Micro-power low-offset instrumentation amplifier IC design for biomedical system applications

This work presents a micro-power low-offset CMOS instrumentation amplifier integrated circuit with a large operating range for biomedical system applications. The equivalent input offset voltage is improved using a new circuit technique of offset cancellation that involves a two-phase clocking scheme with a frequency of 20 kHz. Channel charge injection is cancelled by the symmetrical circuit topology. With the wide-swing cascode bias circuit design, this amplifier realizes a very high power-supply rejection ratio (PSRR), and can be operated at single supply voltage in the range between 2.5-7.5 V. It was fabricated using 0.5-/spl mu/m double-poly double-metal n-well CMOS technology, and occupies a die area of 0.2 mm/sup 2/. This amplifier achieves a 160-/spl mu/V typical input offset voltage, 0.05% gain linearity, greater than 102-dB PSRR, an input-referred rms noise voltage of 45 /spl mu/V, and a current consumption of 61 /spl mu/A at a low supply voltage of 2.5 V. Experimental results indicate that the proposed amplifier can process the input electrocardiogram signal of a patient monitoring system and other portable biomedical devices.     

A high-sensitivity CMOS image sensor with gain-adaptive column amplifiers

A high-sensitivity CMOS image sensor using gain-adaptive column amplifiers is presented and tested. The use of high gain for the column amplifier reduces input-referred random noise, and when coupled with a column-based digital noise cancellation technique, also reduces fixed pattern noise. An experimental application of the circuit using 0.25-/spl mu/m CMOS technology with pinned photodiodes gave an rms random noise of 263 /spl mu/V and an rms fixed pattern noise of 50 /spl mu/V.     

A fully integrated 0.13-/spl mu/m CMOS mixed-signal SoC for DVD player applications

This paper describes a fully integrated single-chip CMOS mixed-signal system on a chip (SoC) for DVD player applications. It integrates one digital signal processor (DSP), two 32-bit CPUs, three dedicated processing units, a partial response maximum likelihood (PRML) read channel with an analog front end (AFE), and many other subsystems on the same die. The AFE includes a fifth-order G/sub m/-C filter and attains over 66 dB C/N overall. PR(3,4,4,3) structure is employed in the PRML read channel. Owing to the PRML signal processing and the mixed-signal system level optimization in the PRML read channel, less than 10/sup -6/ of bit-error rate (BER) is obtained for the focus offset margins over /spl plusmn/0.5 /spl mu/m. This SoC is fabricated in 0.13-/spl mu/m one-poly six-Cu CMOS technology. It contains 24 million transistors in a 63.87 mm/sup 2/ die and consumes 1.5 W at 40 MSample/s data rate, which corresponds to DVD 1.5 times playback operation mode.     

A 10-Gb/s CDR/DEMUX with LC delay line VCO in 0.18-/spl mu/m CMOS

A monolithic 10-Gb/s clock/data recovery and 1:2 demultiplexer are implemented in 0.18-/spl mu/m CMOS. The quadrature LC delay line oscillator has a tuning range of 125 MHz and a 60-MHz/V sensitivity to power supply pulling. The circuit meets SONET OC-192 jitter specifications with a measured jitter of 8 ps p-p when performing error-free recovery of PRBS 2/sup 31/-1 data. Clock and data recovery (CDR) is achieved at 10 Gb/s, demonstrating the feasibility of a half-rate early/late PD (with tri-state) based CDR on 0.18-/spl mu/m CMOS. The 1.9/spl times/1.5 mm/sup 2/ IC (not including output buffers) consumes 285 mW from a 1.8-V supply.     

A Micropower CMOS-Instrumentation Amplifier

A CMOS switched capacitor instrumentation amplifier is presented. Offset is reduced by an auto-zero technique and effects due to charge injection are attenuated by a special amplifier configuration. The circuit which is realized in a 4-/spl mu/m double poly process has an offset (/spl tau/) of 370 /spl mu/V, an rms input referred integrated noise (0.5 -f/sub c//2) of 79 /spl mu/V, and consumes only 21 /spl mu/W (f/sub c/ = 8 kHz, V/sub DD/ = 3 V).     

A 16-bit low-voltage CMOS A/D converter

A/D converters used in telemetry, instrumentation, and measurements require high accuracy, excellent linearity, and negligible DC offset, but need not be fast. A simple and robust instrumentation A/D converter, fabricated in a low-voltage 4-/spl mu/m CMOS technology, is described. The measured overall accuracy was 16 bits. Using a digital compensation for parasitic effects, both offset and nonlinearity were below 12 /spl mu/V. With analog compensation, the offset was 60 /spl mu/V and the nonlinearity below 15 /spl mu/V. These results indicate that even higher accuracy can be achieved using higher voltage technology.     

50 Gbit/s 2:1 multiplexer in 0.13 /spl mu/m CMOS technology

A fully integrated 2:1 multiplexer IC which operates at up to 50 Gbit/s data rate is presented. The MUX uses inductive shunt peaking and an output series inductor for higher bandwidth. The MUX directly drives the 50 /spl Omega/ load. The IC is fabricated in a 0.13 /spl mu/m bulk CMOS technology and draws 65 mA at 1.5 V supply voltage. The output voltage swing is 2/spl times/100 mV.     

A 1.8-V 10-Gb/s fully integrated CMOS optical receiver analog front-end

A fully integrated 10-Gb/s optical receiver analog front-end (AFE) design that includes a transimpedance amplifier (TIA) and a limiting amplifier (LA) is demonstrated to require less chip area and is suitable for both low-cost and low-voltage applications. The AFE is fabricated using a 0.18-/spl mu/m CMOS technology. The tiny photo current received by the receiver AFE is amplified to a differential voltage swing of 400 mV/sub (pp)/. In order to avoid off-chip noise interference, the TIA and LA are dc-coupled on the chip instead of ac-coupled though a large external capacitor. The receiver front-end provides a conversion gain of up to 87 dB/spl Omega/ and -3dB bandwidth of 7.6 GHz. The measured sensitivity of the optical receiver is -12dBm at a bit-error rate of 10/sup -12/ with a 2/sup 31/-1 pseudorandom test pattern. Three-dimensional symmetric transformers are utilized in the AFE design for bandwidth enhancement. Operating under a 1.8-V supply, the power dissipation is 210 mW, and the chip size is 1028 /spl mu/m/spl times/1796 /spl mu/m.     

A merged CMOS LNA and mixer for a WCDMA receiver

A low-noise amplifier (LNA) and mixer circuit in 0.35-/spl mu/m CMOS operates at 2.1 GHz. Merging the LNA and mixer lowers the number of transistors in the signal path and thereby also the nonlinearity and power consumption. The circuit meets the specifications for a direct conversion wide-band code-division multiple access (WCDMA) receiver. Its noise figure is 3.4 dB (5kHz to 5MHz), the total conversion gain is 23 dB, the third-order input-referred intercept point is -1.5 dBm, and the local oscillator leakage to the antenna is less than -71 dBm. The fully differential circuit takes 8 mA from a 2.7-V supply.     

A highly integrated analog front-end for 3G

This paper describes a reconfigurable analog front-end (AFE) and audio codec IC supporting the wideband code division multiple access (WCDMA) standard. The chip is fabricated on Intel's 0.18-/spl mu/m (SOC) flash+logic+analog (FLA) process technology using a 0.35-/spl mu/m feature size analog transistor. The transmit path contains a 10-bit segmented rail-to-rail digital-to-analog converter, automatically tunable active RC filter, and programmable gain amplifier (PGA) with self-tuning gain and offset correction circuit. The receive path incorporates a PGA, active RC filter, and an 8-bit analog-to-digital converter with built-in offset correction. The AFE operates at 2.7 V with a current consumption of 55 mA and total active area of 15 mm/sup 2/.     

Design and anaylsis of a 2.5-Gbps optical receiver analog front-end in a 0.35-/spl mu/m digital CMOS technology

This paper presents the design of an optical receiver analog front-end circuit capable of operating at 2.5 Gbit/s. Fabricated in a low-cost 0.35-/spl mu/m digital CMOS process, this integrated circuit integrates both transimpedance amplifier and post limiting amplifier on a single chip. In order to facilitate high-speed operations in a low-cost CMOS technology, the receiver front-end has been designed utilizing several enhanced bandwidth techniques, including inductive peaking and current injection. Moreover, a power optimization methodology for a multistage wide band amplifier has been proposed. The measured input-referred noise of the optical receiver is about 0.8 /spl mu/A/sub rms/. The input sensitivity of the receiver front-end is 16 /spl mu/A for 2.5-Gbps operation with bit-error rate less than 10/sup -12/, and the output swing is about 250 mV (single-ended). The front-end circuit drains a total current of 33 mA from a 3-V supply. Chip size is 1650 /spl mu/m/spl times/1500 /spl mu/m.     

Baseband stage for WCDMA direct conversion receiver with high dynamic range and accurate temperature compensation

A highly integrated baseband stage, which adopts a new configuration for the wideband code-division multiple access (WCDMA) direct conversion receiver (DCR), is described. The baseband stage satisfies all requirements of the WCDMA DCR and consists of opamp-RC channel select filters and variable gain amplifiers with linear-in-dB gain control. It achieves a high dynamic range of 85 dB with /spl plusmn/1.5 dB accuracy over a temperature variation from -25 to 85/spl deg/C, 16.5 nV//spl radic/Hz input-referred noise, +20 dBV out-of-band IIP3 and +70 dBV out of band IIP2. The baseband stage is fabricated using a 0.35 /spl mu/m SiGe BiCMOS process and consumes a total current of 11 mA/CH from a 2.7 V supply.     

ESD implantation for subquarter-micron CMOS technology to enhance ESD robustness

A new electrostatic discharge (ESD) implantation method is proposed to significantly improve ESD robustness of CMOS integrated circuits in subquarter-micron CMOS processes, especially the machine-model (MM) ESD robustness. By using this method, the ESD current is discharged far away from the surface channel of nMOS, therefore the nMOS (both single nMOS and stacked nMOS) can sustain a much higher ESD level. The MM ESD robustness of the gate-grounded nMOS with a device dimension width/length (W/L) of 300 /spl mu/m/0.5 /spl mu/m has been successfully improved from the original 450 V to become 675 V in a 0.25-/spl mu/m CMOS process. The MM ESD robustness of the stacked nMOS in the mixed-voltage I/O circuits with a device dimension W/L of 300 /spl mu/m/0.5 /spl mu/m for each nMOS has been successfully improved from the original 350 V to become 500 V in the same CMOS process. Moreover, this new ESD implantation method with the n-type impurity can be fully merged into the general subquarter-micron CMOS processes.     

A 3.3-mW /spl Sigma//spl Delta/ modulator for UMTS in 0.18-/spl mu/m CMOS with 70-dB dynamic range in 2-MHz bandwidth

A quadrature fourth-order, continuous-time, /spl Sigma//spl Delta/ modulator with 1.5-b quantizer and feedback digital-to-analog converter (DAC) for a universal mobile telecommunication system (UMTS) receiver chain is presented. It achieves a dynamic range of 70 dB in a 2-MHz bandwidth and the total harmonic distortion is -74 dB at full-scale input. When used in an integrated receiver for UMTS, the dynamic range of the modulator substantially reduces the need for analog automatic gain control and its tolerance of large out-of-band interference also permits the use of only first-order prefiltering. An IC including an I and Q /spl Sigma//spl Delta/ modulator, phase-locked loop, oscillator, and bandgap dissipates 11.5 mW at 1.8 V. The active area is 0.41 mm/sup 2/ in a 0.18-/spl mu/m 1-poly 5-metal CMOS technology.     

Design of a low-power 3.5-GHz broad-band CMOS transimpedance amplifier for optical transceivers

This paper describes a novel low-power low-noise CMOS voltage-current feedback transimpedance amplifier design using a low-cost Agilent 0.5-/spl mu/m 3M1P CMOS process technology. Theoretical foundations for this transimpedance amplifier by way of gain, bandwidth and noise analysis are developed. The bandwidth of the amplifier was extended using the inductive peaking technique, and, simulation results indicated a -3-dB bandwidth of 3.5 GHz with a transimpedance gain of /spl ap/60 dBohms. The dynamic range of the amplifier was wide enough to enable an output peak-to-peak voltage swing of around 400 mV for a test input current swing of 100 /spl mu/A. The output noise voltage spectral density was 12 nV//spl radic/Hz (with a peak of /spl ap/25 nV//spl radic/Hz), while the input-referred noise current spectral density was below 20 pA//spl radic/Hz within the amplifier frequency band. The amplifier consumes only around 5 mA from a 3.3-V power supply. A test chip implementing the transimpedance amplifier was also fabricated using the low-cost CMOS process.     

A capacitor-free CMOS low-dropout regulator with damping-factor-control frequency compensation

A 1.5-V 100-mA capacitor-free CMOS low-dropout regulator (LDO) for system-on-chip applications to reduce board space and external pins is presented. By utilizing damping-factor-control frequency compensation on the advanced LDO structure, the proposed LDO provides high stability, as well as fast line and load transient responses, even in capacitor-free operation. The proposed LDO has been implemented in a commercial 0.6-/spl mu/m CMOS technology, and the active chip area is 568 /spl mu/m/spl times/541 /spl mu/m. The total error of the output voltage due to line and load variations is less than /spl plusmn/0.25%, and the temperature coefficient is 38 ppm//spl deg/C. Moreover, the output voltage can recover within 2 /spl mu/s for full load-current changes. The power-supply rejection ratio at 1 MHz is -30 dB, and the output noise spectral densities at 100 Hz and 100 kHz are 1.8 and 0.38 /spl mu/V//spl radic/Hz, respectively.     

Combined radix<2 and 1.5 bit/stage pipelined analogue-to-digital converter

A new pipeline architecture that combines the radix<2 and traditional 1.5 bit gain-stages is presented. The 10 bit, 60 MHz, 3 V pipelined analogue-to-digital converter has been designed in a 0.25 /spl mu/m 1p4M CMOS technology using digital self-calibration. The converter achieves more than 57 dB SNDR from a 3 V supply (10% lower than nominal 3.3 V) within -40 to +120/spl deg/C temperature range.     

1.5 V four-quadrant CMOS current multiplier/divider

A low voltage CMOS four-quadrant current multiplier/divider circuit is presented. It is based on a compact V-I converter cell able to operate at very low supply voltages. Measurement results for an experimental prototype in a 0.8 /spl mu/m CMOS technology show good linearity for a /spl plusmn/15 /spl mu/A input current range and a 1.5 V supply voltage.     

SODEL FET: novel channel and source/drain profile engineering schemes by selective Si epitaxial growth technology

In this paper, novel channel and source/drain profile engineering schemes are proposed for sub-50-nm bulk CMOS applications. This device, referred to as the silicon-on-depletion layer FET (SODEL FET), has the depletion layer beneath the channel region, which works as an insulator like a buried oxide in a silicon-on-insulator MOSFET. Thanks to this channel structure, junction capacitance (C/sub j/) has been reduced in SODEL FET, i.e., C/sub j/ (area) was /spl sim/0.73 fF//spl mu/m/sup 2/ both in SODEL nFET and pFET at Vbias =0.0 V. The body effect coefficient /spl gamma/ is also reduced to less than 0.02 V/sup 1/2/. Nevertheless, current drives of 886 /spl mu/A//spl mu/m (I/sub off/=15 nA//spl mu/m) in nFET and -320 /spl mu/A//spl mu/m (I/sub off/=10 nA//spl mu/m) in pFET have been achieved in 70-nm gate length SODEL CMOS with |V/sub dd/|=1.2 V. New circuit design schemes are also proposed for high-performance and low-power CMOS applications using the combination of SODEL FETs and bulk FETs on the same chip for 90-nm-node generation and beyond.     

Characterization of 1.9- and 1.4-nm ultrathin gate oxynitride by oxidation of nitrogen-implanted silicon substrate

For gate oxide thinned down to 1.9 and 1.4 nm, conventional methods of incorporating nitrogen (N) in the gate oxide might become insufficient in stopping boron penetration and obtaining lower tunneling leakage. In this paper, oxynitride gate dielectric grown by oxidation of N-implanted silicon substrate has been studied. The characteristics of ultrathin gate oxynitride with equivalent oxide thickness (EOT) of 1.9 and 1.4 nm grown by this method were analyzed with MOS capacitors under the accumulation conditions and compared with pure gate oxide and gate oxide nitrided by N/sub 2/O annealing. EOT of 1.9- and 1.4-nm oxynitride gate dielectrics grown by this method have strong boron penetration resistance, and reduce gate tunneling leakage current remarkably. High-performance 36-nm gate length CMOS devices and CMOS 32 frequency dividers embedded with 57-stage/201-stage CMOS ring oscillator, respectively, have been fabricated successfully, where the EOT of gate oxynitride grown by this method is 1.4 nm. At power supply voltage V/sub DD/ of 1.5 V drive current Ion of 802 /spl mu/A//spl mu/m for NMOS and -487 /spl mu/A//spl mu/m for PMOS are achieved at off-state leakage I/sub off/ of 3.5 nA//spl mu/m for NMOS and -3.0 nA//spl mu/m for PMOS.