含氮氟化非晶碳(a-C∶F∶N)薄膜电学性能的研究

用射频等离子体增强化学气相沉积(RF-PECVD)法制备氮掺杂氟化非晶碳(a-C∶F)薄膜,用电桥测试薄膜的介电常数,研究不同工艺参量对薄膜电学性能的影响.结果表明:掺杂氮、高射频功率、高沉积温度以及热退火都导致薄膜介电常数上升.     

沉积在硅尖上的氮化硼薄膜的场发射特性

利用射频磁控溅射方法,在硅尖上沉积了氮化硼（BN）薄膜．红外光谱分析表明,BN薄膜结构为六角BN（h-BN）相（1380cm^-1和780cm^-1）．在超高真空系统中测量了BN薄膜的场发射特性,与沉积在硅片上的BN薄膜比较,沉积在硅尖上的BN薄膜的场发射特性明显提高．开启电场为8V／μm,最高发射电流为300μA／cm^2．沉积在硅尖上的BN薄膜的场发射FN曲线为两段直线,这可能是由于电子发射源于硅尖的尖部和根部造成的．     

工作气压对氮化硼薄膜场发射特性的影响

利用射频磁控溅射方法，在n型(100)Si基底上沉积了氮化硼(BN)薄膜，并在超高真空系统中测量了BN薄膜的场发射特性．研究发现，沉积时工作气压的变化对BN薄膜的场发射特性有很大影响，工作气压为2Pa时沉积的BN薄膜样品的场发射特性较好，其阈值电场为6V/μm，场发射电流为320μA／cm^2．F—N曲线表明，在外加电场的作用下，电子是通过隧道效应穿透BN薄膜表面势垒发射到真空的．     

射频磁控反应溅射制备HfO2薄膜的工艺及电性能

采用射频磁控反应溅射法,以高纯Hf为靶材、高纯O2为反应气体,成功地在p型硅衬 底上制备了高k栅介质HfO2薄膜,并对薄膜的沉积速率、成分和电学性能进行了研究.结果 表明,薄膜沉积速率随射频功率增加而增大,随O2气流量增加而减小,随溅射气压增加呈先 增大后减小的趋势.制备的薄膜中Hf和O元素的原子浓度比基本符合化学计量比.研究了薄 膜的C-V特性;获得了O2流量、射频功率及退火温度对薄膜电学性能的影响规律.     

表面覆盖钛薄膜的纳米片状碳膜场发射特性(英文)

利用石英管型波等离子体化学气相沉积装置在Si衬底上沉积了纳米片状碳膜,然后采用电子束蒸镀方法在碳膜表面沉积了一层2 nm厚的Ti膜,并在高真空系统中测量了覆盖Ti膜前后的纳米片状碳膜的场发射特性.研究表明:覆盖Ti膜的纳米片状碳膜因表面生成碳化钛而改性,使得场发射特性得到改善;表面覆盖Ti膜后,阈值电场由2.6 V/μm下降到2.0 V/μm,当电场增加到9 V/μm时,场发射电流由12.4 mA/cm2增加到20.2 mA/cm2.     

基底偏压对BN薄膜场发射特性的影响

利用射频磁控溅射方法，在n型(100)Si基底上沉积了氮化硼薄膜(BN)．通过分析电流密度-电场强度曲线，发现BN薄膜的场发射特性与基底偏压影响很大，基底偏压为-140V时BN薄膜样品场发射特性要好于其它样品，阈值电场低于8V／μm．F-N曲线表明：电子是通过隧道效应克服BN薄膜表面势垒发射到真空的．     

表面覆盖氮化硼膜的金刚石膜的场发射特性

利用热丝化学气相沉积（HFCVD）方法在Si衬底上生长了4μm厚的金刚石膜,然后利用射频磁控溅射方法在金刚石膜上沉积了100nm厚的六角氮化硼（h—BN）薄膜．在超高真空系统中测试了覆盖氮化硼（BN）薄膜前后金刚石膜的场发射特性,结果表明覆盖BN薄膜后的金刚石膜的场发射特性明显提高,开启电场由14V／μm升到8V／μm．F—N曲线表明,覆盖BN薄膜后的金刚石膜在强电场区域的场增强因子有所降低,这可能归因于场发射点随着电场的增强而改变．     

等离子体化学气相沉积制备氮化碳薄膜

以H2、N2和CH4气体为前驱气体,通过等离子体化学气相沉积技术制备氮化碳薄膜。采用场发射扫描电子显微镜(FS-EM)及其附带的能量分散电子谱(EDS)、X射线衍射分析(XRD)、红外光谱(FTIR)和拉曼光谱(Raman)对其结构、表面形貌、元素含量和成键状况进行了分析,并讨论了气体流量比和放电功率对薄膜制备的影响。实验结果表明:沉积的薄膜中含有晶态的C3N4,碳氮原子比接近于理论值0.75,样品中碳氮原子多以C N、C N的形式存在;样品中氮元素的含量随着反应气体中N2含量的增加而增加;放电功率的增大使薄膜的沉积速率增大。     

一种N型轻掺杂氢化硅基薄膜的欧姆接触

使用等离子体增强化学气相沉积方法制备了一组磷掺杂氢化硅基薄膜。I-U曲线显示薄膜与铝电极形成了良好的欧姆接触。霍尔测试结果表明该组样品为轻掺杂;利用拉曼光谱和紫外一可见吸收光谱对薄膜的微结构和光学带隙进行了表征,并从薄膜能带结构出发探讨了形成欧姆接触的原因。     

N-Ge_2Sb_2Te_5薄膜的相变特性研究

采用射频磁控溅射法在室温下沉积了N-GST相变薄膜,利用原位XRD研究了其相变过程.结果表明:室温下沉积薄膜均为非晶态,且在室温~375℃温度范围内,纯GST薄膜发生了非晶态→立方晶态→六方晶态相转变;然而,当N2流量为12.8 sccm时,N掺杂GST薄膜则发生了非晶态→六方晶态直接相转变.此外,通过原位XRD确定结晶温度,表明N引入能够显著提高GST薄膜的结晶温度,这有利于提高相变薄膜的非晶热稳定性.     

原子力显微镜在ZAO薄膜表征中的应用

利用磁控溅射法在溅射功率分别为30,50,80,100W条件下制备ZAO薄膜,并通过原子力显微镜(AFM)、X射线衍射(XRD)谱对制得的薄膜样品进行表面形貌、结构特性和黏附性能进行研究。XRD结果表明,随着溅射功率的增加,ZAO薄膜呈现了明显的(002)择优取向,结晶质量获得提高。通过原子力显微镜对样品的二维、三维以及剖面线图进行分析。随着溅射功率增大,薄膜样品表面较均匀致密,晶粒生长较充分,结晶质量较高,粗糙度和黏附力均增大。     

Optimization of material structure of ploy-Si thin film based on Al induced crystallization

Based on Al induced crystallization (AIC) method, influences of different material structures on formation and characteristics of ploy-silicon thin films were studied and optimized. Al-Si films on glass with different structures (Si/Al/Glass, Al/Si/Glass, Si/Al/…/Si/Al/Glass) were deposited on glass substrates by sputtering method. All samples were annealed for MIC with varied time processes under 500℃ N2 environment. X-ray diffraction test and scanning electron microscope were adopted to characterize cryst...     

Investigations of ZnO thin films deposited by a reactive pulsed laser ablation

Highly transparent ZnO thin films were deposited at different substrate temperatures by pulsed laser deposition in an oxygen atmosphere. The thin films were characterized by various techniques including X-ray diffraction, scanning electron microscopy, optical absorption, and photoluminescence. We demonstrated that oriented wurtzite ZnO thin films could be deposited at room temperature using a high purity zinc target. Variable temperature photoluminescence revealed new characteristics in the band edge emission. The underlying mechanism for the observed phenomena was also discussed.     

Effect of silver growth temperature on the contacts between Ag and ZnO thin films

Highly c-axis oriented ZnO thin films were deposited on Si substrates by the pulsed laser deposition (PLD) method. At different growth temperatures, 200 nm silver films as the contact metal were deposited on the ZnO thin films. The growth temperatures have great influence on the crystal quality of Ag films. Current-voltage characteristics were measured at room temperature. The Schottky contacts between Ag and ZnO thin films were successfully obtained when silver electrodes were deposited at 150°C and 200°C. Ohmic contacts were formed while the growth temperatures were lower than 150°C or higher than 200°C. After analysis, the forming of Ag/ZnO Schottky contacts was shown to be dependent on the appearance of the p-type inversion layer at the interface between Ag and ZnO layers.     

脉冲激光能量密度对ZnS薄膜的影响

采用YAG固体激光器（1064nm）和XeCl（308nm）准分子激光器，利用脉冲激光沉积技术，研究了不同的脉冲激光能量密度和不同波长的激光器对制备的ZnS薄膜的影响。利用X射线衍射（XRD）和扫描电子显微镜（SEM）对制备样品的结构、形貌特性进行了表征。结果表明：脉冲激光能量密度过高会使薄膜质量变坏；XeCl激光器制备的薄膜质量更好。     

薄膜型金刚石辐射剂量计的光电性能

金刚石具有宽禁带、强抗辐射性、与人体软组织接近的原子序数等一系列高质量辐射剂量计所需的性质，正日益受到关注。采用微波等离子体在不同条件和不同制备方法下合成金刚石薄膜，并制作出三明治结构的辐射剂量计。研究金刚石薄膜辐射剂量计的暗电流-电压特性，X光电响应特性及响应动力学。暗电流I-V特性测试结果表明，此剂量计具有欧姆特性。X光电响应测试结果表明，膜的取向和纯度是影响辐射剂量计X光响应灵敏度的主要因素。在纯度相近的情况下，[100]取向膜做成的器件X光响应灵敏度高于[111]取向膜；在同一取向下，纯度越高，灵敏度越高，“Priming”效应越弱。剂量计响应电流与辐射剂量间有较好的线性关系。通过标校后此金刚石薄膜剂量计能用于辐射剂量的定量检测。     

沉积温度和速率对电子束沉积ZnSe薄膜应力特性的影响

在不同沉积温度和速率下,采用电子束蒸发法制备ZnSe薄膜样品,利用ZYGO GPI型干涉仪测试样品的应力行为,并采用X射线衍射（XRD）技术测试样品的晶向特征.实验结果表明,在不同条件下制备的ZnSe薄膜均呈现压应力,应力随着沉积温度升高而增大,在200 ℃应力达到最大值,之后应力随沉积温度升高呈下降趋势.XRD结果表明,沉积速率直接影响ZnSe薄膜的晶向结构,进而改变ZnSe薄膜内应力;当沉积速率为1.5 nm/s时,薄膜应力最小.     

基于溶胶凝胶法ITO薄膜材料的制备与表征

基于溶胶凝胶法制备了掺铟二氧化锡（ITO）薄膜,探讨聚乙二醇（PEG）、退火温度、退火过程氧气浓度等因素对ITO薄膜性能的影响。实验结果表明：在相同实验条件下,添加PEG能够降低ITO薄膜表面粗糙度,退火温度会改变ITO薄膜的结晶度,提高含锡量和氧浓度会增加ITO薄膜的电阻率。本研究为ITO埋栅结构气敏传感器制备提供了实验基础。     

Effect of ZnTe/ZnTe:Cu complex back-contact on device characteristics of CdTe solar cells

ZnTe/ZnTe:Cu complex layers deposited by vacuum co-evaporation have been in- troduced to CdS/CdTe solar cells. The C-V and I-V curves have been investigated and the effects of un-doped ZnTe layer thickness as well as annealing temperatures on I-V characteristics of CdTe solar cells have been studied. The results show that the “roll over” and “cross over” phenomena of dark and light I-V curves can be eliminated by use of ZnTe/ZnTe:Cu layer and the fill factor for a typical sample has increased to 73%, where there is no high resistance transparent layer. The reasons have been discussed combined with the energy band diagram of CdTe solar cells.     

Effects of Electrode on Resistance Switching Properties of ZnMn_2O_4 Films Deposited by Magnetron Sputtering

ZnMn_2O_4 films for resistance random access memory(RRAM) were fabricated with different device structures by magnetron sputtering. The effects of electrode on I-V characteristics, resistance switching behavior, endurance and retention characteristics of ZnMn_2O_4 films were investigated. The ZnMn_2O_4 films, using p-Si and Pt as bottom electrode, exhibit bipolar resistive switching(BRS) behavior dominated by the space-charge-limited conduction(SCLC) mechanism in the high resistance state(HRS) and the filament conduction mechanism in the low resistance state(LRS), but the ZnMn_2O_4 films using n-Si as bottom electrodes exhibit both bipolar and unipolar resistive switching behaviors controlled by the Poole-Frenkel(P-F) conduction mechanism in both HRS and LRS. Ag/ZnMn_2O_4/p-Si device possesses the best endurance and retention characteristics, in which the number of stable repetition switching cycle is over 1000 and the retention time is longer than 106 seconds. However, the highest RHRS/R_(LRS) ratio of 104 and the lowest V_(ON) and V_(OFF) of 3.0 V have been observed in Ag/ZnMn_2O_4/Pt device. Though the Ag/ZnMn_2O_4/n-Si device also possesses the highest RHRS/R_(LRS) ratio of 104, but the highest values of V_(ON),V_(OFF), RHRS and R_(LRS), as well as the poor endurance and retention characteristics.