A detailed calculation of the auger lifetime in p-type HgCdTe

There has been recent experimental evidence that showed, in heavily doped p-type HgCdTe, the lifetime may be limited by the Auger 7 recombination mechanism. We have performed a detailed calculation of both the Auger 7 and Auger 1 lifetimes as a function of Cd composition (x), temperature (T), and doping (N_A). Compared with those done 20 years ago, the depth and breadth of these calculations result in a significant increase in the accuracy of the predictions. We present here the Auguer 7 lifetime for two different compositions, x=0.305 and x=0.226 over a range of temperature extending from 60 K to 300 K and for acceptor doping from 10¹⁵ cm⁻³ to 10¹⁸ cm⁻³. The calculated results for MWIR (x=0.305) are in reasonably good agreement with recent experiments performed on MWIR HgCdTe at 77 K over a range of doping. In addition, we calculated γ (≡ τ_A7 /τ_A1) with the same doping, composition (x ≈ 0.22), for a range of temperatures (40–80 K) and found γ=3–6.     

Measurement of minority carrier lifetime in n-type MBE HgCdTe and its dependence on annealing

Results are presented for minority carrier lifetime in n-type molecular beam epitaxy Hg_1−xCd_xTe with x ranging from 0.2 to 0.6. It was found that the lifetime was unintentionally degraded by post-growth annealing under Hg saturated conditions in a H₂ atmosphere that was both time and temperature dependent. This effect was minimal or non-existent for x∼0.2 material, but very strong for x ≥ 0.3. Hydrogen was identified as responsible for this degradation. Identical annealing in a He atmosphere avoids this degradation and results in neartheoretical lifetime values for carrier concentrations as low 1 × 10¹⁵ cm⁻³ in ≥0.3 material. Modeling was carried out for x∼0.2 and x∼0.4 material that shows the extent to which lifetime is reduced by Shockley-Real-Hall recombination for carrier concentrations below 1 × 10¹⁵ cm⁻³, as well as for layers annealed in H₂. It appears that annealing in H₂ results in a deep recombination center in wider bandgap HgCdTe that lowers the lifetime without affecting the majority carrier concentration and mobility.     

Thermoelectric Properties of Ag-doped Mg<Subscript>2</Subscript>Ge Thin Films Prepared by Magnetron Sputtering

Silver doped p-type Mg₂Ge thin films were grown in situ at 773 K using magnetron co-sputtering from individual high-purity Mg and Ge targets. A sacrificial base layer of silver of various thicknesses from 4 nm to 20 nm was initially deposited onto the substrate to supply Ag atoms, which entered the growing Mg₂Ge films by thermal diffusion. The addition of silver during film growth led to increased grain size and surface microroughness. The carrier concentration increased from 1.9 × 10¹⁸ cm⁻³ for undoped films to 8.8 × 10¹⁸ cm⁻³ for the most heavily doped films, but it did not reach saturation. Measurements in the temperature range of T = 200–650 K showed a positive Seebeck coefficient for all the films, with maximum values at temperatures between 400 K and 500 K. The highest Seebeck coefficient of the undoped film was 400 μV K⁻¹, while it was 280 μV K⁻¹ for the most heavily doped film at ∼400 K. The electrical conductivity increased with silver doping by a factor of approximately 10. The temperature effects on power factors for the undoped and lightly doped films were very limited, while the effects for the heavily doped films were substantial. The power factor of the heavily doped films reached a non-optimum value of ∼10⁻⁵ W cm⁻¹ K⁻² at 700 K.     

Minority carrier lifetime and noise in abrupt molecular-beam epitaxy-grown HgCdTe heterostructures

The steady-state lifetime of photogenerated minority carriers has been investigated in heterostructure HgCdTe devices fabricated on molecular-beam epitaxy (MBE) grown material. A wider bandgap capping layer (Hg_(1−x)Cd_(x)Te, x = 0.44) was grown on a narrower bandgap absorbing layer (Hg_(1−x)Cd_(x)Te, x = 0.32, λ_co,80K = 4.57 μm) material in an uninterrupted MBE growth to create an abrupt heterointerface. Steady-state lifetime as a function of temperature over the range 80–300 K was extracted from photoconductive responsivity at an optical wavelength corresponding to the peak responsivity at that temperature. At 80 K, the photoconductors exhibit a specific detectivity of 4.5 × 10¹¹ cm Hz^−1/2W⁻¹ (chopping frequency of 1 kHz). For each measurement temperature, the steady-state excess carrier lifetime determined experimentally was compared to the theoretical bulk lifetime for material with x = 0.32 and effective n-type doping density of 3.7 × 10¹⁴ cm⁻³. Theoretical calculations of the Auger-1 lifetime based on expressions developed by Pratt et al. were not able to account for the reduction in lifetime observed at temperatures above 180 K. Two approaches have been attempted to resolve this discrepancy: A semiempirical expression for Auger lifetime attributed to Meyer et al. was used to fit to the data, with the Auger coefficient γ as a fitting parameter. However, the resulting Auger coefficient found in this work is more than an order of magnitude higher than that reported previously. Alternatively, the reduction in effective lifetime above 180 K may be understood as a “loss” of carriers from the narrow bandgap absorbing layer that are promoted across the potential barrier in the conduction band into a low lifetime, wider bandgap capping layer. The reduction in lifetime as a function of inverse temperature for temperatures above 180 K may be fitted by a “cap lifetime” that has an activation energy equal to the change in bandgap across the heterostucture and scaled by a fitting constant.     

Electrical properties of HgCdTe epilayers doped with silver using an AgNO3 solution

We employed AgNO₃ solutions for doping Ag in liquid phase epitaxy (LPE) grown Hg_0.78Cd_0.22Te epilayers and found that the minority carrier lifetimes became longer so that the diode properties improved. After annealing LPE grown Hg(1-x)Cd(x)Te layers (x=0.22) in Hg atmosphere, the epilayers were immersed in an AgNO₃ solution at room temperature. The typical carrier concentrations of holes was 3 × 10¹⁶ cm⁻³ at 77K. These values were almost the same as for the nondoped wafers. Also, its acceptor level was 3 to 4 meV. This shows that the Ag was activated. The doped crystals have lifetimes several times longer than those of the nondoped crystals. Numerical fitting showed the lifetime was limited mostly by the Auger 7 process. The Shockley-Read-Hall recombination process was not effective. To examine the Ag-doped wafer, we fabricated photodiodes using standard planar technology. The diodes have an average zero-bias resistance of several MΩ and a shunt resistance of about 1 GΩ for a 10 μm cutoff wavelength at 78K. These values are about four times higher than those of nondoped diodes. The photo current is also two times higher at the same pixel size. This shows that the quantum efficiency is increased. The extension of the lifetime contributes to the high resistance and the high quantum efficiency of the photodiode.     

Minority carrier lifetime in indium-doped HgCdTe(211)B epitaxial layers grown by molecular beam epitaxy

We have studied the minority-carrier lifetime on intentionally indium-doped (211)B molecular beam epitaxially grown Hg_1-xCd_xTe epilayers down to 80K with x ≈ 23.0% ± 2.0%. Measured lifetimes were explained by an Auger-limited band-to-band recombination process in this material even in the extrinsic temperature region. Layers show excellent electron mobilities as high as ≈2 x 10⁵ cm²v^-1s^-1 at low temperatures. When the layers are compensated with Hg vacancies, results show that the Schockley-Read recombination process becomes important in addition to the band-to-band processes. From the values of τ_n0 and τ_p0 of one sample, the obtained defect level is acceptor-like and is somewhat related to the Hg vacancies.     

Vacancies in Hg1−xCdxTe

Measurements have been performed of the carrier concentrations in vacancy-doped Hg_1−xCd_xTe with x=0.22, 0.29, 0.45, and 0.5. Anneals to establish the carrier concentrations were performed on both the mercury- and tellurium-rich sides of the phase field. When these results were added to earlier data for x=0.2 and 0.4, and assuming that all vacancies are doubly ionized, then vacancy concentrations for all values of x and anneal temperature can be represented by simple equations. On the mercury side of the phase field, the vacancy concentrations varied as 2.50×10²³(1−x) exp[−1.00/kT] for low concentrations, and as 3.97×10⁷(1−x)^1/3n _i ^2/3 exp[−0.33/kT] for high concentrations, where n_i is the intrinsic carrier concentration. On the tellurium rich side, the vacancy concentrations varied as 2.81 × 10²²(1−x) exp[−0.65/kT] for low concentrations and as 1.92×10⁷(1−x)^1/3n _i ^2/3 exp[−0.22/kT] for high concentrations.     

Effect of extended phosphorus diffusion gettering on chromium impurity in HEM multicrystalline silicon

We have investigated the extended phosphorus diffusion gettering (PDG) effect on chromium impurities (Cr) in p-type multicrystalline silicon (mc-Si) grown by Heat Exchanger Method (HEM). The study was made after phosphorous diffusion and according to different extended annealing temperatures. The secondary ion mass spectrometry (SIMS) analysis revealed a significant accumulation of ⁵²Cr in heavily phosphorus doped (HPD) region. Using quasi-steady state photoconductance (QSSPC) technique, the apparent lifetime dependent minority carrier density curves have been obtained. The results showed an increment of the bulk minority carrier lifetime for specific annealing temperatures. Appropriate calculations based on QSSPC results allowed us to determine the lifetime curves associated to gettered impurities. Their fitting by Shockley-Read-Hall (SRH) model reveal that the origin of the lifetime increment is the reduction of interstitial chromium (Cr_i) density in the bulk. Furthermore, the estimation of electron to hole capture cross-section ratio (k=σ_n/σ_p) through the modelling of apparent lifetime curves using Hornbeck–Haynes model, confirmed the effectiveness of Cr_i gettering and identified the nature of dominant recombination centres after gettering process.     

Charge-carrier lifetime in Hg1−x CdxTe (x=0.22) structures grown by molecular-beam epitaxy

Measurements of the charge carrier lifetime in epitaxial structures based on narrow-gap Hg_1−x Cd_xTe (x=0.22), grown by molecular-beam epitaxy with pulsed excitation using radiation at different wavelengths, are reported. It is shown that in p-type epitaxial films the lifetime is determined by the Auger recombination mechanism at temperatures corresponding to the impurity conductivity, and for n-type epitaxial films recombination via local centers is characteristic. Fiz. Tekh. Poluprovodn. 31, 774–776 (July 1997)     

Low temperature growth and planar doping of ZnSe in a plasma-stimulated LP-MOVPE system

In a low-pressure metalorganic vapor phase epitaxy process, we used dc-plasma activated nitrogen to dope ZnSe, grown with ditertiarybutylselenide and dimethylzinc-triethylamine. The nitrogen concentration of up to 2 × 10¹⁸ cm⁻³ in the doped layers can be adjusted by the growth temperature, the dc-plasma power, and the N₂ dopant flow. Due to the high n-type background carrier concentration of the order of 10¹⁷ cm⁻³ in undoped samples, the doped layers show n-type conductivity or were semi-insulating because of an additional compensation by hydrogen incorporated with a concentration of the order of 10¹⁸ cm⁻³. A planar doping scheme was applied to reduce this hydrogen incorporation by one order of magnitude, although H₂ was used as carrier gas.     

Current-voltage characteristics of ZnGa<Subscript>2</Subscript>Se<Subscript>4</Subscript> compound polycrystals

Current-voltage characteristics of the In-ZnGa₂Se₄-In structure have been studied in the temperature range of 90–335 K. Based on the data calculated for the concentration of three trap types in ZnGa₂Se₄, the values N _t = 1.4 × 10¹³, 8.2 × 10¹², and 2.6 × 10¹² cm⁻³ are obtained. The contact region transparency D _k ^*= 10⁻⁵, surface recombination velocity S _k = 0.65 m/s, and carrier lifetime τ = 1.5 × 10⁻⁴ s were determined. It was found that the current transmission mechanism in electric fields weaker than 10³ V/cm is caused by monopolar carrier injection.     

Minority carrier diffusion length in liquid epitaxial GaP

Using a Schottky diode photocurrent technique, investigations have been made of the room temperature value of minority carrier diffusion length in liquid epitaxial GaP grown on both (111) and (100) oriented pulled GaP substrates. Results are presented for undoped layers and layers doped separately with S, S and N, Te, Zn, and Zn and O, to cover a range of impurity concentration in the GaP. The measured values of minority carrier diffusion length are found to depend on the concentration of the dominant impurity and, for the undoped and Zn doped layers, also on the growth orientation of the substrate. From the dependence of the minority carrier diffusion length on majority carrier concentration we infer the dominant room temperature recombination process in the layers. In our undoped layers this process is believed to correspond to recombination via residual Si substituted on P sites. In Te, S, Zn, and Zn, O doped layers the dominant recombination mechanism can be attributed to a non-radiative band-band Auger process, although in the case of the Zn, O doped layers a competing recombination process is observed which is believed to correspond to recombination via centres formed by unpaired O and Zn defects. The lifetime for this competing process is predicted to be sensitive to annealing.     

Mechanisms of formation of <Emphasis Type="Italic">N–S</Emphasis> transition in nonisothermal <Emphasis Type="Italic">I–V</Emphasis> characteristics of a <Emphasis Type="Italic">p–i–n</Emphasis> diode

On the basis of the self-consistent model of transport processes in the semiconductor p–i–n diode during its self-heating under conditions of limited heat sink, the mechanisms of unusual effect—the formations of N–S transition in nonisothermal I–V characteristics of the device were numerically analyzed. It is established that such an effect is caused by a pronounced temperature reduction of the mobility of carriers in the high-resistivity base and the injection-level saturation at the current densities J > 300–500 A/cm². The saturation is attained due to the Auger recombination or the leakage of carriers from plasma into heavily doped emitter layers, the integrated current of which, as a rule, exceeds the recombination integrated current in the base under these conditions. The Auger recombination in the anode emitter also starts to play an appreciable role in the injection-level restriction in the base if the impurity concentration becomes higher than 10¹⁸ cm⁻³ in there.     

Variable temperature hall effect on p-Hg1−xCdxTe grown on CdTe and sapphire substrates by liquid phase epitaxy

Variable temperature Hall effect measurements have been made down to 9–10K on p-type Hg_1−xCd_xTe grown by liquid phase epitaxy on both CdTe and sapphire substrates. Carrier freeze-out was usually observed throughout the measured temperature range. For most samples, the hole mobility was well-behaved and exhibited a maximum at ˜ 35K. Values of acceptor ionization energy E_A and donor concentration N_D were estimated from the data, using a model assuming significant compensation, which provided a good fit to the low temperature data. In addition, values of N_D were also estimated from an analysis of the low temperature mobility using the hole effective mass as a parameter to provide reasonable agreement between the N_D values calculated from the Hall coefficient and mobility data. The measured carrier concentration is a result of close compensation between stoichiometric acceptors and donors, with N_D usually in the low-10¹⁷ cm⁻³ range. Average values of E_A for as-grown, undoped x = 0.32 layers on CdTe and sapphire substrates are 7.4 and 6.6 meV, respectively. An activation energy of 0.84 meV was determined for a Cu-doped x = 0.32 layer that was annealed in Hg vapor to reduce the number of Hg vacancies. The average E_A for undoped Hg-annealed x = 0.22 layers on CdTe substrates is 2.35 meV. Layers with x = 0.32 grown on sapphire substrates have average carrier concentrations of 2.92 (σ = 0.54) × 10¹⁶ cm⁻³, compared with 4.64 (θ = 1.26) × 10¹⁶ cm⁻³ for the same composition layers grown on CdTe substrates.     

Very low resistance ohmic contacts to n-GaN

Ohmic contacts with low resistance are fabricated on n-GaN films using Al/Ti bilayer metallization. GaN films used are 0.3 μm thick layers with carrier concentrations of 1 × 10¹⁹ cm⁻³ grown on the c-plane sapphire by ion-removed electron cyclotron resonance molecular beam epitaxy. The lowest value for the specific contact resistivity (ρ_c) of 1.2×10⁻⁸ Ω·cm² was obtained with furnace annealing at 500°C for 60 min. This result shows the effectiveness of high carrier concentration GaN layers and the low temperature annealing for the realization of low resistance ohmic contacts. Sputtering Auger electron spectroscopy analysis reveals that Al diffuses into Ti layer and comes into contact with the GaN surface.     

Perimeter governed minority carrier lifetimes in 4H-SiC p+n diodes measured by reverse recovery switching transient analysis

Minority carrier lifetimes in epitaxial 4H-SiC p⁺n junction diodes were measured via an analysis of reverse recovery switching characteristics. Behavior of reverse recovery storage time (t_s) as a function of initial ON-state forward current (I_F) and OFF-state reverse current (I_R) followed well-documented trends which have been observed for decades in silicon p⁺n rectifiers. Average minority carrier (hole) lifetimes (τ_p) calculated from plots of t_s vs I_R/I_F strongly decreased with decreasing device area. Bulk and perimeter components of average hole lifetimes were separated by plotting 1/τ_p as a function of device perimeter-to-area ratio (P/A). This plot reveals that perimeter recombination is dominant in these devices, whose areas are all less than 1 mm². The bulk minority carrier (hole) lifetime extracted from the 1/τ_p vs P/A plot is approximately 0.7 μs, well above the 60 ns to 300 ns average lifetimes obtained when perimeter recombination effects are ignored in the analysis. Given the fact that there has been little previous investigation of bipolar diode and transistor performance as a function of perimeter-to-area ratio, this work raises the possibility that perimeter recombination may be partly responsible for poor effective minority carrier lifetimes and limited performance obtained in many previous SiC bipolar junction devices.     

Pb<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>Sn<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te epitaxial films for terahertz detectors

Liquid-phase epitaxy is used to fabricate Pb_0.8Sn_0.2Te films, undoped or doped with indium to different levels. The depth profiles of the carrier density and dopant concentration in the films are measured and examined. A uniform dopant concentration to a depth of 15 μm is obtained. Electrical-conduction inversion is observed at a temperature of 77.3 K as the doping level is varied. The liquid-phase epitaxial method is shown to be a more suitable technology for the reproducible manufacture of epitaxial films with a given carrier density, such as the ones used in terahertz detectors.     

Advances in LEC growth of InP crystals

By reducing the temperature gradients in the vicinity of the crystal-melt interface, 35-mm-diameter InP boules with much reduced dislocation densities have been grown by the liquid-encapsulated Czochralski technique. A reduction in the residual donor concentration of InP grown by this technique has been achieved by using In-rich charges prepared by adding elemental In to polycrystalline InP ingot material. Nominally undoped crystals with carrier concentrations as low as 1–2 x₄ 10¹⁵ Cm − 1 and 77 K mobilities as high as 7.0 × 10 cm² V⁻¹ s⁻¹ have been obtained. By growing doped crystals at increased seed or crucible rotation rates, short-range longitudinal variations in dopant concentration have been reduced to a few per cent, as determined by optical absorption measurements with a scanning CO₂ laser.     

HgCdTe/CdTe/Si infrared photodetectors grown by MBE for near-room temperature operation

Conventional HgCdTe infrared detectors need significant cooling in order to reduce noise and leakage currents resulting from thermal generation and recombination processes. Although the need for cooling has long been thought to be fundamental and inevitable, it has been recently suggested that Auger recombination and generation rates can be reduced by using the phenomena of exclusion and extraction to produce nonequilibrium carrier distributions. The devices with Auger suppressed operation requires precise control over the composition, and donor and acceptor doping. The successful development of the molecular beam epitaxy (MBE) growth technique for multi-layer HgCdTe makes it possible to grow these device structures. Theoretical calculations suggest that the p n+ layer sequence is preferable for near-room temperature operation due to longer minority carrier lifetime in lightly doped p-HgCdTe absorber layers. However, because the low doping required for absorption and nonequilibrium operation is easier to achieve in n-type materials, and because Shockley-Read centers should be minimized in order to obtain the benefits of Auger suppression, we have focused on p⁺ n structures. Planar photodiodes were formed on CdTe/Si (211) composite substrates by As implantation followed by a three step annealing sequence. Three inch diameter Si substrates were employed since they are of high quality, low cost, and available in large areas. Due to this development, large area focal plane arrays (FPAs) operated at room temperature are possible in the near future. The structures were characterized by FTIR, x-ray diffraction, temperature dependent Hall measurements, minority carrier lifetimes by photoconductive decay, and in-situ ellipsometry. To study the relative influence of bulk and surface effects, devices with active areas from 1.6 10⁻⁵ cm² to 10⁻³ cm² were fabricated. The smaller area devices show better performance in terms of reverse bias characteristics indicating that the bulk quality could be further improved. At 80 K, the zero bias leakage current for a 40 m 40 m diode with 3.2 m cutoff wavelength is 1 pA, the R₀A product is 1.1 10⁴-cm² and the breakdown voltage is in excess of 500 mV. The device shows a responsivity of 1.3 10⁷ V/W and a 80 K detectivity of 1.9 10¹¹ cm-Hz^1/2/W. At 200 K, the zero bias leakage current is 5 nA and the R₀A product 2.03-cm², while the breakdown voltage decreases to 40 mV.