共查询到20条相似文献,搜索用时 9 毫秒
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Moran T.E. Virga K.L. Aguirre G. Prince J.L. 《Advanced Packaging, IEEE Transactions on》2002,25(3):409-416
Split ground planes are sometimes used in RF and mixed signal packages in order to isolate the RF and analog circuits from the digital circuits. Undesired radiation in a packaging environment may occur when a signal trace is routed over a slot in the ground plane. This paper examines and investigates ways to eliminate signal coupling into split ground plane structures and assesses the impact of this reduced coupling on signal integrity in a packaging environment. Suggested methods to reduce coupling of energy into the slot are to alter the shape of the slot with RF chokes or corrugations. 相似文献
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Issues and trends in router design 总被引:19,自引:0,他引:19
Future routers must not only forward packets at high speeds, but also deal with nontrivial issues such as scheduling support for differential services, heterogeneous link technologies, and backward compatibility with a wide range of packet formats and routing protocols. The authors outline the design issues facing the next generation of backbone, enterprise, and access routers. The authors also present a survey of advances in router design, identifying important trends, concluding with a selection of open issues 相似文献
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The current research and development activities in silicon radio-frequency (RF) technologies are first reviewed, accompanied by an illustration of the most pronounced shortcomings of conventional silicon technology in the integrability of RF functions at high GHz frequencies. In the discussion on active RF devices mainly CMOS is investigated due to great interest in this mass-production technology. Issues related to the integration of spiral inductors on silicon are addressed, stressing in particular the difficulty of RF substrate potential definition. Silicon micromachining techniques are highlighted as potential solutions to the integration of RF passives and to reduce substrate losses and cross-talk on silicon. It is explained that micromachining techniques are the best introduced to the silicon mainstream by using post-processing and minimum process complexity. 相似文献
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This paper discusses several aspects of the performance of advanced Si-based RF transistors. The RF performance of SiGe HBTs and Si RF MOSFETs is reviewed and compared to that of III–V RF transistors. The speed – breakdown voltage tradeoff which is typical for bipolar transistors is discussed with special emphasis on SiGe HBTs. On the field-effect transistor side, we review the performance of state-of-the-art Si RF MOSFETs and show that these devices are highly competitive in terms of speed and cutoff frequency. 相似文献
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《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》1986,74(12):1741-1752
The dramatic increase in the functional density of VLSI has been achieved without greatly increasing the chip size. In wafer scale integration, the area of an entire wafer is made available to increase the functional density still further. However, the requirement for fault tolerance, additional levels of metallization, excess power dissipation, process conservatism to achieve finite yield, and nonoptimum nature of the AI/SiO2 transmission line for cross-wafer communication have made WSI noncompetitive with state-of-the-art VLSI and dense multichip hybrid packaging approaches, at least so far. On the other hand, the potential benefits of WSI are great. Chief among them is the greatly increased expected reliability, which is partly due to an all-monolithic system and partly because of the hope that fault tolerance, which is an absolute requirement for WSI fabrication, can be extended to failure tolerance, and thus the ability to reconfigure during systems operation, and perhaps even transparent to it. Pipeline- or bus-oriented logic structures were found to be the most promising for WSI implementation. 相似文献
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SoC Issues for RF Smart Dust 总被引:2,自引:0,他引:2
Cook B.W. Lanzisera S. Pister K.S.J. 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》2006,94(6):1177-1196
Wireless sensor nodes are autonomous devices incorporating sensing, power, computation, and communication into one system. Applications for large scale networks of these nodes are presented in the context of their impact on the hardware design. The demand for low unit cost and multiyear lifetimes, combined with progress in CMOS and MEMS processing, are driving development of SoC solutions for sensor nodes at the cubic centimeter scale with a minimum number of off-chip components. Here, the feasibility of a complete, cubic millimeter scale, single-chip sensor node is explored by examining practical limits on process integration and energetic cost of short-range RF communication. Autonomous cubic millimeter nodes appear within reach, but process complexity and substantial sacrifices in performance involved with a true single-chip solution establish a tradeoff between integration and assembly. 相似文献
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从系统角度出发,主要讨论蜂窝基站测试的射频信号的取样问题.根据国标中的相关要求,通过实验比较讨论衰减器和耦合器的非线性特性,从理论和实验结果进行分析并得出结论. 相似文献
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将GPS接收机嵌入到手机硬件中,GPS接收频率将与手机中其它射频源共存.这些射频源包括GSM,UMTS,WLAN和Bluetooth.指出这些射频源对GPS接收信号的干扰程度,以明确哪种射频源对GPS接收机的阻塞影响最大,成为提出相应的解决方案是关键.验证方法主要是由Texas Instrument提供的GPS评估板接收来自GPS卫星模拟器发出的GPS信息,由具备GSM,UMTS,WLAN,Bluetooth功能的手机分别对GPS评估板发出不同的射频传导信号.结果证明:主要验证了UMTS1 900 MHz作为手机发射源时,对GPS接收机的阻塞影响最大,对改善GPS接收机带通滤波器的性能,为抑制UMTS信号起到很好的作用. 相似文献
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An experimental test bed of a novel full analogue microwave LINC signal component separator scheme is presented. The proposed experiment has been performed to validate the theory and to demonstrate the usefulness of the proposed solution, constituting the preliminary and mandatory step before a completely integrated version. 相似文献
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从频率计数与合成到传感器信号调整等很多应用都需要将RF信号转换为数字逻辑电平。在这些情况下,设计者一般采用一个高速电压比较器完成RF到数字信号的转换工作。由于电压比较器具有高增益,它们一般有很好的灵敏度,但也会带来一些问题。高速比较器价格高,很难找到现成的商品,并且易于被快速淘汰。 相似文献
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MIM capacitor integration for mixed-signal/RF applications 总被引:1,自引:0,他引:1
Chit Hwei Ng Chaw-Sing Ho Shao-Fu Sanford Chu Shi-Chung Sun 《Electron Devices, IEEE Transactions on》2005,52(7):1399-1409
The relentless drive toward high-speed and high-density silicon-based integrated circuits (ICs) has necessitated significant advances in processing technology. The entrance of copper metallization in IC manufacturing has resulted in new challenges in metal-insulator-metal (MIM) capacitor fabrication, one of the key building blocks in analog/mixed signal/RFCMOS circuits. The requirement to reduce passive chip space has led to active researches for MIM with high dielectric constant (/spl kappa/) film. This paper provides an overview of MIM capacitor integration issues with the transition from AlCu backend of line (BEOL) to Cu BEOL. The key to MIM capacitor electrical properties can be achieved with optimized dielectrics. The different MIM capacitor architectures published are also described. Special emphasis is made on the properties of various MIM with high-/spl kappa/ dielectrics in the last section. 相似文献
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We present a system for efficient prediction of RF power distribution in site specific environments using a variation of ray tracing, which we calledray-beam tracing. The simulation results were validated against measured data for a number of large environments with good statistical correlation between the two. We represent geometric environments in full 3D which facilitates rooftop deployment along with any other 3D locations. We use broadcast mode of propagation, whose cost increases more slowly with an increase in the number of receiving bins. The scheme works well both for indoor and outdoor environments. Simple ray tracing has a major disadvantage in that adjacent rays from a transmitter diverge greatly after large path lengths due to multiple reflections, such that arbitrarily large geometric entities could fall in between these rays. This results in asampling error problem. The error increases arbitrarily as the incident angle approaches 90°. The problem is addressed by introducing the notion of beams while retaining the simplicity of rays for intersection calculations. A beam is adaptively split into child beams to limit the error. A major challenge for computational efficiency is to quickly determine the closest ray-surface intersection. We achieve this by using partitioning trees which allows representation of arbitrarily oriented polygonal environments. We also use partitioning trees for our full 3D interactive visualization along with interactive placement of transmitters, receiving bins, and querying of power. 相似文献
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介绍了射频干扰对消技术的原理和系统模型,总结了其实现的关键技术点,指出了在通信系统集成中以及任务系统集成中的应用,以及宽带和大动态等未来的发展方向。 相似文献