GaN基HEMT微加速度计的压阻系数测试

介绍了GaN基HEMT微加速度计结构的设计、加工及测试过程,并对结果做出了分析。通过喇曼测试与ANSYS仿真软件相结合的方式进行应力测试分析,利用安捷伦4156C测试仪对GaN基HEMT进行不同应力状态及不同温度下IDS-VDS特性测试,并通过相关测试数据计算分析GaN基HEMT的压阻系数及其变化规律。结果表明:常温下GaN基HEMT的等效压阻系数为(2.47±0.04)×10-9Pa-1,高于Si的压阻系数(7.23±3.62)×10-10Pa-1。同时测试了HEMT在-40~50℃的输出特性,实验结果表明,HEMT饱和源漏电流随着温度的升高而下降。压阻系数具有负温度系数,且压阻系数随着温度的升高以226TPa-1/℃的速率减小。     

GaAs微结构中共振隧穿薄膜介观压阻效应研究

设计并利用控制孔技术加工了GaAs基微结构和基于该微结构的共振隧穿薄膜,并通过实验研究了微结构中共振隧穿薄膜的介观压阻效应,试验结果表明其介观压阻灵敏度比硅的最大压阻灵敏度高一个数量级.     

共振隧穿二极管的力电耦合特性

报道了微结构中共振隧穿二极管(RTD)的压阻效应.分析并加工了四梁结构,其中RTD置于应力敏感区.沿[110]晶向和[110]晶向的应力导致RTD电流-电压曲线的改变,即介观压阻变化,尤其是在微分负阻(NDR)区.采用不同测试方法,研究了RTD的力电耦合特性,并获得了较相近的压阻系数为10-9Pa-1.     

NDRHBT及其构成的单-双稳转换逻辑单元

设计并研制了InGaP/GaAs/InGaP超薄基区(8nm)负阻异质结晶体管(UTBNDRHBT)。并用它构成一个单-双稳转换逻辑单元(Monostable-bistable transition logic element,简称MOBILE)。经过测试,证实其具有与GRTD、RTD/HEMT构成的MOBILE相类似的逻辑功能。     

具有高击穿电压的AlN背势垒AlGaN/GaN/AlN HEMT材料

采用金属有机化学气相沉积(MOCVD)技术在4英寸(1英寸=2.54 cm)蓝宝石衬底上制备了1.2μm厚的AlN背势垒的AlGaN/GaN/AlN双异质结高电子迁移率晶体管(HEMT)材料,其AlGaN势垒层表面粗糙度(RMS)、二维电子气(2DEG)迁移率以及HEMT材料的弯曲度都较为接近于常规的高阻GaN背势垒结构的HEMT材料。由于AlN晶格常数较小,具有AlN背势垒的HEMT材料受到了更大的压应力。通过对比分析两种HEMT材料所制备的器件发现,受益于AlN背势垒层更高的禁带宽度和临界电场,由AlN背势垒HEMT材料所制备的器件三端关态击穿电压为常规高阻GaN背势垒HEMT器件的1.5倍,缓冲层漏电流则较常规高阻GaN背势垒HEMT器件低2～3个数量级。     

化合物半导体器件与电路的研究进展

介绍了GaAs,InP和GaN等几种重要化合物半导体电子器件的特点、应用和发展前景。回顾了GaAs,InP和GaN材料的材料特性及其器件发展历程与现状。分别讨论了GaAs基HEMT由PHEMT渐变为MHEMT结构和性能的变化,GaAs基HBT在不同电路应用中器件的特性,InP基HEMT与HBT的器件结构及工作特性,GaN基HEMT与HBT的器件特性参数。总体而言,化合物半导体器件与电路在高功率和高频电子器件方面发展较快,GaAs,InP和GaN材料所制得的各种器件电路工作在不同的频率波段,其在相关领域发展潜力巨大。     

超亚微米栅AlGaAs/GaAs HEMT

在分子束外延生长的外延晶片上,用电子束刻蚀技术制作了超亚微米栅AlGaAs/GaAs高电子迁移率晶体管(HEMT),其栅长分布为25～85nm。该器件表明,速度过冲和短栅几何效应对栅长小于100nm的器件起着重要的作用。栅长为30nm的HEMT的最大本征跨导为215mS/mm,有效饱和电子速度可达3×10~7cm/s。     

用于平面型Gunn畴雪崩器件的SiO_2低温淀积技术

<正> 制作平面Gunn畴雪崩器件的材料是在掺Cr的高阻GaAs衬底上汽相外延一层n-GaAs,其电子浓度为1×10~(15)～1×10~(18)cm~(-3),厚度为6～15μm,迁移率为4000～7500cm~2/V·s。在这样的材料上生长SiO_2,常压下,当衬底温度大于630℃时,由于As的升华,使GaAs的晶体完整性受到损坏,而在较低温度下(如420～450℃)淀积时,SiO_2常出现破裂或脱落现象。 GaAs的热膨胀系数为5.9×10~(-6)℃~(-1),而SiO_2为0.4×10~(-6)℃~1,相差一个数量级以上;此外,SiO_2的应力,300K时为1～6×10~3N/cm。实验表明,在GaAs上淀积的SiO_2厚度超过5000(?)时便产生破裂。而P_2O_5在GaAs上淀积1500(?),却未观察到裂纹,因为P_2O_5的热     

高电子迁移率晶体管材料结构的制备及分析

针对高电子迁移率晶体管(HEMT)器件,分析了双δ掺杂 GaAs HEMT的结构组成,基于固源分子束外延方法制备了双δ掺杂 GaAs HEMT的缓冲层、沟道层、平面掺杂层和隔离层等多层材料结构。采用 X-ray射线衍射、透射电镜研究了多层材料的结构。范德堡霍尔测试结果表明, HEMT的2DEG测试浓度为1.82×1012 cm-3,电子迁移率大于6520 cm2·V-1·s-1。     

共振隧穿二极管的力电耦合特性

报道了微结构中共振隧穿二极管（RTD）的压阻效应. 分析并加工了四梁结构,其中RTD置于应力敏感区. 沿［110］晶向和［110］晶向的应力导致RTD电流-电压曲线的改变,即介观压阻变化,尤其是在微分负阻（NDR）区. 采用不同测试方法,研究了RTD的力电耦合特性,并获得了较相近的压阻系数为1E-9Pa-1.     

A high aspect ratio design approach to millimeter-wave HEMT structures

In MESFET and HEMT structures as the gate length is reduced below 0.5 µm in an attempt to achieve amplification at highest possible frequencies, it is essential that the depletion depth under the gate be also reduced in order to preserve a high aspect ratio that ensures a high device voltage gain factor (gm/g0) and a reasonable value of stable power gain at high frequencies. Results based on this design approach indicate that an n-A1GaAs/GaAs HEMT structure with 0.25-µm gate length could provide stable power gain in excess of 6 dB at the unity current gain frequency of 92.4 GHz, and for an aspect ratio of ten it is difficult to reduce the gate length below 0.25 µm.     

Ge1−xSnx stressors for strained-Ge CMOS

A strong piezoresistive effect of GaAs micro-structure which is based on high electron mobility transistor (HEMT) is reported in this paper. The GaAs HEMT is embedded in the root of the cantilever as the sensitive element in order to detect the deformation. The strain is simulated with the ANSYS software, and the maximum gauge factor is about 26,350, which is nearly a hundred times larger than that of piezoresistive silicon. The high gauge factor is not only due to the option of voltage bias, but also the combination of the piezoresistive and piezoelectric effect. The obtained results demonstrate that GaAs micro-structure based on HEMT can be suitable for high sensitive stress/pressure sensors.     

22 nm In0.75Ga0.25As channel-based HEMTs on InP/GaAs substrates for future THz applications

In this work, the performance of L_g=22 nm In_0.75Ga_0.25As channel-based high electron mobility transistor (HEMT) on InP substrate is compared with metamorphic high electron mobility transistor (MHEMT) on GaAs substrate. The devices features heavily doped In_0.6Ga_0.4As source/drain (S/D) regions, Si double δ-doping planar sheets on either side of the In_0.75Ga_0.25As channel layer to enhance the transconductance, and buried Pt metal gate technology for reducing short channel effects. The TCAD simulation results show that the InP HEMT performance is superior to GaAs MHEMT in terms of f_T, f_max and transconductance (g_{m_max}). The 22 nm InP HEMT shows an f_T of 733 GHz and an f_max of 1340 GHz where as in GaAs MHEMT it is 644 GHz and 924 GHz, respectively. InGaAs channel-based HEMTs on InP/GaAs substrates are suitable for future sub-millimeter and millimeter wave applications.     

Integration of GalnP/GaAs heterojunction bipolar transistors andhigh electron mobility transistors

Integration of carbon-doped GaInP/GaAs heterojunction bipolar transistors (HBTs) and high electron mobility transistors (HEMTs) is demonstrated by growing an HBT on the top of a HEMT. A current gain of 60, a cutoff frequency of 59 GHz and a maximum oscillation frequency of 68 GHz were obtained for a 5×15 μm² self-aligned HBT. The HEMT, with a gate length of 1.5 μm has a transconductance of 210 mS/mm, a cutoff frequency of 9 GHz and a maximum oscillation frequency of 22 GHz. It is shown that the GaInP/GaAs HBT on the HEMT is a simple Bi-FET technology suitable for microwave and mixed signal applications     

Optimization of buffer layers for AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistors by atmospheric pressure metalorganic chemical vapor deposition

Pseudomorphic AlGaAs/InGaAs/GaAs high electron mobility transistors (HEMT) incorporating various types of buffer layers were fabricated (D = 0.50 × 100μm) and characterized by Hall-effect measurements, low temperature photoluminescence (PL), and room temperature IV characteristics. The devices fabricated with a thick (5000Å) undoped high purity GaAs buffer layer grown at 650° C showed poor pinch-off characteristics, high output conductance and large leakage currents (>2 mA at pinch-off). Devices incorporating an undoped high purity GaAs (3000Å) buffer layer grown at 550° C showed sharp pinch-off characteristics, low output conductance, and low leakage currents (1.3 mA at pinch-off). Low temperature growth of GaAs (550° C) enhanced carbon incorporation resulting in increasedp-type characteristics. This type of buffer layer provided additional barrier height between the active layer and the substrate reducing the injection of electrons into the substrate.     

DISTORTION PROPERTIES OF GaN SWITCHES AT HIGH-TEMPERATURES

The origins of HEMT distortion in passive control applications as SPST switch are presented in this paper. Also, this paper describes the change of the AlGaN/GaN HEMT switch distortion properties (second-and third distortion intercept points) over a wide range of temperature. The results indicate that the change in second-and third-order distortion intercept points is smaller (about 2dBm) over a wide range of temperature from ?50 to +300°C. A comparison of the GaN-based HEMT switch with InP-and GaAs-HEMT switches shows that the GaN technology generates lower distortion than its InP and GaAs technologies counterpart.     

New technology towards GaAs LSI/VLSI for computer applications

For future large-scale computer applications, new device technologies towards GaAs LSI/VLSI have been developed: self-aligned fully implanted planar GaAs MESFET technology and high electron mobility transistor (HEMT) technology by molecular beam epitaxy (MBE). The self-aligned GaAs MESFET logic with 1.5-µm gate length exhibits a minimum switching time of 50 ps and the lowest power-delay product of 14.5 fJ at room temperature. The enhancement/depletion (E/D) type direct coupled HEMT logic has achieved a switching time of 17.1 ps with 1.7-µm gate length at liquid nitrogen temperature and more recently a switching time of 12.8 ps with 1.1-µm gate HEMT logic, which exceeds the top speed of Josephson Junction logic and shows the highest speed of any device logic ever reported. Optimized system performances are also projected to system delay of 200 ps at 10-kilogate integration with GaAs MESFET VLSI, and 100 ps at 100-kilogate with HEMT VLSI. These values of system delay correspond to the computer performance of over 100 million instructions per second (MIPS).     

Wideband HEMT balanced amplifier

The high electron mobility transistor (HEMT) has demonstrated great potential for high-gain and low-noise applications, achieving a noise figure and current gain cutoff frequency fT superior to that of the GaAs MESFET. The letter presents the practical use of an HEMT in a hybrid wideband balanced amplifier covering 8.5 to 16 GHz producing 9.7 ± 0.5 dB gain and 2.6 dB midband noise figure. The performance is also compared to a GaAs MESFET stage.     

Double pulse doped InGaAs/AlGaAs/GaAs pseudomorphic high-electron-mobility transistor heterostructures

Double pulse doped (δ-doped) InGaAs/AlGaAs/GaAs pseudomorphic high-electron-mobility transistor (HEMT) heterostructures were grown by molecular-beam epitaxy using a multiwafer technological system. The room-temperature electron mobility was determined by the Hall method as 6550 and 6000 cm²/(V s) at sheet electron densities of 3.00 × 10¹² and 3.36 × 10¹² cm⁻², respectively. HEMT heterostructures fabricated in a single process feature high uniformity of structural and electrical characteristics over the entire area of wafers 76.2 mm in diameter and high reproducibility of characteristics from process to process.     

A microwave power double-heterojunction high electron mobility transistor

A microwave power high electron mobility transistor (HEMT) has been developed and tested in theK-band frequency range. The HEMT has a unique configuration of a selectively low-doped (AlGa)As/GaAs/(AlGa)As double heterojunction resulting in both capability of high-current density and high gate breakdown voltage. The structure showed electron mobility of 6800 cm²/V.s and two-dimensional (2-D) electron density as high as 1.2 × 10¹²cm^-2at room temperature. An output power of 660 mW (550 mW/mm) with 3.2-dB gain and 19.3-percent power added efficiency was achieved at 20 GHz with 1-µm gate length and 1.2-mm gate periphery. A similar device with 2.4-mm gate width produced an output power of 1 W with 3-dB gain and 15.5-percent efficiency. These results offer microwave high power capability in a double-heterojunction HEMT (DH-HEMT).