Growth of calcium carbonate by the atomic layer chemical vapour deposition technique

Thin films of CaCO₃ (calcite) have been grown with the atomic layer chemical vapour deposition (ALCVD) technique, using Ca(thd)₂ (Hthd=2,2,6,6-tetramethylheptan-3,5-dione), CO₂, and ozone as precursors. Pulse parameters for the ALCVD-type growth are found and self-limiting reaction conditions are established between 200 and 400 °C. Calcium carbonate films have been deposited on soda-lime glass, Si(100), -Al₂O₃(001), -Al₂O₃(012), -SiO₂(001), and MgO(100) substrates. The observed textures were: in-plane oriented films with [100](001)CaCO₃ [100](001)Al₂O₃ and [100](001)CaCO₃[110](001)Al₂O₃ on -Al₂O₃(001), amorphous films on -Al₂O₃(012) when grown at 250 °C, and columnar oriented films on soda-lime glass, Si(001), -SiO₂(001), and MgO(100) substrates with (00l) and (104) parallel to the substrate plane at 250 and 350 °C, respectively. The film topography was studied by atomic force microscopy and AC impedance characteristics were measured on as-deposited films at room temperature. The films were found to be insulating with a dielectric constant (_r) typically approximately 8. Thin films of CaO were obtained by heat treatment of the carbonate films at 670 °C in a CO₂-free atmosphere, but the thermal decomposition led to a significant increase in surface roughness.     

Properties of tantalum oxide thin films grown by atomic layer deposition

Thin tantalum oxide films were deposited using atomic layer deposition from TaCl₅ and H₂O at temperatures in the range 80–500 °C. The films deposited at temperatures below 300 °C were predominantly amorphous, whereas those grown at higher temperatures were polycrystalline containing the phases TaO₂ and Ta₂O₅. The oxygen to tantalum mass concentration ratio corresponded to that of TaO₂ at all growth temperatures. The optical band gap was close to 4.2 eV for amorphous films and ranged from 3.9 to 4.5 eV for polycrystalline films. The refractive index measured at λ = 550 nm increased from 1.97 to 2.20 with an increase in growth temperature from 80 to 300 °C. The films deposited at 80 °C showed low absorption with absorption coefficients of less than 100 cm⁻¹ in the visible region.     

Characterization and properties of r.f.-sputtered thin films of the alumina–titania system

Thin films of the aluminum oxide (Al₂O₃)–titanium oxide (TiO₂) system including Al₂O₃, TiO₂, and Al₂O₃/TiO₂ were prepared by radio-frequency (r.f.) magnetron sputtering using ceramic targets of Al₂O₃, TiO₂, and Al₂O₃/TiO₂ composites with different Al₂O₃/TiO₂ ratio. These films were studied at different substrate temperatures, r.f. powers, and annealing temperatures. Composition, microstructure, thermomechanical property of internal stress, and mechanical property of scratch adhesion, were evaluated. A thin film with a dielectric constant of 62 and a loss tangent of 0.012 was obtained at 500 °C from a 10/90 target. This thin film remained the high dielectric constant of TiO₂, but had an improvement in the dielectric loss tangent. Al₂O₃-containing films had a higher resistivity and breakdown field, which was improved further by annealing. Optical properties, such as refractive index and optical transmittance, were also investigated.     

Epitaxial aluminum nitride films on sapphire formed by pulsed laser deposition

Highly oriented aluminum nitride thin films were grown on sapphire (0001)-substrate by pulsed laser deposition technique. Characterization was done by X-ray-diffraction, elastic recoil detection analysis and Rutherford backscattering/channeling measurements. The epitaxial properties were studied as function of the substrate temperature and the deposition rate. An epitaxial relation to the sapphire substrate is found to be AlN [0001] || Al₂O₃ [0001] and AlN [11 0] || Al₂O₃ [10 0]. XRD-texture-analysis on films deposited at 850°C shows a full width half maximum Δω of 0.13° (rocking curve) and Δ of 1.1° (in-plane).     

Low temperature metal oxide film deposition and reaction kinetics in supercritical carbon dioxide

An effective method is developed for low temperature metal oxide deposition through thermal decomposition of metal diketonates in supercritical carbon dioxide (scCO₂) solvent. The rates of Al(acac)₃ (Aluminum acetyl acetonate) and Ga(acac)₃ (Gallium acetyl acetonate) thermal decomposition in scCO₂ to form conformal Al₂O₃ and Ga₂O₃ thin films on planar surfaces were investigated. The thermal decomposition reaction of Al(acac)₃ and Ga(acac)₃ was found to be initialized at  150 °C and 160 °C respectively in scCO₂ solvent, compared to  250 °C and 360 °C in analogous vacuum-based processes. By measuring the temperature dependence of the growth rates of metal oxide thin films, the apparent activation energy for the thermal decomposition of Al(acac)₃ in scCO₂ is found to be 68 ± 6 kJ/mol, in comparison with 80–100 kJ/mol observed for the corresponding vacuum-based thermal decomposition reaction. The enhanced thermal decomposition rate in scCO₂ is ascribed to the high density solvent which effectively reduces the energy of the polar transition states in the reaction pathway. Preliminary results of thin film deposition of other metal oxides including ZrO_x, FeO_x, Co₂O₃, Cr₂O₃, HfO_x from thermal decomposition of metal diketonates or fluorinated diketonates in scCO₂ are also presented.     

Effect of water vapor on the growth of aluminum oxide films by low pressure chemical vapor deposition

Low pressure chemical vapor deposition of aluminum oxide films from aluminum acetylacetonate and water vapor has been investigated. Water vapor played an important role in the film growth kinetics, film purity, and the surface morphology of the grown films. High water vapor pressures produced ligand-free pure Al₂O₃ films with a smooth surface even at a substrate temperature of 230 °C.     

Preparation and properties of electrochromic iridium oxide thin film by sol-gel process

We established a method for preparation of iridium oxide thin film by the sol-gel dip-coating process where iridium chloride was used as a starting material. The coating solution was prepared by reacting iridium chloride, ethanol and acetic acid. Iridium oxide coating was formed at 2.0 cm/min withdrawing rate. The coating films heat treated at 300°C did not contain impurities. Iridium oxide crystallized at temperatures above 450°C. Both crystalline and amorphous iridium oxide thin films showed electrochromism. The change in transmittance of the crystalline Ir₂O₃ film is larger than that of the amorphous Ir₂O₃ under the same experimental conditions. The transmittance of the crystalline thin film (film thickness 200 nm, measured at 400 nm) decreased 13.0% on application of 3 V for 1 s.     

Chemical vapour deposition of praseodymium oxide films on silicon: influence of temperature and oxygen pressure

Metal-organic chemical vapour deposition (MOCVD) of various phases in PrO_x system has been studied in relation with deposition temperature (450–750 °C) and oxygen partial pressure (0.027–100 Pa or 0.2–750 mTorr). Depositions were carried out by pulsed liquid injection MOCVD using Pr(thd)₃ (thd = 2,2,6,6-tetramethyl-3,5-heptanedionate) precursor dissolved in toluene or monoglyme. By varying deposition temperature and oxygen partial pressure amorphous films or various crystalline PrO_x phases (Pr₂O₃, Pr₇O₁₂, Pr₆O₁₁) and their mixtures can be grown. The pure crystalline Pr₂O₃ phase grows only in a narrow range of partial oxygen pressure and temperature, while high oxygen pressure (40–100 Pa) always leads to the most stable Pr₆O₁₁ phase. The influence of annealing under vacuum at 750 °C on film phase composition was also studied. Near 90% step coverage conformity was achieved for PrO_x films on structured silicon substrates with aspect ratio 1:10. In air degradation of Pr₂O₃ films with transformation to Pr(OH)₃ was observed in contrast to Pr₆O₁₁ films.     

Sintering and characterization of bismuth-oxide-containing zinc oxide varistors

Zinc oxide with different contents of Bi₂O₃ was prepared via a solid-state reaction to be used as varistors. Sintering was performed at 1200 and 1300 °C. Densification was achieved through liquid-phase sintering. A zincite phase, together with bismuth zinc oxide (Bi_7.65Zn_0.35O_11.83) and zinc bismuth oxide (Bi_25.33Zn_0.667O₄₀) phases, was formed at 1200 °C. A free Bi₂O₃ phase was still present at 1200 °C. Only the zincite phase was developed, and the other phases disappeared at 1300 °C. I–V characteristics show nonlinear behavior in all samples. The behavior was expected to be a result of the development of intergranular phases that crystallized from the Bi-rich liquid phase.     

Spray pyrolysis deposition of polycrystalline magnesia films and their use as buffer layers in Bi(Pb)-Sr-Ca-Cu-O/MgO/Al2O3 (or glass ceramics) structures

The deposition of MgO films on Al₂O₃ and glass ceramic substrates by spray pyrolysis of a water-ethanol magnesium nitrate precursor solution has been studied. Dense polycrystalline films have been obtained by repeated pyrolysis at 300–350 °C followed by annealing of the deposit in air at 970 °C. It has been established that the finest grains obtained under these experimental conditions correspond to the films deposited on glass ceramic substrates. It has been shown that the MgO films can be useful buffer layers preventing the interaction between the above substrates and the BiSr-Ca-Cu-O films deposited on them by spray pyrolysis of nitrates.     

Deposition and dielectric properties of CaCu3Ti4O12 thin films on Pt/Ti/SiO2/Si substrates using pulsed-laser deposition

CaCu₃Ti₄O₁₂ (CCTO) thin films were successfully deposited on Pt/Ti/SiO₂/Si(1 0 0) substrates using pulsed-laser deposition technique. The crystalline structure and the surface morphology of the CCTO thin films were greatly affected by the substrate temperature and oxygen pressure. Thin films with a (2 2 0) preferential orientation were obtained at the substrate temperature above 700 °C and oxygen pressure above 13.3 Pa. The 480-nm thin films deposited under 720 °C and 26.6 Pa have a fairly high dielectric constant of near 2000 at 10 kHz and room temperature. The values of the dielectric constant and loss and their temperature-dependence under different frequency are comparable with those obtained in the epitaxial CCTO films grown on oxide substrates.     

Comparative study on chemical stability of dielectric oxide films under HF wet and vapor etching for radiofrequency microelectromechanical system application

HF wet and vapor etching of dielectric oxide films, which were prepared by thermal atomic layer deposition (ALD) and plasma-enhanced ALD (PEALD), are examined for radiofrequency microelectromechanical system (RF MEMS) application. The chemical stability of oxide films was increased in the order of ALD–Al₂O₃ < PEALD–ZrO₂ < PEALD–TiO₂ ≈ ALD–Ta₂O₅ under wet etching in 6:1 buffered HF aqueous solution, but in a different order of Ta₂O₅ < ZrO₂ < TiO₂ ≈ Al₂O₃ under anhydrous HF/CH₃OH vapor etching at 4 kPa. The unstable films were uniformly and completely etched under the wet etching, while transformed to have increased thickness or non-uniformly etched with thicker residue under the vapor etching. Al₂O₃ and TiO₂ (Ta₂O₅ and TiO₂) can be used for RF MEMS capacitive switch fabricated by using HF vapor (wet) etching of sacrificial SiO₂.     

Synthesis and the luminescent properties of europium-activated Ca2SnO4 phosphors

The synthesis and photoluminescent (PL) properties of calcium stannate crystals doped with europium grown by mechanically activated in a high energy vibro-mill have been investigated. The characteristics of Ca₂SnO₄:Eu³⁺ phosphors were found to depend on the amounts of europium ions. The XRD profiles revealed that the system, (Ca_1−xEu_x)₂SnO₄, could form stable solid solutions in the composition range of x = 0–7% after being calcined at 1200 °C. The calcined powders emit bright red luminescence centered at 618 nm due to ⁵D₀ → ⁷F₂ electric dipole transition. Both XRD data and the emission ratio of (⁵D₀ → ⁷F₂)/(⁵D₀ → ⁷F₁) reveal that the site symmetry of Eu³⁺ ions decreases with increasing doping concentration. The maximum PL intensity has been obtained for 7 mol% concentration of Eu³⁺ in Ca₂SnO₄.     

Formation of a highly oriented FeO thin film by phase transition of Fe3O4 and Fe nanocrystallines

A highly oriented FeO thin film was formed from a Fe₃O₄ thin film containing Fe nanocrystallines by post-annealing at 600°C. Fe₃O₄ thin films were grown on Si(100) substrates by ion beam sputter deposition under oxygen ambient. The stoichiometry of the iron oxide thin film could be precisely controlled by in situ X-ray photoelectron spectroscopy (XPS). X-ray diffraction (XRD) pattern of the Fe₃O₄ thin film grown at substrate temperature of 300°C showed a mixed phase of Fe₃O₄ and Fe nanocrystallines with a preferred orientation (110). However, the mixed phase was converted to a highly oriented FeO(200) phase by post-annealing at 600°C. This could be inverted as a result of Ostwald ripening of the Fe₃O₄ and Fe nanocrystallines.     

Effect of β-spodumene on the phase development in an alumina/aluminium-titanate system

The effect of β-spodumene additions on the in situ phase formation and abundances in an Al₂O₃–Al₂TiO₅ system in the temperature range 1000–1400 °C has been studied by neutron diffraction and differential thermal analysis. Results show that β-spodumene began to decompose by phase separation and partial melting at 1290 °C, followed by complete melting at 1330 °C. Formation of Al₂TiO₅ was observed to occur at 1310 °C and its abundance increased with temperature. The addition of β-spodumene as a sintering aid did not cause its reaction with alumina or rutile to form additional phases. Addition of β-spodumene in excess of 5 wt% resulted in pronounced vitrification, which partly recrystallised when cooled to room temperature. The temperatures of Al₂TiO₅ formation and melting of β-spodumene are consistent with the results of differential thermal analysis.     

Low temperature UV/ozone oxidation formation of HfSiON gate dielectric

Physical and electrical properties of hafnium silicon oxynitride (HfSi_xO_yN_z) dielectric films prepared by UV ozone oxidation of hafnium silicon nitride (HfSiN) followed by annealing to 450 °C are reported. Interfacial layer growth was minimized through room temperature deposition and subsequent ultraviolet/ozone oxidation. The capacitance–voltage (C–V) and current–voltage (I–V) characteristics of the as-deposited and annealed HfSi_xO_yN_z are presented. These 4 nm thick films have a dielectric constant of 8–9 with 12 at.% Hf composition, with a leakage current density of 3×10⁻⁵ A/cm² at V_fb+1 V. The films have a breakdown field strength >10 MV/cm.     

Microstructure, crystallinity, and properties of low-pressure MOCVD-grown europium oxide films

A study of growth, structure, and properties of Eu₂O₃ thin films were carried out. Films were grown at 500–600 °C temperature range on Si(1 0 0) and fused quartz from the complex of Eu(acac)₃·Phen by low pressure metalorganic chemical vapor deposition technique which has been rarely used for Eu₂O₃ deposition. These films were polycrystalline. Depending on growth conditions and substrates employed, these films had also possessed a parasitic phase. This phase can be removed by post-deposition annealing in oxidizing ambient. Morphology of the films was characterized by well-packed spherical mounds. Optical measurements exhibited that the bandgap of pure Eu₂O₃ phase was 4.4 eV. High frequency 1 MHz capacitance–voltage (C–V) measurements showed that the dielectric constant of pure Eu₂O₃ film was about 12. Possible effects of cation and oxygen deficiency and parasitic phase on the optical and electrical properties of Eu₂O₃ films have been briefly discussed.     

Formation of MgAl2O4 in Al2O3-(Al-4wt.%Mg) composites

The Al₂O₃ particles are introduced into the Al-4wt.%Mg melt by the “vortex” method. After being cast, Al₂O₃-(Al-4wt.%Mg) composites are remelted at 700, 750, 800 and 850°C for different residence times to investigate the formation of MgAl₂O₄ (spinel).

The results show that MgAl₂O₄ is the unique interface of the Al₂O₃-(Al---Mg) composites held at 700–850°C. Fine MgAl₂O₄ crystals grow on the surface of the Al₂O₃ particle but, as the holding temperature and the residence time increase, some spinels will form themselves into pyramidal shape. The MgAl₂O₄ grows not only at the matrix-particle interface but also on the surface of the composite specimens. The formation reactions of interfacial MgAl₂O₄ are as follows: Mg(1) + 2Al(1) + 2O₂(g) = MgAl₂O₄(s)3Mg(1) + 4Al₂O₃(s) = 3MgAl₂O₄(s) + 2Al(1) Both of them are equally important.     

Highly conducting indium tin oxide (ITO) thin films deposited by pulsed laser ablation

Highly conducting and transparent indium tin oxide (ITO) thin films were prepared on SiO₂ glass and silicon substrates by pulsed laser ablation (PLA) from a 90 wt.% In₂O₃-10 wt.% SnO₂ sintered ceramic target. The growths of ITO films under different oxygen pressures (P_O2) ranging from 1×10⁻⁴–5×10⁻² Torr at low substrate temperatures (T_s) between room temperature (RT) and 200°C were investigated. The opto-electrical properties of the films were found to be strongly dependent on the P_O2 during the film deposition. Under a P_O2 of 1×10⁻² Torr, ITO films with low resistivity of 5.35×10⁻⁴ and 1.75×10⁻⁴ Ω cm were obtained at RT (25°C) and 200°C, respectively. The films exhibited high carrier density and reasonably high Hall mobility at the optimal P_O2 region of 1×10⁻² to 1.5×10⁻² Torr. Optical transmittance in excess of 87% in the visible region of the solar spectrum was displayed by the films deposited at Po₂≥1×10⁻² Torr and it was significantly reduced as the P_O2 decreases.     

Preparation and optical properties of sol–gel derived Er-doped Al2O3–Ta2O5 films

Thin films of the system xAl₂O₃–(100 − x)Ta₂O₅–1Er₂O₃ were prepared by a sol–gel method and a dip-coating technique. The influences of the composition and the crystallization of the films on Er³⁺ optical properties were investigated. Results of X-ray diffraction indicated that the crystallization temperature of Ta₂O₅ increased from 800 to 1000 °C with increased values of x. In crystallized films, the intensities of the visible fluorescence and upconversion fluorescence tend to decrease with an increase in x values, due to the high phonon energy of Al₂O₃; the strongest fluorescence is observed in a crystallized film for x = 4 heat treated at 1000 °C. In amorphous films obtained by heat treatment at relatively low temperatures the Er³⁺ fluorescence could not be observed because strong fluorescence from organic residues remaining in the films thoroughly covered the Er³⁺ fluorescence. On the other hand, the Er³⁺ upconversion fluorescence in the amorphous films was observed to be stronger than that in the crystallized films. The strongest upconversion fluorescence is observed in an amorphous film for x = 75 heat treated at 800 °C.