ICVI法制备Si3N4P/ Si3N4 复合材料致密化行为数值模拟

根据Si₃N₄ 颗粒增强体的结构特点及等温化学气相法( ICVI) 的工艺特点, 对Si₃N₄ 颗粒增强Si₃N₄ 复合材料的致密化过程进行了数值模拟。用球形孔隙模型表征Si₃N₄ 颗粒增强体的结构特征, 用传质连续方程表征先驱体在预制体中的浓度分布。为了检验模型的准确性和适用性, 进行了相应的实验验证。模拟结果与实验结果具有相似的致密化规律, 预测的渗透时间和孔隙率与实验结果均十分接近, 表明本文中建立的数学模型可以较好地表征Si₃N₄P / Si₃N₄ 复合材料的ICVI 过程。     

烧结温度对(Ti5Si3+TiC+TiB)/Ti复合材料组织和力学性能的影响

为了获得性能优异的钛基复合材料和解决单一增强相对性能提升有限等问题,以Ti粉、SiC粉、TiB₂粉、C粉为原料,采用粉末冶金法,在不同烧结温度下原位自生制备了(Ti₅Si₃+TiC+TiB)/Ti复合材料。通过XRD、SEM、万能试验机等设备表征了复合材料的微观组织和力学性能。结果表明:随烧结温度的升高,复合材料的致密度提高,平均晶粒尺寸逐渐增大;烧结温度的升高使增强相数量增加的同时减少了较低烧结温度下的团聚现象。复合材料的洛氏硬度、屈服强度、抗拉强度随烧结温度的升高先增大后减小,断裂应变下降不显著。在1 300 ℃下,(Ti₅Si₃+TiC+TiB)/Ti具有最佳的综合力学性能,烧结态试样的抗压强度达到最高2 435 MPa,屈服强度1 649 MPa,洛氏硬度49.1HRC,断裂应变28.7%。分析可知,微米尺寸的TiC、TiB和亚微米尺寸的Ti₅Si₃增强相的协同作用在显著提高复合材料强度的同时也保持了一定的塑性。(Ti₅Si₃+TiC+TiB)/Ti复合材料的增强方式以细晶强化、弥散强化和载荷传递强化为主。     

反应烧结法制备(AlN,TiN)-Al2O3复合材料的研究

以Ti,Al,Al₂O₃为初始粉料,通过750~800℃氮气保护下的中温焙烧,然后在1420~1550℃在氮气氛下反应烧结,制备了不同配比的(AlN,TiN)-Al₂O₃复合材料。研究了组成及烧结工艺对复合材料力学性能、显微结构等的影响。用XRD,SEM等方法分析粉体及烧结体的相组成及微观结构。分析结果表明:AlN,TiN的形成,有助于材料的致密化并使其力学性能提高。组成为20wt%(Al,Ti)-Al₂O₃的粉体在1520℃、30MPa、保温、保压30min热压烧结条件下,与N₂气反应可得到硬度(HRA)为 94.1的高硬度的(AlN,TiN)-Al₂O₃复合材料,该材料的抗弯强度为687 MPa,断裂韧性(K_IC)为6.5MPa·m1/2。     

原位反应结合多孔Si3N4陶瓷的制备及其介电性能

以氮化硅(Si₃N₄)和氧化铝(Al₂O₃)为起始原料, 利用原位反应结合技术制备Si₃N₄多孔陶瓷. 研究烧结温度和保温时间对Si₃N₄多孔陶瓷的微观结构、力学性能以及介电性能的影响. 结果表明: 烧结温度在1350℃以下, 保温时间<4h时, 随着烧结温度的升高, 保温时间的延长, 样品的强度和介电常数增大; 但条件超出这个范围, 结果刚好相反; 物相分析表明多孔陶瓷主要由Si3N4和Al₂O₃以及Si₃N₄氧化生成的SiO₂(方石英)组成. 所制备的多孔Si₃N₄陶瓷的气孔率范围为25.34%～48.86%, 抗弯强度为34.77～127.85MPa, 介电常数为3.0～4.6, 介电损耗约为0.002.     

BaWO4/(Ba|Sr)TiO3复合陶瓷的显微结构与介电性能

采用常规的陶瓷工艺制备了BaWO₄/(Ba,Sr)TiO₃复合陶瓷,并通过X射线衍射、扫描电镜及介电性能测试对陶瓷的烧结特性、微结构和介电性能进行了研究。结果表明,BaWO₄/(Ba,Sr)TiO₃复合陶瓷在1250～1300℃ 可以实现致密化烧结,且陶瓷由(Ba,Sr)TiO₃和BaWO₄两相复合而成,未检测到其它物相。随着BaWO₄含量的增加,材料的表观密度逐渐增大,介电常数和可调度逐渐降低,介电损耗变化不大,均在10-3量级。典型样品(60 %BaWO₄/40%Ba 0.5Sr 0.5TiO₃ , 质量分数)介电常数182.7,介电损耗0.0024,在2V·μm-1偏置电场下的可调度为14.7%,具有较好的介电性能。     

烧成温度对Al2O3/Ni复合材料的致密化、物相组成和显微结构的影响

首先采用非均相沉淀合成出Ni包裹Al₂O₃粉体,然后热压烧结包裹粉体制备了Al₂O₃/Ni复合材料。本文作者主要研究了不同烧成温度对复合材料致密化、物相组成和显微结构的影响。结果表明:在1400℃保温1h,烧结体获得了最大相对密度,而致密度随Ni含量的增加反而降低;高于1350℃时,除Al₂O₃和Ni相外,在烧结体的表层生成一种由Al,Ni,O,C四种元素组成的新相;随着温度的升高,包裹层的纳米Ni颗粒聚合、长大,并退缩至三角晶界处,在适当的烧结温度(1400℃),少数小的纳米Ni颗粒被卷入Al₂O₃晶内,大的位于三角晶界,当烧成温度为1450℃时,不仅观察到Al₂O₃/Ni界面存在空隙,也发现了Al₂O₃晶粒异常长大现象。     

纳米-Al2O3/SiO2加入量对MgO-Al2O3-SiO2复相陶瓷烧结机理的影响

为了探究纳米-Al₂O₃/SiO₂加入量对MgO-Al₂O₃-SiO₂复相陶瓷烧结行为的作用机理。以微米级MgO、纳米级Al₂O₃和SiO₂为主要原料制备陶瓷基复合材料。通过XRD和 SEM等检测手段对烧后试样的物相组成和微观结构进行测试与表征,重点研究Al₂O₃/SiO₂的加入对复相陶瓷物相组成、微观结构及烧结性能的影响。结果表明:随着Al₂O₃/SiO₂加入量的增大,试样烧后相对密度和烧后线变化率呈先增大后减小再增大的趋势,加入15%Al₂O₃/SiO₂(质量分数)的试样经1 500 ℃烧结后,其相对密度可以达到94%。引入的Al₂O₃/SiO₂与基体中的MgO生成镁铝尖晶石与镁橄榄石相,原位反应伴随的体积膨胀,抵消部分烧结过程中的体积收缩。Al₂O₃/SiO₂加入量为75%(质量分数)的试样经1 400 ℃烧结后,基体中有大量堇青石相生成,随着煅烧温度提高到1 500 ℃,堇青石分解所产生的高温液相促进了试样的烧结收缩。     

原位生成Al2O3/Cu复合材料的新工艺

采用一种新型工艺制备了Al₂O₃/Cu复合材料。高能球磨制备亚稳态的Cu-0.8 wt% Al合金粉,再将Cu₂O粉与其一起进行高能球磨,然后将复合粉末压坯在真空炉中同时进行氧化和烧结。该工艺省略了还原剩余Cu₂O的环节,氧化和烧结时间仅为1 h。生成的Al₂O₃的粒径约250nm,颗粒间距约500 nm,均匀弥散分布;该材料冷加工后性能接近SCM制品性能。该配比的Al₂O₃/Cu复合材料的热稳定性良好,在800℃下循环冷淬20次无裂纹;软化温度为700℃。     

TiB2-TiC复相陶瓷的结构与性能研究

TiB₂-TiC复合粉制备的TiB₂-TiC复相陶瓷的相对密度达99.8%,硬度为 93.2HRA,断裂韧性为5.53MPa·m1/2。显微结构研究表明:TiB₂-TiC烧结体体内的位错和残余气孔影响材料性能。复合粉烧结体晶粒尺寸细小,大小分布均匀,晶粒之间界面干净,无杂质沉积,烧结体中TiB₂和TiC两相界面接合处元素B,C,Ti的含量存在梯度变化,都有利于烧结体性能提高。TiB₂晶粒生长存在取向性。     

纳米Al2O3颗粒增强新型铜基自润滑复合材料

以Cu-Ni-Y₂O₃-MoS₂-Graphite混合粉为基体,加入质量分数分别为0%、1%、2%、3%、4%的纳米Al₂O₃增强相,采用粉末冶金方法制备纳米Al₂O₃增强新型铜基自润滑复合材料。结果表明：随着铜合金粉末中纳米Al₂O₃颗粒含量的增加 , 所制备自润滑复合材料样品的密度下降,但硬度和压溃强度先上升后下降,在Al₂O₃含量为2%时硬度从HV 23.7增加到HV 35.1,压溃强度从189 MPa提高到276 MPa。由石墨和MoS₂组成的混合固体自润滑材料的摩擦系数小且稳定,约0.12。Al₂O₃质量分数为2%的样品磨损量最小,是未加Al₂O₃试样磨损量的1/7～1/8。铜基体经过镍、纳米Al₂O₃等弥散颗粒强化和固体润滑相石墨和MoS₂的加入,所制备的材料已具有一定的自润滑性能。     

纳米金刚石-陶瓷结合剂复合粉体的高分子网络凝胶法制备与烧结

采用高分子网络凝胶(P-G)法制备了纳米金刚石-陶瓷结合剂的复合粉体, 通过压制成型, 低温烧结, 获得了纳米金刚石-陶瓷结合剂的复合烧结块体试样; 同时与采用高温熔融法制备的陶瓷结合剂, 再加入纳米金刚石机械混合后烧结制备的复合烧结块体试样进行对比。通过X射线衍射分析了试样的物相构成, 借助场发射扫描电镜对试样断口进行了显微形貌观察, 采用三点弯曲法测试了试样的抗折强度, 利用阿基米德原理测试了试样的密度和气孔率。结果表明, 采用高分子网络凝胶法可以获得纳米金刚石均匀分散的纳米金刚石-陶瓷复合粉体, 经过800 ℃/2h烧结后试样的抗折强度为60.41 MPa, 密度为1.81 g/cm³, 气孔率为15.67%; 而采用高温熔融法+纳米金刚石的工艺获得的纳米金刚石-陶瓷结合剂烧结后试样, 其抗折强度、 密度和气孔率分别为46.48 MPa、 2.23 g/cm³和11.75%, 其显微结构中可见明显的纳米金刚石团聚体。高分子网络凝胶法可以成为超精磨削用纳米金刚石-陶瓷磨具制备的新方法。     

SEM/EDS分析纳米TiN颗粒在SiC陶瓷中的分布状况

采用水基喷雾造粒技术制备SiC/纳米TiN复合粉体,并借助二步成型和无压烧结技术制备SiC/纳米TiN复合陶瓷,利用场发射扫描电镜结合能谱分析(SEM/EDS)研究了纳米TiN颗粒在SiC/纳米TiN复合粉体、素坯及烧结体过程中的分布状态,借此评价制备工艺。     

Mechanical Properties and Microstructure of Si3N4-TiC Nanocomposites

1. IntroductionSilicon nitride is one of the promising structural ma-terials for high-temperature applications because of itshigh resistance to thermal shock, as well as high strength,high fracture toughness, and high resistance to chemicalattack[1~3]. However, wider application has been lim-ited mainly due to its inherent brittleness. Many effortshave been made to improve its properties by control-ling the microstructure or by fabricating various typesof composites[4~7].The silicon nitride wi…     

金属粉末注射成形钛合金工艺研究

为了探究保障最终产品性能满足ASTM标准的粉末注射成形工艺,本文采用金属粉末注射成形方法,以德国Basf公司提供的喂料为原料,通过对注射参数优化获取1组最优注射工艺参数,用于后续脱脂及烧结工艺.利用拉伸、弯曲等力学实验,扫描电镜、金相光学显微镜等表征方法对材料的力学性能及微观结构进行表征,研究了注射、脱脂和烧结工艺参数...     

Synthesis and characterization of Al-Zn/Al2O3 nano-powder composites

Composites consisting of Al-Zn/Al2O3 have been synthesized using high energy mechanical milling. High energy ball milling increases the sintering rate of the composite powder due to increased diffusion rate. Owing to the finer microstructure, the hardness of the sintered composite produced by using the mechanically milled nanocomposite powder is significantly higher than that of the sintered composite produced by using the as-mixed powder. The mean crystallite size of the matrix has been determined to be 27 nm by Scherrer equation using X-ray diffraction data. The powders have been characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and differential thermal analysis (DTA). The effect of high-energy ball milling and subsequent annealing on a mixture of Al and ZnO has also been investigated. DTA result show that the reaction temperature of Al-ZnO decreases with the increase in the ball milling time.     

Mechanical alloying and sintering of nanostructured tungsten carbide-reinforced copper composite and its characterization

Elemental powders of copper (Cu), tungsten (W) and graphite (C) were mechanically alloyed in a planetary ball mill with different milling durations (0–60 h), compacted and sintered in order to precipitate hard tungsten carbide particles into a copper matrix. Both powder and sintered composite were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM) and assessed for hardness and electrical conductivity to investigate the effects of milling time on formation of nanostructured Cu–WC composite and its properties. No carbide peak was detected in the powder mixtures after milling. Carbide WC and W₂C phases were precipitated only in the sintered composite. The formation of WC began with longer milling times, after W₂C formation. Prolonged milling time decreased the crystallite size as well as the internal strain of Cu. Hardness of the composite was enhanced but electrical conductivity reduced with increasing milling time.     

氧化物电解池阳极用铁酸镧粉体的制备及性能

采用溶胶-凝胶自蔓延法合成锶掺杂铁酸镧粉体,在此基础上制备锶掺杂铁酸镧与钇稳定的氧化锆的复合材料,并研究该材料应用于固体氧化物电解池阳极的各方面性能。通过X射线衍射、透射电镜、扫描电镜等手段,研究该材料的化学稳定性及微观结构。通过动电位扫描研究了该阳极材料的电化学性能。透射电镜分析显示:以该方法制备得到的锶掺杂铁酸镧粉体粒径在20～50nm之间,颗粒形状较为规则。扫描电镜结果显示:经过1200℃、2h的烧结后,复合阳极与电解质结合紧密,阳极材料内部孔隙均匀,钇稳定的氧化锆与锶掺杂铁酸镧两相各自形成连通的网络结构。对锶掺杂铁酸镧-钇稳定的氧化锆阳极复合材料的电化学性能及热循环稳定性进行了研究,结果显示复合阳极表现出较高的电催化活性以及较好的耐热循环稳定性。     

Improved mechanical property of foam glass composites toughened by glass fiber

The mechanically improved foam glass composite toughened by glass fiber was prepared by sintering technique, using waste sodium-calcium silicon flat glass powder as main raw materials. In this study, the preparation and properties of the samples were characterized by differential thermal analysis (DTA), field-emission scanning electron microscopy (FESEM) and mechanical property test. The specific strength of the composite was defined for the first time, and applied into the investigation of mechanical property. The results show that the specific improved bending strength of 10.45-22.26 MPa/(g cm^− 3), and the specific compressive strength of 30.45-34.34 MPa/(g cm^− 3) can be displayed when sintered at 790-815 °C with the addition of 5-25 wt.% glass fiber. Good correlations between the microstructure (in particular the fiber distribution), the high specific strength and the high modulus of elasticity of glass fibers.     

Effect of dispersion method on the deterioration,interfacial interactions and re-agglomeration of carbon nanotubes in titanium metal matrix composites

The influence of various synthesis techniques on the dispersion and evolution of multi-walled carbon nanotubes (MWCNTs) in titanium (Ti) metal matrix composites (TMCs) prepared via powder metallurgy routes has been investigated. The synthesis techniques included sonication, high energy ball milling (HEBM), cold compaction, high temperature vacuum sintering and spark plasma sintering (SPS). Powder mixtures of Ti and MWCNTs (0.5 wt.%) were processed by HEBM in two batches: (i) ball milling of the mixtures (Batch 1) and (ii) ball milling of Ti powder alone, followed by a further ball milling with sonicated MWCNTs (Batch 2). Both batches of the powder mixtures were pressed at 40 MPa into green compacts and then sintered in vacuum. Batch 2 powder mixtures were also consolidated using SPS. The crystallinity and sp² carbon network of the MWCNTs were characterized through analyzing the characteristic Raman peak ratio (I_D/I_G) of each processed sample. X-ray diffraction (XRD) was used for phase identification. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were used to study the morphology of the MWCNTs in the powder mixtures. The evolution of MWCNTs during the fabrication process and mechanical properties of the sintered compacts were discussed in conjunction with the formation of nano-crystalline TiC.     

石墨纳米片对铜电子浆料导电性的影响

为改善铜浆导电性,以表面改性的金属铜粉为主要导电相,通过添加少量导电性优异的石墨纳米片作为导电增强相制备复合电子浆料,并采用四探针测试仪、扫描电子显微镜(SEM)等分析测试方法研究了石墨纳米片的参数、添加量对铜电子浆料导电性能的影响.结果表明:选用厚度为3~5 nm,片径为5μm的石墨纳米片作为导电增强相,制得石墨纳米片—铜电子浆料,在460℃烧结后导电膜层的电阻率较小;石墨纳米片与铜粉质量比为2∶98时,测得浆料电阻率为17.14 mΩ·cm,相比纯铜浆料电阻率34.43 mΩ·cm降低了50.22%.分析电子浆料导电机理并建立导电相连接几何模型,在导电膜层中,部分折断的石墨纳米片会填充到铜颗粒之间的空隙中,较长石墨纳米片则会形成"搭桥"现象,增加导电相之间的连接,形成较紧密的微观组织和良好的导电网络,从而改善复合浆料的导电性.