Synthesis, characterization and properties of tetramethyl stilbene-based epoxy resins for electronic encapsulation

Two novel tetramethyl stilbene-based novolac (II and IV) were synthesized from 2,6-dimethyl phenol and chloroacetaldehyde dimethylacetal or chloroacetone, and then the resulted novolacs were epoxidized to tetramethyl stilbene-based epoxy resins (III and V). The proposed structures were confirmed by FTIR, elemental analysis, mass spectra, NMR spectra and epoxy equivalent weight titration. The synthesized tetramethyl stilbene-based epoxy resins were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-diaminodiphenyl sulfone (DDS). Thermal properties of cured epoxy resins were studied using dynamic mechanical analyzer, differential scanning calorimeter, thermal expansion analyzer and thermal gravimetric analyzer (TGA). These data were compared with that of the commercial tetramethyl biphenol (TMBP) epoxy system. According to the experimental data, the order of T_g for cured epoxy system is III>TMBP>V. The order of moisture absorption for cured epoxy system is V<III<TMBP. According to TGA, the 5% degradation temperatures in nitrogen atmosphere were in the range 370-377 and 397-412 °C for DDM and DDS curing systems, respectively. In air atmosphere, the 5% degradation temperatures were in the range 372-385 and 410-411 °C for DDM and DDS curing systems, respectively. The CTE is in inverse order with T_g, therefore, III/DDS<TMBP/DDS<V/DDS.     

Improving thermal and flame‐retardant properties of epoxy resins by a novel reactive phosphorous‐containing curing agent

In an attempt to improve thermal and flame‐retardant properties of epoxy resins efficiently, a new reactive phosphorus‐containing curing agent called 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐(phenylimino)‐(4‐hydroxyphenyl)me‐thane (DOPO‐PHM) was synthesized and was combined with 4,4′‐diaminodiphenyl methane (DDM) to co‐cure epoxy resins (E51), which covalently incorporated halogen‐free DOPO organ groups into the epoxy networks. The chemical structure of this curing agent was confirmed by FTIR, 1D, and 2D NMR spectra. A reaction mechanism during the preparation was proposed, and the electron effect on the stabilization of the carbocation was discussed. Various DDM/DOPO‐PHM molar ratios were used to get the materials with different phosphorus contents. Their dynamic mechanical, thermal, and flame‐retardant properties were evaluated by dynamic mechanical thermal analysis, thermogravimetric analysis, and limiting oxygen index (LOI) respectively. All samples had a single T_g, showing that these epoxy resins were homogeneous phase for long‐term use in spite of adding DOPO‐PHM. Both char yields (under nitrogen and air atmospheres) increased with the increasing of phosphorus content and the LOI values increased from 24.5 for standard resin to 33.5 for phosphorus‐containing resins, indicating the significant enhancement of thermal stability and flame retardancy. POLYM. ENG. SCI., 54:1192–1200, 2014. © 2013 Society of Plastics Engineers     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Curing kinetics and properties of epoxy resin-fluorenyl diamine systems

Diglycidyl ether of bisphenol fluorene (DGEBF), 9,9-bis-(4-aminophenyl)-fluorene (BPF) and 9,9-bis-(3-methyl-4-aminophenyl)-fluorene (BMAPF) were synthesized to introduce more aromatic structures into the epoxy systems, and their chemical structures were characterized with FTIR, NMR and MS analyses. The curing kinetics of fluorenyl diamines with different epoxy resins including DGEBF, cycloaliphatic epoxy resin (TDE-85) and diglycidyl ether of bisphenol A (DGEBA) was investigated using non-isothermal differential scanning calorimetry (DSC), and determined by Kissinger, Ozawa and Crane methods. The thermal properties of obtained polymers were evaluated with dynamic mechanical thermal analysis (DMTA) and thermogravimetric analysis (TGA). The results show that the values of activation energy (E_a) are strongly dependent on the structures of epoxy resin and curing agent. The curing reactivity of epoxy system is restrained by the introduction of rigid fluorene into chain backbone and flexible methyl into side groups. The cured DGEBF/fluorenyl diamine systems exhibit remarkably higher glass transition temperature, better thermal stability and lower moisture absorption compared to those of DGEBA/fluorenyl diamine systems, and display approximate heat resistance and much better moisture resistance relative to those of TDE-85/fluorenyl diamine systems.     

Improving thermal and flame‐retardant properties of epoxy resins by a new imine linkage phosphorous‐containing curing agent

A new reactive phosphorus‐containing curing agent with imine linkage called 4, 4′‐[1, 3‐phenyl‐bis(9, 10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl)dimethyneimino)]diphenol (2) was synthesized both via two‐pot and one‐pot procedure. The chemical structure of this curing agent was confirmed by FTIR, ¹H, ¹³C, and ³¹P NMR spectra. A series of thermosetting systems were prepared by using conventional epoxy resins (E51), 4, 4′‐diaminodiphenyl methane (DDM) and (2). Resins with different phosphorus contents were obtained by changing the DDM/(2) molar ratios. Their dynamic mechanical thermal, thermal and flame‐retardant properties were evaluated by dynamic mechanical thermal analysis (DMTA), thermogravimetric analysis (TGA), and limiting oxygen index (LOI), respectively. All samples had a single T_g, which showed that these epoxy resins were homogeneous phase. Both the two char yields under nitrogen and air atmospheres increased with increasing content of (2) and the LOI values increased from 24.5 for standard resin to 37.5 for phosphorus‐containing resin, which indicated that incorporation of (2) could impart good thermal stability and excellent flame retardancy to the conventional epoxy thermosets. POLYM. ENG. SCI., 56:441–447, 2016. © 2016 Society of Plastics Engineers     

Synthesis,Characterization, and Properties of Multifunctional Epoxy Maleimide Resins

Summary: Novel multifunctional formaldehyde resins bearing diaminodiphenylmethane groups are synthesized by the polymerization of a mixture of diaminodiphenylmethane (DDM), o‐cresol (o‐Cz), and cyclohexanone (CH_x) with formaldehyde (FA) (at a molar ratio of monomers/formaldehyde, 1/1), in the presence of acid catalyst (HCl). The obtained resins are epoxidated with a large excess of epichlorohydrin and transformed into multifunctional epoxy resins. The multifunctional epoxy maleimide resins are obtained by reaction of the epoxy resins with carboxy phenyl maleimide in the presence of triethylamine as a catalyst. The resultant resins are characterized by IR and NMR spectroscopy, elemental, and thermal analysis. The curing and thermal behavior of these epoxy maleimide resin/DDM systems are investigated using differential scanning calorimetry (DSC) and thermogravimetry (TG) techniques. The activation energies of the curing reactions are situated in the range of 53–90 kJ · mol^?1. The cured products have good thermal properties, and activation energies of degradation reactions have values between 42–74 kJ · mol^?1.

The curing reaction of multifunctional epoxy maleimide resins with DDM.     

Some factors influencing exfoliation and physical property enhancement in nanoclay epoxy resins based on diglycidyl ethers of bisphenol A and F

An investigation of the factors influencing the degree of exfoliation of an organically modified clay in a series of epoxy resins is reported. The use of sonication, choice of curing agent, effect of the moisture content of the clay, and the cure temperature were examined. The dispersion was characterized using a combination of rheological measurements, X‐ray diffraction, and dynamic mechanical thermal analysis. Rheological analysis of the clay dispersion in the epoxy monomer indicated that at high clay loads Herschel–Bulkley type behavior is followed. Higher cure temperatures and higher levels of clay moisture were found to influence the extent of exfoliation. Improvements in physical properties were observed through the addition of nanocomposites. The DGEBA/DDM and DEGEBA/DDS exhibited 2 and 4°C increase, respectively, in T_g per wt % of added clay. DGEBF showed virtually no enhancement. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Biphenyl liquid crystal epoxy containing flexible chain: Synthesis and thermal properties

A biphenyl type liquid crystal epoxy (LCE) monomer 4,4′-di(2,3-epoxyhexyloxy)biphenyl (LCBP4) containing flexible chain was synthesized and the curing behavior was investigated using 4,4′-diaminodiphenylmethane (DDM) as the curing agent. The effect of curing condition on the formation of the liquid crystalline phase was examined. The cured samples show good mechanical properties and thermal stabilities. Moreover, the relationship between thermal conductivity and structure of liquid crystalline domain was also discussed. The samples show high thermal conductivity up to 0.28–0.31 W/(m*K), which is 1.5 times as high as that of conventional epoxy systems. In addition, thermal conductive filler, Al₂O₃, was introduced into LCBP4/DDM to obtain higher thermal conductive composites. When the content of Al₂O₃ was 80 wt%, the thermal conductivity of the composite reached to 1.86 W/(m*K), while that of diglycidyl ether of bisphenol A (Bis-A) epoxy resin/DDM/Al₂O₃ was 1.15 W/(m*K). Compared with Bis-A epoxy resin, the formation of liquid crystal domains in the cured LCE resin enhanced the thermal conductivity synergistically with the presence of Al₂O₃. Furthermore, the introduction of Al₂O₃ also slightly increased the thermal stabilities of the cured LCE.     

Thermo-mechanical behaviors of epoxy resins reinforced with nano-Al2O3 particles

This study examined the thermo-mechanical behavior of epoxy resins/nano-Al₂O₃ composites including the curing behavior, thermal stability, dynamic mechanical properties and thermal mechanical properties. The DSC curve peak temperature of the composites was decreased by the addition of nano-Al₂O₃. The thermal stability of the composites was similar to that of the neat epoxy resins. Dynamic mechanical analysis (DMA) indicated the glass transition temperature of the composites to be approximately 11 °C higher than that of the neat epoxy resins. The coefficient of thermal expansion (CTE) of the composites decreased with increasing nano-Al₂O₃ content.     

Low dielectric thermoset. I. Synthesis and properties of novel 2,6‐dimethyl phenol‐dicyclopentadiene epoxy

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant 2,6‐dimethyl phenol‐dicyclopentadiene novolac was epoxidized to 2,6‐dimethyl phenol‐dicyclopentadiene epoxy. The structures of novolac and epoxy were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis, mass spectroscopy (MS), nuclear magnetic resonance spectroscopy (NMR), and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol‐dicyclopentadiene epoxy was then cured with 4,4‐diaminodiphenyl methane (DDM), phenol novolac (PN), 4,4‐diaminodiphenyl sulfone (DDS), and 4,4‐diaminodiphenyl ether (DDE). Thermal properties of cured epoxy resins were studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermal gravimetric analysis (TGA). These data were compared with those of the commercial bisphenol A epoxy system. Compared with the bisphenol A epoxy system, the cured 2,6‐dimethyl phenol‐ dicyclopentadiene epoxy resins exhibited lower dielectric constants (～3.0 at 1 MHz and 2.8 at 1 GHz), dissipation factors (～0.007 at 1 MHz and 0.004 at 1 GHz), glass transition temperatures (140–188°C), thermal stability (5% degradation temperature at 382–404°C), thermal expansion coefficients [50–60 ppm/°C before glass‐transition temperature (T_g)], and moisture absorption (0.9–1.1%), but higher modulus (～2 Gpa at 60°C). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2607–2613, 2003     

Synthesis of naphthalene containing aralkyl novolac epoxy resins for electronic application

Naphthalene containing aralkyl novolac epoxy resins were synthesized by the condensation of p‐xylylene glycol with 2,7‐dihydroxynaphthalene or 2‐naphthol followed by the epoxidation of the resulting aralkyl novolacs with epichlorohydrin. The mechanical and dynamic viscoelastic properties of cured aralkyl novolac epoxy resins were investigated. Comparisons of mono‐ and di‐functional naphthalene containing aralkyl novolac epoxy resins based on thermal and moisture absorption properties were also studied. The results indicate that a naphthalene containing aralkyl epoxy resin made from the difunctional naphthol has a low coefficient of thermal expansion, high heat resistance, and low moisture absorption.     

Formaldehyde Resins Bearing Diaminodiphenylmethane Groups: Synthesis,Characterization and Properties

Summary: Novel formaldehyde resins bearing diaminodiphenylmethane groups were synthesized by the polymerization of a mixture of diaminodiphenylmethane (DDM), cyclohexanone (CHx) and o‐cresol (o‐Cz) with formaldehyde (FA) in the presence of an acid catalyst (HCl). The resins obtained were characterized by spectral, elemental and thermal analysis and used as a hardener for epoxy resins. The curing and temperature behavior of these epoxy resin/formaldehyde systems were investigated using differential scanning calorimetry and thermogravimetry techniques. The resins had good thermal stability and the activation energies of degradation reactions had values between 70–98 kJ · mol^?1.

The curing reaction of epoxy resins with the DDM/CHx/o‐Cz/formaldehyde resins.     

Improvement of surface and moisture resistance of epoxy resins with fluorinated glycidyl ether

Laurylfluoro glycidyl ether (FGE) was synthesized by laurylfluoro‐1‐pentanol with epichlorohydrin, and confirmed by FTIR and ¹³C‐NMR. The surface properties, moisture absorption, and mechanical properties of the epoxy resins modified by different content of laurylfluoro glycidyl ether acted as mono functional thinner were investigated by X‐ray photoelectron spectroscopy (XPS), universal testing machine (UTM), dynamic mechanical thermal analyzer (DMTA), etc. The fluorine content at the surface of the modified resins were enriched greatly with the increase of the content of laurylfluoro glycidyl ether, and the hydrophobic property of the resins surface increased. When the FGE content was 10%, the fluorine content at the surface of the modified epoxy resin reached to 66% and the water contact angle was 102°. The equilibrium moisture content of the resin dropped by 30% when the content of FGE was 5%. The mechanical properties of the epoxy resins modified by FGE were improved while the thermal mechanical properties changed little at low content of FGE (less than 3%). Further increase of FGE content in the epoxy resins may result in decreases of the mechanical and thermal mechanical properties of the resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis and characterization of a novel heat resistant epoxy resin based on N,N′-bis(5-hydroxy-1-naphthyl)pyromellitic diimide

A novel epoxy resin containing imide and naphthyl groups was synthesized, and characterized using NMR, NMR, FT-IR spectra and elemental analyses. The curing behavior was investigated with differential scanning calorimetry (DSC) using 4,4′-diaminodiphenylsulfone (DDS) as curing agent. The physical properties of the cured polymer were evaluated with dynamic thermal mechanical analysis (DMTA) and thermogravimetric analysis (TGA). The results showed that the cured polymer exhibited higher glass transition temperature (T_g) and better thermal stability compared with those commercial available heat resistant epoxy resins.     

Preparation and properties of one epoxy system bearing fluorene moieties

Diglycidyl ether of bisphenol fluorene (DGEBF) and 9,9‐bis(4‐aminophenyl) fluorene (BPF) were synthesized to introduce more aromatic structures into an epoxy system, and their chemical structures were characterized with Fourier transform infrared spectroscopy, NMR, and mass spectrometric analysis. The dynamic curing behavior of the DGEBF/BPF system was investigated with differential scanning calorimetry. DGEBF was cured with BPF, diaminodiphenylsulfone (DDS), and diaminodiphenylmethane (DDM), and E‐44 (bisphenol A epoxide) was also cured with BPF for comparison. The thermal properties of the obtained polymers were evaluated with dynamic mechanical thermal analysis and thermogravimetric analysis. The cured DGEBF/BPF system showed a remarkably higher glass‐transition temperature, better thermal stability and lower moisture absorption in comparison with the general bisphenol A epoxy resin/BPF system but approximated the heat resistance of the DGEBF/DDS and DGEBF/DDM systems. Such properties make this epoxy system very promising for heat‐resistant applications. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Novel flame retardant epoxy resins I: Synthesis, characterization, and properties of aryl phosphinate epoxy ether cured with diamine

Summary A novel aryl phosphinate epoxy ether, 10-(2',5'-bis(glycidyloxy)phenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHQEP), was synthesized. The structures of the obtained compounds were confirmed by mass, FTIR, ¹H, ¹³C, ³¹P-NMR spectroscopies, elemental analysis, and X-ray single crystal analysis. In addition, compositions of DHQEP with common curing agents, e.g., 4,4'-diaminodiphenylmethane (DDM), 4,4'-diaminodiphenyl sulfone (DDS), and dicyanodiamide (DICY), were studied to compare their thermal and flame resistance with that of commercial epoxy resins. The aryl phosphinate epoxy-resin composites exhibited excellent thermal properties and a quite high limiting oxygen index (LOI) value as well as high char yield. Aryl phosphinate epoxy ether is shown to be an effective flame retardant and thermal stabilizer for epoxy resins. Received: 13 April 1998/Revised version: 8 May 1998/Accepted: 11 May 1998     

Tetraglycidyl epoxy resins and graphite fiber composites cured with flexibilized aromatic diamines

Studies were performed to synthesize new ether modified, flexibilized aromatic diamine hardeners for curing epoxy resins. The effect of moisture absorption on the glass transition temperatures of a tetraglycidyl epoxy, MY 720, cured with flexibilized hardeners and a conventional aromatic diamine was studied. Unidirectional composites, using epoxy-sized Celion 6000 graphite fiber as the reinforcement, were fabricated. The room temperature and 300°F mechanical properties of the composites, before and after moisture exposure, were determined. The Mode I interlaminar fracture toughness of the composites was characterized, using a double cantilever beam technique to calculate the critical strain energy release rate, G_IC.     

Multifunctional formaldehyde resins as curing agent for epoxy resins

Formaldehyde resins (FR) at 1/1/2 molar ratios of monomers (Cl‐phenol/amino monomers/p‐formaldehyde) were synthesized under acid catalysis. The obtained resins were characterized using elemental analysis, FTIR and RMN spectroscopic methods, being used as crosslinking agents for epoxy resin formulations. The curing of epoxy resins with FR were investigated. The glass transition temperature (T_g) and decomposition behavior of crosslinked resins were studied by differential scanning calorimetry (DSC) and thermogravimetric (TGA) techniques. All DSC scans show two exothermic peaks, which implied the occurrence of cure reactions between epoxy ring and amine or carboxylic protons, in function of chemical structures of FR. The crosslinked products showed good thermal properties, high glass transitions, and low water absorption. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Thermo-mechanical behaviors and moisture absorption of silica nanoparticle reinforcement in epoxy resins

An investigation of the thermo-mechanical behavior of silica nanoparticle reinforcement in two epoxy systems consisting of diglycidyl ether of bisphenol F (DGEBF) and cycloaliphatic epoxy resins was conducted. Silica nanoparticles with an average particle size of 20 nm were used. The mechanical and thermal properties, including coefficient of thermal expansion (CTE), modulus (E), thermal stability, fracture toughness (K_IC), and moisture absorption, were measured and compared against theoretical models. It was revealed that the thermal properties of the epoxy resins improved with silica nanoparticles, indicative of a lower CTE due to the much lower CTE of the fillers, and furthermore, DGEBF achieved even lower CTE than the cycloaliphatic system at the same wt.% filler content. Equally as important, the moduli of the epoxy systems were increased by the addition of the fillers due to the large surface contact created by the silica nanoparticles and the much higher modulus of the filler than the bulk polymer. In general, the measured values of CTE and modulus were in good agreement with the theoretical model predictions. With the Kerner and Halpin-Tsai models, however, a slight deviation was observed at high wt.% of fillers. The addition of silica nanoparticles resulted in an undesirable reduction of glass transition temperature (T_g) of approximately 20 °C for the DGEBF system, however, the T_g was found to increase and improve for the cycloaliphatic system with silica nanoparticles by approximately 16 °C. Furthermore, the thermal stability improved with addition of silica nanoparticles where the decomposition temperature (T_d) increased by 10 °C for the DGEBF system and the char yield significantly improved at 600 °C. The moisture absorption was also reduced for both DGEBF and cycloaliphatic epoxies with filler content. Lastly, the highest fracture toughness was achieved with approximately 20 wt.% and 15 wt.% of silica nanoparticles in DGEBF and cycloaliphatic epoxy resins, respectively.     

双马来酰亚树脂基体的湿热特性研究

本文以四官能环氧树脂基体作参比物、选择两种典型的双马来酰亚胺树脂基体（环氧改性双马基体、烯丙基双酚Ａ／双马共聚基体）作为对象，研究其吸湿特性以及吸湿对树脂基体性能的影响，结果表明，树脂基体的化学结构和交联密度对吸湿特性有较大的影响，吸湿量对树脂基体性能的影响也与基体材料的类型，交联密度有关，不能简单地用给定时间下的吸湿率来评定树脂基体的湿热性能优劣。