Injection photodiodes based on low-resistivity ZnS single crystals

Results of an experimental study of Ni-n-n ⁺-In photodiode structures fabricated from a low-resistivity ZnS:Al crystal (n ⁺-region) are reported. The high-resistivity compensated n-type layer is produced by thermal diffusion of silver. The photodiodes exhibit an injection amplification of the photocurrent under a forward bias of 1–10 V. The dependence of the currents through the diodes on the thickness of the n-type layer in the dark and under UV irradiation is determined. The photosensitivity is at a maximum in the fundamental absorption range in a narrow spectral band.     

Spectral response of an injection-mode infrared detector

Large injection pulses are observed in simple circuits containing forward-biased silicon p-i-n (p⁺-n-n⁺) structures at liquid helium temperatures. The pulse rate is dependent on the intensity of infrared radiation incident on the device. The substantial voltage, current, and power output eliminates the need for on-chip or off-chip amplifiers. The first observation of the spectral response of such a detector as measured from 22 to 32 μm with a liquid-helium-cooled monochromator is reported. The response is similar to other extrinsic detectors and modulated by a multiple internal reflection interference pattern. The interference pattern and the origin of optical absorption are analyzed.     

Spectral sensitivity of p-Cu1.8S/n −-ZnS/n-(II-VI) heterostructures

Photosensitivity of multilayered p-Cu_1.8S/n ^?-(II-VI)/n-(II-VI) heterostructures beyond the fundamental-absorption edge of the wide-gap component is studied experimentally, and a simple model is suggested as an explanation of this photosensitivity. It is established that an effective method for reducing the photosensitivity of the structures beyond the ultraviolet spectral region consists in decreasing the probability of dominant tunneling processes, by increasing the thickness of the wide-gap layer, giving rise to a blocking barrier for photogenerated minority charge carriers. It is shown that the p-Cu_1.8S/n ^?-ZnS/n-CdSe heterostructures are promising for the development of efficient “solar-blind” detectors of ultraviolet radiation.     

Light detector for camera using a GaAs1−xPx photo diode

We have developed a light detector for a camera. It is a photodiode with a shallow p-n junction in a n-GaAs_1?xP_x layer grown epitaxially from the vapor phase on a n⁺-GaAs substrate. By controlling the composition, the junction depth and the donor concentration, photodiodes having ΔEV less than 0.085 and typical dark current 0.2 pA/mm² for a reverse bias of 2 V are mass produced. ΔEV less than 0.085 means that the spectral response of the photodiode is very close to that of the human eye. The diode has also proved to be highly reliable, partly because an i.r. cut-off filter is not needed.     

Degradation mechanism for silicon p+-n junctions under forward bias

Leakage current degradation has been observed during forward bias stressing of silicon integrated p⁺-n junctions. Detailed characterization results of the anomalous leakage behavior are discussed in this paper. From these results an electric field-enhanced impurity diffusion mechanism has been proposed to explain both the strong temperature and forward bias dependencies on leakage current time-to-saturation. An activation energy has been determined for this mechanism (0.48±0.04 eV) and is in good agreement with that previously determined for diffusion of interstitial copper in p-type silicon. Subsequent Secondary Ion Mass Spectrometer elemental analysis has confirmed the presence of copper near the surface of the epitaxial layer containing the p⁺-n device.     

Solution of the problem of charge-carrier injection into an insulating layer under self-consistent boundary conditions at contacts

The problem of charge carrier injection into a finite-length insulating layer is analytically solved in the drift-diffusion approximation, taking into account self-consistent boundary conditions. The main assumption is the neglect of intrinsic doping of the i-type layer. The solution allows calculation of the potential, electric field, and current-voltage characteristics of various structures, i.e., metal-i-n ⁺ (or p ⁺)-semiconductor, metal-i-layer-metal, and n ⁺(p ⁺)-i-n ⁺(p ⁺) structures. The solution allows generalization for structures having heterobarriers at semiconductor layer interfaces. The proposed approach considers contact phenomena and volume effects associated with the space-charge-limited current in the i-type layer. The solution is valid in both extreme cases and intermediate conditions.     

High-voltage planar junction with a field-limiting ring

A twodimensional Poisson equation is solved as part of a program to improve breakdown characteristics of a planar p-n junction by using a field limiting ring. The influences of n^? concentration and n^? layer width of p⁺-n^?-n⁺ diode are investigated. Higher n^? concentration and smaller n^? width make optimum distance between anode and field limiting ring smaller. Breakdown voltages predicted by optimising method reported agree well with the experimental results.     

Voltage dependence of the differential capacitance of a p +-n junction

The dependences of the differential capacitance and current of a p ⁺-n junction with a uniformly doped n region on the voltage in the junction region are calculated. The p ⁺-n junction capacitance controls the charge change in the junction region taking into account a change in the electric field of the quasi-neutral n region and a change in its bipolar drift mobility with increasing excess charge-carrier concentration. It is shown that the change in the sign of the p ⁺-n junction capacitance with increasing injection level is caused by a decrease in the bipolar drift mobility as the electron-hole pair concentration in the n region increases. It is shown that the p ⁺-n junction capacitance decreases with increasing reverse voltage and tends to a constant positive value.     

Numerical analysis on abnormal thyristor forward voltage increase due to heavy doping in gated p-base layer

An abnormal forward voltage increase was observed for a p-base gated double diffused n⁺pn^?p⁺ high power thyristor with high impurity concentration at the n⁺-p emitter-base junction. Accurate numerical analysis shows that heavy doping effects are the most responsible mechanism for the abnormality and that depletion layer formation at the center junction accompanies it.It will be shown that appropriate control of the impurity concentration at the emitter-base junction is necessary to avoid this abnormality by realizing the common base transistor current gain of greater than 0.73 for n⁺n^?-portion.     

<Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-Si-<Emphasis Type="Italic">n</Emphasis>-CdF<Subscript>2</Subscript> heterojunctions

Boron diffusion and the vapor-phase deposition of silicon layers are used to prepare ultrashallow p⁺-n junctions and p⁺-Si-n-CdF₂ heterostructures on an n-CdF₂ crystal surface. Forward portions of the I–V characteristics of the p⁺-n junctions and p⁺-Si-n-CdF₂ heterojunctions reveal the CdF₂ band gap (7.8 eV), as well as allow the identification of the valence-band structure of cadmium fluoride crystals. Under conditions in which forward bias is applied to the p⁺-Si-n-CdF₂ heterojunctions, electroluminescence spectra are measured for the first time in the visible spectral region.     

Impedance and barrier capacitance of silicon diodes implanted with high-energy Xe ions

Characteristics of Si p⁺n diodes with non-uniformly distributed compensating defects, which were introduced by implantation with Xe²³⁺ ions, have been studied. The layer with the maximum concentration of the compensating defects was located in the vicinity of the metallurgical p-n junction. It is found that the presence of the defect layer results in non-monotonic dependences of the imaginary part of impedance (−Z″) and differential conductance (G = −dI/dU) of the implanted diodes on reverse bias voltage U. An equivalent circuit of the irradiated diode is proposed, which allows us to approximate the measured frequency dependences of capacitance and conductance of the irradiated diodes and to determine values of diode barrier capacitance C_pn at different reverse bias voltages.     

Effect of irradiation with fast neutrons on electrical characteristics of devices based on CVD 4<Emphasis Type="Italic">H</Emphasis>-SiC epitaxial layers

The effect of irradiation with 1-MeV neutrons on electrical properties of Al-based Schottky barriers and p⁺-n-n⁺ diodes doped by ion-implantation with Al was studied; the devices were formed on the basis of high-resistivity, pure 4H-SiC epitaxial layers possessing n-type conductivity and grown by vapor-transport epitaxy. The use of such structures made it possible to study the radiation defects in the epitaxial layer at temperatures as high as 700 K. Rectifying properties of the diode structures were no longer observed after irradiation of the samples with neutrons with a dose of 6×10¹⁴ cm^?2; this effect is caused by high (up to 50 GΩ) resistance of the layer damaged by neutron radiation. However, the diode characteristics of irradiated p⁺-n-n⁺ structures were partially recovered after an annealing at 650 K.     

On the forward current-voltage characteristics of p+-n-n+ (n+-p-p+) epitaxial diodes

The forward-biased current-voltage characteristics of p⁺-n-n⁺ and n⁺-p-p⁺ epitaxial diodes are derived theoretically. Effects of the energy-gap shrinkage, the high-low junction built-in voltage, the high-level injection, and the minority-carrier life time on the forward-biased current-voltage characteristics are included. Good agreements between the theoretically derived results and the experimental data of Dutton et al. are obtained. The developed theory predicts that the leakage of the high-low junction is dominated by the recombination of minority carriers in the highly doped substrate, not by the recombination of minority carriers in the high-low space charge region, which is opposite to the previous prediction of Dutton et al.     

Effect of double reflection on the forward current-voltage characteristics of a silicon p+-s-n+ epitaxial diode

The behaviour of both majority and minority carriers in a p⁺-s-n⁺ epitaxial diode (where s may be p or n) has been investigated in this paper. Forward current-voltage characteristics of the diodes are obtained by exact numerical analysis, taking into account the effects of energy-gap narrowing, Auger recombination and carrier-carrier scattering. As with previous authors, it is found that the forward current increases with increasing middle layer thickness. The present analysis shows that such increase occurs only upto a specific applied bias, after which the forward current decreases with increasing middle layer thickness. This behaviour is attributed to double reflection, i.e. the reflection of both majority and minority carriers by the p-n junction and high-low junction respectively. Beyond the specific bias so determined, junction reflection loses its effectiveness. Distribution of carrier concentration and junction voltages for several device configurations are given to illustrate these features. The majority carrier reflection by the p-n junction is found to have a dominating effect in all cases.     

Photosensitivity of InP/CdS heterostructures in linearly polarized light

Measurements have been made of the photosensitivity of (p ⁺ -p ⁻)-InP/n ⁺-CdS structures formed by the growth of indium phosphide and cadmium sulfide films on p ⁺-InP substrates with (100) crystallographic orientation. These structures exhibit a photosensitivity S _i ⋍0.13A/W in the spectral range from 1.3 to 2.4 eV at T=300 K. Polarizational photosensitivity was observed for oblique incidence of linearly polarized light on the CdS surface of these structures. The induced photopleochroism of these structures is governed by the angle of incidence θ. The photopleochroism increases proportionally to θ² and its maximum value is found to be ∼50% at θ⋍75–80°. The maximum azimuthal photosensitivity was found to be ∼0.13A/W·deg. Structures consisting of CdS deposited on InP can be used as polarimetric photodetectors. Fiz. Tekh. Poluprovodn. 31, 305–308 (February 1997)     

Minority carrier lifetimes in silicon solar cells determined from spectral and transient measurements

Measurements of the spectral collection efficiency and short circuit current decay rate following an X-ray pulse have been made on three types of single crystal silicon solar cells. The cell types were n⁺ - p, p⁺ - n, and p⁺ - n - n⁺ with base resistivities of 0.3, 10 and 10 Ω-cm, respectively. Minority carrier lifetimes were determined from both experiments using analytical or device code calculations, as required. For the n⁺ - p and p⁺ - n cells, nominal lifetimes of 2 and 5 ωsec, respectively, were obtained. A lifetime greater than 100 ωsec was inferred for the p⁺ - n - n⁺ device. This value represents a minimum estimate since our analysis is inaccurate when the diffusion length exceeds the cell thickness, as is the case here. The difference in base lifetime for the p⁺ - n and p⁺ - n - n⁺ structures is attributed to gettering during the phosphorus diffusion to form the back surface field layer.     

Influence of the electron-hole equilibrium shift on transition-metal diffusion in GaAs

Diffusion of impurities of transition metals Fe, Cu, and Cr in heavily doped p ⁺-, n ⁺-, and intrinsic (at diffusion temperature) GaAs is studied. A technique in which impurity diffuses into GaAs-based structures with heavily doped layers (p ⁺-n or n ⁺-n) was used. It is shown that the impurity diffusivity values in p ⁺-GaAs and n ⁺-GaAs are significantly higher and lower, respectively, than for i-GaAs. The results obtained are discussed taking into account the effect of the electron-hole equilibrium shift in semiconductors on the diffusion of impurities migrating according to the dissociative mechanism. The interstitial-component concentration for Fe, Cu, and Cr impurities in GaAs was determined at the diffusion temperature.     

Computer analysis of induced-inversion layer MOS solar cells

A computer analysis of induced inversion layer MOS solar cells is described. The analysis simultaneously solves Poisson's equation and the continuity equation in one dimension and provides a very effective method for solar cell evaluation. Numerical solutions of the carrier continuity equation in the inversion layer illustrate how cell designs may be improved in order to obtain higher short wavelength spectral response. Very shallow junctions (on the order of 0.07-0.1 μm) are shown to be optimum with higher electric fields in a direction to aid the collection of carriers generated by very high energy photons. The results also indicate that induceed inversion layer cells are less sensitive to surface recombination velocity variations than diffused p-n junction cells and have higher minority carrier lifetime. Furthermore, the effect of a p-p⁺ low-high junction on the back surface is examined and the results indicate that it is insignificant when the substrate doping concentration is optimized. High inversion layer sheet resistance values are evaluated and minimized with the contact diffusion used in the analysis designed to reduce the high inversion layer sheet resistance. Design improvements in cell performance are evaluated and identified with further improvement possible here. Conversion efficiency for silicon of 17.3% at AMO in the inversion layer solar cell is predicted assuming 95% transmission through the transparent conductor.     

A dynamic model of the p-n-n+ step recovery diodes for the numerical analysis of pulse circuits

A new p-n-n⁺ diode model for circuit transient analysis is developed. In contrast to existing circuit models, this model reflects all step-recovery diode (SRD) effects during switching on and off, including “ramp” of slow recovery phase. It is accomplished by taking into account the dynamic physical phenomena in the p-n-n⁺ diodes when switched. A non-linear dynamic diffusion capacitance of the diode model is determined by the dependence of the instantaneous base charge on the instantaneous diode voltage.The accuracy of the presented model is verified by comparison of the calculated and measured wave forms of some pulse circuits.The present model has been proved to be more accurate than SRD models previously published.