Electrical sensing properties of silica aerogel thin films to humidity

Mesoporous silica aerogel thin films have been fabricated by dip coating of sol-gel derived silica colloid on gold electrode-patterned alumina substrates followed by supercritical drying. They were evaluated as the sensor elements at relative humidity 20-90% and temperature 15-35 °C under an electrical field of frequency 1-100 kHz. Film thickness and pore structure were two main parameters that determined the sensor performance. The film with a greater thickness showed a stronger dielectric characteristic when moisture abounded, and presented a smaller hysteresis loop and a higher recovery rate, due to the large size of pore throats. As the film thickness decreased, at low humidity the surface conductivity enhanced and the response rate increased. The silica aerogel based humidity sensor can be modeled as an equivalent electrical circuit composed of a resistor and a capacitor in parallel, and is driven by ionic conduction with charged proton carriers.     

Study of La-modified antiferroelectric PbZrO3 thin films

Dielectric and DC electrical properties of antiferroelectric lead zirconate and La-doped lead zirconate thin films deposited using a pulsed excimer-laser ablation technique were studied in detail. Increased La dopant concentration in pure lead zirconate thin films reduced the dielectric maximum and Curie temperature. At 9 mol.% of La in pure lead zirconate, the dielectric transition temperature reduced to room temperature. A gradual change from antiferroelectric to paraelectric through ferroelectric phases was observed with the addition of La to pure lead zirconate. The DC electrical properties of pure lead zirconate and the effect of donor addition on leakage current properties were studied. Correlation between the macroscopic changes observed in the charge transport mechanisms, microscopic defect chemistry and charge-carrier trapping phenomenon was examined in detail.     

Preparation and electrical/optical bistable property of potassium tetracyanoquinodimethane thin films

Potassium tetracyanoquinodimethane (K(TCNQ)) thin films were prepared using physical vapor deposition combined with solid state chemical replacement reaction. Reversible electrical bistable behavior at or even above room temperature was observed; and, the optical bistable property of K(TCNQ) film was observed.     

Electrical characterization of CVD diamond thin films grown on silicon substrates

Diamond thin films grown on high resistivity, 100 oriented silicon substrates by the hot filament chemical vapor deposition (HFCVD) method have been characterized by four-point probe and current-voltage (through film) techniques. The resistivities of the as-grown, chemically etched and annealed samples lie in the range of 10² Ω cm to 10⁸ Ω cm. The Raman measurements on these samples indicate sp³ bonding with a sharp peak at 1332 cm⁻¹. The surface morphology as determined by scanning electron microscope shows polycrystalline films with (100) or (111) faceted structures with average grain size of ≈2.5 μm. The through film current-voltage characteristics obtained via indium contacts on these diamond films showed either rectifying or ohmic behavior. The difference in Schottky and ohmic behavior is explained on the basis of the high or low sheet resistivities measured by four-point probe technique. 5% methane to hydrogen concentration during film growth resulted in poor surface morphology, absence of sp³ bonds, and low resistivity.     

Effect of thickness on the thermoelectric properties of PbS thin films

A non-monotonic dependence of the thermoelectric properties of PbS epitaxial films grown on (001)KCl substrates and covered with an EuS protective layer on the PbS layer thickness (d=2-200 nm) was detected at room temperature. The complex character of the dependence on d is attributed to a competition between percolation phenomena and size quantization. Within the framework of percolation theory on the basis of experimental data, the critical exponent for the electrical conductivity was determined. Oscillations in the thickness dependence of the kinetic coefficients are attributed to quantum size effects occurring in thin layers.     

Drying temperature effects on microstructure, electrical properties and electro-optic coefficients of sol-gel derived PZT thin films

Transparent lead zirconium titanate (PZT) thin film is suitable for a variety of electro-optic application, and the increasing of the electro-optic coefficient of PZT film is one of the important factors for this application. In this study, the main processing variable for improving an electro-optic coefficient was the drying temperature: 300, 350, 450 and 500°C in sol-gel derived PZT thin films. The highest linear electro-optic coefficient (1.65×10⁻¹⁰ (m/V)) was observed in PZT film dried at 450°C. The PZT film showed the highest perovskite content, polarization (P_max=49.58 μC/cm², P_r=24.8 μC/cm²) and dielectric constant (532). A new two-beam polarization (TBP) interferometer with a reflection configuration was used for electro-optic testing of PZT thin films which allows measurement of the linear electro-optic coefficient of thin film with strong Fabry–Perot (FP) effect usually present in PZT thin film.     

D.c. properties of ZnO thin films prepared by r.f. magnetron sputtering

In the development of ZnO-based varistors the electrical properties of ZnO/Bi₂O₃ junctions and of the two individual oxides are being investigated. Following our recent work on a.c. conductivity in Al---ZnO---Al sandwich structures we currently report d.c. measurements. The structures were prepared by r.f. magnetron sputtering in an argon/oxygen mixture in the ratio 4:1. Capacitance-voltage data confirm that the Al/ZnO interface does not form a Schottky barrier and measurements of the dependence of capacitance on film thickness indicate that the relative permittivity of the films is approximately 9.7. With increasing voltage the current density changed from an ohmic to a power-law dependence with exponent n≈3. Furthermore measurements of current density as a function of reciprocal temperature showed a linear dependence above about 240 K, with a very low activation energy below this temperature consistent with a hopping process. The higher temperature results may be explained assuming a room-temperature electron concentration n₀ and space-charge-limited conductivity, dominated by traps exponentially distributed with energy E below the conduction band edge according to N = N₀exp(−E/kT_t), where k is Boltzmann's constant. Typical derived values of these parameters are: n₀ = 7.2 × 10¹⁶ m⁻³, N₀ = 1.31 × 10⁴⁵ J⁻¹ m⁻³ and T_t = 623 K. The total trap concentration and the electron mobility were estimated to be 1.13 × 10²⁵ m⁻³ and (5.7−13.1) ×10⁻³m²V⁻¹s⁻¹ respectively.     

Evaluation of diffusion barrier and electrical properties of tantalum oxynitride thin films for silver metallization

The thermal stability and the diffusion barrier properties of DC reactively sputtered tantalum oxynitride (Ta-O-N) thin films, between silver (Ag) and silicon (Si) p⁺n diodes were investigated. Both materials characterization (X-ray diffraction analysis, Rutherford backscattering spectrometry (RBS), Auger depth profiling) and electrical measurements (reverse-biased junction leakage current-density) were used to evaluate diffusion barrier properties of the thin films. The leakage current density of p⁺n diodes with the barrier (Ta-O-N) was approximately four orders of magnitude lower than those without barriers after a 30 min, 400 °C back contact anneal. The Ta-O-N barriers were stable up to 500 °C, 30 min anneals. However, this was not the case for the 600 °C anneal. RBS spectra and cross-sectional transmission electron microscopy of as-deposited and vacuum annealed samples of Ag/barrier (Ta-O-N)/Si indicate the absence of any interfacial interaction between the barrier and substrate (silicon). The failure of the Ta-O-N barriers has been attributed to thermally induced stresses, which cause the thin film to crack at elevated temperatures.     

Elaboration and characterization of Fe1-xO thin films sputter deposited from magnetite target

Majority of the authors report elaboration of iron oxide thin films by reactive magnetron sputtering from an iron target with Ar-O₂ gas mixture. Instead of using the reactive sputtering of a metallic target we report here the preparation of Fe_1-xO thin films, directly sputtered from a magnetite target in a pure argon gas flow with a bias power applied. This oxide is generally obtained at very low partial oxygen pressure and high temperature. We showed that bias sputtering which can be controlled very easily can lead to reducing conditions during deposition of oxide thin film on simple glass substrates. The proportion of wustite was directly adjusted by modifying the power of the substrate polarization. Atomic force microscopy was used to observe these nanostructured layers. Mössbauer measurements and electrical properties versus bias polarization and annealing temperature are also reported.     

Direct current electrical conduction mechanism in plasma polymerized thin films of tetraethylorthosilicate

The plasma polymerized tetraethylorthosilicate (PPTEOS) thin films were deposited on to glass substrates at room temperature by a parallel plate capacitively coupled glow discharge reactor. The current density-voltage (J-V) characteristics of PPTEOS thin films of different thicknesses have been observed at different temperatures in the voltage region from 0.2 to 15 V. In the J-V curves two slopes were observed — one in the lower voltage region and another in the higher voltage region. The voltage dependence of current density at the higher voltage region indicates that the mechanism of conduction in PPTEOS thin films is space charge limited conduction. The carrier mobility, the free carrier density and the total trap density have been calculated out to be about 2.80 × 10^− 15m²V^− 1s^− 1, 1.50 × 10²²m^− 3 and 4.16 × 10³³m^− 3 respectively from the observed data. The activation energies are estimated to be about 0.13 ± 0.05 and 0.46 ± 0.07 eV in the lower and higher temperature regions respectively for an applied voltage of 2 V and 0.09 ± 0.03 and 0.43 ± 0.10 eV in the lower and higher temperature regions respectively for an applied voltage of 14 V. The conduction in PPTEOS may be dominated by hopping of carriers between the localized states at the low temperature and thermally excited carriers from energy levels within the band gap in the vicinity of high temperature.     

Electron emission characterization of diamond thin films grown from a solid carbon source

Diamond films of various morphologies and compositions have been deposited on silicon substrates by a plasma-enhanced chemical transport (PECT) process from a solid carbon source. Electron emission efficiency of these diamond films is related to their morphology and composition. The electric field required to excite emission in a boron-doped polycrystalline diamond film ranged between 20 to 50 MV m⁻¹. In an undoped conducting nanocrystalline diamond composite film, the field was as low as 5–11 MV m⁻¹. The cold field electron emission of these films is confirmed from the Fowler-Nordhelm plots of the data. Enhancement of electron emission by band-bending and by the nanocrystalline microstructure are discussed. New diamond emitters made of nanocrystalline boron-doped diamond composite are proposed.     

Conductivity and dielectric properties of silicon nitride thin films prepared by RF magnetron sputtering using nitrogen gas

Silicon nitride is an important material in very-large-scale integration fabrication and processing. Recent work on films prepared by radio frequency magnetron sputtering using nitrogen gas have shown that the relative permittivity is typically 6.3 and that aluminium forms an ohmic contact to this material. Under direct current (DC) bias the films exhibited space-charge-limited conductivity with a bulk trap density of the order of 2×10²⁴ m⁻³. In the present work alternating current electrical measurements were made on identical samples as a function of frequency and temperature. Conductivity appeared to be by hopping at lower temperatures, giving way to a free-band conduction process with activation energy of typically 0.44 eV at higher temperatures. Over a limited range of frequency and temperature the model of Elliott was applicable, and yielded a value of 2.87×10²³ m⁻³ for the density of localised states, in reasonable agreement with our estimate of the trap density from DC measurements. As in the DC measurements capacitance followed a geometric relationship with relative permittivity 6.3, and showed a moderate decrease with increasing frequency and an increase with increasing temperature, tending towards a constant value at high frequencies and low temperatures. The loss tangent showed a minimum in its frequency dependence, which appeared to shift to higher frequencies with increasing temperature. The measurements are consistent with the model of Goswami and Goswami for samples having ohmic contacts, and are typical of results obtained on other insulating thin film structures.     

Electrical and optical switching properties of ion implanted VO2 thin films

The metal-insulator transition in vanadium dioxide thin films implanted with O⁺ ions was studied. Ion implantation lowered the metal-insulator transition temperature of the VO₂ films by 12 °C compared to the unimplanted ones, as measured both optically and electrically. The lowering of the transition temperature was accomplished without significantly reducing the mid-wave infrared optical transmission in the insulating state for wavelengths > 4.3 μm. Raman spectroscopy was used to examine changes to the crystalline structure of the implanted films. The Raman spectra indicate that ion implantation effects are not annealed out for temperatures up to 120 °C.     

Effect of high temperature annealing on the electrical performance of titanium/platinum thin films

In this study, the influence of post deposition annealing steps (PDA) on the electrical resistivity of evaporated titanium/platinum thin films on thermally oxidised silicon is investigated. Varying parameters are the impact of thermal loading with maximum temperatures up to T_PDA = 700 °C and the platinum top layer thickness ranging from 24 nm to 105 nm. The titanium based adhesive film thickness is fixed to 10 nm. Up to post deposition annealing temperatures of T_PDA = 450 °C, the film resistivity is linearly correlated with the reciprocal value of the platinum film thickness according to the size effect. Modifications in the intrinsic film stress strongly influence the electrical material parameter in this temperature regime. At T_PDA > 600 °C, diffusion of titanium into the platinum top layer and its plastic deformation dominate the electrical behaviour, both causing an increase in film resistivity above average.     

The effect of rapid thermal annealing on structural and electrical properties of TiB2 thin films

This work reports on the effect of post-deposition rapid thermal annealing on the structural and electrical properties of deposited TiB₂ thin films. The TiB₂ thin films, thicknesses from 9 to 450 nm, were deposited by e-beam evaporation on high resistivity and thermally oxidized silicon wafers. The resistivity of as-deposited films varied from 1820 μΩ cm for the thinnest film to 267 μΩ cm for thicknesses greater than 100 nm. In the thickness range from 100 to 450 nm, the resistivity of TiB₂ films has a constant value of 267 μΩ cm.

A rapid thermal annealing (RTA) technique has been used to reduce the resistivity of deposited films. During vacuum annealing at 7 × 10⁻³ Pa, the film resistivity decreases from 267 μΩ cm at 200 °C to 16 μΩ cm at 1200 °C. Heating cycles during RTA were a sequence of 10 s. According to scanning tunneling microscopy analysis, the decrease in resistivity may be attributed to a grain growth through polycrystalline recrystallization, as well as to an increase in film density.

The grain size and mean surface roughness of annealed films increase with annealing temperature. At the same time, the conductivity of the annealed samples increases linearly with grain size. The obtained results show that RTA technique has a great potential for low resistivity TiB₂ formation.     

Structural, electrical and optical characteristics of SnO2:Sb thin films by ultrasonic spray pyrolysis

Antimony-doped tin oxide (SnO₂:Sb) thin films were fabricated by an ultrasonic spray pyrolysis method. The effect of antimony doping on the structural, electrical and optical properties of tin oxide thin films were investigated. Tin(II) chloride dehydrate (SnCl₂·2H₂O) and antimony(III) chloride (SbCl₃) were used as a host and a dopant precursor. X-ray diffraction analysis showed that the non-doped SnO₂ thin film had a preferred (211) orientation, but as the Sb-doping concentration increased, a preferred (200) orientation was observed. Scanning electron microscopy studies indicated that the polyhedron-like grains observed for the non-doped SnO₂ thin films became rounder and decreased in size with the Sb-doping concentration. The lowest resistivity (about 8.4 × 10^− 4 Ω·cm) was obtained for the 3 at.% Sb-doped films. Antimony-doping led to an increase in the carrier concentration and a decrease in Hall mobility. The transmittance level in the near infrared region was lowered with the Sb-doping concentration.     

Effect of growth temperature on the structural and transport properties of magnetite thin films prepared by pulse laser deposition on single crystal Si substrate

Magnetite (Fe₃O₄) thin films are prepared by pulsed laser deposition using an α-Fe₂O₃ target on silicon (111) substrate in the substrate temperature range of 350 °C to 550 °C. X-ray diffraction (XRD) measurement shows that the film deposited at 450 °C is a single phase Fe₃O₄ film oriented along [111] direction. However, the film grown at 350 °C reveals mixed oxide phases (FeO and Fe₃O₄), while the film deposited at 550 °C is a polycrystalline Fe₃O₄. X-ray photoelectron spectroscopy study confirms the XRD findings. Raman measurements reveal identical spectra for all the films deposited at different substrate temperatures. We observe abrupt increase in the resistivity behavior of all the films around Verwey transition temperature (T_V) (125 K-120 K) though the transition is broader in the film deposited at 350 °C. We observe that the optimized temperature for the growth of Fe₃O₄ film on Si is 450 °C. The electrical transport behavior follows Shklovskii and Efros variable range hopping type conduction mechanism below T_V for the film deposited at 450 °C possibly due to the granular growth of the film.     

The electromagnetic interference shielding effect of indium-zinc oxide/silver alloy multilayered thin films

A study was made to examine the electromagnetic interference (EMI) shielding effect of multilayered thin films in which indium-zinc oxide (IZO) thin films and Ag or Ag alloy thin films were deposited alternately at room temperature using a RF magnetron sputtering. The optical, electrical and morphological properties of the constituent layers were analyzed using an ultraviolet-visible photospectrometer, a 4-point probe and an atomic force microscopy (AFM), respectively. The EMI shielding effect of the multilayered thin films was also measured using a coaxial transmission line method. A detailed analysis showed that the control of the film morphologies, i.e., the surface roughnesses of the constituent metal layers was essential to an accurate estimate of the electrical and optical properties of multilayered coatings. It was shown that properly designed IZO/Ag alloy multilayered thin films could yield a visible transmission of more than 70%, a sheet resistance of less than 1 Ω/sq., together with an EMI shielding effect larger than 45 dB in the range from 30 to 1000 MHz.     

Degradation of NiCr/CuNiMn/NiCr films on alumina substrates

This paper addresses the aging behaviour of NiCr/CuNiMn/NiCr triple layers on Al₂O₃ ceramics at temperatures up to 200°C for film thicknesses d0.5 μm. Investigations of the film structure and the increase of resistance and its temperature coefficient during the annealing process and studies of the dependence of this aging drift on both the film thickness and the storage temperature have been carried out. Furthermore, the film stress and the effect of substrate bending on resistance have been measured. The results can be explained by the irregular film structure (columns and small bridges between them), which causes stress and current concentrations as well as local creeping, cracking and oxidation processes in the micro-bridges. They are compared with such for structurally homogeneous films on silicon wafers.     

Electronic conduction in SiO2:N thin films grown by thermal oxidation of silicon in N2O

Silicon oxynitride [SiO₂:N] thin films have been grown by oxidizing silicon in N₂O at 900, 1000 and 1100 °C and at 760 and 1520 torr. It is shown that the dominant electrical conduction mechanism, for high electric fields, is the field assisted thermionic emission from the traps (Poole-Frenkel effect), and is not direct or Fowler-Nordheim tunneling, as typically occurs in thermal silicon oxide with similar thickness. Electrical conduction in these films occurs by field assisted electron emission from donor traps with energy levels varying in the range from 0.5 to 1 eV from the conduction band. The results shown here indicate that the best quality films are those grown at low temperature and pressure, since they give films with a higher critical electric field, a higher energy barrier depth at the traps and less donors compensated by acceptors than those grown at high temperatures and pressures.