氧化铝陶瓷高温银浆表面金属化研究

电子银浆料是通过丝网印刷工艺预先均匀分布在氧化铝陶瓷板表面。笔者通过四探针测试法和背散射电子成像分别研究了烧结保温时间和基板腐蚀情况对银金属化层的形貌、表面电阻率以及机械特性的影响。实验数据显示,在850℃保温40min时银金属化层的表面电阻率最小且有最大的附着力强度。此外,即使在氧化铝陶瓷基板被不同浓度的氢氧化钠碱液腐蚀后,银金属化层仍然具有较小的表面电阻率和较大的附着力强度。基于实验结果可得出,在银金属化层与氧化铝陶瓷基板界面处提出了银金属化层网状结构和玻璃的网状结构相互交错的模型。     

非导体表面金属化

介绍了非导体表面金属化技术。阐述了化学镀、直接电镀技术Futuron工艺、化学还原、接枝共聚表面处理新技术,并分析了近年来在非导体金属化方面关键技术的改进和发展;介绍了非导体金属化技术的应用领域,并对金属化技术的应用前景进行了探讨。     

纳米改性聚合物材料研究进展

综述了纳米改性聚合物材料的研究进展,包括纳米粒子的结构与性质,纳米粒子的表面改性,纳米粒子对聚合物的改性机理和方法及纳米技术在高分子材料领域中的应用。     

炭黑表面聚合物接枝改性的研究进展

介绍了各种单体通过自由基聚合、阴离子聚合、阳离子聚合等机理在炭黑表面的接技改性及活性聚合物在炭黑表面的接枝反应的研究进展,归纳了改性炭黑的性能及其表征方法。     

金属化纤维织物材料

综述了金属化纤维织物材料的研究与发展，金属化纤维和织物的主要制造方法及技术；金属化织物材料的应用及其重要意义。     

不锈钢涂装前处理工艺实践

不锈钢设备长时间在腐蚀性介质环境中运行,表面会出现腐蚀,需要进行涂装防护。但不锈钢表面光滑,涂料对其附着力差、防护能力弱,探索了不锈钢涂装的前处理工艺。实验发现,除油处理并不能完全解决漆膜的附着力问题,除油后增加酸洗工序,可以有效提高漆膜的附着力,增强漆膜对不锈钢基材的防护能力,经有机酸处理后漆膜的附着性能及防护性能最强,附着力达到0级。     

聚合物的润湿和表面改性

本文提出聚合物填料表面化学处理的方法有二,即光氯化法和液相化学处理法,经论证,是改善聚合物填料润湿性能的有效途径。该法具有简单易行、处理费用低廉、收效显著等优点。     

化学镀银在材料表面金属化中的应用

介绍了化学镀银法制备导电填料、屏蔽材料、电子元件等的工艺,分析了影响化学镀银速度和镀层质量的因素,如表面预处理、镀液配方、操作工艺条件等。指出了工艺中存在的问题,并对发展前景进行了展望。     

碳纤维表面聚合物接枝改性的研究进展

碳纤维以轻质高强、耐热耐腐蚀、抗蠕变等优点成为十分重要的增强材料。但未经处理的碳纤维表面光滑、呈惰性、界面的粘结性差,需对其表面处理。聚合接枝改性具有不损坏基体、稳定性好且可以接枝特定聚合物等使它成为改性碳纤维的主要方法,详细综述了辐射接枝、光表面接枝、等离子接枝和化学接枝4种聚合接枝改性方法的研究与应用,并比较了它们的优缺点,为碳纤维表面改性研究提供了参考。     

不锈钢件涂装前处理工艺的选择

对不锈钢涂装预处理工艺进行了试验和分析,同时结合现有不锈钢产品的涂层质量要求和产品结构特点,选取了适合本公司产品的不锈钢涂装前处理工艺。     

Role of polymer chain end groups in plasma modification for surface metallization of polymeric materials

How to improve adhesion between poly(oxybenzoate‐co‐oxynaphthoate) (Vecstar OC and FA films) and copper metal by Ar, O₂, N₂ and NH₃ plasma modification was investigated. The mechanism of adhesion improvement is discussed from the viewpoint of chemical and physical interactions at the interface between the Vecstar film and copper metal layer. The adhesion between Vecstar OC film and copper metal was improved by chemical rather than physical interactions. Polymer chain end groups that occur at Vecstar OC film surfaces contribute effectively to adhesion. This improvement in adhesion is due to interactions between copper metal and O?C groups formed by plasma modification. Aggregation of the O?C groups to the copper metal/Vecstar OC film interface is a key factor for good adhesion. From this aspect, heat treatment of plasma‐modified Vecstar OC films on glass plates is effective in the aggregation, and the peel strength for the copper metal/Vecstar OC film system reached 1.21 N (5 mm)^?1. Copyright © 2009 Society of Chemical Industry     

智能高分子材料的研究进展

从合成、加工、新产品开发及其应用诸方面综述了智能高分子材料，如智能高分子凝胶、形状记忆高分子材料、智能织物、智能高分子膜和智能高分子复合材料等的研究进展，并展望了其发展前景。     

难粘高分子材料的等离子体表面处理研究进展

简要介绍了等离子体表面处理技术的作用原理、分类及特点,综述了等离子体表面处理技术在难粘高分子材料聚乙烯、聚丙烯和聚四氟乙烯的薄膜、纤维以及片材的表面改性中的研究进展,并对等离子体表面处理技术在表面改性研究中的应用及前景做了展望。     

Aqueous pretreatment of polyetherimide to facilitate the bonding of electrolessly deposited metals. Part 2. Solubilizer-free systems

An aqueous method for chemically pretreating polyetherimide substrates to promote adhesion to electrolessly deposited copper or nickel is described. The process consists of cleaning the polymer surface followed by surface normalization and debris removal. In contrast to previously developed processes, no separate adhesion promotion step is required. Peel strengths between 150-250 and 120-150 g/mm were achieved for copper and nickel, respectively. Scanning electron microscopy and X-ray photoelectron spectroscopy were utilized to investigate changes in the polymer surface morphology and chemistry during processing. Possible candidates for the different steps are presented, as are analyses of the failure loci following peel strength assessment.     

Surface modification and metallization of polyimide using gold colloids as a seed layer

Herein we report on metallization of Cu on to surface‐modified polyimide resin, the method of which relies on potassium hydroxide‐induced modification of the polyimide surface to introduce carboxylic acid groups and incorporation of gold colloids as a seed layer through reduction of chloroauric acid. The contact angle of modified polyimide surface with water changed from 70 to 35° due to the hydrolysis of polyimide. Secondary amine group on the surface was detected with attenuated total reflection (ATR) Fourier transform infrared (FTIR) spectrophotometry, suggesting that tertiary amine group has turned into secondary group. In addition, on the basis of hydrophilic behavior, we succeeded in depositing gold colloids on the chemically modified surface. SEM image of copper electroless plated on polyimide surface indicated that copper particles were compact and about ～ 300 nm in diameter. It showed that gold colloids provide an excellent conductive layer to catalyze the electroless plating of Cu on polyimide surface. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

The effect of TiO2 morphology on the surface modification of poly (ethylene terephthalate) for electroless plating

In this study, a surface modification of the poly (ethylene terephthalate) (PET) film using TiO₂ photocatalytic treatment was investigated. In order to enhance the adhesion strength between the PET film and the electroless copper film, the effects of TiO₂ crystal forms, TiO₂ particle sizes, and TiO₂ content, as well as treatment condition, upon the surface contact angle, surface characterization, and adhesion strength were investigated. Anatase TiO₂ with a particle size of 5 nm had a high catalytic activity and dispersibility in aqueous solution. After the optimal photocatalytic treatment, the surface contact angle of the PET film decreased from 84.4° to 19.8°, and the surface roughness of the PET film increased from 36 to 117 nm. The adhesion strength between the PET film and the electroless copper film reached 0.89?KN?m^?1. X-ray photoelectron spectroscopy analyses indicated the carbonyl group was formed on the PET surface after photocatalytic treatment, and the surface hydrophilicity was improved. Consequently, TiO₂ photocatalytic treatment is an environmentally friendly and effective method for the surface modification of the PET film.     

塑料表面化学镀金属化的进展

介绍了ABS、聚丙烯、聚苯乙烯、聚氯乙烯等塑料的化学镀表面金属化工艺。对其关键工序表面粗化方法进行了综述。列举了3种结合力检测方法。指出了塑料金属化今后的发展趋势。     

Effects of surface modification by remote hydrogen plasma on adhesion in poly(tetrafluoroethylene)/copper composites

Poly(tetrafluoroethylene) (PTFE) sheet was modified with the remote hydrogen plasma, and the effect of the modification on adhesion between the PTFE sheet and copper metal was investigated. The remote hydrogen plasma was able to make PTFE surfaces hydrophilic without etching. In the modification process, defluorination and oxidation occurred on the PTFE surface. Reactivity of defluorination was 25% (estimated from the concentration of CF₂ component) −39% (estimated from the F/C atom ratio). Surface modification of PTFE surface by remote hydrogen plasma contributed to the adhesion between PTFE and copper metal. Peel strength was improved from 7.5 to 92 mN/5 mm by surface modification by a factor of 12. Failure of the PTFE/copper adhesive joint occurred at the interface between the PTFE and copper metal layers, rather than in the inner layer of the PTFE polymer or copper metal layers. Remote hydrogen plasma treatment is a preferable pretreatment of PTFE surface for the fabrication of PTFE and copper metal composites. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 2191–2200, 1999     

煤系高岭土表面改性及在高分子材料中的应用

介绍了煤系高岭土的特征、对其表面改性的目的及改性设备和工艺,浅析了硅烷偶联剂和钛酸酯偶联剂的构造与改性机理,综述了我国煤系高岭土在高分子材料中的应用情况。     

凹凸棒土/聚合物复合材料研究进展

综述了凹凸棒土在聚合物中的应用研究进展。研究表明，大多数情况下，常规的聚合物加工技术不足以将凹凸棒土解离为纳米短纤维，因此只能形成凹凸棒土／聚合物微米复合材料，但将凹凸棒土进行有机改性，可以明显提高其增强效果。采用原位聚合的方法可以制备出性能优异的凹凸棒土／聚合物纳米复合材料，或在高黏度和高极性的聚合物熔体中，凹凸棒土在剪切力下可以解离为纳米单晶，从而形成纳米复合材料。利用凹凸棒土／乳液共混共凝方式也可制备出凹凸棒土／橡胶纳米复合材料。