半导体功率发光二极管温升和热阻的测量及研究

通过电学测量方法得到了半导体功率发光二极管温升与热阻的加热响应曲线.曲线出现一个或多个台阶,反映了其内部的热阻构成与器件物理结构.同时采用遮光法对器件温升及热阻进行了修正.还应用瞬态加热响应原理对功率管的封装结构进行了监测.     

半导体功率发光二极管温升和热阻的测量及研究

通过电学测量方法得到了半导体功率发光二极管温升与热阻的加热响应曲线.曲线出现一个或多个台阶,反映了其内部的热阻构成与器件物理结构.同时采用遮光法对器件温升及热阻进行了修正.还应用瞬态加热响应原理对功率管的封装结构进行了监测.     

达林顿管瞬态热阻测试方法的研究

达林顿管是一种两级或多级的复合管。功率型的达林顿管的功率级是后极,而后极功率管的δVbe不能直接测量,所以,达林顿管瞬态热阻测量仪器的研发一直是一个的难点。从晶体管的瞬态热阻测量原理出发,研究了达林顿管的热阻测量方法。此方法也可以引申到达林顿管稳态热阻的检测中。     

功率PIN二极管PSpice子电路模型

提出一种改进的PIN二极管子电路模型。该模型能够反映PIN二极管的瞬态开关特性,将基区电导调制效应考虑在内。通过PSpice软件瞬态仿真PIN二极管的正向直流、反向恢复特性。利用该子电路对新型SiC材料PIN二极管建模仿真,仿真结果表明运用新材料对二极管开关性能有显著提高。     

SiC肖特基功率二极管在Boost功率因数校正器应用中的性能评估

实验评估了600V，4A碳化硅(SiC)肖特基二极管(英飞凌，SDP04S06)的性能。作为一种重点的应用，作者考虑选用一种300W，按平均电流模式控制的Boost功率因数校正器(PFC)。作者测量了采用该型号SiC肖特基二极管和采用两种超快、软恢复的硅功率二极管(RURD460和目前正被列入的STTH5R06D)制成的整机的效率、开关损耗、二极管损耗和电磁干扰(EMI)等特性。本文比较了这些结果，特别是定量地考察了SiC二极管提供的恢复电流的减小对该变换器行为的这些关键参数的影响。基于试验结果，本文表明在功率因数校正器设计中，采用SiC二极管只是在高开关频率时才是合算的。     

英飞凌推出采用TO-220 FullPAK封装的第二代SiC肖特基二极管

英飞凌科技股份公司近日宣布推出采用TO-220 FullPAK封装的第二代SiC(碳化硅)肖特基二极管。新的TO-220 FullPak产品系列不仅延续了第二代ThinQ! TM SiC肖特基二极管的优异电气性能,而且采用全隔离封装,无需使用隔离套管和隔离膜,使安装更加简易、可靠。独具特色的是,新的TO220 FullPAK器件的内部结到散热器的热阻与标准     

GaAs MESFET热特性电学法测量与分析

采用快速脉冲技术,研制了ＧａＡＭＥＳＦＥＴ热特性测试仪,并测量,分析了ＧａＡｓＭＥＳＦＥＴ冷响应曲线、温升、稳态热阻、瞬态热阻及入曲线。采用该方法,可在器件正常工作条件下,快速、非破坏性地测量分析器件的芯片、粘接及管壳各部分的热阻。     

SiC MOSFET并联动态电流不均衡的无源补偿策略

SiC MOSFET分立器件的并联结构已在中大功率应用中广泛使用,为了充分利用并联的优势,需解决并联动态电流不均衡问题.在SiC MOSFET特性参数中,阈值电压是影响并联动态均流特性最主要的参数.通过建立SiC MOSFET双管并联的电路模型,探究了并联动态电流不均衡的补偿策略,推导了阈值电压对SiC MOSFET开关管动态均流程度影响的公式.建立了含寄生电感的双管并联电路模型,提出了两种双管并联动态电流不均衡的无源补偿策略,即基于共源极寄生电感的补偿策略以及基于开尔文源极电感和功率源极寄生电感并联的补偿策略.通过仿真比较了两种无源补偿策略下的开关总损耗.最后,优化了基于开尔文源极电感和功率源极寄生电感并联的补偿策略,并通过双脉冲实验验证了此并联补偿策略下的动态均流效果.     

AlGaN/GaN高电子迁移率晶体管的可靠性

利用正向肖特基结结电压与温度的线性关系,对AlGaN/GaN HEMT器件有源区瞬态温升进行了测量,其热阻为19.6℃/W。比较了不同测温方法和外界环境对器件沟道温升的影响。并研究了栅极施加反向直流阶梯应力对AlGaN/GaN HEMT器件性能的影响,结果表明器件在应力作用下电学参数退化,大信号寄生源/漏极电阻RS/RD和栅源正向I-V特性在击穿后能得到恢复。AlGaN势垒层陷阱俘获电子和电子填充栅极表面态是器件参数退化的原因,表面态恢复是器件参数恢复的主要原因。     

碳化硅封装高功率半导体激光器散热性能研究

为研究基于碳化硅(SiC)陶瓷封装的高功率半导体激光器的散热性能,将其与常用的氮化铝(AlN)陶瓷进行对比,使用基于结构函数法的热阻仪分别测量SiC和AlN封装F-mount器件的热阻值,得到SiC器件的总热阻约为3.0℃·W~(-1),AlN的约为3.4℃·W~(-1),SiC器件的实测热阻值比AlN器件低14.7%,实验结果表明SiC过渡热沉具有较好的散热性能。实验进一步测试了两种过渡热沉封装器件的输出性能,在16A连续电流注入时,915nm波段的SiC器件单管输出功率为15.9 W,AlN为15 W,测试结果显示SiC封装的器件具有更高的功率输出水平。     

Comparison of current-voltage characteristics of n- and p-type 6H-SiC Schottky diodes

Current-voltage (I–V) characteristics of n- and p-type 6H−SiC Schottky diodes are compared in a temperature range of room temperature to 400°C. While the room temperature I–V characteristics of the n-type Schottky diode after turn-on is more or less linear up to ∼100 A/cm², the I–V characteristics of the p-type Schottky diode shows a non-linear behavior even after turn-on, indicating a variation in the on-state resistance with increase in forward current. For the first time it is shown that at high current densities (>125 A/cm²) the forward voltage drop across p-type Schottky diodes is lower than that across n-type Schottky diodes on 6H−SiC. High temperature measurements indicate that while the on-state resistance of n-type Schottky diodes increases with increase in temperature, the on-state resistance of p-type Schottky diodes decreases with increase in temperature up to ∼330 K.     

Thermal analysis of high power LED package with heat pipe heat sink

The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 °C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system.     

多发光区大功率激光器的热特性分析

通过电学温敏参数法测得多发光区大功率激光器瞬态加热响应曲线,利用结构函数法给出了多发光区激光器热阻构成,分析了多发光区激光器热特性。通过串并联热阻网络模型刻画了单发光区、两发光区、四发光区激光器的热阻构成,给出了激光器芯片热阻与发光区个数之间的定量关系。实验结果表明,不同发光区激光器的芯片级热阻随着发光区数量的增加成比例减小,而封装级热阻不变,这对激光器热设计提供了重要的参考准则。     

Thermal Investigation of GaN-Based Laser Diode Package

We investigated thermal behavior of GaN-based laser diode (LD) packages as a function of cooling systems, die attaching materials, chip loading conditions, and optical performances. The electrical thermal transient technique was employed for the thermal measurement of junction temperature and thermal resistance of LD packages. The results demonstrate that the total thermal resistance of LD packages is controlled mainly by the packaging design rather than the chip structure itself. Significant changes in thermal resistance with input current were observed under a natural cooling system because of the sensitive change in the heat transfer coefficient with the change in temperature. Employment of PbSn as a die attachment was more advantageous over the Ag-paste in the thermal behavior of LD packages. The LD package with epi-down structure resulted in the lower thermal resistance compared to one with epi-up structure. A continuous increase in junction temperature was measured after lasing. It was attributed to an increase in the thermal resistance of LD when it took the optical power into an account. Effective input power was decreased by the lasing and led to high thermal resistance values.     

Development and characterization of the thermal behavior of packaged cascode GaN HEMTs

This study investigates the heat generation behavior of packaged normally-on multi-finger AlGaN/GaN high electron mobility transistors (HEMTs) that are cascoded with a low-voltage MOSFET (LVMOS) and a SiC Schottky barrier diode (SBD). By foremost carrying out electro-thermal simulation and related thermal measurements with infrared thermography and Raman spectroscopy for basic 5 mm GaN HEMTs, the location of hot spot in operating device can be obtained. Based on the outcome, further packaged cascode GaN HEMT is analyzed. A hybrid integration of the GaN-HEMT, LVMOS, and SiC SBD are assembled on a directly bonded copper (DBC) substrate in the four-pin metal case TO-257 package. The metal plate is used as both the source terminal and heat sink. The analytical results of thermal investigation are confirmed by comparing them with the infrared thermographic measurements and numerical results obtained from a simulation using Ansys Icepak. For a power dissipation of less than 11.8 W, the peak temperature of the GaN HEMTs is 118.7 °C, obtained from thermal measurements.     

The influence of high-temperature annealing on SiC schottky diode characteristics

The influence of high temperature (up to 800C) annealing on the current-voltage characteristics of n-type 6H-SiC Schottky diodes is presented. Our experimental results indicate that high-temperature annealing can result in the improvement of the forw ard and reverse electrical characteristics of SiC Schottky diodes by repairing any leaky low barrier secondary diode parallel to the primary diode that may be present due to the barrier inhomogeneities at the Schottky contact interface.     

Silicon carbide PiN and merged PiN Schottky power diode models implemented in the Saber circuit simulator

Dynamic electrothermal circuit simulator models are developed for silicon carbide power diodes. The models accurately describe the temperature dependence of on-state characteristics and reverse-recovery switching waveforms. The models are verified for the temperature dependence of the on-state characteristics, and the di/dt, dv/dt, and temperature dependence of the reverse-recovery characteristics. The model results are presented for 1500 V SiC Merged PiN Schottky (MPS) diodes, 600 V Schottky diodes, and 5000 V SiC PiN diodes. The devices studied have current ratings from 0.25 A to 5 A and have different lifetimes resulting in different switching energy versus on-state voltage trade-offs. The devices are characterized using a previously reported test system specifically designed to emulate a wide range of application conditions by independently controlling the applied diode voltage, forward diode current, di/dt, and dv/dt at turn-off. A behavioral model of the test system is implemented to simulate and validate the models. The models are validated for a wide range of application conditions for which the diode could be used.     

6H-SiC Schottky二极管的正向特性

提出了一种考虑Schottky结势垒不均匀性和界面层作用的Si C Schottky二极管( SBD)正向特性模型,势垒的不均匀性来自于Si C外延层上的各种缺陷,而界面层上的压降会使正向Schottky结的有效势垒增高.该模型能够对不同温度下Si C Schottky结正向特性很好地进行模拟,模拟结果和测量数据相符.它更适用于考虑器件温度变化的场合,从机理上说明了理想因子、有效势垒和温度的关系.     

应用于车载变流器的RC-IGBT工作特性

逆导型IGBT (RC-IGBT)是将IGBT功能与续流二极管功能集成在一个芯片上,实现了在相同封装体积下,可获得更大的功率密度,由于IGBT与二极管紧密的移相热耦合,在相同散热条件下,RC-IGBT允许的工作结温更高.同时,RC-IGBT的本征二极管还受到栅极电压控制,通过栅极电压控制策略,可以降低器件损耗,优化系统特性.介绍了RC-IGBT的基本工作原理和二极管退饱和控制特性,研究了RC-IGBT应用于变流器系统的损耗优化控制策略,分析了应用RC-IGBT的单相脉宽调制(PWM)整流器的工作特性与损耗特性.通过一个具体的应用工况运行仿真,分析对比了RC-IGBT和普通IGBT在PWM整流器应用中的损耗特性.结果显示,应用RC-IGBT后总体损耗有所降低,验证了RC-IGBT退饱和脉冲控制的有效性.     

Electrical characteristics of rectifying polycrystalline silicon/silicon carbide heterojunctions

This paper presents a study of the rectifying properties of heavily doped polycrystalline silicon (polysilicon) on 4H silicon carbide (4H-SiC). Current properties and barrier heights were found using analysis of the heterojunction. This revealed that Schottky analysis would be valid for the large barrier height devices. Isotype and an-isotype devices were fabricated on both p-type and n-type SiC and the electrical characteristics were investigated using capacitance vs voltage measurements, current vs voltage measurements (I-V), and temperature I-V measurements. Extraction of the barrier height, built-in potential, and Richardson constant were made and then compared to theoretical values for the heterojunction. Temperature I-V measurements demonstrated that the current transport mechanism is thermionic emission, confirming the validity of the Schottky diode model. The I-V characteristics show near ideal diode rectifying behavior and the capacitance-voltage characteristics show ideal junction space charge modulation for all polysilicon/SiC combinations. These experimental results match well with heterojunction band-offset estimated barrier heights and demonstrate that the barrier height of the polysilicon/4H SiC interface may be controlled by varying the polysilicon doping type.