An 8-Gb/s/pin simultaneously bidirectional transceiver in 0.35-/spl mu/m CMOS

This paper presents architecture, circuits, and test results for a single-ended, simultaneously bidirectional interface capable of a total throughput of 8 Gb/s per pin. The interface addresses noise reduction challenges by utilizing a pseudodifferential reference with noise immunity approaching that of a fully differential reference. The transmitter supports on-chip termination, predistortion, and low-skew near-end outgoing signal echo cancellation. The receiver's sense amplifier evaluates the average of two differential input signals without use of analog components and utilizes imbalanced charge injection to compensate for offset voltages. A test chip integrated in a 0.35-/spl mu/m digital CMOS technology uses the proposed techniques to implement an 8-bit wide single-ended voltage-mode simultaneous bidirectional interface and achieves a performance of 8 Gb/s per pin.     

Low-power fully integrated 10-Gb/s SONET/SDH transceiver in 0.13-/spl mu/m CMOS

Here, we present a low-power fully integrated 10-Gb/s transceiver in 0.13-/spl mu/m CMOS. This transceiver comprises full transmit and receive functions, including 1:16 multiplex and demultiplex functions, high-sensitivity limiting amplifier, on-chip 10-GHz clock synthesizer, clock-data recovery, 10-GHz data and clock drivers, and an SFI-4 compliant 16-bit LVDS interface. The transceiver exceeds all SONET/SDH (OC-192/STM-64) jitter requirements with significant margin: receiver high-frequency jitter tolerance exceeds 0.3 UI/sub pp/ and transmitter jitter generation is 30 mUI/sub pp/. All functionality and specifications (core and I/O) are achieved with power dissipation of less than 1 W.     

A 2-Gb/s 0.5-/spl mu/m CMOS parallel optical transceiver with fast power-on capability

This paper describes an optical transceiver designed for power-efficient connections within high-speed digital systems, specifically for board- and backplane-level interconnections. A 2-Gb/s, four-channel, dc-coupled differential optical transceiver was fabricated in a 0.5-/spl mu/m complementary metal-oxide-semiconductor (CMOS) silicon-on-sapphire (SoS) process and incorporates fast individual-channel power-down and power-on functions. A dynamic sleep transistor technique is used to turn off transceiver circuits and optical devices during power-down. Differential signaling (using two optical channels per signal) enables self-thresholding and allows the transceiver to quickly return from power-down to normal operation. A free-space optical link system was built to evaluate transceiver performance. Experimental results show power-down and power-on transition times to be within a few nanoseconds. Crosstalk measurements show that these transitions do not significantly impact signal integrity of adjacent active channels.     

A 0.13-/spl mu/m CMOS 5-Gb/s 10-m 28AWG cable transceiver with no-feedback-loop continuous-time post-equalizer

The frequency-dependent attenuation of the transmission lines between chips and printed circuit boards, for example, is an obstacle to improving the performance of a system enhanced with LSI technology scaling. This is because large frequency-dependent attenuation results in poor eye-opening performance and a high bit-error rate in data transmission. This paper presents a 5-Gb/s 10-m 28AWG cable transceiver fabricated by using 0.13-/spl mu/m CMOS technology. In this transceiver, a continuous-time post-equalizer, with recently developed no-feedback-loop high-speed analog amplifiers, can handle up to 9dB of frequency-dependent attenuation in cables and also achieve an 18-dB improvement in the attenuation (27dB total improvement) by using pre- and post-equalization techniques in combination.     

A 2.4-GHz 0.25-/spl mu/m CMOS dual-mode direct-conversion transceiver for bluetooth and 802.11b

A dual-mode transceiver integrates the transmitter of 0-dBm output power and the receiver for both Bluetooth with -87 dBm sensitivity and 802.11b with -86 dBm sensitivity in a single chip. A direct-conversion architecture enables the maximum reuse and the optimal current consumption of the various building blocks in each mode for a low-cost and low-power solution. A single-ended power-amplifer (PA) driver transmits the nominal output power of 0 dBm with 18-dB gain control in 3-dB steps. Only little area overhead is required in the baseband active filter and programmable gain amplifier (PGA) to provide the dual-mode capability with optimized current consumption. The DC-offset cancellation scheme coupled with PGAs implements the very low high-pass cutoff frequency with a smaller area than required by a simple coupling capacitor. Fabricated in 0.25-/spl mu/m CMOS process, the die area is 8.4 mm/sup 2/ including pads, and current consumption in RX is 50 mA for Bluetooth and 65 mA for 802.11b from a 2.7-V supply.     

A 0.25-/spl mu/m CMOS quad-band GSM RF transceiver using an efficient LO frequency plan

This paper describes a single-chip CMOS quad-band (850/900/1800/1900 MHz) RF transceiver for GSM/GPRS applications. It is the most important design issue to maximize resource sharing and reuse in designing the multiband transceivers. In particular, reducing the number of voltage-controlled oscillators (VCOs) required for local oscillator (LO) frequency generation is very important because the VCO and phase-locked loop (PLL) circuits occupy a relatively large area. We propose a quad-band GSM transceiver architecture that employs a direct conversion receiver and an offset PLL transmitter, which requires only one VCO/PLL to generate LO signals by using an efficient LO frequency plan. In the receive path, four separate LNAs are used for each band, and two down-conversion mixers are used, one for the low bands (850/900 MHz) and the other for the high bands (1800/1900 MHz). A receiver baseband circuit is shared for all four bands because all of their channel spaces are the same. In the transmit path, most of the building blocks of the offset PLL, including a TX VCO and IF filters, are integrated. The quad-band GSM transceiver that was implemented in 0.25-/spl mu/m CMOS technology has a size of 3.3/spl times/3.2 mm/sup 2/, including its pad area. From the experimental results, we found that the receiver provides a maximum noise figure of 2.9 dB and a minimum IIP3 of -13.2dBm for the EGSM 900 band. The transmitter shows an rms phase error of 1.4/spl deg/ and meets the GSM spectral mask specification. The prototype chip consumes 56 and 58 mA at 2.8 V in the RX and TX modes, respectively.     

12-Gb/s 0.25-μm CMOS 1:4分接器

介绍光纤传输系统的组成,分析1:4分接器的树型结构,并给出其主要特点.在此基础上,进一步探讨树型结构中所用的1:2分接器,并给出其中的锁存器电路结构.此外,讨论了起重要作用的匹配电路以及驱动电路.电路采用标准的0.25μm CMOS工艺设计并实现.实际测试结果显示该电路能够稳定地在STM-16至STM-64所要求的数据速率下工作,最高工作速率为12.92Gb/s.     

A multimode 0.3-200-kb/s transceiver for the 433/868/915-MHz bands in 0.25-/spl mu/m CMOS

A fully integrated transceiver suitable for low-data-rate wireless telemetry and sensor networks operating in the license-free ISM frequency bands at 433, 868, or 915 MHz implemented in 0.25-/spl mu/m CMOS is presented. G/FSK, ASK, and OOK modulation formats are supported at data rates from 0.3 to 200 kb/s. The transceiver's analog building blocks include a low-noise amplifier, mixer, channel filter, received signal-strength indication, frequency synthesizer, voltage-controlled oscillator, and power amplifier. FSK demodulation is implemented using a novel digital complex-frequency correlator that operates over a wide modulation-index range and approximates matched filter detection performance. Automatic gain control, automatic frequency control, and symbol timing recovery loops are included on chip. Operating in the 915-MHz band in FSK mode at 9.6 kb/s, the receiver consumes 19.7 mA from a 3-V supply and achieves a sensitivity of -112.8dBm at 0.1% BER. The transmitter consumes 28.5 mA for an output power of 10 dBm and delivers up to 14 dBm.     

0.18 /spl mu/m CMOS backplane receiver with decision-feedback equalisation embedded

Decision-feedback equalisation (DFE) is explored to reduce intersymbol interference and crosstalks in high-speed backplane applications. In the design of the clock and data recovery circuit, embedding DFE within a phase and frequency detector enhances the recovery of data inherently from distorted input signals and facilitates providing DFE with the recovered clock.     

A 40-Gb/s clock and data recovery circuit in 0.18-/spl mu/m CMOS technology

A phase-locked clock and data recovery circuit incorporates a multiphase LC oscillator and a quarter-rate bang-bang phase detector. The oscillator is based on differential excitation of a closed-loop transmission line at evenly spaced points, providing half-quadrature phases. The phase detector employs eight flip-flops to sample the input every 12.5 ps, detecting data transitions while retiming and demultiplexing the data into four 10-Gb/s outputs. Fabricated in 0.18-/spl mu/m CMOS technology, the circuit produces a clock jitter of 0.9 ps/sub rms/ and 9.67 ps/sub pp/ with a PRBS of 2/sup 31/-1 while consuming 144 mW from a 2-V supply.     

10-Gb/s limiting amplifier and laser/modulator driver in 0.18-/spl mu/m CMOS technology

A limiting amplifier incorporates active feedback, inductive peaking, and negative Miller capacitance to achieve a voltage gain of 50 dB, a bandwidth of 9.4 GHz, and a sensitivity of 4.6 mV/sub pp/ for a bit-error rate of 10/sup -12/ while consuming 150 mW. A driver employs T-coil peaking and negative impedance conversion to achieve operation at 10 Gb/s while delivering a current of 100 mA to 25-/spl Omega/ lasers or a voltage swing of 2 V/sub pp/ to 50-/spl Omega/ modulators with a power dissipation of 675 mW. Fabricated in 0.18-/spl mu/m CMOS technology, both prototypes operate with a 1.8-V supply.     

An analog GFSK modulator in 0.35-/spl mu/m CMOS

An analog Gaussian frequency shift keying (GFSK) modulator designed in 0.35-/spl mu/m CMOS consumes 600 /spl mu/A from a 3-V supply and realizes an analog implementation of the FM differential equation. The modulator operates at baseband and is intended for use in a direct-conversion Bluetooth transmitter. It achieves a frequency deviation of 160 kHz with better than /spl plusmn/3% accuracy. The modulator implements an amplitude control loop to achieve a well-defined output swing. The total output harmonic distortion is less than 1%.     

A 10-Gb/s CDR/DEMUX with LC delay line VCO in 0.18-/spl mu/m CMOS

A monolithic 10-Gb/s clock/data recovery and 1:2 demultiplexer are implemented in 0.18-/spl mu/m CMOS. The quadrature LC delay line oscillator has a tuning range of 125 MHz and a 60-MHz/V sensitivity to power supply pulling. The circuit meets SONET OC-192 jitter specifications with a measured jitter of 8 ps p-p when performing error-free recovery of PRBS 2/sup 31/-1 data. Clock and data recovery (CDR) is achieved at 10 Gb/s, demonstrating the feasibility of a half-rate early/late PD (with tri-state) based CDR on 0.18-/spl mu/m CMOS. The 1.9/spl times/1.5 mm/sup 2/ IC (not including output buffers) consumes 285 mW from a 1.8-V supply.     

A cellular-band CDMA 0.25-/spl mu/m CMOS LNA linearized using active post-distortion

The theory of a linearization method using active post-distortion (APD) is explained for low-frequency and high-frequency applications. The low-frequency cancellation is explained in power series format and the high-frequency cancellation is explained in Volterra series format. The method is utilized for a cellular band (869-894 MHz) CDMA low-noise amplifier (LNA), which is implemented in 0.25-/spl mu/m CMOS process. The LNA achieves 1.2 dB NF, 16.2 dB power gain, and +8 dBm IIP3 while consuming 12 mA current from 2.6 V supply voltage. It shows 13.5 dB of IM3 product reduction with 0.15 dB NF penalty in comparison with an LNA which does not use the APD method.     

A high-voltage output driver in a 2.5-V 0.25-/spl mu/m CMOS technology

The design of a high-voltage output driver in a digital 0.25-/spl mu/m 2.5-V technology is presented. The use of stacked devices with a self-biased cascode topology allows the driver to operate at three times the nominal supply voltage. Oxide stress and hot carrier degradation is minimized since the driver operates within the voltage limits imposed by the design rules of a mainstream CMOS technology. The proposed high-voltage architecture uses a switching output stage. The realized prototype delivers an output swing of 6.46 V to a 50-/spl Omega/ load with a 7.5-V supply and an input square wave of 10 MHz. A PWM signal with a dual-tone sinusoid at 70 kHz and 250 kHz results in an IM3 of -65 dB and an IM2 of -67 dB. The on-resistance is 5.9 /spl Omega/.     

A 10-Gb/s receiver with series equalizer and on-chip ISI monitor in 0.11-/spl mu/m CMOS

A 10-Gb/s receiver is presented that consists of an equalizer, an intersymbol interference (ISI) monitor, and a clock and data recovery (CDR) unit. The equalizer uses the Cherry-Hooper topology to achieve high-bandwidth with small area and low power consumption, without using on-chip inductors. The ISI monitor measures the channel response including the wire and the equalizer on the fly by calculating the correlation between the error in the input signal and the past decision data. A switched capacitor correlator enables a compact and low power implementation of the ISI monitor. The receiver test chip was fabricated by using a standard 0.11-/spl mu/m CMOS technology. The receiver active area is 0.8 mm/sup 2/ and it consumes 133 mW with a 1.2-V power supply. The equalizer compensates for high-frequency losses ranging from 0 dB to 20 dB with a bit error rate of less than 10/sup -12/. The areas and power consumptions are 47 /spl mu/m /spl times/ 85 /spl mu/m and 13.2 mW for the equalizer, and 145 /spl mu/m /spl times/ 80 /spl mu/m and 10 mW for the ISI monitor.     

A 0.25-/spl mu/m CMOS OPLL transmitter IC for GSM and DCS applications

A single-chip CMOS global system for mobile communications/digital cellular system dual-band offset phase-locked loop (OPLL) transmitter is presented in this paper. This chip includes a quadrature modulator and an OPLL modulation loop. Except for the loop filter and high-power voltage-controlled oscillator (TX VCO), everything is integrated into this chip to form a dual-band transmitter. This transmitter integrated circuit is fabricated in a 0.25-mum CMOS process. The current consumption without the TX VCO is approximately 23 mA under 2.7-V power supply for both bands. The measured rms and peak phase errors for Gaussian minimum shift-keying (GMSK) modulated signals are approximately 1deg and 2.4deg, respectively. The measurements show comparable performance to its BiCMOS counterparts     

A divide-by-16.5 circuit for 10-gb ethernet transceiver in 0.13-/spl mu/m CMOS

A divide-by-16.5 frequency divider, providing read- and write-clocks for an elastic buffer or a gearbox between 10.3125-Gb/s and quad 3.125-Gb/s transceivers in 10-G Ethernet application, is presented. The high-speed and noninteger division is designed by cascading high-speed divide-by-3 followed by divide-by-5.5 which uses double-edge-triggered flip-flops. The divide-by-3 circuit receives and generates 5.15625-GHz and 1.71875-GHz differential clocks with a 50% duty cycle, respectively. Based on current-mode logics (CMLs), the proposed divide-by-16.5 scheme is implemented in a 0.13-/spl mu/m CMOS technology to achieve over 5-GHz operation while consuming 18 mW from a 1.2-V supply.     

A 300-MHz quadrature direct digital synthesizer/mixer in 0.25-/spl mu/m CMOS

A 300-MHz quadrature direct digital frequency synthesizer/complex mixer (QDDSM) chip is presented. With a 32-bit input frequency control word, the tuning resolution is 0.07 Hz at the operating frequency of 300 MHz. The 12-bit I and Q inputs and 13-bit I and Q outputs offer a spurious-free dynamic range of 90.3 dB. The tuning latency is 13 clock cycles, which corresponds to 43 ns at 300 MHz. The tuning bandwidth (half the operating frequency) is 150 MHz. The IC is realized in 0.25-/spl mu/m TSMC CMOS technology with 4180 standard library cells and occupies a core area of 0.36 mm/sup 2/. At 300 MHz, the power dissipation is less than 400 mW. A key feature of the design is the creation of conditionally negating multipliers.