大面积高深宽比微结构硅片的热氧化实验研究

利用大面积硅片制作X射线光栅和硅基微通道板等都涉及硅的热氧化工艺。热氧化使具有高深宽比微结构的大面积硅片产生形变,严重影响了这些器件的应用。本文以5英寸硅片为例,研究了硅基微结构在热氧化过程中的变形问题,定性分析了产生形变的力学因素,提出了减小形变的氧化方法。首先实验制作了具有高深宽比微结构的硅片,采用不同的氧化方法,比较了变形的大小。结果表明,通过控制热氧化过程中的温度来控制热膨胀系数和在热氧化过程中施加外部热塑应力等方法能够有效地减小热氧化变形量。     

等离子体低温刻蚀单晶硅高深宽比结构

等离子体低温刻蚀是一种针对高深宽比结构的干法刻蚀技术。本文在低温刻蚀单晶硅样品时得到典型的刻蚀结果为:各向异性值>0.99,硅刻蚀速率>1.5μm/min,对SiO2刻蚀选择比>75,说明该刻蚀方法很具竞争力。通过对载片台温度、反应气体配比、腔体气压和ICP线圈功率等工艺参数的系列实验分析,证明低温刻蚀高深宽比硅微结构必需一定的低温和氧,同时揭示出低温刻蚀过程的主要控制因素是离子轰击而非刻蚀表面的化学反应。本文还对刻蚀过程中刻蚀滞后和凹蚀现象的产生机理进行了分析讨论,指出介电质掩蔽层的充放电效应导致了凹蚀,而刻蚀滞后的诱因则与通常的刻蚀情况不同,主要是台阶对离子轰击的覆盖效应。     

多层等离子体蚀刻技术的研究

干法刻蚀现已成为微小高深宽比结构加工与微细图形制作的重要手段.提出了一种新的干法刻蚀技术一多层等离子体蚀刻,充分利用腔体的空间布局,布置多层电极,并采用分层送气装置输送放电气体,实现多层同时进行刻蚀,可成倍提高产能.采用该技术刻蚀光阻为例,从空间与时间两个角度分析了工艺参数对刻蚀速率与均匀性的影响规律与作用机理.实验结果表明,极板间距为50/55/60mm(由下向上),工作压力为40Pa,R[O2:Ar]为1/2,RF功率为600W时,整炉次刻蚀速率均值为14.395nm/min,均匀性为9.8％,此时工艺最为合理.     

低压压印制备硅点阵结构的工艺研究

高密度、图形规则的硅点阵结构由于其独特的光电性能具有广泛的应用前景.本文介绍了一种以低压压印结合反应离子刻蚀制备硅点阵的方法,即利用PDMS模板通过压印复制获得PMMA掩模结构,用反应离子刻蚀在硅片表面制得高度有序的硅纳米点阵结构.实验和有限元模拟结果表明,低压压印因为毛细作用下光刻胶在模板内的充分填充可以获得良好的图形复制精度和较小的残余胶厚度,因此适于大面积高密度光刻胶结构的均匀复制.     

连续面形微光学元件的深刻蚀工艺

利用电感耦合等离子(ICP)刻蚀技术,在石英上刻蚀深连续面形微光学元件。分析了影响 深刻蚀工艺的烘焙条件、气体组分、自偏压和刻蚀温度等主要工艺参数,并对影响深刻蚀稳定性、均匀性、刻蚀污染与损伤等因素进行了探讨。通过实验,在石英上制作出深达55微米的浮雕微柱透镜,其面形峰值误差小于3%。     

P型单晶硅片在KOH溶液中腐蚀行为的电化学研究

采用电化学极化测量技术研究了p(100)和p(111)硅片在碱性KOH溶液中的腐蚀行为,考察了KOH溶液浓度、温度和硅片表面缝隙等因素对腐蚀行为的影响.结果表明:在室温下当KOH浓度为5～6 mol/L时硅片腐蚀速率最大;随着KOH腐蚀液温度增加,腐蚀速率增大,在50℃左右腐蚀速率增加显著;硅片表面缝隙会加剧硅的局部腐蚀,在同等实验条件下缝隙腐蚀速率比均匀腐蚀快一个数量级.     

基于SU-8/PMMA双层胶技术的硅点阵结构制作

本文介绍了一种通过SU-8/PMMA双层胶制备硅点阵结构的方法,首先用PDMS模板压印带SU-8/PMMA双层胶的硅片,用ICP刻蚀后,得到具有内切结构的光刻胶掩膜,镀金属膜并去胶后,进行金属辅助化学湿法刻蚀,在硅片表面获得点阵结构。实验结果表明,通过该方法获得的硅点阵结构的反射率较平面硅有显著降低;该方法成本较低,过程简单,由于采用软压印和低压压印的方式,可实现硅点阵结构的大面积制备。     

PMMA的反应离子深刻蚀

对PMMA进行反应离子深刻蚀以获得高深度比微结构.研究了纯氧刻蚀气体中加入CHF3对刻蚀速率、图形形貌等的影响.纯氧刻蚀PMMA,钻蚀现象严重.加入CHF3后,刻蚀速率随CHF3含量增加而下降.加入适量CHF3,可以在侧壁形成钝化层,保护侧壁不受钻蚀.当CHF3含量为40%,刻蚀功率30 W,工作气压为4 Pa时,即使刻蚀深度达到400 μm,侧壁仍然陡直,刻蚀深宽比大于10.     

深高宽比微结构的干法刻蚀

介绍了深高宽比微结构在干法刻蚀过程中遇到的刻蚀滞后、刻蚀中止、侧壁弯曲和开槽效应等与传统器件刻蚀不同的现象,讨论了制作高深宽比结构所需的关键技术和检测手段.     

HCl浓度对多孔硅微结构及Si-H键合的影响

采用电化学湿法刻蚀制备了P型多孔硅,通过改变HCl溶液浓度来调整刻蚀液中的氢离子浓度。制备出的多孔硅孔径相同,孔深随着氢离子浓度的提高呈线性增大直至恒定。基于电流突发模型阐述了结构参数的变化:孔径的形成开始于刻蚀的初始阶段,空穴主导了初始阶段的腐蚀,空穴的迁移与消耗过程就是孔径扩张和孔壁形成的过程,该过程与硅片本身的性能密切相关,与氢离子浓度无关,故孔径基本恒定;氢离子浓度的提高加快氢的置换反应直至平衡,从而使反应总速率提高直至恒定,因此孔深先线性增大然后保持恒定;Si-H含量在一定范围内与孔深的变化吻合呈现上升趋势,且键合形式以Si-H2为主。     

Nonuniformity of the macropore etching front in thin <Emphasis Type="Italic">n</Emphasis>-Si wafers

A factor responsible for the appearance of a dome-shaped front of macropore etching in thin silicon wafers during their photoelectrochemical etching in a cell with a ring anode has been established. It is shown that the formation of a dome-shaped front is related to a radial voltage drop in the substrate, which leads to a decrease in the current density in the central part of the etched wafer. The effect of applied voltage on the shape of the front has been studied. We suggest monitoring of the development of nonuniformity in the course of etching using a change (i) in the temporal variation of the adjusted intensity of illumination and (ii) in the current-voltage characteristic. Various methods intended to provide deep uniform macropores are considered.     

基于多掩膜光刻工艺的MEMS体硅加工

本文提出了一种新颖的MEMS多掩膜工艺,实现了带有大台阶和大深宽比窄槽的衬底上的体硅精细加工。通过薄胶多次光刻在衬底上制作出氧化硅(SiO2)、氮化硅(Si3N4)、光刻胶(photo-resist,PR)等材料的多层掩膜图形,每层掩膜可以进行一次衬底刻蚀或腐蚀,刻蚀或腐蚀完毕后去除该层掩膜。该工艺解决了MEMS工艺中的深坑涂胶和光刻问题,结合深反应离子刻蚀(Deep Re-active Ion Etching,DR IE)、湿法腐蚀等工艺可以用于多级台阶、深坑底部精细结构、微结构释放等MEMS工艺。     

A new single-component low-cost emitter etch-back process for silicon wafer solar cells

A way of achieving lightly doped emitter is a combination of a heavy emitter diffusion and emitter etch back, which has an added advantage of phosphorous diffusion gettering. However, this chemical emitter etch-back process must fulfil some critical requirements, e.g. cost-effectiveness, near-conformal Si etching even after deep emitter etch back, controlled Si etch rate, post-etch clean Si surface and lowest safety issues in chemical handling and drainage. In this work, we report a new low-cost (less than 1 US Cents/wafer), single-chemical, non-acidic, high-throughput emitter etch-back process for tube-diffused emitters for crystalline Si wafers. This process uses only sodium hypochlorite solution at 80 °C as the Si etchant. This process is versatile with its applications on phosphorous and boron tube-diffused monocrystalline Si and phosphorous tube-diffused multicrystalline Si wafers. The preparation, usage and drainage of this highly diluted solution are easy and safe. The Si etching process leads to excellent spatial uniformity over large-area Si wafers (243 cm²). With deep etch back resulting in a change of sheet resistance by ~60 Ω/sq, the standard deviation value changes by only 2.7%. High surface conformity in the etch-back surface is evident from reflectance studies. Quasi-steady-state photoconductance and photoluminescence imaging are used to demonstrate improved electrical parameters of the etch-back wafers.     

金刚石线锯切割多晶硅片表面制绒工艺研

晶体硅片的制绒技术是太阳能电池制造工艺中的关键步骤。本研究以工业中酸制绒方法为基础, 研究了腐蚀时间、浓度对绒面结构以及反射率的影响。此外, 还采用金属催化化学腐蚀法进行制绒, 选用氢氟酸和硝酸银作为腐蚀液。而且对两种制绒方法效果进行了对比。研究获得的最优绒面结构及反射率结果的实验条件为: 氢氟酸浓度4.6 mol/L、硝酸银浓度0.02 mol/L, 室温下反应90 min, 得到的平均反射率为8%, 远低于目前多晶硅片制绒生产标准。     

Large-area, high-speed patterning of carbon nanotubes using material-assisted excimer laser photoablation

Large-area patterning of carbon nanotubes (CNTs) using a nonlithographic process is demonstrated. Projection imaging with deep ultraviolet radiation from 248 nm KrF excimer laser and material-assisted photoablation were used to pattern the CNTs. A matrix of CNTs dissolved in a DMF solution was deposited on a silicon wafer by spin coating, followed by coating of photodefinable polyimide on the CNTs. The CNTs and the polyimide layer were simultaneously patterned by the excimer laser projection photoablation process. Even though CNTs cannot be directly photoablated by low-fluence excimer laser radiation, simultaneous patterning of the illuminated CNT-polyimide combination region occurred due to the physical force of dissociated fragments of polyimide layer. We have demonstrated clean, large-area patterning of CNTs on 100 mm diameter Si wafers. Additionally, this patterning process is economical and provides higher throughput compared with conventional methods.     

A sub-atmospheric chemical vapor deposition process for deposition of oxide liner in high aspect ratio through silicon vias

The formation of a Through Silicon Via (TSV) includes a deep Si trench etching and the formation of an insulating layer along the high-aspect-ratio trench and the filling of a conductive material into the via hole. The isolation of the filling conductor from the silicon substrate becomes more important for higher frequencies due to the high coupling of the signal to the silicon. The importance of the oxide thickness on the via wall isolation can be verified using electromagnetic field simulators. To satisfy the needs on the Silicon dioxide deposition, a sub-atmospheric chemical vapor deposition (SA-CVD) process has been developed to deposit an isolation oxide to the walls of deep silicon trenches. The technique provides excellent step coverage of the 100 microm depth silicon trenches with the high aspect ratio of 20 and more. The developed technique allows covering the deep silicon trenches by oxide and makes the high isolation of TSVs from silicon substrate feasible which is the key factor for the performance of TSVs for mm-wave 3D packaging.     

UV photodetectors with thin-film Si nanoparticle active medium

We constructed ultraviolet (UV) photodetectors using thin films of silicon nanoparticles as active media. The Si nanoparticle films are electrodeposited at room temperature on Si p-type substrates. Uniform silicon nanoparticles of 1-nm diameter are dispersed from Si wafers using electrochemical etching. The nanoparticles are ultrabright under UV excitation, with nanosecond luminescence time characteristics. Current-voltage (I--V) characteristics indicate a photoconductor in series with a diode-like junction with a large enhancement in the forward current under UV illumination. Our results point to a sensitive UV detector with good visible blindness where the particle films effectively constitutes a wide-bandgap material.     

一种新型微机械陀螺的研究

设计了一种检测模态和驱动模态具有相近品种因子的微机械陀螺。这种我们称之为栅型结构的陀螺由悬空弹簧将具有栅条的检测质量块与衬底相联。计算结果表明,这种器件在大气压条件下其驱动模态和检测模态的品质因子几乎同为140。同时,计算结果还表明可以获得比较平坦的较大带宽。采用硅－玻璃键合和深反应离子刻蚀技术制作了这种器件。     

Nanostructure formation and passivation of large-area black silicon for solar cell applications

Nanoscale textured silicon and its passivation are explored by simple low-cost metal-assisted chemical etching and thermal oxidation, and large-area black silicon was fabricated both on single-crystalline Si and multicrystalline Si for solar cell applications. When the Si surface was etched by HF/AgNO(3) solution for 4 or 5 min, nanopores formed in the Si surface, 50-100 nm in diameter and 200-300 nm deep. The nanoscale textured silicon surface turns into an effective medium with a gradually varying refractive index, which leads to the low reflectivity and black appearance of the samples. Mean reflectance was reduced to as low as 2% for crystalline Si and 4% for multicrystalline Si from 300 to 1000 nm, with no antireflective (AR) coating. A black-etched multicrystalline-Si of 156 mm × 156 mm was used to fabricate a primary solar cell with no surface passivation or AR coating. Its conversion efficiency (η) was 11.5%. The cell conversion efficiency was increased greatly by using surface passivation process, which proved very useful in suppressing excess carrier recombination on the nanostructured surface. Finally, a black m-Si cell with efficiency of 15.8% was achieved by using SiO(2) and SiN(X) bilayer passivation structure, indicating that passivation plays a key role in large-scale manufacture of black silicon solar cells.     

Study of Morphological and Optical Properties of Porous Silicon

Porous silicon layers have been prepared from non-polished p-type silicon wafers of (100) orientation. Scanning electron microscopy and fluorescence spectroscopy have been used to characterize the morphological and optical properties of porous silicon. The influence of varying the anodizing current density on the morphological and optical properties of porous silicon has been investigated. SEM micrographs show that by increasing the anodizing current density in the electrochemical process two peculiar surface morphologies are obtained. The surface morphology in the central region of the sample consists of solid cells delimited by trenches and the trenches bottom is covered by polyhedral pores, and the surface morphology in the periphery contains polyhedral and current-line-oriented pores. The fluorescence spectrum peak at the anodizing current density of 93 mA/cm² gets the maximum intensity and is blue shifted.