采用Pd／Sn胶体催化剂的直接电镀工艺

采用Ｐｄ／Ｓｎ胶体催化剂的直接电镀工艺蔡积庆（南京无线八厂，２１００１８）１前言五十年代工业上采用化学镀铜工艺实现塑料等非导体材料的金属化。到了六十年代中期，化学镀铜应用于印制板（ＰＣＢ）的孔金属化。在以后的３０多年中，人们对化学镀铜溶液的稳定性、化...     

用溶剂化金属原子浸渍法制备的高分散负载型催化剂Pd－Cu／C的结构与性质

应用溶剂化金属原子浸渍（ＳＭＡＩ）法制备了三种金属含量比不同的Ｐｄ－Ｃｕ／Ｃ双金属催化剂。经ＸＲＤ和ＴＥＭ测定结果表明，催化剂中Ｐｄ和Ｃｕ已形成合金，合金颗粒平均直径小于５ｎｍ。ＸＰＳ和Ａｕｇｅｒ谱说明Ｐｄ和Ｃｕ均以零价态存在。在亚异丙基丙酮（ＣＨ＿３）＿２Ｃ＝ＣＨＣＯＣＨ＿３加氢反应中，随着催化剂中Ｃｕ比例增加，催化活性增大，而生成六碳酮的选择性基本不变。     

合成二氧化氯的催化剂

在高活性且低失活速率催化剂的存在下，可由亚氯酸钠溶液制备二氧化氯。适宜催化剂为含Ｌａ２Ｏ３和Ｎｄ２Ｏ３的Ｐｄ／Ａｌ２Ｏ３或钯和其它铂族金属（例如Ｐｄ＋Ｐｔ／Ａｌ２Ｏ３）或钯和ＩＢ族金属（例如Ｐｄ＋Ａｕ／Ａｌ２Ｏ３）催化剂。     

Sn或Sn－Pb合金镀层退除工艺

Ｓｎ或Ｓｎ－Ｐｂ合金镀层退除工艺蔡积庆（南京无线电八厂，２１００１８）在印制板制造工艺中，往往采用电镀或化学镀等方法在印制板的导线图形、金属化孔和焊盘部分沉积－薄层Ｓｎ或Ｓｎ－Ｐｂ合金，厚度约５～１０μｍ，作为以后蚀刻除去非线路图形部分Ｃｕ的金属抗蚀...     

磺胺喹啉偶氮衍生物的合成及其分析应用的研究

由８－氨基喹啉－５－偶氮衍生物与苯磺酰氯或对甲苯磺酰氯反应制得了６种磺胺喹啉偶氮衍生物。产品经红外光谱和元素分析确证。用光度法测定了其中两个试剂的酸离解常数。系统研究了试剂与金属离子的显色反应和荧光反应。发现ＳＰＴＳＱ，ＮＰＴＳＱ和ＮＰＢＳＱ是Ｃｕ（Ⅱ）、Ｃｏ（Ⅱ），Ｎｉ（Ⅱ）、Ｐｄ（Ⅱ）、Ａｕ（Ⅲ）、Ｐｔ（Ⅱ）的灵敏光度试剂，６个衍生物均是Ｃｕ（Ⅱ）、Ｃｏ（Ⅱ）的灵敏荧光试剂，其中ＭＯＰＢＳＱ和ＡＡＰＴＳＱ还是Ｐｄ（Ⅱ）的良好荧光试剂。建立了几个性能优良的光度、荧光和极谱分析新体系。     

球形Ni(OH)2化学镀Co、Zn和Co-Zn合金工艺的研究

给出了不需用ＰｄＣｌ２活化,采用连续化方式在球形Ｎｉ（ＯＨ）２表现化学镀和钴锌合金的工艺条件。研究了镀液ｐＨ值、钴盐浓度和化学镀的反应温度对产物的堆积密度以及结构的影响。结果表明,析氢反应随着整个化学镀过程,有利于生成多孔化学镀层,并能够有效地提高材料的电化学性能。     

用于塑料电镀的固体活化剂

一、前言在塑料电镀的前处理工艺中,敏化和活化是非常重要的工序。经过敏化和活化处理,使非金属表面具有催化化学镀的活性,从而能够在非金属表面获得连续的化学镀层。目前国内大部分塑料电镀工艺采用氯化亚锡溶液敏化处理后,再在硝酸银溶液中活化而还原出金属银晶核,使塑料表面获得催化活性。在电子工业部门,特别是在印制板孔化工艺中,则多采用胶体钯活化法。即使用以金属钯为核心形成的钯锡胶体溶液进行活化处理,经过解胶(加速)后,裸露出钯核作为活性中心。分步活化工艺的原料成本较低,配制容易,但是操作复杂,工序间需要严格的蒸馏水清洗,且使用寿命较短。另外,只能催化化学镀铜而不能催化化学镀镍,也不适合自动线生产。     

化学镀金

印制板化学镀金时,导线铜箔周边的绝缘基体上往往会析出金,容易发生镀金层溢出现象,这种现象一般是由于镀液中的微细金粒附着在绝缘基体上,通过金粒的自身催化作用,在绝缘基体上引起金的析出。这种镀金层溢出现象往往是引起高密度印制板电气短路的主要原因之一。为了克服镀金层的溢出,曾经采用添加聚乙二醇等非离子型表面活性剂的还原型化学镀金液,非离子型表面活性剂特异的吸附在非线性扩散产生的微细金粒子表面上,阻止镀层的溢出成长。然而当非离子型表面活性剂因消耗而浓度降低时,就会丧失 阻止金镀层溢出的效果。如果镀液中的非离子型表面活性剂浓度过高,就会吸附在导体表面上,进而抑制化学镀金反应。鉴于上述状况,随着印制板高密度化的发展,化学镀金层质量对于高密度印制板的质量至关重要。本文就抑制镀金层溢出,且可获得均镀性优良的印制板化学镀金液及其工艺加以叙述。     

氯化钯催化活性的研究

对氯化钯在塑料表面化学镀铜和镀镍中催化活性进行了研究,着重考察了影响氯化钯催化活性的主要因素,如：催化剂载体、前处理液酸度、ＰｄＣｌ２的浓度、操作温度和处理时间等等,还简要讨论了氯化钯活化作用的机理。     

有机锡试剂与芳卤化合物在Pd（Ⅱ）／γ—Al2O3催化下的偶联反应

制备了有机锡试剂Ｂｕ３ＳｎＰｈ,Ｂｕ３ＳｎＣＨ２Ｐｈ及催化剂Ｐｄ（Ⅱ）／γ－Ａｌ２Ｏ３催化剂对有机锡试剂与芳卤化合物的偶联反应有较高的活性。该反应条件温和,催化剂可重复使用,产率较高。     

日本表面处理技术近期动向第一部分贵金属电镀

分别介绍了日本的镀金种类和用途,酸性金电镀和高速还原型化学镀金、化学镀硬质金的工艺配方,中性金电镀和置换型镀金的工艺特点,pH对酸性金合金电镀的影响以及影响化学镀硬质金镀层硬度的因素。对无氰光亮镀银和无氰冲击镀银、化学镀钯、酸性白金电镀和碱性白金电镀的工艺配方以及化学镀白金的工艺特点也进行了相应地介绍。     

Palladium‐catalyzed electroless plating of gold on latex particle surfaces

Gold can be deposited onto a latex particle surface via the growth of metal islands with the electroless plating method. A new method is proposed for the electroless plating of gold on the surface of poly(styrene‐co‐vinylimidazole) latex particles, which is catalyzed by palladium present on the latex particle surfaces. The palladium ions are anchored to the latex particle surfaces by the formation of a palladium–imidazole complex, and palladium nanoparticles are nucleated by a reductant. These palladium islands act as catalytic sites, so gold is preferentially deposited onto the latex particle surfaces. Transmission electron microscopy, X‐ray photoelectron spectroscopy, and sucrose density gradient column results indicate that the palladium is associated with the imidazole‐functionalized latex particles. Different gold loading levels and reductant types were explored. Latex particles were partially encapsulated by finely dispersed gold nanoparticles less than 2 nm in diameter or by gold islands with sizes ranging from 10 to 100 nm up to a gold loading level of 3.1 mg of Au/m² of latex. However, using higher gold loading levels led to uncontrollable electroless plating of gold because gold reduction in the water phase became very dominant even in the presence of catalytic palladium on the latex particle surface. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

无氰置换镀金工艺的研究

探讨了工艺参数对无氰置换镀金液稳定性及镀层性能的影响;采用正交试验优化工艺,得到了镀液稳定性好、镀层性能良好的中性无氰置换镀金工艺.此工艺含有能够减缓镀金初始时沉积速率,又能降低对镍层腐蚀的添加剂.     

Gold wire bondability of electroless gold plating using disulfiteaurate complex

Generally, contact or terminal areas are coated with nickel as a barrier layer; subsequently, gold plating is performed to maintain reliability of electrical interconnection. Treatment using dilute solutions of palladium ions have been applied to initiate electroless nickel plating on copper substrates because copper has no catalytic action for the oxidation of hypophosphite. However, trace amounts of palladium ions may remain on the unwanted areas and extraneous nickel deposits are often observed. We confirmed that nickel films without extraneous deposits can be formed using the activation solutions containing dimethyl amine borane (DMAB). Bondability on the electrolessly deposited gold was greatly influenced by the phosphorus contents of the deposited nickel films as the underlayer. Bonding strength after electroless gold plating was increased with increasing phosphorus contents in the nickel films. Stabilizers in the electroless gold plating also influenced the bonding strength. Baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. Gold deposits having strong orientation with Au(220) and Au(311) indicated high bond strength.     

接插件的表面处理

综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。     

铍青铜零件电镀金工艺

在铍青铜基体上采用镍作为中间层然后镀金是传统的镀覆方法.有些应用场合不允许采用镀镍而直接镀金,必须解决镀层与基体结合力的问题.分析铍青铜的特性和镀金层结合力不良的原因,提出了一种铍青铜直接电镀金的工艺流程和工艺参数,包括热处理疏松氧化层、微腐蚀、除钝化膜、镀金及封闭处理等工序,解决了铍青铜氧化层的去除及镀金层与基体结合...     

脉冲电镀发展概况

总结脉冲电镀应用于镀铬、镀铜、镀镍及镍合金 ,镀金及金合金 ,镀银及银合金 ,镀钯及钯合金的现状 ,简述了脉冲换向电流电镀 ,脉冲电镀在复合镀层和制备非晶态合金等方面的研究。     

化学镀在电子工业中的应用

化学镀作为一种功能精饰技术,特别是在电子工业中受到越来越物关注。本语文以大量的文献阐述了铜、镍、金、钯及其它化学镀在电子工业中的应用。     

Electroless copper plating on acrylonitrile butadiene styrene material surfaces without chromic acid etching and a palladium catalyst

Hydrolysis modification of nitrile groups on acrylonitrile butadiene styrene (ABS) plate surfaces into carboxylic acid groups was investigated to find a new recipe for electroless copper plating of ABS plate surfaces without etching reactions using chromic acid and also without a palladium catalyst. Hydrolysis modification of nitrile groups was successfully conducted in an aqueous sodium hydroxide (NaOH) solution (70 wt %) at 80°C for more than 72 h, and nitrile groups were modified into carboxylic acid groups. The hydrolysis modification was accelerated by the addition of dioxane as a supplement to the aqueous NaOH solution. The modification, when an aqueous mixture solution of NaOH (35 wt %) and dioxane (10 wt %) was used as a reagent, was accomplished at 65°C in 30 min. The hydrolyzed ABS plate surfaces were successfully metalized by electroless copper plating. A silver catalyst, instead of a palladium catalyst, was usable in the electroless copper‐plating process. Adhesion between the deposited copper metal and ABS plate surface was perfect for the Scotch tape test. Consequently, we propose a new recipe for an electroless copper‐plating process without an etching process using chromic acid and without a palladium catalyst. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Effects of Sn residue on the high temperature stability of the H_2-permeable palladium membranes prepared by electroless plating on Al_2O_3 substrate after SnCl_2–PdCl_2 process: A case study

The stability of composite palladium membranes is of key importance for their application in hydrogen energy systems. Most of these membranes are prepared by electroless plating, and beforehand the substrate surface is activated by a SnCl_2–PdCl_2 process, but this process leads to a residue of Sn, which has been reported to be harmful to the membrane stability. In this work, the Pd/Al_2O_3 membranes were prepared by electroless plating after the SnCl_2–PdCl_2 process. The amount of Sn residue was adjusted by the SnCl_2 concentration, activation times and additional Sn(OH)_2coating. The surface morphology, cross-sectional structure and elemental composition were analyzed by scanning electron microscopy(SEM), metallography and energy dispersive spectroscopy(EDS), respectively. Hydrogen permeation stability of the prepared palladium membranes were tested at450–600 °C for 400 h. It was found that the higher SnCl_2 concentration and activation times enlarged the Sn residue amount and led to a lower initial selectivity but a better membrane stability. Moreover, the additional Sn(OH)_2coating on the Al_2O_3 substrate surface also greatly improved the membrane selectivity and stability.Therefore, it can be concluded that the Sn residue from the SnCl_2–PdCl_2 process cannot be a main factor for the stability of the composite palladium membranes at high temperatures.