工业／安防／医疗电子

易良盛：高品质霍尔传感器IC,瞄准家电和汽车应用 易良盛科技（天津）有限公司是天津市开发区集成电路产业园内的一家集成电路设计公司,其主要产品方向是传感器IC及与传感器相关的周边IC。如磁敏传感器、光敏传感器、温度传感器、电机驱动IC等。目前公司产品主要是霍尔传感器IC,已经获得6项国家集成电路版图保护证书。     

新型风扇速度自动控制集成电路及其应用

介绍两种新型风扇速度自动控制集成电路使用简单远程二极管温度传感器的四速风扇控制集成电路LM88及双风扇速度控制集成电路LTC1840的性能特点及其应用电路。     

直读式摄氏温度传感器

美国国家半导体公司制成并开始出售LM35系列精密温度传感器,它的输出电压与摄氏温标成线性比例.与一般用开耳文方法校准的温度传感器相比,新传感器采用了集成电路,它不必从传感器输出中减去恒压,可比较方便地得到摄氏读数.     

用于臭氧技术产品中的传感器

简述了传感器在臭氧技术产品中的应用。对臭氧技术产品中使用最多的温度传感器、光传感器和红外遥控技术的工作原理进行了详述。进一步对应用于臭氧技术产品中的传感器进行了分类,并对压力式温度传感器、热敏传感器、双金属热保护器、热聚合开关、光敏二极管和红外遥控技术的工作原理、使用场所进行了逐一介绍。设计了几个使用这些传感器来对臭氧产品进行控制的控制电路。     

传感器与传动器

Omega相对湿度/温度传感器OmegaEngineering公司HX94相对湿度/温度传感器为管道或墙壁安装的监测应用提供了一种方法。该传感器适于HVAC应用。其固态传感器提供理想的灵敏度、快速响应和稳定等特性。该传感器连接简便、直线式输出,可与大多数显示与控制器件接口连接。报价为235美元。ifmefector紧凑型光电传感器ifmefector公司推出一种光电传感器,它带有直角透镜,用于安装空间有限的应用。该OG90带有一个18mm不锈钢外壳,具有低矮安装外形,安装只需28mm空间。该传感器提供预设固定敏感范围,避免额外编程和设置。采用红光技术,可以在安装…     

电子技术在温度传感器中的应用研究

本文就以半导体集成电路中的COMS正反馈式温度传感器设计为例,对温度传感器中的电子技术应用进行分析。希望通过本次的分析,可以对电子技术的应用和温度传感器的发展提供科学参考。     

电子设计工程师认证实操实训基础系列讲座(15) 第六讲 简易温度监控器设计(续)

五、温度采集及调理电路设计与仿真测温离不开温度传感器.常见的温度传感器有热电偶、热电阻、模拟集成电路温度传感器、数字温度传感器等多种类型.为方便在Proteus中仿真观测结果,我们采用LM35温度器作为温度采集器件.LM35是美国国家半导体公司(现被美国德州仪器公司收购)生产的集成电路温度传感器,它具有很高的工作精度和...     

数字温度传感器在医疗行业中的应用

简要回顾了温度传感器的发展历程,介绍了数字温度传感器的技术优势,分析了该类传感器在多功能电子温度计、与RFID技术结合以及可穿戴设备等智能医疗系统中的应用。     

传感器在集中式空调系统中的应用

主要介绍了在集中式空调系统中的各种传感器如温度传感器、湿度传感器、压力传感器、压差传感器、流量传感器等的作用,并对集中式空调系统中常见的几类传感器的应用进行了探讨,供同行参考.     

传感器在发电厂中的应用

概述了料位传感器、温度传感器、磁致位移传感器、电磁流量计、声热传感器等多种传感器在火电、水电及核电发电站中的应用。对电厂设计运营、新型传感器的研发具有参考意义。     

Hydrogen, Calcium, and Potassium Ion-Sensitive FET Transducers: A Preliminary Report

The application of integrated circuit technology to the field of physiological data acquisition may produce a significant impact on patient monitoring, diagnosis and therapeutic medical decisions. Biomedical sensors based on IC technology have several potential advantages not available in present biomedical sensors. These include small size, reliability, rapid time response, multi-sensor chip, and onchip signal processing to achieve high to low impedance transformation, temperature compensation, signal multiplexing, etc.     

Design of a sensorless commutation IC for BLDC motors

This paper presents the design and realization of a sensorless commutation integrated circuit (IC) for brushless DC motors (BLDCMs) by using mixed-mode IC design methodology. The developed IC can generate accurate commutation signals for BLDCMs by using a modified back-EMF sensing scheme instead of using Hall-effect sensors. This IC can be also easily interfaced with a microcontroller or a digital signal processor (DSP) to complete the closed-loop control of a BLDCM. The developed sensorless commutation IC consists of an analog back-EMF processing circuit and a programmable digital commutation control circuit. Since the commutation control is very critical for BLDCM control, the proposed sensorless commutation IC provides a phase compensation circuit to compensate phase error due to low-pass filtering, noise, and nonideal effects of back-EMFs. By using mixed-mode IC design methodology, this IC solution requires less analog compensation circuits compared to other commercially available motor control ICs. Therefore, high maintainability and flexibility can be both achieved. The proposed sensorless commutation IC is integrated in a standard 0.35-/spl mu/m single-poly four-metal CMOS process, and the realization technique of this mixed-mode IC has been given. The proposed control scheme and developed realization techniques provide illustrative engineering procedures for the system-on-a-chip solution for advanced digital motor control. Simulation and experimental results have been carried out in verification of the proposed control scheme.     

Design of integrated and autonomous conductivity–temperature–depth (CTD) sensors

Impedance characterization of interfaces is a basic technique for a large class of chemical and biological sensors. This technique is often used to model interfaces between ion-based and electron-based conductive materials by means of electric variables such as voltage, current and charge. Conductivity–temperature–depth (CTD) sensors are sophisticated devices used in the environmental monitoring field to understand the effects of climate changes on oceans and on marine organisms. They usually require impedance sensing as readout technique. High-accuracy CTD sensors are present on the market but they are bulky and power hungry. However, the downscale of modern CMOS technology allows shrinking very complex bioelectronic interfaces into millimeter square size systems, thus opening a large ground of applications. This paper will describe an IC architecture and the related design approach to implement an electrochemical impedance spectroscopy (EIS) technique for CTD sensing and will propose a general approach for sensing complex impedance with low power consumption and high precision. The presented system is designed to achieve 15-bit resolution and power consumption to ensure lifetime up to 1 year using button-size batteries in ocean environment.     

蓝宝石光纤光栅高温传感器研究进展与发展趋势(特邀)

在高速飞行器、航空发动机、核反应堆等国防安全和国民经济的重要领域,需要实现1800 ℃以上的高温原位测量。常规石英光纤传感器受限于材料特性,无法在1000 ℃以上高温环境中长期稳定使用。单晶蓝宝石光纤具有极高的熔点（2053 ℃）和较低的传输损耗,是一种良好的高温传感材料。在单晶蓝宝石光纤内部刻写布拉格光栅,可以研制出蓝宝石光纤光栅传感器,具有耐温性能好、测量精度高、便于多点测量等优点,是当前最具发展前景的新型高温传感器件。首先介绍了蓝宝石光纤光栅高温传感器的工作原理和理论模型,接着介绍了利用飞秒激光制备蓝宝石光纤光栅的三种主流技术,包括相位掩模板扫描法、双光束干涉法、直写法,并从制备效率、光谱质量等方面比较了三种技术的优劣,指出飞秒激光直写法是制备蓝宝石光纤光栅高温传感器的最佳手段;然后介绍了蓝宝石光纤光栅的光谱优化方法,包括如何减小光栅光谱带宽和如何降低光谱噪声;进一步介绍了蓝宝石光纤光栅的高温传感特性、封装工艺及高温温度、应变传感应用;最后展望了蓝宝石光纤光栅传感器的未来发展趋势。蓝宝石光纤光栅高温传感器的快速发展和大规模推广应用,必将有助于解决当前我国航空航天、核电等领域重大装备结构健康监测的卡脖子难题。     

Differential Pressure/Pressure Transmitters Applied with Semiconductor Sensors

The optimum design for silicon diaphragm-type pressure sensors and that for a sensing body of the transmitters have been considered. Three types of sensors, which have different section shapes, have been developed for measuring wide-range pressure with high sensitivity and good linearity. The transmitters of the range from 0-100 Pa up to 0-50 MPa with an accuracy of 0.2 percent have been developed. For a differential pressure transmitter a three-metal diaphragm structure has been devised to protect the sensor from an overpressure. The characteristics of the transmitters are high accuracy, high reliability, and long-term stability.     

Multifunctional ceramic sensors: Humidity-gas sensor and temperature-humidity sensor

Two types of multifunctional ceramic sensors have been developed in response to strong demands for automatic control systems in cooking ovens, air conditioners, etc. The first sensing device can detect both humidity and particular reducing agents, such as alcohols and smokes, with a high sensitivity and selectivity. This novel ceramic sensor utilizes gas chemisorption at 400°-500°C as well as water physisorption at <150°C on the grain surface of MgCr2O4-TiO2ceramic with a porous structure and p-type semiconduction. The other sensor is composed of a porous dielectric Ba0.5MSr0.5TiO3ceramic characterized by a high temperature dependence of the dielectric constant. The sensing device can independently detect simultaneously and rapidly both temperature and humidity. These sensors exhibit long-term stability, in combination with heat treatment.     

Micromachined thermally based CMOS microsensors

An integrated circuit (IC) approach to thermal microsensors is presented. The focus is on thermal sensors with on-chip bias and signal conditioning circuits made by industrial complementary metal-oxide-semiconductor (CMOS) IC technology in combination with post-CMOS micromachining or deposition techniques. CMOS materials and physical effects pertinent to thermal sensors are summarized together with basic structures used for microheaters, thermistors, thermocouples, thermal isolation, and heat sinks. As examples of sensors using temperature measurement, we present micromachined CMOS radiation sensors and thermal converters. Examples for sensors based on thermal actuation include thermal flow and pressure sensors, as well as thermally excited microresonators for position and chemical sensing. We also address sensors for the characterization of process-dependent thermal properties of CMOS materials, such as thermal conductivity, Seebeck coefficient, and heat capacity, whose knowledge is indispensable for thermal sensor design. Last, two complete packaged microsystems-a thermoelectric air-flow sensor and a thermoelectric infrared intrusion detector-are reported as demonstrators     

飞秒激光制备光纤微孔传感器

为了实现高精度、低成本的液体折射率测量,采用飞秒激光水辅助微加工技术,制备出一种基于微孔结构的单模光纤液体折射率传感器.研究了传感器的传输损耗与孔内液体折射率及微孔长度的关系,利用射线理论分析了传感的机理,讨论了温度对传感器性能的影响.结果表明,该传感器在折射率1.333～1.413区间具有良好的线性响应,灵敏度达到157.48dB/RIU,且不易受温度串扰.该传感器具有结构紧凑、制备简单、高灵敏度、温度不敏感和低成本等优点,在生物化学测量领域中有着广泛的应用前景.     

多节锂电池过电压保护芯片的设计

文章提出了一种基于BiCOMS工艺的多节锂电池过电压保护芯片的设计。阐述了此芯片的系统结构，对芯片的关键电路的独特设计方法及原理进行了详细分析。最终给出芯片的测试结果。此芯片具有过电压探测时间可设计、低功耗、过电压检测精度高等特点，可用于2节、3节或4节电池组的二级保护。     

Four different approaches for the measurement of IC surface temperature: application to thermal testing

Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC.