不同TiB2颗粒粒径的TiB2/Cu复合材料耐电弧侵蚀行为

采用放电等离子烧结法（SPS）制备了不同TiB₂颗粒粒径的3wt% TiB₂/Cu复合材料,研究了3wt% TiB₂/Cu复合材料致密度、导电率、硬度和耐电弧侵蚀性能随TiB₂颗粒粒径的变化规律,重点分析了不同TiB₂颗粒粒径的3wt% TiB₂/Cu复合材料耐电弧侵蚀行为。结果表明:3wt% TiB₂/Cu复合材料致密度和硬度随TiB₂颗粒粒径的增大而略有降低;TiB₂颗粒粒径越小,TiB₂/Cu复合材料的综合性能越好。随着TiB₂颗粒粒径的增大,3wt% TiB₂/Cu复合材料耐蚀稳定性降低,3wt% TiB₂/Cu阴极材料的损耗量明显增加;当TiB₂颗粒粒径为10 μm时,3wt% TiB₂/Cu复合材料的耐电弧侵蚀性能最佳。电弧蚀形貌观察表明:不同TiB₂颗粒粒径的3wt% TiB₂/Cu复合材料经电弧侵蚀后,3wt% TiB₂/Cu复合材料均由阴极向阳极发生转移;随着TiB₂颗粒粒径的增大,阴极质量损耗逐渐增加,触头表面电弧侵蚀面积增加;而在Cu基体中引入较小的TiB₂颗粒,有利于减弱电接触实验过程中TiB₂/Cu复合材料的喷溅现象。      

TiB2/Cu复合材料的电弧侵蚀行为

采用放电等离子烧结法（SPS）制备TiB₂质量分数为1wt%~5wt%的TiB₂/Cu复合材料,测试其导电率和硬度。当TiB₂质量分数由0增至5wt%时,复合材料的导电率由96.9%（International Annealed Copper Standard,IACS）降至65.1%（IACS）,布氏硬度由42.8增至65.2。对所制备的不同TiB₂质量分数的TiB₂/Cu复合材料在直流24 V、不同电流条件下进行电接触实验,探究TiB₂添加量和电流对TiB₂/Cu复合材料耐电弧侵蚀性能的影响。结果表明,TiB₂/Cu复合材料的平均燃弧时间、平均燃弧能量和材料损耗量随着电流的增加而增加,TiB₂/Cu复合材料的阴极损耗量高于阳极,整体上TiB₂/Cu复合材料由阴极向阳极转移。在24 V和25 A条件下,不同TiB₂质量分数的TiB₂/Cu复合材料的燃弧时间和燃弧能量随操作次数增加不断波动,整体上呈逐渐增加的趋势,3wt% TiB₂/Cu复合材料的稳定性最高,平均燃弧时间和燃弧能量最低。随着TiB₂质量分数的增加,TiB₂/Cu复合材料损耗量降低,表面蚀坑变浅。     

TiB2 and TiC stainless steel matrix composites

Stainless steel matrix composites reinforced with TiB₂ or TiC particulates have been in situ produced through the reactive sintering of Ti, C and FeB. X-ray diffraction analysis confirmed the completion of reaction. The TiB₂, TiC and steel were detected by X-ray diffraction analysis. No other reaction product or boride was found, indicating the stability of TiB₂ and TiC in steel matrix. The SEM micrographs revealed the morphology and distribution of in situ synthesized TiB₂ and TiC reinforcements in steel matrix. During sintering the reinforcements TiB₂ and TiC grew in different shapes. TiB₂ grew in hexagonal prismatic and rectangular shape and TiC in spherical shape.     

SPS烧结制备TiB2/TiC复合材料

采用金属钛粉和碳化硼为初始粉料,利用SPS放电等离子烧结技术制备了致密的纳米结构TiB2/TiC复合材料.并借助XRD、SEM考察了复合材料的相组成和显微结构,利用压痕法和小样品力学性能测试方法(MSP)测定了室温显微硬度、断裂韧性和MSP强度.研究结果表明:利用一步法直接升温至1550℃并保温6 min制备的复合材料,其晶粒尺寸大于1μm,MSP强度为833 MPa.而采用两步法升温至1550℃,然后迅速降低保温温度至1450℃,并保温6 min条件下使金属钛粉和碳化硼同步完成反应、烧结、致密化,生成晶粒细小的TiB2/TiC复合材料,晶粒尺寸大约为200 nm,并且所制备的复合材料力学性能更好,MSP强度达到1095 MPa.     

挤压铸造TiB2P/Al复合材料室温力学性能

采用挤压铸造法制备不同体积分数的TiB_2P/Al复合材料, 利用扫描电镜、 硬度计、 拉伸试验机等对复合材料的室温力学性能进行了研究, 系统地分析了体积分数和热处理工艺对材料力学性能的影响。结果表明: 挤压铸造TiB_2P/Al复合材料的布氏硬度、 抗弯强度和弹性模量随增强相TiB₂体积分数的增加而提高。45% TiB_2P/Al复合材料T6处理后硬度和抗弯强度分别比退火态时提高了23%和40%, 但热处理状态对弹性模量的影响不大。      

液硅渗透法制备Ti3SiC2改性C/CSiC复合材料

采用浆料浸渗结合液硅渗透法原位生成高韧性Ti₃SiC₂基体, 制备Ti₃SiC₂改性C/C-SiC复合材料。研究了TiC颗粒的引入对熔融Si浸渗效果的影响, 分析了Ti₃SiC₂改性C/C-SiC复合材料的微结构和力学性能。实验结果表明: TiC与熔融Si反应生成Ti₃SiC₂是可行的, 而且C的存在更有利于生成Ti₃SiC₂; 在含TiC颗粒的C/C预制体孔隙(平均孔径22.3 μm)内, 熔融Si的渗透深度1 min内可达10.8 cm; Ti₃SiC₂取代残余Si后提高了 C/C-SiC复合材料的力学性能, C/C-SiC-Ti₃SiC₂复合材料的弯曲强度达203 MPa, 断裂韧性达到8.8 MPa·m1/2; 对于厚度为20 mm的试样, 不同渗透深度处材料均具有相近的相成分、 密度和力学性能, 无明显微结构梯度存在, 表明所采用的浆料浸渗结合液硅渗透工艺适用于制备厚壁Ti₃SiC₂改性C/C-SiC复合材料构件。      

原位合成TiB2/Fe复合材料的高温氧化行为

采用微波烧结技术原位生成TiB₂/Fe复合材料,研究其在500℃、600℃与700℃空气中的恒温氧化行为,并对氧化膜的表面、截面形貌及相组成进行了分析。结果表明:TiB₂/Fe复合材料由TiB₂、Fe₂B和α-Fe三种物相组成。随着氧化温度的升高,TiB₂/Fe复合材料的氧化增重明显增大,均呈现抛物线型规律,在500℃时,其氧化产物主要为Fe₂O₃和Fe₃O₄,而700℃时,其氧化物为Fe₂O₃、TiO₂、Fe₉TiO₁₅及少量Fe₃BO₆组成。相同温度下,随着TiB₂含量增加,TiB₂/Fe复合材料氧化物粒径、氧化增重和氧化层厚度均减小,氧化激活能增大,其抗氧化性能也越好。      

Application of thermodynamic calculation in the in-situ process of Al/TiB2

A thermodynamic model describing the formation of in-situ TiB₂ reinforced Al metal matrix composite (MMC) has been established. Based on thermodynamic principles, the Gibbs free energies of formation of TiB₂, AlB₂, and Al₃Ti were evaluated. Experimental investigation was carried out to verify the validity of the thermodynamic model. KBF₄ and K₂TiF₆ were used to synthesize in-situ particulates in molten Al at different temperatures. X-ray diffraction was employed to characterize the formation of different phases in the composite.     

Impact behavior of in situ TiB2/Al composite at various temperatures

The impact behavior of the in situ TiB₂/Al composite was investigated at temperatures varying from −50 to 200 °C. The effects of the reinforcement, heat treatment as well as temperature on the impact toughness and failure mechanism were discussed. Results showed that the impact toughness of the composite decreases significantly due to the presence of the stiff TiB₂ reinforcements. The precipitations caused by aging play the same role as TiB₂ reinforcements, which constrain the deformation of the matrix and reduce the impact toughness. The TiB₂/Al composite is more endurable in suffering the impact load at subzero and high temperatures compared to that at room temperature. The fractography of the TiB₂/Al composite is a cleavage-and-dimple morphology. The eutectic silicon is the preferred site for catastrophic cracking. There is no cracking in the in situ TiB₂ reinforcement because of the small size and near spherical shape. However, the “pulled-out” failure occurs for the TiB₂ reinforcement, which is due to the relative weaker interfacial strength than the strength of reinforcement.     

Fabrication of SiCf/SiC composites by chemical vapor infiltration and vapor silicon infiltration

Three-dimensional (3D) silicon carbide fiber reinforced silicon carbide matrix (SiC_f/SiC) composites, employing KD-1 SiC fibers (from National University of Defense Technology, China) as reinforcements, were fabricated by a combining chemical vapor infiltration (CVI) and vapor silicon infiltration (VSI) process. The microstructure and properties of the as prepared SiC_f/SiC composites were studied. The results show that the density and open porosity of the as prepared SiC_f/SiC composites are 2.1 g/cm³ and 7.7%, respectively. The SiC fibers are not severely damaged during the VSI process. And the SiC fibers adhere to the matrix with a weak interface, therefore the SiC_f/SiC composites exhibit non-catastrophic failure behavior with the flexural strength of 270 MPa, fracture toughness of 11.4 MPa·m^1/2 and shear strength of 25.7 MPa at ambient conditions. Moreover, the flexural strength decreases sharply at the temperature higher than 1200 °C. In addition, the thermal conductivity is 10.6 W/mk at room temperature.     

碳纳米管和TiB2混杂增强铜复合材料的电弧侵蚀行为

采用放电等离子烧结（SPS）工艺制备出不同混杂比例碳纳米管（CNTs）和TiB₂混杂增强铜（CNTs-TiB₂/Cu）复合材料,对复合材料致密度、硬度、导电率、导热率和显微组织进行了对比和分析。同时对复合材料进行了电接触试验,研究了不同电流条件下CNTs与TiB₂混杂比例对CNTs-TiB₂/Cu复合材料电弧侵蚀行为的影响。结果表明:随着CNTs与TiB₂混杂比例的增加,CNTs-TiB₂/Cu复合材料的密度、硬度、导电率和导热率逐渐降低,铜基体晶界分离现象越来越明显;在特定电流条件下,合适的CNTs-TiB₂混杂比例可提高CNTs-TiB₂/Cu复合材料的抗电弧侵蚀性能;当电流为5 A和10 A时,CNTs与TiB₂混杂比例为4∶1的平均燃弧能量、平均燃弧时间和材料转移量达到最低,而电流为15 A时,CNTs与TiB₂混杂比例为1∶4的平均燃弧能量、平均燃弧时间和材料转移量达到最低。电弧侵蚀后阴极出现熔池、气孔及熔融金属铺展等特征,且随着CNTs与TiB₂混杂比的增加,CNTs-TiB₂/Cu复合材料熔池面积减小,气孔数量变少,熔融金属铺展的特征减弱。      

Ti/Al2O3复合材料制备及其力学性能

利用放电等离子烧结(SPS)制备了性能优异的40%(体积分数)Ti/Al2O3复合材料,其弯曲强度、断裂韧性、显微硬度和相对密度分别为897.29MPa、17.38MPa·m1/2、17.13GPa和99.24%.SEM和HREM对复合材料的微观结构分析发现,晶粒细化、位错环强化等是材料强度提高的主要原因;裂纹的偏转和桥联是材料韧性提高的关键所在.     

Mechanochemical synthesis and characterization of TiB2 and VB2 nanopowders

A novel method for the synthesis of transition-metal boride nanopowder has been developed using a mechanochemical reaction between LiBH₄, LiH and transition-metal chloride (TiCl₃ and VCl₃) by high energy ball milling. This method successfully produces TiB₂ and VB₂ particles dispersed within a soluble LiCl matrix. Subsequent washing with distilled water, ethanol and acetone to remove the LiCl matrix phase yields TiB₂ and VB₂ nanopowders of 15-60 nm particle size. From the X-ray diffraction patterns and high resolution transmission electron microscopy image, it is found that each particle is polycrystalline consisting of 3-5 nm crystallites. Neither particle nor crystallite size are increased significantly after heating at 680 °C.     

无压渗透法制备Al／AlN复合材料及其性能

在常压下通过熔渗工艺将AlSi7Mg合金渗入由AlN粉末模压成形、预烧所获得的预烧结坯中,得到了不同Al含量的Al／AlN复合材料。采用X射线衍射仪对复合材料的相组成进行了测试,采用金相显微镜和SEM对其显微组织进行了观测,并对不同Al含量的Al／AlN复合材料的维氏硬度、抗弯强度、热膨胀系数及导热系数等进行了测试分析...     

不同粒径TiB2/Cu复合材料热传导模拟与实验

采用ANSYS对不同粒径TiB₂/Cu复合材料热传导过程进行模拟。采用粉末冶金法制备了不同粒径TiB₂增强的Cu复合材料,采用LINSEIS LFA1600激光导热仪测试了室温至280℃下的TiB₂/Cu复合材料热传导性能变化,并与模拟结果进行对比。结果表明:热导率模拟结果与实验结果吻合较好。在50~200℃之间,复合材料热导率变化不大,在6%~9%范围内波动。200℃之后,模拟值与实验值均呈现出随温度升高而增大的趋势,且吻合度较高。这是由于温度低于200℃时,在模拟过程中未考虑材料界面处两相不同热膨胀系数的影响,导致模拟值与实验值有较大的差异。当温度高于200℃时,模拟值和实验值吻合程度趋于稳定。在200℃时,由于两相热膨胀系数的影响,复合材料内部界面处等效应力大于Cu基体屈服强度,使其发生塑性变形,从而引起热导率发生较大幅度变化。此外,热导率随着TiB₂粒径的增大呈现出先提高后降低的趋势,在10 μm时达到最大。这是由于当颗粒直径小于临界平均直径时,颗粒直径的增大会减少界面数量,从而降低界面热阻。当颗粒直径大于临界平均直径时,平均自由程l的急剧增加导致热导率降低。      

Synthesis of in situ Al–TiB2 composites using stir cast route

When elemental Ti and B powders were added to molten Al at above 1000°C, fine in situ TiB₂ particulates were formed through Al–Ti–B exothermic reaction. By optimising the nucleation of TiB₂, the tensile and yield strengths of a synthesised Al–15V_f%TiB_s composite were twice that of matrix material. Modification of Al-matrix with 4.5 wt%Cu tripled the tensile and yield strengths at peak-aged condition. Owing to the co-presence of brittle Al₃Ti flakes with TiB₂ particles in the composites synthesised by the Al–Ti–B system, ductility was reduced to 68% and 84% in composites with Al- and Al–Cu matrices, respectively. When the (Ti + B) mixture was incorporated with 3 wt%C, TiB₂ and TiC reinforcing phases were simultaneously produced in the composite with Al–Cu matrix. Such an approach reduced Al₃Ti compound in the composite considerably. Although the presence of Cu in the composite was found to promote the formation of Al₃Ti, its effect on the fluidity caused the melt recovery to increase from 33% to 52%.     

Fabrication of Al/Al2O3 composites and FGM

Al/Al2O3 composites of different ratios were hot-press sintered at 575 similar to 640℃ under a pressure of 30 MPa for 2 h in a vacuum furnace. It was found that the relative density of the Al/Al2O3 composites could be increased evidently with the rise of sinter temperature. No reaction occurred between Al and Al2O3 at the sinter temperatures. Under 640℃-30 MPa-2 h experimental condition, Al/Al2O3 system FGM was successfully fabricated, and its density range changed quasi-continuously from 2.887x10(3) kg/m(3) to 3.1909x10(3) kg/m3 within the middle 1.0 mm thickness range.     

SiO2-TiO2/聚四氟乙烯复合材料的制备及热膨胀性能

为了使微波基板材料与Cu金属衬底的热膨胀性能匹配,对陶瓷/聚四氟乙烯（PTFE）微波复合基板材料的热膨胀性能进行了研究。采用湿法工艺制备了以SiO₂和TiO₂为填料的SiO₂-TiO₂/PTFE复合材料,研究了复合材料密度、填料粒度和填料体积分数对SiO₂-TiO₂/PTFE复合材料热膨胀性能的影响。结果表明,当SiO₂的体积分数由0增至40%（TiO₂ ：34%~26%）时,SiO₂-TiO₂/PTFE复合材料的线膨胀系数（CTE）由50.13×10^-6 K^-1减小至10.03×10^-6K^-1。陶瓷粉体粒径和复合材料密度减小会导致CTE减小。通过ROM、Turner和Kerner模型计算CTE发现,ROM和Kerner模型与实验数据较相符,而实验值与Turner模型预测值之间的差异随PTFE含量的升高而逐渐增大。