The new generation of superconductor equipment for the electric power grid

High-temperature superconductor (HTS) power equipment, such as power cables, synchronous condensers, fault current limiters (FCLs), and transformers, are poised to address key technical issues in the U.S. Power grid. This equipment is enabled by the successful development of robust long-length HTS wire, available commercially from a variety of manufacturers worldwide. Compared to conventional cables, HTS power cables offer higher capacity with minimal disturbance to neighboring underground infrastructure, and their low series impedance opens the opportunity for cost-effective power flow control with phase angle regulators. HTS cables are being actively prototyped worldwide. Based on technology developed for industrial and ship propulsion motors, an HTS synchronous condenser has been developed and successfully tested in the Tennessee Valley Authority (TVA) grid; this is the first HTS power equipment to be offered commercially. It addresses the growing need for dynamic reactive power compensation for grid stability and power quality. HTS FCLs and transformers are also in active development.     

Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

10-9 atm cc/s are possible, meeting the demands of MIL-STD-883E.     

Advanced ceramic packaging for microwave and millimeter waveapplications

Advances in integrated circuit technologies have produced devices with higher speeds, frequencies, powers, and functional complexity. In addition, these attributes have been realized with smaller and smaller semiconductor devices. Such improvements are primarily due to the effective control and management of wafer-scale interconnect technology. It has become apparent, however, that the next level of interconnect technology to be addressed is in the packaging of these high performance semiconductors. As frequency or speed increases, packaging can quickly become the chief inhibitor to electrical response by degrading signal propagation or by contributing to structural configurations that foster cavity resonances or waveguide modes. The paper attempts to lay out the electrical, structural, material, and cost considerations that need to be simultaneously addressed by the microwave engineer to design the best interconnection method possible between the die and the subsystem. Several packaging concepts are reviewed-from single transition design to multilayer, multichip modules for phased-array applications     

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance, and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 μm in width is performed. The electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package is 1 mm × 1 mm × 700 μm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.     

A new generation of universal contactless Battery Charging platform for portable Consumer Electronic equipment

This invention is related to a new planar inductive battery charger for portable electronic equipment such as mobile phones, palm pilots and CD players. New multilayer printed-circuit-board winding matrices of hexagonal structures that can generate magnetic flux of almost even magnitude over the surface of the winding arrays have been developed. The new concept forms the basis for a new generation of universal charging platform for a wide range of portable electronic equipment. Different types of portable electronic equipment can be placed and charged simultaneously on the charging platform, regardless of their positions and orientation. The principle and structure of the charging platform are explained and the feasibility has been confirmed with practical measurements. The proposed universal charging platform has been successfully used for mobile phones, MP3 players and electronic dictionaries.     

用于LED封装的等离子清洗设备选型及工艺优化

等离子清洗工艺具有效果明显、操作简单的优点,在电子封装(包括半导体封装、LED封装等)中得到了广泛的应用;基于加工成本考虑,LED封装制程中普遍采用高密度加工方式(整个料盒清洗),清洗效果不理想。本文针对用于LED封装的等离子清洗设备选型、工艺优化进行了探讨,提出了有效的解决方案。     

Optoelectronic generation of microwave power

In this letter a method of microwave generation by optoelectronic excitation of a charged resonator is presented. The basic principles of operation are explained and preliminary experimental results are discussed.     

微波功率晶体管的金属气密封装

提出了晶体管自身组态与电路组态匹配的思想,介绍了一种微波功率晶体管的金属气密封装--选极F型封装技术.还介绍了1.5GHz和2.0GHz选极F型封装微波功率晶体管的技术指标和功能特征.     

Permittivity and permeability measurement of microwave packaging materials

There has recently been a growing interest in using new packaging materials-dielectric and/or magnetic-in a wide variety of applications for controlling the microwave heating of food. The study of the thermal behavior of these products requires the accurate determination of the complex permittivity and permeability when the temperature varies, and when the materials are irradiated in specific conditions. One of the main challenges is to distinguish the dielectric losses from the magnetic ones. In this paper, a practical measurement method is proposed, which consists of irradiating a rod sample successively with a homogeneous electric-field distribution with a low magnetic field and with a homogeneous magnetic-field distribution with low electric field. An accurate and efficient electromagnetic analysis tool is used to generate a set of points, which allow the construction of several bilinear functions that relate the scattering parameters of the circuit to the complex values of /spl epsiv/ and /spl mu/ so that /spl epsiv/ and /spl mu/ can then be easily determined from experimental measurements in accordance to whatever the special irradiation conditions. Some results for test materials are presented and discussed.     

West Ford radar and microwave equipment

The ground stations used in the West Ford experiment, one in California and one in Massachusetts, can transmit and receive CW X-band communications signals simultaneously. In addition, each station can be changed within minutes to a radar capable of tracking and measuring the characteristics of the dipole belt and other satellites. The high performance of these stations also permits other scientific experiments. New radio and radar techniques and components such as high-power X-band klystrons, low-noise masers, and high-performance waveguide devices are used at these stations. The operation of the stations and the microwave components and techniques are described in this paper.     

High-efficiency microwave generation in InP

InP transferred-electron microwave oscillators have been made which have high efficiency in the 12?18 GHz band. The maximum observed efficiency is 13.2% at 15.3 GHz, which is superior to published results in IMPATT and GaAs transferred-electron oscillator devices. A peculiar cathode contact is necessary in order to obtain high microwave performance.     

A generation of microwave ferrite devices

The development of microwave ferrite materials and devices over the last thirty years is traced. The status of materials, devices, and theoretical understanding prevalent in the mid-1950s is first reviewed. Developments in materials engineering of garnets and lithium ferrites in the 1960s and 1970s are described, along with the evolution of circulators and phase shifters. Current levels of performance achievable in circulators and phase shifters are described, and future challenges and opportunities are discussed     

Reliability of new packaging concepts

Today, most of the microelectronics packaging needs are met by semiconductor devices in plastic surface mount (SM) packages. Microelectronics packaging of the future will be either bare chip or chip size/scale packaging (CSP). Of the 45 billion SM packaged ICs to be manufactured in 2000, CSPs will be a small 3.4% but growing at 62% (compound annual growth rate). The use of direct bonded chip-on-board and flip chip (FC) technology for custom solutions may not match the growth of CSPs. The popcorn problem of existing plastic packages has been solved in many ways including the use of hydrophobic composite encapsulants as the best solution and thorough bake-out and storage as the long-standing practical solution. The popcorn problem which was more severe with the smaller and thinner encapsulations of CSPs is also solved with modern hydrophobic materials and new non-paddle package designs. Further, there is good evidence that reliability is not impaired even by delaminations in the bulk of the encapsulations – small delaminations being an inevitable consequence of stress relaxation following transfer moulding. CSP and FC bump joint reliability is safeguarded both by good soldering practice and by effective underfill. High reliabilities are achievable with the range of new packages built from modern materials, with random failure rates down to 10 failure units, infant mortalities controlled to low levels by six sigma manufacturing processes and wearout lifetimes exceeding 100 years even in tropical operation.     

微波通信设备漏能的测试与分析

本文根据九个不同类型微波通信局(站)的微波设备在工作位对工作人员微波辐射量级的测试取得的大量数据,进行了分析处理,得出微波站工作位最大漏能为2.5μW/cm~2。文中还分析了其测试结果,找出了微波通信设备电磁波能量泄漏途径,提出了减少微波通信设备泄漏的防护措施及建议。     

A new method for microwave generation and data transmission using DFB laser based on fiber Bragg gratings

A novel architecture for microwave/millimeter-wave signal generation and data modulation using a fiber-grating-based distributed feedback laser has been proposed in this letter. For demonstration, a 155.52-Mb/s data stream on a 16.9-GHz subcarrier has been transmitted and recovered successfully. It has been proved that this technology would be of benefit to future microwave data transmission systems.     

Multichip packaging and the need for new materials

The sole determiner of speed, of cost, and of possible system size is the interconnection density of the circuits. The best way to increase the interconnection density is to reduce the dielectric constant, and there are new materials that offer almost a 2:1 reduction. Designing new modules with these low dielectric constant materials and with larger chips increases the wattage and increases the wattage density. Ceramic substrates must be used to dissipate the heat of the new large higher wattage chips without destroying them. This requires the use of new ceramic materials. A choice must be made between the leading contenders. A new multichip module technology is being defined, and will result in a major packaging change. The processes and the materials choices are presently overwhelming, but there are great advantages to those who identify the best solutions.     

寻呼式智能微波设备告警系统的设计

介绍采用PIC58BS单片机设计的一种新型微波设备告警系统，当微波设备发生故障时通过电话网传送告警信号，有效地扩展了警距离，BP机和手机可全天候接收告警。也可将告警发生时间、地点等信息以语音形式存放在语音箱中供多人提取。     

Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging

The reaction kinetics of microwave cure process of underfill materials in flip-chip packaging was investigated with nonisothermal kinetic method and compared with that of the thermal cure. Three-dimensional (3-D) nonlinear cure kinetic and transient heat transfer coupled model was solved by finite-element method (FEM) to simulate the microwave cure process. The accuracy of the program was verified using a simple heat conduction case by commercial FEM software. Temperature and conversion inside underfill during microwave cure process were evaluated by solving the nonlinear anisotropic heat conduction equation including internal heat generation produced by exothermic chemical reactions. Numerical results show that the iteration calculations are very sensitive to small changes in time step sizes. It was also found that variable frequency microwave can process underfill materials with uniform conversion under different curing temperatures.