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1.
The dynamics of spreading of liquid metal atoms via molecular dynamics is considered vs. the commensurability of the solid surface with respect to the size of the liquid atoms. The solid surfaces are modeled as rigid (1 0 0) oriented Ni and, for two series of simulations, the lattice spacing of the substrate is varied from the regular equilibrium spacing to a commensurate situation with Au or Ag drops spreading spontaneously on top. The diffusion is calculated in the layered region of the liquid in contact with the two different solid surfaces and then compared. Then, the dynamic evolution of the contact angle is fitted to Molecular Kinetic Theory and compared with the two substrate geometries. It is observed that the friction parameter scales as the inverse of the diffusion in the interfacial region. The change in ordering induced by the commensurate substrate is characterized by examining the density profiles across the solid/liquid interface and fitting the curve by an exponential decay with a characteristic correlation distance 1/κ. It is shown that the commensurability/non-commensurability of the solid surface with respect to the liquid atoms changes the ordering, which plays a significant role in the dynamics, a feature not properly taken into account in the present formulation of Molecular Kinetic Theory.  相似文献   

2.
Wetting of Si single crystals by pure copper has been studied using the dispensed drop technique under high vacuum at 1100 °C. At this temperature copper dissolved large quantities of Si during spreading. CuSi droplets presaturated in silicon were also used to obtain non-reactive spreading. From the results obtained the different contributions to “dissolutive wetting” were determined. Moreover, a simple analytical model was formulated for analysing the influence on wetting of the interfacial atomic processes and of Si transport in the liquid. It is seen that, under our experimental conditions, solute transport by Marangoni convection controls the spreading kinetics.  相似文献   

3.
4.
The trend of miniaturization of electronic products induced the shrinking dimension of interconnects in the chip. When those interconnects are subjected to high current density (usually 103 to 104 A/cm2), electromigration (EM) could affect the reliability of the chip which would ultimately break the circuit. In this study, eutectic SnPb solders with thickness of 280, 128, and 50 μm were investigated under high current density (104 A/cm2) and high ambient temperature (120 °C). The EM-induced surface undulations were more prominent at the shorter thickness, demonstrating that the diffusion of metal atoms/ions was controlled by the actual temperature in the bulk solder instead of the back stress. Bamboo groove features were observed on the surface of solder extrusion at the anode side for the three solder thickness, which indicated the metal atoms/ions that migrated parallel to the direction of flow of electrons.  相似文献   

5.
Thermal fatigue in shear is an important cause of failure in electronic devices. Microstructures of solder joints with 5Sn-95Pb and 60Sn-40Pb solder contacts on copper have been studied and their performance in both isothermal and thermal fatigue investigated. In 5Sn-95Pb joints the shear fatigue failure is always through the solder rather than the solder-copper interface and occurs in an intergranular fashion. In 60Sn-40Pb joints, the shear fatigue failure occurs along bands of concentrated shear, but the shear induces a rapid coarsening of the eutectic microstructure which helps to concentrate the deformation.  相似文献   

6.
Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed ...  相似文献   

7.
The initial rapid wetting of a solid surface by a liquid phase is an important step in many industrial processes. Liquid-phase sintering of powder metallurgical steels is one such industrial process, where metallic powders of micrometer size are used. Investigating the dynamic wetting of a high-temperature metallic drop of micrometer size experimentally is very challenging. Here, a phase-field-based numerical model is first implemented and verified by accurately capturing the initial dynamic wetting of millimeter-sized metal drops and then the model is extended to predict the dynamic wetting of a micrometer-sized metal drop. We found, in accordance with recent observations, that contact line friction is required for accurate simulation of dynamic wetting. Our results predict the wetting time for a micrometer-sized metal drop and also indicate that the dynamic wetting patterns at the micro- and millimeter length scales are qualitatively similar. We also found that the wetting process is much faster for a micrometer-sized metal drop compared to a millimeter-sized metal drop.  相似文献   

8.
In addition to providing electrical connections, solder is useful in the formation of passive, precision alignments for optoelectronic packaging. Different designs have demonstrated micrometer-level alignment accuracies, and the aligned structures are becoming more and more complex. Solder engineering has been successfully introduced into the field of optoelectronics, and it is expected to be applied to many other areas demanding low-cost, precision alignments.  相似文献   

9.
采用差热分析、润湿性和力学性能试验研究了自主研发的一种新型低银无铅焊料Sn-XAg-0.3Cu-3Bi-0.05Er(SACBE)(X=1.0,1.5,2.0)及其焊点的拉伸性能。结果显示,与Sn-3.0Ag-0.5Cu(SAC)焊料相比,SACBE焊料具有较低的起始熔化温度(204~206℃)和较好的润湿性。Cu/SACBE/Cu焊点的拉伸强度与Cu/SAC/Cu焊点相当,但是其韧性显著改善。表明新型低银SACBE焊料,在保持SAC焊料优良物理力学性能基础上所具有的成本优势。  相似文献   

10.
新型船舶制造技术-搅拌摩擦焊   总被引:7,自引:0,他引:7  
对搅拌摩擦焊的原理、特点以及在船舶制造工业中的应用进行了阐述,并且对搅拌摩擦焊在中国船舶制造领域的应用进行了展望。  相似文献   

11.
High-Temperature Oxidation of a Sn-Zn-Al Solder   总被引:8,自引:0,他引:8  
Lin  Kwang-Lung  Liu  Tzy-Ping 《Oxidation of Metals》1998,50(3-4):255-267
The oxidation of 91Sn-9(95Zn-5Al) solder in theliquid state, 250°C, was studied by thermalgravimetric analysis (TGA). The oxidation behavior of63Sn-37Pb, 91Sn-9Zn, 99.4Sn-0.6Al, and Sn was alsoinvestigated for comparison. The weight gains per unitsurface area descend in the order: 63Sn-37Pb > Sn> 91Sn-9Zn > 91Sn-9(95Zn-5Al) > 99.4Sn-0.6Al.The initial weight gains of the materials investigated increase linearly with reaction time, whileparabolic behavior exists after the linear stage. Therate constants of the oxidation reaction for the tworeaction stages were determined. Activation energies for oxidation of the five materials weredetermined in the range of 250 to 400°C. Theactivation energies, derived from the linear rateconstants for the early stages of oxidation, are 27.7kJ/mole for 99.4Sn-0.6Al, 23.3 kJ/mole for 91Sn-9Zn, 21.4kJ/mole for 91Sn-9(95Zn-5Al), 20.5 kJ/mole for63Sn-37Pb, and 19.8 kJ/mole for Sn. Thesurface-oxidation behavior was investigated further withelectron spectroscopy for chemical analysis (ESCA) and Auger electronspectroscopy (AES). AES profiles showed that oxides ofZn and Al formed on 91Sn-9Zn and 91Sn-9(95Zn-5Al)solders, while tin oxide is formed on 63Sn-37Pbsolder.  相似文献   

12.
The role of intermetallics in wetting in metallic systems   总被引:3,自引:0,他引:3  
Formation of intermetallic seems to improve strongly wetting of a solid metal by a liquid one. The aim of this study is to identify the reasons of this improvement. For this purpose, wetting of Fe is determined at the same experimental conditions for two liquid metals, one reactive (Sn), the other non-reactive (Pb).  相似文献   

13.
New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing β-Sn nucleation in Sn-based solders, and isothermally solidified interconnects using transient liquid phases. Issues in β-Sn nucleation in Sn-based solders were summarized in the context of Swenson’s 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based on a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. All of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.  相似文献   

14.
An emf method was employed to determine tin activities in the liquid Au-Cu-Sn alloys using solid electrolyte galvanic cells. The whole concentration range of the Gibbs triangle was covered, and emf readings were taken for both heating and cooling mode within temperature interval: 900-1360 K. Emf versus T relations were approximated by line equations, and its coefficients were listed in tables. Tin activity versus composition curves were constructed, displaying negative deviation from ideal behavior. Activity data were compared to the respective values calculated from COST 531 database using binary formalism, and relatively good agreement was observed.  相似文献   

15.
在电子和太阳能光伏行业中,为达到产品要求,须在铜基材表面镀层锡焊料.而在实际生产操作中,采用的工艺一般为热浸镀锡工艺,由于操作环境温度较高,导致对铜基材造成热侵蚀,使锡焊料槽中的铜含量升高,从而影响焊料的物理、化学和使用性能,造成焊接工艺不稳定.针对此问题,对锡焊料槽中除铜工艺进行了研究,提出不同的除铜工艺.  相似文献   

16.
熔融状态下共晶SnBi钎料的电迁移特性   总被引:2,自引:0,他引:2  
研究电流密度为1.5×104 A/cm2时,共晶SnBi焊点的微观组织的演变.试验过程中应用Microview MVC2000图像采集卡对焊点形态的变化进行实时监控.通电仅110 s,焊点的局部区域开始熔化;130 s后达到完全熔融的状态.结果表明:通电10 min后,焊点的阳极附近形成了大量的块状Bi相,而在阴极则以细条形的Bi相为主.然而抛光后发现,阴极和阳极的微观组织保持一致,钎料基体内出现了大量的Bi的小颗粒形成的聚集,阴极界面出现了空洞.通电30 min后,共晶组织的均匀分布已经被打乱.阳极附近出现了Bi的聚集,而且阳极界面的IMC层比阴极界面的IMC层厚.  相似文献   

17.
采用电镀的方法在制备了尺寸小于100 μm的Sn-3.0Ag凸点,研究了多次回流和时效过程下SnAg/Cu界面IMC的生长、孔洞的生长机理和分布以及影响因素.结果表明,回流过程中孔洞彤成的主要原因是相变过程发生的体积缩减,而时效过程中孔洞形成的主要原因是柯肯达尔效应.时效过程中Cu3Sn(ε相)中孔洞的生长及分布受初始形成的Cu6Sn5(η相)影响.厚η相及η晶界处形成的孔洞促进ε相中孔洞的生长.平直的ε相/Cu界面以及ε相层内孔洞的连接对凸点的长期可靠性构成威胁.  相似文献   

18.
利用化学元素周期表上第VA族X元素和Ni元素代替Sn-Ag-Cu系列中的Ag制备出一种新型无铅焊料.用DSC测量了合金焊料的熔点,并考察了其润湿性和焊接接头强度,实验结果表明:Sn-X-Cu-Ni系新型合金焊料与Sn-Ag-Cu系和Sn-Cu系合金相比其润湿性和焊点剪切强度有明显的改善,焊点拉伸强度略有提高,但熔点有所升高.  相似文献   

19.
Au-Ag-Si钎料合金的初步研究   总被引:13,自引:1,他引:13  
针对目前熔点在450~500℃范围内的电子器件用钎料的空缺,通过分析Au-Ag-Si系三元相图,并根据其存在的共晶单变量线e1e2,制备了几种熔化温度在400~500℃的共晶钎料合金,并对其钎焊性和加工性能进行了初步的研究。DTA分析发现,合金的熔点在所选定的合金成分范围内随Ag含量的增加而升高。此钎料与Ni板浸润性较好;将钎料合金铸锭热轧后表明该合金作为可加工的实用钎料是合适的。同时,初步探讨了Cu元素对于Au-Ag-Si系合金的熔化特性和塑性变形能力的影响,结果表明Cu对于改善合金的加工性能和缩小固液相间距具有重要的意义。  相似文献   

20.
为了获得低成本和性能良好的无铅焊料,本文在Sn-4.1X-1.5Cu-Ni焊料中添加质量分数为0.6%的Bi元素,对其微观组织及物相成分、熔点、润湿性和剪切强度进行了分析研究,并对焊点等温时效后其界面组织进行了SEM和EDS分析.结果表明,Sn-4.1 X- 1.5Cu-Ni-0.6Bi焊料中主要由β-Sn、Cu6Sn5、XSn和SnBi组成,Bi的加入能有效地降低焊料的熔点和提高焊料的润湿性,焊点也保持较高的剪切强度.随着等温时效时间的延长,Sn-4.1X-1.5Cu-Ni/Cu和Sn-4.1X- 1.5Cu-Ni-0.6Bi/Cu界面金属间化合物(IMC)层厚度也增加,其界面IMC的增厚主要由扩散机制控制,界面IMC主要成份为Cu6Sn5、Cu3Sn和(Cu,Ni)6Sn5.Bi能抑制等温时效过程中界面IMC的形成和生长,从而提高了焊点的可靠性,其中Sn-4.1 X- 1.5 Cu-Ni/Cu的IMC生长速率为2.95×10-17m2/s,Sn-4.1X-1.5Cu-Ni-0.6Bi/Cu的IMC生长速率为2.78× 10-17m2/s.  相似文献   

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