pressure annealing should be used following the high Zn-pressure annealing. The diffusion of Zn in the bulk crystal has also been analyzed at the temperatures of 700°C and 500°C. Calculations determined that D_Zn (700°C)=4.02 × 10⁻¹² cm²s⁻¹ and D_Zn (500°C)=1.22 × 10⁻¹³ cm²s⁻¹.     

Two Layer Surface Exfoliation on Si3N4/Si by Sequential Implantation of He and H Ions

n-Type Si(100) wafers with a thermally grown Si₃N₄ layer (∼170 nm) were sequentially implanted with 160 keV He ions at a dose of 5 × 10¹⁶ cm⁻² and 110 keV H ions at a dose of 1 × 10¹⁶ cm⁻². Depending on the annealing temperature, surface exfoliations of two layers were observed by optical microscopy and atomic force microscopy. The first layer exfoliation was found to correspond to the top Si₃N₄ layer, which was produced at lower annealing temperatures. The other was ascribed to the implanted Si layer, which was formed at higher temperatures. The possible exfoliation processes are tentatively discussed, and potential applications of such phenomena are also suggested.     

YBa2Cu3-xZnxO7薄膜红外探测器的研究

在对红外探测器进行理论分析的基础上,设计并研制了液氮温度下的Yba2Cu3-xZnxO7薄膜红外探测器,系统地测试了器件的特征参数.最好的结果为:对于波长为10μm,调制频率为f=500Hz,带宽为Δf=1Hz的红外输入辐射Rv(500,10,1)=3587V/W,NEP(500,10,1)=6.5×10-12W/Hz1/2,D*(500,10,1)=7.2×1012cmHz1/2/W,τ(500,10,1)=1.2ms.     

Redistribution of implanted dopants in GaN

Donor (S, Se, and Te) and acceptor (Mg, Be, and C) dopants have been implanted into GaN at doses of 3–5×10¹⁴ cm⁻² and annealed at tem peratures up to 1450°C. No redistribution of any of the elements is detectable by secondary ion mass spectrometry, except for Be, which displays behavior consistent with damageassisted diffusion at 900°C. At higher temperatures, there is no further movement of the Be, for peak annealing temperature durations of 10 s. Effective diffusivities are ≤2×10⁻¹³ cm²·s⁻¹ at 1450°C for each of the dopants in GaN.     

Advancements in THM-Grown CdZnTe for Use as Substrates for HgCdTe

The focus of this work is to evaluate the suitability and substrate potential of Cd_0.9Zn_0.1Te and Cd_0.96Zn_0.04Te crystals grown by the traveling heater method (THM). THM-grown Cd_0.9Zn_0.1Te crystals used for gamma spectroscopy have shown very good spectral performance owing partly to the very low concentration of Te inclusions and precipitates. Inspection in the infrared (IR) of annealed THM-grown CdZnTe wafers reveals no inclusions >3 μm, and Fourier-transform infrared measurements show IR transmission values in excess of 60%. Wafer etch pit density values are typically less than 4 × 10^?4 pits/cm², and double-crystal x-ray rocking-curve measurements show full-width at half-maximum values approaching 40 arcsec. 〈211〉 wafers have been produced with off orientation within 0.3°. (111)-Oriented, seeded THM growth runs have the ability to provide 10 60 mm × 60 mm × 2 mm wafers from a 75-mm-diameter boule or 20 90 mm × 90 mm × 2 mm wafers from a 100-mm-diameter boule.     

Zinc-doped CdS nanoparticles synthesized by microwave-assisted deposition

Cd_1-xZn_xS nanoparticles were grown on pre-cleaned glass substrates using microwave-assisted chemical bath deposition technique. Nanoparticles obtained by this method were smooth, uniform, good adherent, brownish yellow in color where the brightness of the yellow color nature decreases with increasing Zn²⁺ content. The elemental composition analysis confirmed that the nanoparticles comprise of Cd²⁺, Zn²⁺and S^2-. Scanning electron microscope images confirmed the surface uniformity of the Cd_1-xZn_xS nanoparticles devoid of any void, pinhole or cracks and covered the substrate well. The particle size also decreases with increasing Zn ion content. X-ray diffraction (XRD) indicates the hexagonal structure (002) without phase transition. The grain size decreases from 36.45 to 9.60 nm, dislocation density increases from 0.000745 to 0.01085 Line²/m² and lattice parameter decreased from 6.868 to 6.155 nm with increasing Zn²⁺ content. The best transmittance of about 95% was achieved for x=1.0. The nanoparticles showed reduction in the absorbance as Zn ion content increased. Four point probe revealed that the electrical resistivity increased from 1.51×10¹⁰ to 6.67×10¹⁰ Ω ·cm while electrical conductivity decreases from 6.62×10^-11 to 1.49×10^-11 (Ω ·cm)^-1 with increasing Zn²⁺ content. The other electrical properties such as sheet resistance increased from 1.52×10⁸ to 1.58×10⁸Ω, charge carrier mobility decreased from 0.777 to 0.0105 cm²/(V·s) and charge carrier density increased from 1.06×10¹² to 3.95×10¹² cm^-3.     

The effect of hydrogen on boron diffusion in SiO2

The diffusivity of boron in silicon dioxide may be increased by the introduction of hydrogen into the annealing atmosphere. In this paper we report on the diffusion characteristics of boron ion-implanted into thermally grown SiO₂. A sensitive technique was used in which the boron atoms redistributed into the substrate are characterized by electrical methods. The diffusivity of boron in thermal SiO₂ was measured over the temperature range of 950-1150°C with hydrogen partial pressure from 0 to 0.2 atm. It was found that the diffusion coefficient of boron in oxide at 1150° C increases as the square root of the hydrogen partial pressure. At fixed pressure the temperature dependence of the diffusion coefficient obeys a single-activation-energy exponential rule. At 0.1 atm partial pressure of H₂ the activation energy is 3.0 eV and the preexponential factor is 6 x 10⁵ [cm²/sec.].     

Exfoliation and blistering of Cd<Subscript>0.96</Subscript>Zn<Subscript>0.04</Subscript>Te substrates by ion implantation

As part of a series of wafer bonding experiments, the exfoliation/blistering of ion-implanted Cd_0.96Zn_0.04Te substrates was investigated as a function of postimplantation annealing conditions. (211) Cd_0.96Zn_0.04Te samples were implanted either with hydrogen (5×10¹⁶ cm⁻²; 40–200 keV) or co-implanted with boron (1×10¹⁵ cm⁻²; 147 keV) and hydrogen (1–5×10¹⁶ cm⁻²; 40 keV) at intended implant temperatures of 253 K or 77 K. Silicon reference samples were simultaneously co-implanted. The change in the implant profile after annealing at low temperatures (<300°C) was monitored using high-resolution x-ray diffraction, atomic force microscopy (AFM), and optical microscopy. The samples implanted at the higher temperature did not show any evidence of blistering after annealing, although there was evidence of sample heating above 253 K during the implant. The samples implanted at 77 K blistered at temperatures ranging from 150°C to 300°C, depending on the hydrogen implant dose and the presence of the boron co-implant. The production of blisters under different implant and annealing conditions is consistent with nucleation of subsurface defects at lower temperature, followed by blistering/exfoliation at higher temperature. The surface roughness remained comparable to that of the as-implanted sample after the lower temperature anneal sequence, so this defect nucleation step is consistent with a wafer bond annealing step prior to exfoliation. Higher temperature anneals lead to exfoliation of all samples implanted at 77 K, although the blistering temperature (150–300°C) was a strong function of the implant conditions. The exfoliated layer thickness was 330 nm, in good agreement with the projected range. The “optimum” conditions based on our experimental data showed that implanting CdZnTe with H⁺ at 77 K and a dose of 5×10¹⁶/cm² is compatible with developing high interfacial energy at the bonded interface during a low-temperature (150°C) anneal followed by layer exfoliation at higher (300°C) temperature.     

Effect of the concentration of uncompensated impurities on the properties of CdTe-based X- and γ-ray detectors

Measurements of the ⁵⁵Fe-isotope emission spectra and the photosensitivity of CdTe detectors with a Schottky diode, and also the temperature dependence of the resistivity of a CdTe crystal ((2–3) × 10⁹ Ωcm at 300 K) have been used to determine the concentration of uncompensated donors (1–3) × 10¹² cm⁻³. Similar measurements performed for Cd_0.9Zn_0.1Te crystals with the resistivity (3–5) × 10¹⁰ Ω cm at 300 K have shown that the concentration of uncompensated donors in this case is lower by approximately four orders of magnitude. The results of calculations show that, due to such a significant decrease in the concentration of uncompensated donors, the efficiency of X- and γ-ray radiation detection in the photon energy range 59 to 662 keV can decrease by one-three orders of magnitude (depending on the photon energy and the lifetime of charge carriers in the space-charge region). The results obtained account for the apparent poor detecting properties of the Cd_0.9Zn_0.1Te detectors.